DE3884903D1 - Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe. - Google Patents

Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe.

Info

Publication number
DE3884903D1
DE3884903D1 DE88101301T DE3884903T DE3884903D1 DE 3884903 D1 DE3884903 D1 DE 3884903D1 DE 88101301 T DE88101301 T DE 88101301T DE 3884903 T DE3884903 T DE 3884903T DE 3884903 D1 DE3884903 D1 DE 3884903D1
Authority
DE
Germany
Prior art keywords
cutting
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88101301T
Other languages
English (en)
Other versions
DE3884903T2 (de
Inventor
Honda Katsuo Honda Katsuo
Sawafuji Susumu Sawafuj Susumu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62274536A external-priority patent/JPH01115603A/ja
Priority claimed from JP62274537A external-priority patent/JPH01115604A/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE3884903D1 publication Critical patent/DE3884903D1/de
Application granted granted Critical
Publication of DE3884903T2 publication Critical patent/DE3884903T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE88101301T 1987-10-29 1988-01-29 Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe. Expired - Fee Related DE3884903T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62274536A JPH01115603A (ja) 1987-10-29 1987-10-29 ウエハの切断方法
JP62274537A JPH01115604A (ja) 1987-10-29 1987-10-29 ウエハの切断装置

Publications (2)

Publication Number Publication Date
DE3884903D1 true DE3884903D1 (de) 1993-11-18
DE3884903T2 DE3884903T2 (de) 1994-02-10

Family

ID=26551071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88101301T Expired - Fee Related DE3884903T2 (de) 1987-10-29 1988-01-29 Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe.

Country Status (4)

Country Link
US (2) US4852304A (de)
EP (2) EP0534499A3 (de)
KR (1) KR930001284B1 (de)
DE (1) DE3884903T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3737540C1 (de) * 1987-11-05 1989-06-22 Mueller Georg Nuernberg Verfahren und Maschine zum Herstellen von Ronden mit zumindest einer planen Oberflaeche
BE1002045A4 (fr) * 1988-05-26 1990-06-05 Biebuyck Sa Ets Procede de tronconnage-flettage combines a l'aide d'outils abrasifs d'articles de verrerie ou de cristallerie et dispositif mettant en oeuvre le procede.
US5111622A (en) * 1989-05-18 1992-05-12 Silicon Technology Corporation Slicing and grinding system for a wafer slicing machine
JPH0767692B2 (ja) * 1989-09-07 1995-07-26 株式会社東京精密 スライシングマシンの切断方法
JPH0695504B2 (ja) * 1989-10-31 1994-11-24 直江津電子工業株式会社 ウエハ枚葉式内周刃２分割切断装置におけるウエハ供給回収装置
JP2505930B2 (ja) * 1990-05-10 1996-06-12 株式会社東京精密 スライシングマシンの切断方法
US5018938A (en) * 1990-05-18 1991-05-28 At&T Bell Laboratories Method and apparatus for separating chips
US5185956A (en) * 1990-05-18 1993-02-16 Silicon Technology Corporation Wafer slicing and grinding system
US5189843A (en) * 1990-08-30 1993-03-02 Silicon Technology Corporation Wafer slicing and grinding machine and a method of slicing and grinding wafers
JPH04193443A (ja) * 1990-11-26 1992-07-13 Brother Ind Ltd 工作機械用補助装置
JPH078495B2 (ja) * 1990-11-29 1995-02-01 信越半導体株式会社 単結晶引上装置の単結晶絞り部自動切断装置
DE4134110A1 (de) * 1991-10-15 1993-04-22 Wacker Chemitronic Verfahren zum rotationssaegen sproedharter werkstoffe, insbesondere solcher mit durchmessern ueber 200 mm in duenne scheiben vermittels innenlochsaege und vorrichtung zur durchfuehrung des verfahrens
DE4136566C1 (de) * 1991-11-07 1993-04-22 Gmn Georg Mueller Nuernberg Ag, 8500 Nuernberg, De
JP2903916B2 (ja) * 1992-11-30 1999-06-14 信越半導体株式会社 半導体インゴット加工方法
US5285600A (en) * 1992-12-17 1994-02-15 Ford Motor Company Apparatus and method for finishing a workpiece
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JPH07323420A (ja) * 1994-06-02 1995-12-12 Tokyo Seimitsu Co Ltd ウェーハ製造方法及びその装置
US5632666A (en) * 1994-10-28 1997-05-27 Memc Electronic Materials, Inc. Method and apparatus for automated quality control in wafer slicing
JP3174484B2 (ja) * 1995-06-30 2001-06-11 株式会社東京精密 平面研削内周刃切断複合加工機
US5667428A (en) * 1995-10-18 1997-09-16 Lunn; Garfield R. Apparatus for cutting and grinding a workpiece
KR100219700B1 (ko) * 1995-10-30 1999-09-01 손욱 음극선관용편향요오크
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
US5816892A (en) * 1997-02-06 1998-10-06 Cobra Machine Tool Co., Inc. Positioning control for combined milling machine and internally positioned grinding wheel
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US6358851B1 (en) * 2000-04-04 2002-03-19 Taiwan Semiconductor Manufacturing Company Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
US7638091B2 (en) * 2004-07-02 2009-12-29 Sabic Innovative Plastics Ip B. V. Methods of sterilizing polycarbonate articles and methods of manufacture
CN102229010A (zh) * 2011-04-01 2011-11-02 浙江恒成硬质合金有限公司 切片机
CN103273576B (zh) * 2013-05-15 2015-05-13 马达德 一种疏松砂岩岩心薄片制备装置
CN106514880B (zh) * 2016-11-15 2018-04-10 周志花 一种原石加工方法
CN106738387B (zh) * 2016-11-15 2018-09-11 周志花 一种原石的切割方法
CN106738386B (zh) * 2016-11-15 2019-02-26 周志花 原石打磨流水线
CN106826491B (zh) * 2016-12-27 2018-09-21 重庆晶宇光电科技有限公司 用于晶片研磨的加工设备
CN112428100A (zh) * 2020-11-23 2021-03-02 上饶市迈创商贸有限公司 一种圆形半导体材料快速抛磨设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
US3577861A (en) * 1969-04-07 1971-05-11 Kayex Corp Transfer device for cutting apparatus
US3662733A (en) * 1969-10-12 1972-05-16 Yoji Hattori Annular cutting apparatus with work removal means
US3828758A (en) * 1972-09-27 1974-08-13 P Cary Machine for producing thin section specimens
US4084354A (en) * 1977-06-03 1978-04-18 International Business Machines Corporation Process for slicing boules of single crystal material
FR2469259A1 (fr) * 1979-08-08 1981-05-22 Radiotechnique Compelec Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede
JPS61106207A (ja) * 1984-10-31 1986-05-24 株式会社東京精密 ウエハー製造方法並びに装置
JPS61114813A (ja) * 1984-11-09 1986-06-02 日立精工株式会社 切断方法
JPS6296400A (ja) * 1985-10-23 1987-05-02 Mitsubishi Metal Corp ウエハの製造方法
JPS62106207A (ja) * 1985-10-31 1987-05-16 株式会社東芝 蒸気タ−ビンプラントにおける給水装置
JPS62224537A (ja) * 1986-03-25 1987-10-02 Citizen Watch Co Ltd 薄基板製造用の複合加工機
DE3613132A1 (de) * 1986-04-18 1987-10-22 Mueller Georg Nuernberg Verfahren zum zerteilen von harten, nichtmetallischen werkstoffen
JPS62264835A (ja) * 1986-05-08 1987-11-17 Citizen Watch Co Ltd 薄基板製造用の複合加工機
JPS62264836A (ja) * 1986-05-08 1987-11-17 Citizen Watch Co Ltd 薄基板用複合加工機
JP3047670B2 (ja) * 1993-04-08 2000-05-29 トヨタ自動車株式会社 電気自動車用エンジン駆動発電機の制御装置
JPH106207A (ja) * 1996-06-18 1998-01-13 Tokyo Seimitsu Co Ltd 研磨装置用定盤
JPH114813A (ja) * 1997-06-17 1999-01-12 Nippon Colin Co Ltd 脈波強度表示機能を備えた自動血圧測定装置

Also Published As

Publication number Publication date
EP0313714B1 (de) 1993-10-13
KR930001284B1 (ko) 1993-02-25
EP0313714A1 (de) 1989-05-03
DE3884903T2 (de) 1994-02-10
EP0534499A3 (en) 1993-04-21
KR890007392A (ko) 1989-06-19
EP0534499A2 (de) 1993-03-31
US4894956A (en) 1990-01-23
US4852304A (en) 1989-08-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee