DE2604735A1 - Integrierter halbleiterbaustein - Google Patents

Integrierter halbleiterbaustein

Info

Publication number
DE2604735A1
DE2604735A1 DE19762604735 DE2604735A DE2604735A1 DE 2604735 A1 DE2604735 A1 DE 2604735A1 DE 19762604735 DE19762604735 DE 19762604735 DE 2604735 A DE2604735 A DE 2604735A DE 2604735 A1 DE2604735 A1 DE 2604735A1
Authority
DE
Germany
Prior art keywords
region
type
conductivity type
area
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762604735
Other languages
German (de)
English (en)
Inventor
Tadaharu Tsuyuki
Hajime Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE2604735A1 publication Critical patent/DE2604735A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0112Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H10D84/0119Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including complementary BJTs
    • H10D84/0121Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including complementary BJTs the complementary BJTs being vertical BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/67Complementary BJTs
    • H10D84/673Vertical complementary BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
DE19762604735 1975-02-08 1976-02-06 Integrierter halbleiterbaustein Withdrawn DE2604735A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50016561A JPS5914897B2 (ja) 1975-02-08 1975-02-08 半導体装置

Publications (1)

Publication Number Publication Date
DE2604735A1 true DE2604735A1 (de) 1976-08-19

Family

ID=11919681

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762604735 Withdrawn DE2604735A1 (de) 1975-02-08 1976-02-06 Integrierter halbleiterbaustein

Country Status (8)

Country Link
JP (1) JPS5914897B2 (enrdf_load_stackoverflow)
CA (1) CA1048655A (enrdf_load_stackoverflow)
CH (1) CH607332A5 (enrdf_load_stackoverflow)
DE (1) DE2604735A1 (enrdf_load_stackoverflow)
FR (1) FR2300417A1 (enrdf_load_stackoverflow)
GB (1) GB1533156A (enrdf_load_stackoverflow)
IT (1) IT1055132B (enrdf_load_stackoverflow)
NL (1) NL7601307A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0093304A1 (en) * 1982-04-19 1983-11-09 Matsushita Electric Industrial Co., Ltd. Semiconductor IC and method of making the same
FR2581796A1 (fr) * 1985-05-09 1986-11-14 Sgs Microelettronica Spa Circuit integre bipolaire comprenant des transistors pnp verticaux avec collecteur sur le substrat, et procede pour la realisation d'un tel circuit

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126960A (en) * 1980-03-11 1981-10-05 Nec Corp Manufacture of semiconductor device
JPS61164399U (enrdf_load_stackoverflow) * 1985-03-30 1986-10-11
JPS6386192U (enrdf_load_stackoverflow) * 1986-11-19 1988-06-06
EP0301468B1 (en) * 1987-07-29 1993-08-25 Fairchild Semiconductor Corporation Process for fabricating complementary contactless vertical bipolar transistors
JPH02296994A (ja) * 1989-05-09 1990-12-07 Fujita Corp 泥漿シールド機のカツターヘツド
JPH03128793U (enrdf_load_stackoverflow) * 1990-04-10 1991-12-25
JPH0450493U (enrdf_load_stackoverflow) * 1990-08-31 1992-04-28
FR3106931B1 (fr) 2020-01-30 2022-02-18 St Microelectronics Crolles 2 Sas Procédé de fabrication d’un dispositif comprenant un transistor bipolaire PNP et un transistor bipolaire NPN pour applications radiofréquences

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147583B2 (enrdf_load_stackoverflow) * 1972-12-29 1976-12-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0093304A1 (en) * 1982-04-19 1983-11-09 Matsushita Electric Industrial Co., Ltd. Semiconductor IC and method of making the same
FR2581796A1 (fr) * 1985-05-09 1986-11-14 Sgs Microelettronica Spa Circuit integre bipolaire comprenant des transistors pnp verticaux avec collecteur sur le substrat, et procede pour la realisation d'un tel circuit

Also Published As

Publication number Publication date
CA1048655A (en) 1979-02-13
FR2300417A1 (fr) 1976-09-03
JPS5191680A (enrdf_load_stackoverflow) 1976-08-11
FR2300417B1 (enrdf_load_stackoverflow) 1980-03-21
NL7601307A (nl) 1976-08-10
GB1533156A (en) 1978-11-22
JPS5914897B2 (ja) 1984-04-06
IT1055132B (it) 1981-12-21
CH607332A5 (enrdf_load_stackoverflow) 1978-12-15

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination