DE3686614D1 - Vorrichtung und verfahren zum automatisierten manipulieren einer kassette. - Google Patents
Vorrichtung und verfahren zum automatisierten manipulieren einer kassette.Info
- Publication number
- DE3686614D1 DE3686614D1 DE8686106653T DE3686614T DE3686614D1 DE 3686614 D1 DE3686614 D1 DE 3686614D1 DE 8686106653 T DE8686106653 T DE 8686106653T DE 3686614 T DE3686614 T DE 3686614T DE 3686614 D1 DE3686614 D1 DE 3686614D1
- Authority
- DE
- Germany
- Prior art keywords
- cassette
- automated manipulation
- manipulation
- automated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/13—Handlers utilizing parallel links
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Warehouses Or Storage Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/759,013 US4705444A (en) | 1985-07-24 | 1985-07-24 | Apparatus for automated cassette handling |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3686614D1 true DE3686614D1 (de) | 1992-10-08 |
DE3686614T2 DE3686614T2 (de) | 1993-04-29 |
Family
ID=25054051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686106653T Expired - Fee Related DE3686614T2 (de) | 1985-07-24 | 1986-05-15 | Vorrichtung und verfahren zum automatisierten manipulieren einer kassette. |
Country Status (4)
Country | Link |
---|---|
US (2) | US4705444A (de) |
EP (1) | EP0209660B1 (de) |
JP (1) | JPH0618231B2 (de) |
DE (1) | DE3686614T2 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5097421A (en) * | 1984-12-24 | 1992-03-17 | Asyst Technologies, Inc. | Intelligent waxer carrier |
JPH0821609B2 (ja) * | 1985-08-26 | 1996-03-04 | アシスト テクノロジ−ス | 標準機械的インタ−フェ−ス装置用のマニピュレ−タ |
US4826360A (en) * | 1986-03-10 | 1989-05-02 | Shimizu Construction Co., Ltd. | Transfer system in a clean room |
US5176493A (en) * | 1989-02-24 | 1993-01-05 | North American Philips Corporation | High speed wafer handling method |
US4995430A (en) * | 1989-05-19 | 1991-02-26 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
JP2905857B2 (ja) * | 1989-08-11 | 1999-06-14 | 東京エレクトロン株式会社 | 縦型処理装置 |
US5162047A (en) * | 1989-08-28 | 1992-11-10 | Tokyo Electron Sagami Limited | Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers |
US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
US5339952A (en) * | 1992-06-19 | 1994-08-23 | International Business Machines Corporation | Transfer container for transferring flimsy circuit panels under clean room conditions |
US5395198A (en) * | 1992-06-19 | 1995-03-07 | International Business Machines Corporation | Vacuum loading chuck and fixture for flexible printed circuit panels |
US5364225A (en) * | 1992-06-19 | 1994-11-15 | Ibm | Method of printed circuit panel manufacture |
US5451131A (en) * | 1992-06-19 | 1995-09-19 | International Business Machines Corporation | Dockable interface airlock between process enclosure and interprocess transfer container |
KR100302012B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크 |
KR100303075B1 (ko) | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
DE4326309C1 (de) * | 1993-08-05 | 1994-09-15 | Jenoptik Jena Gmbh | Vorrichtung zum Transport von Wafermagazinen |
US5538390A (en) * | 1993-10-29 | 1996-07-23 | Applied Materials, Inc. | Enclosure for load lock interface |
US5570987A (en) * | 1993-12-14 | 1996-11-05 | W. L. Gore & Associates, Inc. | Semiconductor wafer transport container |
US5544421A (en) * | 1994-04-28 | 1996-08-13 | Semitool, Inc. | Semiconductor wafer processing system |
US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
AU2368495A (en) * | 1994-04-28 | 1995-11-29 | Semitool, Incorporated | Semiconductor processing system with wafer container docking and loading station |
US6833035B1 (en) | 1994-04-28 | 2004-12-21 | Semitool, Inc. | Semiconductor processing system with wafer container docking and loading station |
DE4417491C2 (de) * | 1994-05-19 | 1999-07-15 | Keiper Gmbh & Co | Fanghaken zur lösbaren Verriegelung der mit dem Sitzteil eines Fahrzeugsitzes vorschwenkbar verbundenen Rückenlehne |
US5482161A (en) * | 1994-05-24 | 1996-01-09 | Fluoroware, Inc. | Mechanical interface wafer container |
DE4430844C1 (de) * | 1994-08-31 | 1996-02-22 | Jenoptik Technologie Gmbh | Beschickungseinrichtung für Halbleiterbearbeitungsanlagen |
DE4430846C2 (de) * | 1994-08-31 | 1997-04-10 | Jenoptik Jena Gmbh | Einrichtung zur Umsetzung eines Transportobjektes zwischen zwei Endlagen |
US5766404A (en) * | 1994-12-05 | 1998-06-16 | March Instruments, Inc. | Methods and apparatus for plasma treatment of workpieces |
US6245189B1 (en) | 1994-12-05 | 2001-06-12 | Nordson Corporation | High Throughput plasma treatment system |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
US5586585A (en) * | 1995-02-27 | 1996-12-24 | Asyst Technologies, Inc. | Direct loadlock interface |
US5984610A (en) * | 1995-03-07 | 1999-11-16 | Fortrend Engineering Corporation | Pod loader interface |
