DE3751333D1 - Verfahren zum Entfernen von Photoresists auf Halbleitersubstraten. - Google Patents
Verfahren zum Entfernen von Photoresists auf Halbleitersubstraten.Info
- Publication number
- DE3751333D1 DE3751333D1 DE3751333T DE3751333T DE3751333D1 DE 3751333 D1 DE3751333 D1 DE 3751333D1 DE 3751333 T DE3751333 T DE 3751333T DE 3751333 T DE3751333 T DE 3751333T DE 3751333 D1 DE3751333 D1 DE 3751333D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor substrates
- removing photoresists
- photoresists
- substrates
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61030327A JPH0773104B2 (ja) | 1986-02-14 | 1986-02-14 | レジスト剥離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3751333D1 true DE3751333D1 (de) | 1995-07-13 |
DE3751333T2 DE3751333T2 (de) | 1995-10-19 |
Family
ID=12300714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3751333T Expired - Fee Related DE3751333T2 (de) | 1986-02-14 | 1987-02-09 | Verfahren zum Entfernen von Photoresists auf Halbleitersubstraten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4938839A (de) |
EP (1) | EP0234387B1 (de) |
JP (1) | JPH0773104B2 (de) |
KR (1) | KR900003256B1 (de) |
DE (1) | DE3751333T2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6445123A (en) * | 1987-08-14 | 1989-02-17 | Hitachi Ltd | Method and apparatus for ashing |
EP0305946B1 (de) * | 1987-08-28 | 1996-10-30 | Kabushiki Kaisha Toshiba | Plasma-Entschichtungsverfahren für organische und anorganische Schichten |
JP2785027B2 (ja) * | 1989-01-10 | 1998-08-13 | 日本真空技術株式会社 | プラズマアッシング方法 |
KR900013595A (ko) * | 1989-02-15 | 1990-09-06 | 미다 가쓰시게 | 플라즈마 에칭방법 및 장치 |
EP0397315B1 (de) * | 1989-05-08 | 1995-03-01 | Applied Materials, Inc. | Verfahren und Vorrichtung zum Erwärmen und Kühlen von Plättchen in einer Halbleiterplättchenbearbeitungseinrichtung |
JPH031530A (ja) * | 1989-05-29 | 1991-01-08 | Tokuda Seisakusho Ltd | ドライエッチング装置 |
US5378317A (en) * | 1990-10-09 | 1995-01-03 | Chlorine Engineers Corp., Ltd. | Method for removing organic film |
JPH04352157A (ja) * | 1991-05-30 | 1992-12-07 | Toyota Autom Loom Works Ltd | レジスト除去方法 |
JPH06177088A (ja) * | 1992-08-31 | 1994-06-24 | Sony Corp | アッシング方法及びアッシング装置 |
JP3391410B2 (ja) * | 1993-09-17 | 2003-03-31 | 富士通株式会社 | レジストマスクの除去方法 |
KR0126801B1 (ko) * | 1993-12-22 | 1998-04-02 | 김광호 | 반도체 장치의 배선 형성방법 |
US5646814A (en) | 1994-07-15 | 1997-07-08 | Applied Materials, Inc. | Multi-electrode electrostatic chuck |
US5592358A (en) | 1994-07-18 | 1997-01-07 | Applied Materials, Inc. | Electrostatic chuck for magnetic flux processing |
JPH08186098A (ja) * | 1994-12-27 | 1996-07-16 | Ryoden Semiconductor Syst Eng Kk | 感光性樹脂の除去方法および除去装置 |
US6323168B1 (en) * | 1996-07-03 | 2001-11-27 | Advanced Technology Materials, Inc. | Post plasma ashing wafer cleaning formulation |
WO1998022568A1 (en) * | 1996-11-22 | 1998-05-28 | Advanced Chemical Systems International, Inc. | Stripping formulation including catechol, hydroxylamine, non-alkanolamine, water for post plasma ashed wafer cleaning |
US5972796A (en) * | 1996-12-12 | 1999-10-26 | Texas Instruments Incorporated | In-situ barc and nitride etch process |
US6024887A (en) * | 1997-06-03 | 2000-02-15 | Taiwan Semiconductor Manufacturing Company | Plasma method for stripping ion implanted photoresist layers |
US6536449B1 (en) | 1997-11-17 | 2003-03-25 | Mattson Technology Inc. | Downstream surface cleaning process |
US6080680A (en) * | 1997-12-19 | 2000-06-27 | Lam Research Corporation | Method and composition for dry etching in semiconductor fabrication |
TW434877B (en) | 1998-12-03 | 2001-05-16 | Matsushita Electronics Corp | Semiconductor memory device and method for manufacturing the same |
US6420251B1 (en) * | 1999-01-05 | 2002-07-16 | Trw Inc. | Method for fabricating a microelectronic integrated circuit with improved step coverage |
US6309976B1 (en) * | 1999-03-22 | 2001-10-30 | Taiwan Semiconductor Manufacturing Company | Critical dimension controlled method of plasma descum for conventional quarter micron and smaller dimension binary mask manufacture |
US6805139B1 (en) | 1999-10-20 | 2004-10-19 | Mattson Technology, Inc. | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing |
