DE3685623T2 - Duennfilmtransistor und verfahren zu seiner herstellung. - Google Patents
Duennfilmtransistor und verfahren zu seiner herstellung.Info
- Publication number
- DE3685623T2 DE3685623T2 DE8686113674T DE3685623T DE3685623T2 DE 3685623 T2 DE3685623 T2 DE 3685623T2 DE 8686113674 T DE8686113674 T DE 8686113674T DE 3685623 T DE3685623 T DE 3685623T DE 3685623 T2 DE3685623 T2 DE 3685623T2
- Authority
- DE
- Germany
- Prior art keywords
- film transistor
- production
- semiconductor layer
- thin film
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000010408 film Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/04—Contact lenses for the eyes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78663—Amorphous silicon transistors
- H01L29/78666—Amorphous silicon transistors with normal-type structure, e.g. with top gate
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60221666A JPH0622244B2 (ja) | 1985-10-04 | 1985-10-04 | 薄膜トランジスタ及びその製造方法 |
JP60221667A JPS6281065A (ja) | 1985-10-04 | 1985-10-04 | 薄膜トランジスタ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3685623D1 DE3685623D1 (de) | 1992-07-16 |
DE3685623T2 true DE3685623T2 (de) | 1992-12-24 |
Family
ID=26524429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686113674T Expired - Lifetime DE3685623T2 (de) | 1985-10-04 | 1986-10-03 | Duennfilmtransistor und verfahren zu seiner herstellung. |
Country Status (5)
Country | Link |
---|---|
US (2) | US4864376A (de) |
EP (1) | EP0217406B1 (de) |
KR (1) | KR900000066B1 (de) |
AT (1) | ATE77177T1 (de) |
DE (1) | DE3685623T2 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE77177T1 (de) * | 1985-10-04 | 1992-06-15 | Hosiden Corp | Duennfilmtransistor und verfahren zu seiner herstellung. |
US4990460A (en) * | 1989-01-27 | 1991-02-05 | Nec Corporation | Fabrication method for thin film field effect transistor array suitable for liquid crystal display |
US5053347A (en) * | 1989-08-03 | 1991-10-01 | Industrial Technology Research Institute | Amorphous silicon thin film transistor with a depletion gate |
JP2976483B2 (ja) * | 1990-04-24 | 1999-11-10 | 日本電気株式会社 | 液晶表示素子用薄膜トランジスタの製造方法 |
US5198694A (en) * | 1990-10-05 | 1993-03-30 | General Electric Company | Thin film transistor structure with improved source/drain contacts |
KR920008834A (ko) * | 1990-10-09 | 1992-05-28 | 아이자와 스스무 | 박막 반도체 장치 |
KR950013784B1 (ko) * | 1990-11-20 | 1995-11-16 | 가부시키가이샤 한도오따이 에네루기 겐큐쇼 | 반도체 전계효과 트랜지스터 및 그 제조방법과 박막트랜지스터 |
US5849601A (en) | 1990-12-25 | 1998-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
US7115902B1 (en) | 1990-11-20 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
US7098479B1 (en) | 1990-12-25 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
US7576360B2 (en) | 1990-12-25 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device which comprises thin film transistors and method for manufacturing the same |
CA2061796C (en) * | 1991-03-28 | 2002-12-24 | Kalluri R. Sarma | High mobility integrated drivers for active matrix displays |
JP3255942B2 (ja) * | 1991-06-19 | 2002-02-12 | 株式会社半導体エネルギー研究所 | 逆スタガ薄膜トランジスタの作製方法 |
