FR2731637B1 - Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere - Google Patents

Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere

Info

Publication number
FR2731637B1
FR2731637B1 FR9503043A FR9503043A FR2731637B1 FR 2731637 B1 FR2731637 B1 FR 2731637B1 FR 9503043 A FR9503043 A FR 9503043A FR 9503043 A FR9503043 A FR 9503043A FR 2731637 B1 FR2731637 B1 FR 2731637B1
Authority
FR
France
Prior art keywords
ablation
photo
polymeric mass
polymeric
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9503043A
Other languages
English (en)
Other versions
FR2731637A1 (fr
Inventor
Bernard Lacour
Vincent Baudinaud
Bruno Esmiller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Group SAS
Original Assignee
Airbus Group SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airbus Group SAS filed Critical Airbus Group SAS
Priority to FR9503043A priority Critical patent/FR2731637B1/fr
Publication of FR2731637A1 publication Critical patent/FR2731637A1/fr
Application granted granted Critical
Publication of FR2731637B1 publication Critical patent/FR2731637B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
FR9503043A 1995-03-16 1995-03-16 Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere Expired - Fee Related FR2731637B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9503043A FR2731637B1 (fr) 1995-03-16 1995-03-16 Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9503043A FR2731637B1 (fr) 1995-03-16 1995-03-16 Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere

Publications (2)

Publication Number Publication Date
FR2731637A1 FR2731637A1 (fr) 1996-09-20
FR2731637B1 true FR2731637B1 (fr) 1997-05-16

Family

ID=9477076

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9503043A Expired - Fee Related FR2731637B1 (fr) 1995-03-16 1995-03-16 Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere

Country Status (1)

Country Link
FR (1) FR2731637B1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6335208B1 (en) 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
EP1440608B1 (fr) 2001-11-02 2006-02-15 ATMEL Germany GmbH Procede pour ouvrir le boitier en plastique d'un module electronique
DE10154017A1 (de) * 2001-11-02 2003-05-15 Atmel Germany Gmbh Verfahren zum Schutz einer kunststoffgehäusten elektronischen Baugruppe
DE10154021A1 (de) * 2001-11-02 2003-05-15 Atmel Germany Gmbh Verfahren zum Messen einer elektronischen Baugruppe
US7271012B2 (en) * 2003-07-15 2007-09-18 Control Systemation, Inc. Failure analysis methods and systems
CN102692447B (zh) * 2012-06-11 2014-04-02 燕山大学 小型化强脉冲单轨放电烧蚀装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328410A (en) * 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
US4752668A (en) * 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
JP2603873B2 (ja) * 1989-01-09 1997-04-23 三菱電機株式会社 レ−ザ加工機及びレ−ザ加工方法
US4969722A (en) * 1989-03-17 1990-11-13 Gmf Robotics Corporation Device for delivering a collimated beam such as a laser beam
EP0398082A1 (fr) * 1989-05-19 1990-11-22 Siemens Aktiengesellschaft Procédé de fabrication d'une lentille optique
US4940881A (en) * 1989-09-28 1990-07-10 Tamarack Scientific Co., Inc. Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions

Also Published As

Publication number Publication date
FR2731637A1 (fr) 1996-09-20

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse