DE69011125D1 - Verfahren und vorrichtung zum ausrichten von zusammenarbeitenden werkzeugen. - Google Patents

Verfahren und vorrichtung zum ausrichten von zusammenarbeitenden werkzeugen.

Info

Publication number
DE69011125D1
DE69011125D1 DE69011125T DE69011125T DE69011125D1 DE 69011125 D1 DE69011125 D1 DE 69011125D1 DE 69011125 T DE69011125 T DE 69011125T DE 69011125 T DE69011125 T DE 69011125T DE 69011125 D1 DE69011125 D1 DE 69011125D1
Authority
DE
Germany
Prior art keywords
tooling tools
aligning tooling
aligning
tools
tooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69011125T
Other languages
English (en)
Inventor
James Wehrly
Michael Bertram
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microelectronics and Computer Technology Corp
Original Assignee
Microelectronics and Computer Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microelectronics and Computer Technology Corp filed Critical Microelectronics and Computer Technology Corp
Application granted granted Critical
Publication of DE69011125D1 publication Critical patent/DE69011125D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B26F1/14—Punching tools; Punching dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8821—With simple rectilinear reciprocating motion only
    • Y10T83/8855—With spaced guide pins [e.g., die set leader pins]

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
DE69011125T 1989-09-28 1990-08-30 Verfahren und vorrichtung zum ausrichten von zusammenarbeitenden werkzeugen. Expired - Lifetime DE69011125D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/414,549 US4945954A (en) 1989-09-28 1989-09-28 Method and apparatus for aligning mating form tools
PCT/US1990/004943 WO1991004808A1 (en) 1989-09-28 1990-08-30 Method and apparatus for aligning mating form tools

Publications (1)

Publication Number Publication Date
DE69011125D1 true DE69011125D1 (de) 1994-09-01

Family

ID=23641931

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69011125T Expired - Lifetime DE69011125D1 (de) 1989-09-28 1990-08-30 Verfahren und vorrichtung zum ausrichten von zusammenarbeitenden werkzeugen.

Country Status (5)

Country Link
US (1) US4945954A (de)
EP (1) EP0493411B1 (de)
JP (1) JPH05500776A (de)
DE (1) DE69011125D1 (de)
WO (1) WO1991004808A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5070916A (en) * 1990-06-11 1991-12-10 Universal Instruments Corporation Apparatus for processing a molded carrier ring device
US5271146A (en) * 1990-07-06 1993-12-21 Matsushita Electric Industrial Co., Ltd. Electronic component supplying apparatus
US5105857A (en) * 1990-10-31 1992-04-21 Microtek Industries, Inc. System for forming leads for surface mounted components
DE4121108C1 (de) * 1991-06-26 1992-10-01 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
US5210936A (en) * 1992-01-06 1993-05-18 Microelectronics And Computer Technology Corporation Method and apparatus for the excise and lead form of TAB devices
US5241740A (en) * 1992-08-24 1993-09-07 Kettler John H Automated excise-form and shuttle system and apparatus
US5368217A (en) * 1993-08-25 1994-11-29 Microelectronics And Computer Technology Corporation High force compression flip chip bonding method and system
AU7481798A (en) * 1997-05-13 1998-12-08 Taltec Systems, Inc. Pick and place cutting head that separates chip scale packages from a multi-layered film strip
US6041639A (en) * 1999-02-09 2000-03-28 The Boeing Company Method and apparatus for stretch-forming and shearing sheet metal
US6311597B1 (en) * 1999-05-24 2001-11-06 Humdinger, Inc. Self-guiding punch and die set
JP3473533B2 (ja) * 2000-01-18 2003-12-08 ヤマハ株式会社 穿孔装置及び穿孔装置に使用される穿孔用ユニット
US6435067B1 (en) 2000-05-22 2002-08-20 Jere F. Irwin Apparatus and method for registering articles during a web processing operation
GB0402842D0 (en) * 2004-02-10 2004-03-17 Rolls Royce Plc A forming die
KR200353165Y1 (ko) * 2004-03-26 2004-06-14 디앤크래프트 주식회사 네 방향 펀칭이 가능한 펀치
US7624491B2 (en) * 2005-10-13 2009-12-01 The Boeing Company System and method for fabricating composite parts
TWM289953U (en) * 2005-11-24 2006-04-21 Inventec Corp Cutting tool of circuit board disposed with electronic devices
US8464567B2 (en) * 2008-04-24 2013-06-18 Crown Packaging Technology, Inc. Distributed drives for a multi-stage can necking machine
US8245551B2 (en) 2008-04-24 2012-08-21 Crown Packaging Technology, Inc. Adjustable transfer assembly for container manufacturing process
US7997111B2 (en) * 2008-04-24 2011-08-16 Crown, Packaging Technology, Inc. Apparatus for rotating a container body
US8601843B2 (en) 2008-04-24 2013-12-10 Crown Packaging Technology, Inc. High speed necking configuration
CN101925292B (zh) * 2009-06-11 2014-03-26 鸿富锦精密工业（深圳）有限公司 电子元件引脚校正装置及方法
KR20120103003A (ko) * 2011-03-09 2012-09-19 삼성디스플레이 주식회사 인서트 부재, 이를 갖는 인쇄 회로 필름 타발 장치 및 인쇄 회로 필름 타발 방법
EP3088095B1 (de) * 2015-04-29 2019-07-17 TRUMPF Werkzeugmaschinen GmbH + Co. KG Verfahren zum bearbeiten von plattenartigen werkstücken
CN111496912B (zh) * 2020-04-29 2021-12-03 滁州市锴模装备模具制造有限公司 一种冰箱内胆模具冲压装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997907A (en) * 1957-11-22 1961-08-29 Constantino Alfred Self aligning punching apparatus
US3417643A (en) * 1966-07-13 1968-12-24 Edward D. Bennett Punching apparatus
US4064917A (en) * 1976-10-18 1977-12-27 Honeywell Information Systems Inc. Apparatus for cutting and forming flexible beam leads of an integrated circuit chip
DE2944684C2 (de) * 1979-11-06 1984-03-22 Thomas 7500 Karlsruhe Weresch Vorrichtung zum Bearbeiten der Anschlußdrähte von elektrischen Bauelementen
CA1130996A (en) * 1980-02-14 1982-09-07 Franciscus J. A. Storimans Machine for forming the leads of electric components
DE3311792C2 (de) * 1983-03-31 1985-01-24 Blaupunkt-Werke Gmbh, 3200 Hildesheim Vorrichtung zum Richten von Anschlußdrähten elektrischer Bauelemente
US4488581A (en) * 1983-05-19 1984-12-18 Amp Incorporated Terminal alignment tool
GB8314628D0 (en) * 1983-05-26 1983-06-29 Ambotech Ltd Bending leg of component in printed circuit board
US4633920A (en) * 1984-07-17 1987-01-06 Avco Corporation Positioning device
US4787426A (en) * 1985-03-11 1988-11-29 American Tech Manufacturing, Inc. High-speed electrical component lead forming apparatus and method
US4691747A (en) * 1986-03-27 1987-09-08 Advanced Micro Devices, Inc. Controlled deformation alignment method and apparatus
US4926677A (en) * 1987-12-03 1990-05-22 Kurt Waldner Die apparatus

Also Published As

Publication number Publication date
WO1991004808A1 (en) 1991-04-18
US4945954A (en) 1990-08-07
EP0493411A1 (de) 1992-07-08
JPH05500776A (ja) 1993-02-18
EP0493411B1 (de) 1994-07-27
EP0493411A4 (en) 1992-08-12

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Legal Events

Date Code Title Description
8332 No legal effect for de