DE3686614T2 - Vorrichtung und verfahren zum automatisierten manipulieren einer kassette. - Google Patents

Vorrichtung und verfahren zum automatisierten manipulieren einer kassette.

Info

Publication number
DE3686614T2
DE3686614T2 DE8686106653T DE3686614T DE3686614T2 DE 3686614 T2 DE3686614 T2 DE 3686614T2 DE 8686106653 T DE8686106653 T DE 8686106653T DE 3686614 T DE3686614 T DE 3686614T DE 3686614 T2 DE3686614 T2 DE 3686614T2
Authority
DE
Germany
Prior art keywords
cassette
automated manipulation
manipulation
automated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686106653T
Other languages
English (en)
Other versions
DE3686614D1 (de
Inventor
Barclay J Tullis
John S Bailey
D R Gunawardena
Ulrich Kaempf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE3686614D1 publication Critical patent/DE3686614D1/de
Application granted granted Critical
Publication of DE3686614T2 publication Critical patent/DE3686614T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/13—Handlers utilizing parallel links
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
DE8686106653T 1985-07-24 1986-05-15 Vorrichtung und verfahren zum automatisierten manipulieren einer kassette. Expired - Fee Related DE3686614T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/759,013 US4705444A (en) 1985-07-24 1985-07-24 Apparatus for automated cassette handling

Publications (2)

Publication Number Publication Date
DE3686614D1 DE3686614D1 (de) 1992-10-08
DE3686614T2 true DE3686614T2 (de) 1993-04-29

Family

ID=25054051

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686106653T Expired - Fee Related DE3686614T2 (de) 1985-07-24 1986-05-15 Vorrichtung und verfahren zum automatisierten manipulieren einer kassette.

Country Status (4)

Country Link
US (2) US4705444A (de)
EP (1) EP0209660B1 (de)
JP (1) JPH0618231B2 (de)
DE (1) DE3686614T2 (de)

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US5097421A (en) * 1984-12-24 1992-03-17 Asyst Technologies, Inc. Intelligent waxer carrier
EP0238541B1 (de) * 1985-08-26 1992-10-07 Asyst Technologies Manipulator für mechanische standardkoppelsysteme
US4826360A (en) * 1986-03-10 1989-05-02 Shimizu Construction Co., Ltd. Transfer system in a clean room
US5176493A (en) * 1989-02-24 1993-01-05 North American Philips Corporation High speed wafer handling method
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
JP2905857B2 (ja) * 1989-08-11 1999-06-14 東京エレクトロン株式会社 縦型処理装置
US5162047A (en) * 1989-08-28 1992-11-10 Tokyo Electron Sagami Limited Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
US5451131A (en) * 1992-06-19 1995-09-19 International Business Machines Corporation Dockable interface airlock between process enclosure and interprocess transfer container
US5339952A (en) * 1992-06-19 1994-08-23 International Business Machines Corporation Transfer container for transferring flimsy circuit panels under clean room conditions
US5364225A (en) * 1992-06-19 1994-11-15 Ibm Method of printed circuit panel manufacture
US5395198A (en) * 1992-06-19 1995-03-07 International Business Machines Corporation Vacuum loading chuck and fixture for flexible printed circuit panels
KR100303075B1 (ko) 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
KR100302012B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen
US5538390A (en) * 1993-10-29 1996-07-23 Applied Materials, Inc. Enclosure for load lock interface
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US6833035B1 (en) 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US5544421A (en) * 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
AU2368495A (en) * 1994-04-28 1995-11-29 Semitool, Incorporated Semiconductor processing system with wafer container docking and loading station
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
DE4417491C2 (de) * 1994-05-19 1999-07-15 Keiper Gmbh & Co Fanghaken zur lösbaren Verriegelung der mit dem Sitzteil eines Fahrzeugsitzes vorschwenkbar verbundenen Rückenlehne
US5482161A (en) * 1994-05-24 1996-01-09 Fluoroware, Inc. Mechanical interface wafer container
DE4430846C2 (de) * 1994-08-31 1997-04-10 Jenoptik Jena Gmbh Einrichtung zur Umsetzung eines Transportobjektes zwischen zwei Endlagen
DE4430844C1 (de) * 1994-08-31 1996-02-22 Jenoptik Technologie Gmbh Beschickungseinrichtung für Halbleiterbearbeitungsanlagen
US5766404A (en) * 1994-12-05 1998-06-16 March Instruments, Inc. Methods and apparatus for plasma treatment of workpieces
US6245189B1 (en) 1994-12-05 2001-06-12 Nordson Corporation High Throughput plasma treatment system
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
US5984610A (en) * 1995-03-07 1999-11-16 Fortrend Engineering Corporation Pod loader interface
US5674123A (en) * 1995-07-18 1997-10-07 Semifab Docking and environmental purging system for integrated circuit wafer transport assemblies
DE19612114C2 (de) * 1996-03-27 1998-08-13 Jenoptik Jena Gmbh Einrichtung zur Verstellung eines Aufnahmeelementes in einem Reinstraum
US5879458A (en) 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
EP0875921A1 (de) * 1997-05-03 1998-11-04 Stäubli AG Pfäffikon Umladevorrichtung für Wafer
US5847529A (en) * 1997-04-18 1998-12-08 Taiwan Semiconductor Manufacturing Co. Ltd. Robot protection system
US5944602A (en) * 1997-09-09 1999-08-31 Tumi Manufacturing, Inc. Portable cleanroom cabinet assembly
US6427096B1 (en) 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
JP3730810B2 (ja) * 1999-07-09 2006-01-05 東京エレクトロン株式会社 容器の移動装置および方法
US6972071B1 (en) 1999-07-13 2005-12-06 Nordson Corporation High-speed symmetrical plasma treatment system
US6709522B1 (en) 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US6726429B2 (en) 2002-02-19 2004-04-27 Vertical Solutions, Inc. Local store for a wafer processing station
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
ITBO20120686A1 (it) * 2012-12-19 2014-06-20 Marchesini Group Spa Sistema di carico e di alimentazione di articoli per una apparecchiatura di confezionamento operante in ambiente sterile
CN103400789B (zh) * 2013-08-01 2018-01-26 上海集成电路研发中心有限公司 设备平台系统及其晶圆传输方法
US10069030B2 (en) * 2015-12-14 2018-09-04 Solarcity Corporation Load lock solar cell transfer system
JPWO2018021195A1 (ja) * 2016-07-27 2019-05-09 シンフォニアテクノロジー株式会社 無菌グローブボックス

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Publication number Priority date Publication date Assignee Title
GB710309A (en) * 1951-04-20 1954-06-09 George Max Arnold Kustner Improvements in stacking and/or transporting devices
US3052366A (en) * 1960-04-18 1962-09-04 Wilber O Duncan Power operated bale pilers
US3651957A (en) * 1970-03-02 1972-03-28 Motorola Inc Chip packaging and transporting apparatus
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
DE2702974A1 (de) * 1977-01-25 1978-07-27 Maschf Augsburg Nuernberg Ag Einrichtung zum versetzen von gegenstaenden, insbesondere von werkstuecken hinueber zu einer werkzeugmaschine, und anordnung der einrichtung
US4345866A (en) * 1980-02-22 1982-08-24 Acco Industries Inc. Loader-unloader system for work pieces
US4343584A (en) * 1980-07-11 1982-08-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Apparatus for sequentially transporting containers
FR2512425A1 (fr) * 1981-09-09 1983-03-11 Cit Alcatel Agencement de manutention de plaquettes a chargeurs verticaux et tapis roulant
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
JPH067566B2 (ja) * 1983-09-28 1994-01-26 ヒューレット・パッカード・カンパニー 集積回路処理装置
US4534389A (en) * 1984-03-29 1985-08-13 Hewlett-Packard Company Interlocking door latch for dockable interface for integrated circuit processing
US4668484A (en) * 1984-02-13 1987-05-26 Elliott David J Transport containers for semiconductor wafers
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
US4674939A (en) * 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
US4815912A (en) * 1984-12-24 1989-03-28 Asyst Technologies, Inc. Box door actuated retainer

Also Published As

Publication number Publication date
DE3686614D1 (de) 1992-10-08
US4923353A (en) 1990-05-08
JPH0618231B2 (ja) 1994-03-09
JPS6224640A (ja) 1987-02-02
EP0209660A3 (en) 1989-08-02
EP0209660B1 (de) 1992-09-02
EP0209660A2 (de) 1987-01-28
US4705444A (en) 1987-11-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee