DE3789212T2 - Integriertes Bearbeitungssystem mit Vielfachkammer. - Google Patents

Integriertes Bearbeitungssystem mit Vielfachkammer.

Info

Publication number
DE3789212T2
DE3789212T2 DE3789212T DE3789212T DE3789212T2 DE 3789212 T2 DE3789212 T2 DE 3789212T2 DE 3789212 T DE3789212 T DE 3789212T DE 3789212 T DE3789212 T DE 3789212T DE 3789212 T2 DE3789212 T2 DE 3789212T2
Authority
DE
Germany
Prior art keywords
chamber
wafer
load lock
chambers
loadlock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3789212T
Other languages
German (de)
English (en)
Other versions
DE3789212D1 (de
Inventor
David Cheng
Isaac Harari
Peter D Hoppe
Dan Maydan
Sasson Somekh
Masato Toshima
David Nin-Kou Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE3789212D1 publication Critical patent/DE3789212D1/de
Application granted granted Critical
Publication of DE3789212T2 publication Critical patent/DE3789212T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Threshing Machine Elements (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
DE3789212T 1986-12-19 1987-12-18 Integriertes Bearbeitungssystem mit Vielfachkammer. Expired - Fee Related DE3789212T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94480386A 1986-12-19 1986-12-19

Publications (2)

Publication Number Publication Date
DE3789212D1 DE3789212D1 (de) 1994-04-07
DE3789212T2 true DE3789212T2 (de) 1994-06-01

Family

ID=25482099

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3789212T Expired - Fee Related DE3789212T2 (de) 1986-12-19 1987-12-18 Integriertes Bearbeitungssystem mit Vielfachkammer.

Country Status (4)

Country Link
EP (1) EP0272141B1 (https=)
JP (1) JPS63252439A (https=)
AT (1) ATE102397T1 (https=)
DE (1) DE3789212T2 (https=)

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US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
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DE69032945T2 (de) * 1989-10-20 1999-09-16 Applied Materials, Inc. Robotereinrichtung
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CN101730613B (zh) * 2007-05-15 2013-11-06 株式会社爱发科 搬送装置及使用该搬送装置的真空处理装置
KR20100052525A (ko) * 2007-09-10 2010-05-19 가부시키가이샤 알박 기판 반송 로봇, 진공 처리 장치
TWI499725B (zh) * 2010-12-30 2015-09-11 Au Optronics Corp 潔淨風扇節能系統
JP5314789B2 (ja) * 2012-06-13 2013-10-16 株式会社日立製作所 真空処理装置及び真空処理方法
KR102214961B1 (ko) * 2012-08-08 2021-02-09 어플라이드 머티어리얼스, 인코포레이티드 링크된 진공 프로세싱 툴들 및 그 사용 방법들
CN111254418B (zh) * 2020-02-10 2020-12-29 深圳市拉普拉斯能源技术有限公司 一种pecvd镀膜机
CN114256124A (zh) * 2021-12-27 2022-03-29 无锡邑文电子科技有限公司 晶圆真空顶升装置以及半导体设备
CN119993867B (zh) * 2025-02-08 2025-10-31 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 集束型高真空晶圆键合设备

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Also Published As

Publication number Publication date
JPS63252439A (ja) 1988-10-19
JPH0322057B2 (https=) 1991-03-26
EP0272141A2 (en) 1988-06-22
EP0272141B1 (en) 1994-03-02
EP0272141A3 (en) 1989-10-11
ATE102397T1 (de) 1994-03-15
DE3789212D1 (de) 1994-04-07

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