US20050022839A1 (en) * | 1999-10-20 | 2005-02-03 | Savas Stephen E. | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing |
US7270724B2 (en) | 2000-12-13 | 2007-09-18 | Uvtech Systems, Inc. | Scanning plasma reactor |
US6524936B2 (en) | 2000-12-22 | 2003-02-25 | Axcelis Technologies, Inc. | Process for removal of photoresist after post ion implantation |
US6773683B2 (en) * | 2001-01-08 | 2004-08-10 | Uvtech Systems, Inc. | Photocatalytic reactor system for treating flue effluents |
TWI226059B (en) * | 2001-06-11 | 2005-01-01 | Sony Corp | Method for manufacturing master disk for optical recording medium having pits and projections, stamper, and optical recording medium |
TW508648B (en) * | 2001-12-11 | 2002-11-01 | United Microelectronics Corp | Method of reducing the chamber particle level |
US6720132B2 (en) * | 2002-01-08 | 2004-04-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bi-layer photoresist dry development and reactive ion etch method |
US7067235B2 (en) * | 2002-01-15 | 2006-06-27 | Ming Huan Tsai | Bi-layer photoresist dry development and reactive ion etch method |
US20050279453A1 (en) * | 2004-06-17 | 2005-12-22 | Uvtech Systems, Inc. | System and methods for surface cleaning |
US20070054492A1 (en) * | 2004-06-17 | 2007-03-08 | Elliott David J | Photoreactive removal of ion implanted resist |
US20110061679A1 (en) * | 2004-06-17 | 2011-03-17 | Uvtech Systems, Inc. | Photoreactive Removal of Ion Implanted Resist |
US20070186953A1 (en) * | 2004-07-12 | 2007-08-16 | Savas Stephen E | Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing |
KR100814409B1 (ko) * | 2006-08-14 | 2008-03-18 | 삼성전자주식회사 | 애싱 방법 및 이를 수행하기 위한 장치 |
US20080156264A1 (en) | 2006-12-27 | 2008-07-03 | Novellus Systems, Inc. | Plasma Generator Apparatus |
US20080156631A1 (en) * | 2006-12-27 | 2008-07-03 | Novellus Systems, Inc. | Methods of Producing Plasma in a Container |
US9591738B2 (en) * | 2008-04-03 | 2017-03-07 | Novellus Systems, Inc. | Plasma generator systems and methods of forming plasma |
US8916022B1 (en) | 2008-09-12 | 2014-12-23 | Novellus Systems, Inc. | Plasma generator systems and methods of forming plasma |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5226274B2 (de) * | 1973-01-25 | 1977-07-13 | ||
JPS53112065A (en) * | 1977-03-11 | 1978-09-30 | Toshiba Corp | Removing method of high molecular compound |
US4292384A (en) * | 1977-09-30 | 1981-09-29 | Horizons Research Incorporated | Gaseous plasma developing and etching process employing low voltage DC generation |
US4264393A (en) * | 1977-10-31 | 1981-04-28 | Motorola, Inc. | Reactor apparatus for plasma etching or deposition |
US4241165A (en) * | 1978-09-05 | 1980-12-23 | Motorola, Inc. | Plasma development process for photoresist |
JPS5766642A (en) * | 1980-10-09 | 1982-04-22 | Mitsubishi Electric Corp | Plasma etching device |
JPS5796529A (en) * | 1980-12-09 | 1982-06-15 | Fujitsu Ltd | Microwave plasma treating method |
JPS58153332A (ja) * | 1982-03-08 | 1983-09-12 | Mitsubishi Electric Corp | ドライエツチング装置 |
JPS6060060A (ja) * | 1983-09-12 | 1985-04-06 | 株式会社日立製作所 | 鉄道車両の扉開閉装置 |
US4522681A (en) * | 1984-04-23 | 1985-06-11 | General Electric Company | Method for tapered dry etching |
US4673456A (en) * | 1985-09-17 | 1987-06-16 | Machine Technology, Inc. | Microwave apparatus for generating plasma afterglows |
-
1986
- 1986-02-14 JP JP61030327A patent/JPH0773104B2/ja not_active Expired - Fee Related
-
1987
- 1987-02-09 EP EP87101772A patent/EP0234387B1/de not_active Expired - Lifetime
- 1987-02-09 DE DE3751333T patent/DE3751333T2/de not_active Expired - Fee Related
- 1987-02-09 KR KR1019870001043A patent/KR900003256B1/ko not_active IP Right Cessation
-
1988
- 1988-10-11 US US07/257,165 patent/US4938839A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3751333T2 (de) | 1995-10-19 |
JPH0773104B2 (ja) | 1995-08-02 |
KR900003256B1 (ko) | 1990-05-12 |
EP0234387B1 (de) | 1995-06-07 |
US4938839A (en) | 1990-07-03 |
KR870008379A (ko) | 1987-09-26 |
JPS62208636A (ja) | 1987-09-12 |
EP0234387A3 (en) | 1989-02-01 |
EP0234387A2 (de) | 1987-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |