DE202016008840U1 - metal sheet - Google Patents

Abstract

A metal sheet for producing a deposition mask having a plurality of through holes formed therein, the metal sheet being made of an iron alloy containing 30 to 54 mass% of nickel, the thickness of the metal sheet being 85 µm or less, and wherein: when a composition analysis of a first one Surface of the metal sheet is performed using an X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension peak value of nickel hydroxide and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide; andin the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees; The method of calculating the ratio A1 / A2 based on the analysis result by the XPS method is carried out as specified in the description; and wherein the background line calculation is performed using the Shirley method as set forth in the description.

Description

TECHNICAL AREA

The present invention relates to a metal sheet for use in manufacturing a deposition mask having a plurality of through holes formed therein.

STATE OF THE ART

A display device used in a portable device such as a smartphone and a tablet PC, a great delicacy, such as have a pixel density of 300 ppi or more. In addition, there is an increasing need for the portable device to be applicable in a full high definition standard. In this case the pixel density of the display device e.g. 450 ppi or more.

An organic EL display device has received attention because of its excellent responsiveness and low power consumption. A known method of forming pixels of an organic EL display device is a method that uses a deposition mask that includes through holes arranged in a desired pattern and forms pixels in the desired pattern. Specifically, a deposition mask is first brought into close contact with a substrate for an organic EL display device, and then the substrate and the deposition mask that is in close contact therewith are put into a deposition device so that an organic material, etc., is deposited.

A deposition mask can generally be made by forming through holes in a metal sheet by etching using a photolithographic technique (see e.g. Patent Document 1). For example, a first photoresist pattern is first formed on a first surface of the metal sheet and a second photoresist pattern is formed on a second surface of the metal sheet. Then, an area of the second surface of the metal sheet that is not covered with the first photoresist pattern is etched, so that second recesses are formed in the second surface of the metal sheet. Thereafter, a portion of the first surface of the metal sheet that is not covered with the first photoresist pattern is etched to form first recesses in the first surface of the metal sheet. Through-etching of the regions so that each first recess and every second recess are connected to one another can form through holes which run through the metal sheet.

In a deposition step using a deposition mask, a deposition mask and a substrate are arranged so that the side of a second surface of the deposition mask faces the substrate. In addition, a crucible that contains a deposition material such as e.g. an organic material, is disposed on the side of a first surface of the deposition mask. The deposition material is then heated so that the deposition material is evaporated or sublimed. The vaporized or sublimed deposition material adheres to the substrate through the through holes in the deposition mask. As a result, the deposition material is deposited on the surface of the substrate in a desired pattern corresponding to the through hole positions of the deposition mask.

Patent document 1: JP 2014-148740 A

DISCLOSURE OF THE INVENTION

As the pixel density of an organic EL display device increases, the size and spacing of through holes of a deposition mask decrease. When through holes are formed in a metal sheet by etching using the photolithographic technique, the width of a resist pattern provided on a first surface or a second surface of the metal sheet decreases. Consequently, a resist film for forming a resist pattern is required to have a high resolution. That the width of the photoresist pattern is reduced means that a contact area between the photoresist pattern and the metal sheet is reduced. Consequently, the photoresist film to form a photoresist pattern is also required to have a high adhesive force on the metal sheet.

The present invention has been made in view of the above circumstances. The object of the present invention is to provide a method for producing a metal sheet, on the surface of which a photoresist pattern with a small width can be stably provided, and such a metal sheet. In addition, the present invention relates to a method for producing a deposition mask using such a metal sheet.

The present invention is a method of manufacturing a metal sheet used for manufacturing a deposition mask having a plurality of through holes formed therein, the method comprising a manufacturing step of manufacturing a sheet member made of a nickel-containing iron alloy, wherein: when a composition analysis of a first surface of the metal sheet obtained from the sheet member is performed using an X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, A1 being the sum a planar dimension peak value of nickel oxide and a planar dimension peak value of nickel hydroxide and A2 is the sum of a planar dimension peak value of iron oxide and a planar dimension peak value of iron hydroxide; and in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.

The method of manufacturing a metal sheet according to the present invention may further include an annealing step of annealing the sheet metal member to obtain the metal sheet.

In the method for manufacturing a metal sheet according to the present invention, the tempering step can be carried out in an inert gas atmosphere.

In the method for manufacturing a metal sheet according to the present invention, the manufacturing step may include a rolling step of rolling a base metal made of a nickel-containing iron alloy.

In the method for manufacturing a metal sheet according to the present invention, the manufacturing step may include a film forming step of forming a plating film by using a plating liquid comprising a solution containing a nickel compound and a solution containing an iron compound.

In the method of manufacturing a metal sheet according to the present invention, the thickness of the metal sheet can be 85 µm or less.

In the method of manufacturing a metal sheet according to the present invention, the metal sheet for manufacturing the deposition mask can be formed by exposing and developing a dry film attached to the first surface of the metal sheet to form a first photoresist pattern and by etching a portion of the serve the first surface of the metal sheet, wherein the area is not covered with the first photoresist pattern.