US5674123A (en) * | 1995-07-18 | 1997-10-07 | Semifab | Docking and environmental purging system for integrated circuit wafer transport assemblies |
DE19612114C2 (de) * | 1996-03-27 | 1998-08-13 | Jenoptik Jena Gmbh | Einrichtung zur Verstellung eines Aufnahmeelementes in einem Reinstraum |
US5879458A (en) * | 1996-09-13 | 1999-03-09 | Semifab Incorporated | Molecular contamination control system |
EP0875921A1 (de) * | 1997-05-03 | 1998-11-04 | Stäubli AG Pfäffikon | Umladevorrichtung für Wafer |
US5847529A (en) * | 1997-04-18 | 1998-12-08 | Taiwan Semiconductor Manufacturing Co. Ltd. | Robot protection system |
US5944602A (en) * | 1997-09-09 | 1999-08-31 | Tumi Manufacturing, Inc. | Portable cleanroom cabinet assembly |
US6427096B1 (en) | 1999-02-12 | 2002-07-30 | Honeywell International Inc. | Processing tool interface apparatus for use in manufacturing environment |
JP3730810B2 (ja) * | 1999-07-09 | 2006-01-05 | 東京エレクトロン株式会社 | 容器の移動装置および方法 |
US6972071B1 (en) | 1999-07-13 | 2005-12-06 | Nordson Corporation | High-speed symmetrical plasma treatment system |
US6709522B1 (en) | 2000-07-11 | 2004-03-23 | Nordson Corporation | Material handling system and methods for a multichamber plasma treatment system |
US6841033B2 (en) * | 2001-03-21 | 2005-01-11 | Nordson Corporation | Material handling system and method for a multi-workpiece plasma treatment system |
US6726429B2 (en) | 2002-02-19 | 2004-04-27 | Vertical Solutions, Inc. | Local store for a wafer processing station |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
ITBO20120686A1 (it) * | 2012-12-19 | 2014-06-20 | Marchesini Group Spa | Sistema di carico e di alimentazione di articoli per una apparecchiatura di confezionamento operante in ambiente sterile |
CN103400789B (zh) * | 2013-08-01 | 2018-01-26 | 上海集成电路研发中心有限公司 | 设备平台系统及其晶圆传输方法 |
US10069030B2 (en) * | 2015-12-14 | 2018-09-04 | Solarcity Corporation | Load lock solar cell transfer system |
US20190240848A1 (en) * | 2016-07-27 | 2019-08-08 | Sinfonia Technology Co., Ltd. | Germ-free glove box |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB710309A (en) * | 1951-04-20 | 1954-06-09 | George Max Arnold Kustner | Improvements in stacking and/or transporting devices |
US3052366A (en) * | 1960-04-18 | 1962-09-04 | Wilber O Duncan | Power operated bale pilers |
US3651957A (en) * | 1970-03-02 | 1972-03-28 | Motorola Inc | Chip packaging and transporting apparatus |
US4047624A (en) * | 1975-10-21 | 1977-09-13 | Airco, Inc. | Workpiece handling system for vacuum processing |
DE2702974A1 (de) * | 1977-01-25 | 1978-07-27 | Maschf Augsburg Nuernberg Ag | Einrichtung zum versetzen von gegenstaenden, insbesondere von werkstuecken hinueber zu einer werkzeugmaschine, und anordnung der einrichtung |
US4345866A (en) * | 1980-02-22 | 1982-08-24 | Acco Industries Inc. | Loader-unloader system for work pieces |
US4343584A (en) * | 1980-07-11 | 1982-08-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Apparatus for sequentially transporting containers |
FR2512425A1 (fr) * | 1981-09-09 | 1983-03-11 | Cit Alcatel | Agencement de manutention de plaquettes a chargeurs verticaux et tapis roulant |
US4500407A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Disk or wafer handling and coating system |
US4532970A (en) * | 1983-09-28 | 1985-08-06 | Hewlett-Packard Company | Particle-free dockable interface for integrated circuit processing |
JPH067566B2 (ja) * | 1983-09-28 | 1994-01-26 | ヒューレット・パッカード・カンパニー | 集積回路処理装置 |
US4534389A (en) * | 1984-03-29 | 1985-08-13 | Hewlett-Packard Company | Interlocking door latch for dockable interface for integrated circuit processing |
US4668484A (en) * | 1984-02-13 | 1987-05-26 | Elliott David J | Transport containers for semiconductor wafers |
US4558984A (en) * | 1984-05-18 | 1985-12-17 | Varian Associates, Inc. | Wafer lifting and holding apparatus |
US4674939A (en) * | 1984-07-30 | 1987-06-23 | Asyst Technologies | Sealed standard interface apparatus |
US4815912A (en) * | 1984-12-24 | 1989-03-28 | Asyst Technologies, Inc. | Box door actuated retainer |
-
1985
- 1985-07-24 US US06/759,013 patent/US4705444A/en not_active Expired - Lifetime
-
1986
- 1986-05-15 DE DE8686106653T patent/DE3686614T2/de not_active Expired - Fee Related
- 1986-05-15 EP EP86106653A patent/EP0209660B1/de not_active Expired
- 1986-07-23 JP JP61173508A patent/JPH0618231B2/ja not_active Expired - Lifetime
-
1987
- 1987-07-09 US US07/072,181 patent/US4923353A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0209660A2 (de) | 1987-01-28 |
EP0209660A3 (en) | 1989-08-02 |
DE3686614T2 (de) | 1993-04-29 |
US4705444A (en) | 1987-11-10 |
JPH0618231B2 (ja) | 1994-03-09 |
EP0209660B1 (de) | 1992-09-02 |
JPS6224640A (ja) | 1987-02-02 |
US4923353A (en) | 1990-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |