DE2449688C3 - Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper - Google Patents

Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper

Info

Publication number
DE2449688C3
DE2449688C3 DE2449688A DE2449688A DE2449688C3 DE 2449688 C3 DE2449688 C3 DE 2449688C3 DE 2449688 A DE2449688 A DE 2449688A DE 2449688 A DE2449688 A DE 2449688A DE 2449688 C3 DE2449688 C3 DE 2449688C3
Authority
DE
Germany
Prior art keywords
layer
semiconductor body
dopant
polycrystalline
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2449688A
Other languages
German (de)
English (en)
Other versions
DE2449688B2 (de
DE2449688A1 (de
Inventor
Juergen Dipl.-Ing. Dr. 8022 Gruenwald Graul
Helmuth Dipl.-Phys. Dr. 8012 Ottobrunn Murrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2449688A priority Critical patent/DE2449688C3/de
Priority to GB3486775A priority patent/GB1464801A/en
Priority to CA236,668A priority patent/CA1055620A/en
Priority to US05/621,071 priority patent/US4063967A/en
Priority to FR7531393A priority patent/FR2288391A1/fr
Priority to IT28325/75A priority patent/IT1043400B/it
Priority to JP50125207A priority patent/JPS5952533B2/ja
Publication of DE2449688A1 publication Critical patent/DE2449688A1/de
Publication of DE2449688B2 publication Critical patent/DE2449688B2/de
Application granted granted Critical
Publication of DE2449688C3 publication Critical patent/DE2449688C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133—Emitter regions of BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60—Impurity distributions or concentrations
    • H10P32/1414—
    • H10P32/171—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/024—Defect control-gettering and annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/122—Polycrystalline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/124—Polycrystalline emitter

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
DE2449688A 1974-10-18 1974-10-18 Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper Expired DE2449688C3 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE2449688A DE2449688C3 (de) 1974-10-18 1974-10-18 Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper
GB3486775A GB1464801A (en) 1974-10-18 1975-08-22 Production of doped zones of one conductivity type in semi conductor bodies
CA236,668A CA1055620A (en) 1974-10-18 1975-09-30 Semiconductor diffusions from ion implanted films
US05/621,071 US4063967A (en) 1974-10-18 1975-10-09 Method of producing a doped zone of one conductivity type in a semiconductor body utilizing an ion-implanted polycrystalline dopant source
FR7531393A FR2288391A1 (fr) 1974-10-18 1975-10-14 Procede pour la realisation d'une zone dopee d'un type de conductibilite dans un corps semi-conducteur, ainsi qu'un transistor fabrique selon ce procede
IT28325/75A IT1043400B (it) 1974-10-18 1975-10-16 Procedimento per fobmare una zona drogata di un tipo di conduzione in un corpo di materiale semicon duttore nonche transistore fabbricato secondo tale procedimento
JP50125207A JPS5952533B2 (ja) 1974-10-18 1975-10-17 半導体内にド−プ領域を作る方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2449688A DE2449688C3 (de) 1974-10-18 1974-10-18 Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper

Publications (3)

Publication Number Publication Date
DE2449688A1 DE2449688A1 (de) 1976-04-22
DE2449688B2 DE2449688B2 (de) 1979-10-04
DE2449688C3 true DE2449688C3 (de) 1980-07-10

Family

ID=5928640

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2449688A Expired DE2449688C3 (de) 1974-10-18 1974-10-18 Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper

Country Status (7)

Country Link
US (1) US4063967A (cg-RX-API-DMAC10.html)
JP (1) JPS5952533B2 (cg-RX-API-DMAC10.html)
CA (1) CA1055620A (cg-RX-API-DMAC10.html)
DE (1) DE2449688C3 (cg-RX-API-DMAC10.html)
FR (1) FR2288391A1 (cg-RX-API-DMAC10.html)
GB (1) GB1464801A (cg-RX-API-DMAC10.html)
IT (1) IT1043400B (cg-RX-API-DMAC10.html)

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DE2627855A1 (de) * 1976-06-22 1977-12-29 Siemens Ag Halbleiterbauelement mit wenigstens zwei, einen pn-uebergang bildenden zonen unterschiedlichen leitungstyps sowie verfahren zu dessen herstellung
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US4190466A (en) * 1977-12-22 1980-02-26 International Business Machines Corporation Method for making a bipolar transistor structure utilizing self-passivating diffusion sources
US4118250A (en) * 1977-12-30 1978-10-03 International Business Machines Corporation Process for producing integrated circuit devices by ion implantation
US4155779A (en) * 1978-08-21 1979-05-22 Bell Telephone Laboratories, Incorporated Control techniques for annealing semiconductors
US4214918A (en) * 1978-10-12 1980-07-29 Stanford University Method of forming polycrystalline semiconductor interconnections, resistors and contacts by applying radiation beam
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JPS5586151A (en) * 1978-12-23 1980-06-28 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor integrated circuit
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JPS5638815A (en) * 1979-09-07 1981-04-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
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DE3064143D1 (en) * 1979-12-03 1983-08-18 Ibm Process for producing a vertical pnp transistor and transistor so produced
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US4301588A (en) * 1980-02-01 1981-11-24 International Business Machines Corporation Consumable amorphous or polysilicon emitter process
US4803528A (en) * 1980-07-28 1989-02-07 General Electric Company Insulating film having electrically conducting portions
US4339285A (en) * 1980-07-28 1982-07-13 Rca Corporation Method for fabricating adjacent conducting and insulating regions in a film by laser irradiation
US4411708A (en) * 1980-08-25 1983-10-25 Trw Inc. Method of making precision doped polysilicon vertical ballast resistors by multiple implantations
JPS5766674A (en) * 1980-10-09 1982-04-22 Toshiba Corp Semiconductor device
JPS5931556Y2 (ja) * 1980-11-28 1984-09-06 功 田中 農作物の収納用網袋
JPS5793525A (en) * 1980-12-03 1982-06-10 Nec Corp Manufacture of semiconductor device
JPS5795625A (en) 1980-12-04 1982-06-14 Toshiba Corp Manufacture of semiconductor device
US4391651A (en) * 1981-10-15 1983-07-05 The United States Of America As Represented By The Secretary Of The Navy Method of forming a hyperabrupt interface in a GaAs substrate
JPS58122724A (ja) * 1982-01-18 1983-07-21 Toshiba Corp 半導体素子の製造方法
EP0101737A4 (en) * 1982-02-26 1984-08-20 Western Electric Co DIFFUSION OF SHALLOW DEEP REGIONS.
US4472212A (en) * 1982-02-26 1984-09-18 At&T Bell Laboratories Method for fabricating a semiconductor device
JPS58188157A (ja) * 1982-04-28 1983-11-02 Toshiba Corp 半導体装置およびその製造方法
US4437897A (en) 1982-05-18 1984-03-20 International Business Machines Corporation Fabrication process for a shallow emitter/base transistor using same polycrystalline layer
US4471524A (en) * 1982-06-01 1984-09-18 At&T Bell Laboratories Method for manufacturing an insulated gate field effect transistor device
CA1198226A (en) * 1982-06-01 1985-12-17 Eliezer Kinsbron Method for manufacturing a semiconductor device
US4888297A (en) * 1982-09-20 1989-12-19 International Business Machines Corporation Process for making a contact structure including polysilicon and metal alloys
GB2130793B (en) * 1982-11-22 1986-09-03 Gen Electric Co Plc Forming a doped region in a semiconductor body
JPS59113619A (ja) * 1982-12-20 1984-06-30 Matsushita Electronics Corp 半導体装置の製造方法
JPS59186367A (ja) * 1983-04-06 1984-10-23 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6068611A (ja) * 1983-09-26 1985-04-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4569701A (en) * 1984-04-05 1986-02-11 At&T Bell Laboratories Technique for doping from a polysilicon transfer layer
US4694561A (en) * 1984-11-30 1987-09-22 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making high-performance trench capacitors for DRAM cells
US4898838A (en) * 1985-10-16 1990-02-06 Texas Instruments Incorporated Method for fabricating a poly emitter logic array
JPS6293929A (ja) * 1985-10-21 1987-04-30 Toshiba Corp 半導体装置の製造方法
JPS62208638A (ja) * 1986-03-07 1987-09-12 Toshiba Corp 半導体装置の製造方法
JP2695185B2 (ja) * 1988-05-02 1997-12-24 株式会社日立製作所 半導体集積回路装置及びその製造方法
JP2508818B2 (ja) * 1988-10-03 1996-06-19 三菱電機株式会社 半導体装置の製造方法
JPH0744275B2 (ja) * 1988-10-06 1995-05-15 日本電気株式会社 高耐圧ｍｏｓ型半導体装置の製造方法
US5028973A (en) * 1989-06-19 1991-07-02 Harris Corporation Bipolar transistor with high efficient emitter
US5188978A (en) * 1990-03-02 1993-02-23 International Business Machines Corporation Controlled silicon doping of III-V compounds by thermal oxidation of silicon capping layer
US5296388A (en) * 1990-07-13 1994-03-22 Matsushita Electric Industrial Co., Ltd. Fabrication method for semiconductor devices
JPH04199507A (ja) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp ３―Ｖ族化合物半導体へのｎ型不純物固相拡散方法
DE59409300D1 (de) * 1993-06-23 2000-05-31 Siemens Ag Verfahren zur Herstellung von einem Isolationsgraben in einem Substrat für Smart-Power-Technologien
JPH07142419A (ja) * 1993-11-15 1995-06-02 Toshiba Corp 半導体装置の製造方法
US6451644B1 (en) * 1998-11-06 2002-09-17 Advanced Micro Devices, Inc. Method of providing a gate conductor with high dopant activation

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US3460007A (en) * 1967-07-03 1969-08-05 Rca Corp Semiconductor junction device
US3558374A (en) * 1968-01-15 1971-01-26 Ibm Polycrystalline film having controlled grain size and method of making same
JPS4826179B1 (cg-RX-API-DMAC10.html) * 1968-09-30 1973-08-07
US3548233A (en) * 1968-11-29 1970-12-15 Rca Corp Charge storage device with pn junction diode array target having semiconductor contact pads
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US3664896A (en) * 1969-07-28 1972-05-23 David M Duncan Deposited silicon diffusion sources
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JPS5217747B2 (cg-RX-API-DMAC10.html) * 1971-08-09 1977-05-17
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US3928095A (en) * 1972-11-08 1975-12-23 Suwa Seikosha Kk Semiconductor device and process for manufacturing same

Also Published As

Publication number Publication date
US4063967A (en) 1977-12-20
DE2449688B2 (de) 1979-10-04
GB1464801A (en) 1977-02-16
FR2288391A1 (fr) 1976-05-14
JPS5165561A (cg-RX-API-DMAC10.html) 1976-06-07
IT1043400B (it) 1980-02-20
DE2449688A1 (de) 1976-04-22
FR2288391B1 (cg-RX-API-DMAC10.html) 1982-10-01
JPS5952533B2 (ja) 1984-12-20
CA1055620A (en) 1979-05-29

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)