KR950003235B1 (ko) * | 1991-12-30 | 1995-04-06 | 주식회사 금성사 | 반도체 소자의 구조 |
JP3378280B2 (ja) * | 1992-11-27 | 2003-02-17 | 株式会社東芝 | 薄膜トランジスタおよびその製造方法 |
US7081938B1 (en) | 1993-12-03 | 2006-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
JP3272532B2 (ja) * | 1993-12-27 | 2002-04-08 | 富士通株式会社 | 半導体装置の製造方法 |
US6790714B2 (en) * | 1995-07-03 | 2004-09-14 | Sanyo Electric Co., Ltd. | Semiconductor device, display device and method of fabricating the same |
US5771110A (en) * | 1995-07-03 | 1998-06-23 | Sanyo Electric Co., Ltd. | Thin film transistor device, display device and method of fabricating the same |
US6800875B1 (en) | 1995-11-17 | 2004-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix electro-luminescent display device with an organic leveling layer |
TW439003B (en) | 1995-11-17 | 2001-06-07 | Semiconductor Energy Lab | Display device |
JPH09146108A (ja) | 1995-11-17 | 1997-06-06 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその駆動方法 |
KR100198556B1 (ko) * | 1995-11-22 | 1999-07-01 | 구자홍 | 박막트랜지스터의 구조 및 제조방법 |
TW309633B (de) | 1995-12-14 | 1997-07-01 | Handotai Energy Kenkyusho Kk | |
JP2757850B2 (ja) * | 1996-04-18 | 1998-05-25 | 日本電気株式会社 | 薄膜トランジスタおよびその製造方法 |
US5913113A (en) * | 1997-02-24 | 1999-06-15 | Lg Electronics Inc. | Method for fabricating a thin film transistor of a liquid crystal display device |
GB9726094D0 (en) * | 1997-12-10 | 1998-02-11 | Philips Electronics Nv | Thin film transistors and electronic devices comprising such |
KR100330096B1 (ko) * | 1998-11-27 | 2002-10-25 | 삼성전자 주식회사 | 액정표시장치 |
US6475836B1 (en) | 1999-03-29 | 2002-11-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
KR100524622B1 (ko) * | 1999-04-03 | 2005-11-01 | 엘지.필립스 엘시디 주식회사 | 폴리실리콘 반도체층을 포함한 박막트랜지스터 제조방법 |
US6407617B1 (en) * | 1999-11-19 | 2002-06-18 | Matsushita Electric Industrial Co., Ltd. | Bias circuit and method of fabricating semiconductor device |
US6620719B1 (en) * | 2000-03-31 | 2003-09-16 | International Business Machines Corporation | Method of forming ohmic contacts using a self doping layer for thin-film transistors |
KR101406889B1 (ko) * | 2007-12-24 | 2014-06-13 | 삼성디스플레이 주식회사 | 박막트랜지스터 및 그의 제조 방법 |
JP5363009B2 (ja) * | 2008-02-29 | 2013-12-11 | 株式会社ジャパンディスプレイ | 表示装置およびその製造方法 |
KR20090108431A (ko) * | 2008-04-11 | 2009-10-15 | 삼성전자주식회사 | 표시 기판 및 그 제조 방법 |
CN103022150B (zh) * | 2012-12-25 | 2015-05-20 | 京东方科技集团股份有限公司 | 一种薄膜晶体管、其制备方法、阵列基板及显示装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1139170A (en) * | 1965-12-22 | 1969-01-08 | Mullard Ltd | Thin film transistors |
US3616527A (en) * | 1968-07-15 | 1971-11-02 | Ncr Co | Method of accurately doping a semiconductor material layer |
US4040073A (en) * | 1975-08-29 | 1977-08-02 | Westinghouse Electric Corporation | Thin film transistor and display panel using the transistor |
JPS54154289A (en) * | 1978-05-26 | 1979-12-05 | Matsushita Electric Ind Co Ltd | Manufacture of thin-film transistor array |
DE3028718C2 (de) * | 1979-07-31 | 1982-08-19 | Sharp K.K., Osaka | Dünnfilmtransistor in Verbindung mit einer Anzeigevorrichtung |
GB2107115B (en) * | 1981-07-17 | 1985-05-09 | Citizen Watch Co Ltd | Method of manufacturing insulated gate thin film effect transitors |
US4558340A (en) * | 1983-06-29 | 1985-12-10 | Stauffer Chemical Company | Thin film field effect transistors utilizing a polypnictide semiconductor |
US4398340A (en) * | 1982-04-26 | 1983-08-16 | The United States Of America As Represented By The Secretary Of The Army | Method for making thin film field effect transistors |
JPS58218169A (ja) * | 1982-06-14 | 1983-12-19 | Seiko Epson Corp | 半導体集積回路装置 |
JPH0693509B2 (ja) * | 1983-08-26 | 1994-11-16 | シャープ株式会社 | 薄膜トランジスタ |
JPS6052058A (ja) * | 1983-09-01 | 1985-03-23 | Komatsu Ltd | 薄膜トランジスタ |
JPS6083370A (ja) * | 1983-10-14 | 1985-05-11 | Hitachi Ltd | 多結晶シリコン薄膜トランジスタ |
GB8406330D0 (en) * | 1984-03-10 | 1984-04-11 | Lucas Ind Plc | Amorphous silicon field effect transistors |
JPH0697317B2 (ja) * | 1984-04-11 | 1994-11-30 | ホシデン株式会社 | 液晶表示器 |
US4727044A (en) * | 1984-05-18 | 1988-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making a thin film transistor with laser recrystallized source and drain |
ATE77177T1 (de) * | 1985-10-04 | 1992-06-15 | Hosiden Corp | Duennfilmtransistor und verfahren zu seiner herstellung. |
JPS6281057A (ja) * | 1985-10-04 | 1987-04-14 | Hosiden Electronics Co Ltd | 透明導電膜 |
JPS6329977A (ja) * | 1986-07-23 | 1988-02-08 | Komatsu Ltd | 薄膜トランジスタの製造方法 |
JP2572379B2 (ja) * | 1986-07-31 | 1997-01-16 | 株式会社日立製作所 | 薄膜トランジスタの製造方法 |
JPS63172469A (ja) * | 1987-01-12 | 1988-07-16 | Fujitsu Ltd | 薄膜トランジスタ |
US4849797A (en) * | 1987-01-23 | 1989-07-18 | Hosiden Electronics Co., Ltd. | Thin film transistor |
US4762398A (en) * | 1987-01-26 | 1988-08-09 | Hosiden Electronics Co., Ltd. | Pixel transistor free of parasitic capacitance fluctuations from misalignment |
US4918504A (en) * | 1987-07-31 | 1990-04-17 | Nippon Telegraph And Telephone Corporation | Active matrix cell |
JPS6449478A (en) * | 1987-08-20 | 1989-02-23 | Mitsubishi Electric Corp | Synchronizing signal processing circuit |
JPS6449473A (en) * | 1987-08-20 | 1989-02-23 | Sanyo Electric Co | Facsimile equipment |
JPH01183853A (ja) * | 1988-01-19 | 1989-07-21 | Toshiba Corp | 薄膜電界効果トランジスタとその製造方法 |
JP3198990B2 (ja) * | 1997-06-17 | 2001-08-13 | 日新電機株式会社 | コンデンサ装置 |
-
1986
- 1986-10-03 AT AT86113674T patent/ATE77177T1/de not_active IP Right Cessation
- 1986-10-03 DE DE8686113674T patent/DE3685623T2/de not_active Expired - Lifetime
- 1986-10-03 EP EP86113674A patent/EP0217406B1/de not_active Expired - Lifetime
- 1986-10-04 KR KR1019860008313A patent/KR900000066B1/ko not_active IP Right Cessation
-
1988
- 1988-07-22 US US07/222,296 patent/US4864376A/en not_active Expired - Lifetime
-
1989
- 1989-08-28 US US07/399,141 patent/US5061648A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5061648A (en) | 1991-10-29 |
DE3685623D1 (de) | 1992-07-16 |
US4864376A (en) | 1989-09-05 |
KR900000066B1 (ko) | 1990-01-19 |
EP0217406A3 (en) | 1988-01-07 |
EP0217406B1 (de) | 1992-06-10 |
ATE77177T1 (de) | 1992-06-15 |
EP0217406A2 (de) | 1987-04-08 |
KR870004325A (ko) | 1987-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HOSIDEN AND PHILIPS DISPLAY CORP., KOBE, HYOGO, JP |
|
8339 | Ceased/non-payment of the annual fee |