AU7481798A - Pick and place cutting head that separates chip scale packages from a multi-layered film strip - Google Patents

Pick and place cutting head that separates chip scale packages from a multi-layered film strip

Info

Publication number
AU7481798A
AU7481798A AU74817/98A AU7481798A AU7481798A AU 7481798 A AU7481798 A AU 7481798A AU 74817/98 A AU74817/98 A AU 74817/98A AU 7481798 A AU7481798 A AU 7481798A AU 7481798 A AU7481798 A AU 7481798A
Authority
AU
Australia
Prior art keywords
pick
cutting head
film strip
layered film
chip scale
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU74817/98A
Inventor
Ron Browne
Thomas A. La Rovere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TALTEC SYSTEMS Inc
Original Assignee
TALTEC SYSTEMS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TALTEC SYSTEMS Inc filed Critical TALTEC SYSTEMS Inc
Publication of AU7481798A publication Critical patent/AU7481798A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
AU74817/98A 1997-05-13 1998-05-12 Pick and place cutting head that separates chip scale packages from a multi-layered film strip Abandoned AU7481798A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4688497P 1997-05-13 1997-05-13
US60046884 1997-05-13
PCT/US1998/009665 WO1998052212A1 (en) 1997-05-13 1998-05-12 Pick and place cutting head that separates chip scale packages from a multi-layered film strip

Publications (1)

Publication Number Publication Date
AU7481798A true AU7481798A (en) 1998-12-08

Family

ID=21945920

Family Applications (1)

Application Number Title Priority Date Filing Date
AU74817/98A Abandoned AU7481798A (en) 1997-05-13 1998-05-12 Pick and place cutting head that separates chip scale packages from a multi-layered film strip

Country Status (3)

Country Link
AU (1) AU7481798A (en)
TW (1) TW411309B (en)
WO (1) WO1998052212A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003506216A (en) * 1999-08-03 2003-02-18 イクシィル・テクノロジー・リミテッド Circuit singulation system and method
JP2001196328A (en) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Method of splitting csp substrate
ES2277696B1 (en) * 2004-04-06 2008-06-01 Index Servicios De Ingenieria, S.L. PROCEDURE FOR TROQUELAR AND DISPENSE ON A PIECE, AND CORRESPONDING DEVICE.
TW200714379A (en) * 2005-06-30 2007-04-16 Fico Bv Method and device for cleaning electronic components processed with a laser beam
US9499921B2 (en) 2012-07-30 2016-11-22 Rayton Solar Inc. Float zone silicon wafer manufacturing system and related process
US9404198B2 (en) * 2012-07-30 2016-08-02 Rayton Solar Inc. Processes and apparatuses for manufacturing wafers
JP2015139835A (en) * 2014-01-27 2015-08-03 株式会社安川電機 Robot system, suction hand, and manufacturing method of product including workpiece
CN113681632A (en) * 2021-08-20 2021-11-23 吉安嘉之宏电子有限公司 Automatic FPC defective products marking equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064917A (en) * 1976-10-18 1977-12-27 Honeywell Information Systems Inc. Apparatus for cutting and forming flexible beam leads of an integrated circuit chip
US4945954A (en) * 1989-09-28 1990-08-07 Microelectronics And Computer Technology Corporation Method and apparatus for aligning mating form tools

Also Published As

Publication number Publication date
WO1998052212A1 (en) 1998-11-19
TW411309B (en) 2000-11-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase