DE3606068A1 - Harzmischung zur herstellung von laminierten artikeln - Google Patents

Harzmischung zur herstellung von laminierten artikeln

Info

Publication number
DE3606068A1
DE3606068A1 DE19863606068 DE3606068A DE3606068A1 DE 3606068 A1 DE3606068 A1 DE 3606068A1 DE 19863606068 DE19863606068 DE 19863606068 DE 3606068 A DE3606068 A DE 3606068A DE 3606068 A1 DE3606068 A1 DE 3606068A1
Authority
DE
Germany
Prior art keywords
polymer
butadiene
parts
weight
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19863606068
Other languages
German (de)
English (en)
Inventor
Hajime Fujisawa Kanagawa Hara
Fumiaki Yokohama Kanagawa Oshimi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Oil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oil Corp filed Critical Nippon Oil Corp
Publication of DE3606068A1 publication Critical patent/DE3606068A1/de
Priority to US07/017,242 priority Critical patent/US4767782A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
DE19863606068 1985-02-22 1986-02-21 Harzmischung zur herstellung von laminierten artikeln Withdrawn DE3606068A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07/017,242 US4767782A (en) 1986-02-21 1987-02-20 Propargyl cinnamates, their preparation and their use for controlling pests

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3408585A JPS61192720A (ja) 1985-02-22 1985-02-22 積層板用樹脂組成物

Publications (1)

Publication Number Publication Date
DE3606068A1 true DE3606068A1 (de) 1986-08-28

Family

ID=12404422

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863606068 Withdrawn DE3606068A1 (de) 1985-02-22 1986-02-21 Harzmischung zur herstellung von laminierten artikeln

Country Status (2)

Country Link
JP (1) JPS61192720A (enrdf_load_stackoverflow)
DE (1) DE3606068A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0415749A3 (en) * 1989-08-31 1992-06-03 Amoco Corporation Epoxy resins containing epoxidized polybutenes
DE4138411A1 (de) * 1991-11-22 1993-05-27 Bosch Gmbh Robert Haertende vergussmassen
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62218464A (ja) * 1986-03-19 1987-09-25 Toshiba Chem Corp 積層板用ワニス
JPH0641506B2 (ja) * 1989-04-25 1994-06-01 松下電工株式会社 硬化性エポキシ樹脂組成物
JPH0641504B2 (ja) * 1989-04-25 1994-06-01 松下電工株式会社 硬化性エポキシ樹脂組成物
JPH0641505B2 (ja) * 1989-04-25 1994-06-01 松下電工株式会社 硬化性エポキシ樹脂組成物
JPH0641503B2 (ja) * 1989-04-25 1994-06-01 松下電工株式会社 硬化性エポキシ樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347827B2 (enrdf_load_stackoverflow) * 1973-07-03 1978-12-23
JPS55126452A (en) * 1979-03-24 1980-09-30 Fujitsu Ltd Heat resisting property laminated board
JPS5889614A (ja) * 1981-11-24 1983-05-28 Shin Kobe Electric Mach Co Ltd 難燃性積層板の製造法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0415749A3 (en) * 1989-08-31 1992-06-03 Amoco Corporation Epoxy resins containing epoxidized polybutenes
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes
DE4138411A1 (de) * 1991-11-22 1993-05-27 Bosch Gmbh Robert Haertende vergussmassen

Also Published As

Publication number Publication date
JPH0446969B2 (enrdf_load_stackoverflow) 1992-07-31
JPS61192720A (ja) 1986-08-27

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee