DE3788155D1 - Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe. - Google Patents

Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe.

Info

Publication number
DE3788155D1
DE3788155D1 DE87104937T DE3788155T DE3788155D1 DE 3788155 D1 DE3788155 D1 DE 3788155D1 DE 87104937 T DE87104937 T DE 87104937T DE 3788155 T DE3788155 T DE 3788155T DE 3788155 D1 DE3788155 D1 DE 3788155D1
Authority
DE
Germany
Prior art keywords
semiconductor wafer
excess material
removing excess
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE87104937T
Other languages
English (en)
Inventor
Michael Gerald Rosenfield
David Earle Seeger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3788155D1 publication Critical patent/DE3788155D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE87104937T 1986-04-28 1987-04-03 Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe. Expired - Lifetime DE3788155D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/856,303 US4752668A (en) 1986-04-28 1986-04-28 System for laser removal of excess material from a semiconductor wafer

Publications (1)

Publication Number Publication Date
DE3788155D1 true DE3788155D1 (de) 1993-12-23

Family

ID=25323291

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87104937T Expired - Lifetime DE3788155D1 (de) 1986-04-28 1987-04-03 Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe.

Country Status (4)

Country Link
US (1) US4752668A (de)
EP (1) EP0247331B1 (de)
JP (1) JPS62257731A (de)
DE (1) DE3788155D1 (de)

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DE10203795B4 (de) * 2002-01-31 2021-12-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements
JP2003302745A (ja) * 2002-04-12 2003-10-24 Dainippon Printing Co Ltd 異物の無害化方法
KR20040111319A (ko) * 2002-05-13 2004-12-31 가부시기가이샤 디스코 레이저빔을 사용한 가공기
US7067763B2 (en) 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
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DE102010025403A1 (de) 2009-07-23 2011-01-27 Luk Lamellen Und Kupplungsbau Beteiligungs Kg Verfahren zur Herstellung eines Reibbelags und Reibbelag
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DE102011078825B4 (de) * 2011-07-07 2018-07-19 Sauer Gmbh Lasertec Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks
CN103170481A (zh) * 2011-12-26 2013-06-26 财团法人金属工业研究发展中心 放电加工模具表面清洁方法
CN103048815B (zh) * 2013-01-15 2015-09-09 深圳市华星光电技术有限公司 阵列基板修复装置及方法
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Also Published As

Publication number Publication date
US4752668A (en) 1988-06-21
EP0247331A2 (de) 1987-12-02
JPS62257731A (ja) 1987-11-10
EP0247331A3 (en) 1989-10-11
EP0247331B1 (de) 1993-11-18

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Legal Events

Date Code Title Description
8332 No legal effect for de