The present invention is a metal sheet used for manufacturing a deposition mask having a plurality of through holes formed therein, wherein: when a compositional analysis of a first surface of the metal sheet is performed using an X-ray photoelectron spectroscopy, a ratio A1 / A2 determined by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak of nickel oxide and a planar dimension peak of nickel hydroxide, and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide; and in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.

In the metal sheet according to the present invention, the thickness of the metal sheet can be 85 µm or less.

In the metal sheet according to the present invention, the metal sheet for manufacturing the deposition mask can be formed by exposing and developing a dry film attached to the first surface of the metal sheet to form a first photoresist pattern and by etching a portion of the first surface of the metal sheet , the area not being covered with the first photoresist pattern.

The present invention is a method of manufacturing a deposition mask having a plurality of through holes formed therein, the method comprising: a step of manufacturing a metal sheet; a first photoresist pattern forming step of forming a first photoresist pattern on a first surface of the metal sheet; and an etching step of etching a portion of the first surface of the metal sheet, the portion not being covered with the photoresist pattern, so that first recesses for defining the through holes are formed in the first surface of the metal sheet; wherein: when a compositional analysis of a first surface of the metal sheet is carried out using X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension peak of nickel hydroxide, and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide; and in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.

In the method of manufacturing a deposition mask according to the present invention, the thickness of the metal sheet may be 85 µm or less.

In the method of manufacturing a deposition mask according to the present invention, the first photoresist pattern formation step may include a step of applying a dry film to the first surface of the metal sheet and a step of exposing and developing the dry film to form the first photoresist pattern.

The present invention is a deposition mask comprising: a metal sheet comprising a first surface and a second surface opposite the first surface; and a plurality of through holes formed in the metal sheet so as to extend from the first surface of the metal sheet to the second surface thereof; wherein: each through hole has a second recess formed in the second surface of the metal sheet and a first recess formed in the first surface of the metal sheet to be connected to the second recess; when a compositional analysis of a first surface of the metal sheet is performed using X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension -Peak value of nickel hydroxide, and A2 is the sum of a planar dimension peak value of iron oxide and a planar dimension peak value of iron hydroxide; and in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.

In the deposition mask according to the present invention, the thickness of the metal sheet can be 85 µm or less.

According to the present invention, a photoresist pattern with a small width can be stably provided on a surface of a metal sheet. As a result, a deposition mask for manufacturing an organic EL display device having a high pixel density can be stably obtained.

Figure list

• 1 11 is a view for explaining an embodiment of the present invention, which is a schematic plan view showing an example of a deposition mask device including a deposition mask.
• 2nd FIG. 14 is a view for explaining a deposition method using the one shown in FIG 1 Deposition mask device shown.
• 3rd is a partial plan view showing the in the 1 deposition mask shown.
• 4th is a sectional view taken along the IV-IV Line from 3rd .
• 5 is a sectional view taken along the VV Line from 3rd .
• 6 Fig. 3 is a sectional view showing the VI-VI Line from 3rd shows.
• 7 Fig. 3 is an enlarged sectional view showing that in the 4th shown through hole and an area nearby.
• 8 (a) to 8 (c) 14 are views schematically showing a manufacturing method for a deposition mask.
• 9 (a) Fig. 12 is a view showing a step of obtaining a metal sheet with a desired thickness by rolling a base metal.
• 9 (b) Fig. 12 is a view showing a step of tempering the metal sheet obtained by rolling.
• 10th Fig. 12 is a view showing a compositional analysis of a first surface of the metal sheet, which is carried out using an X-ray photoelectron spectroscopy.
• 11 FIG. 14 is a schematic view for generally explaining an example of a method of manufacturing the deposition mask shown in FIG 1 is shown.
• 12th Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which is a sectional view showing a step of forming a photoresist film on the metal sheet.
• 13 Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which is a sectional view showing a step of closely contacting the photoresist film.
• 14A Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which shows an elongated metal sheet in a section along a vertical direction.
• 14B is a partial top view if that in the 14A shown elongated metal sheet is viewed from the side of a first surface.
• 15 Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which shows an elongated metal sheet in a section along a vertical direction.
• 16 Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which shows an elongated metal sheet in a section along a vertical direction.
• 17th Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which shows an elongated metal sheet in a section along a vertical direction.
• 18th Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which shows an elongated metal sheet in a section along a vertical direction.
• 19th Fig. 12 is a view for explaining an example of the method of manufacturing the deposition mask, which shows an elongated metal sheet in a section along a vertical direction.
• 20th FIG. 12 is a view showing a modification example of the deposition mask device including a deposition mask.
• 21 (a) and 21 (b) Fig. 4 are views showing the result of analyzing a first test piece cut out from a first package using an XPS device.
• 22 (a) Fig. 12 is a view showing the result of analyzing nickel oxide manufactured as the first reference specimen using an XPS method.
• 22 (b) Fig. 12 is a view showing the result of analyzing nickel hydroxide manufactured as the second reference specimen using the XPS method.
• 23 Fig. 12 is a view showing a resist pattern formed on a surface of a first sample.
• 24 (a) and 24 (b) Fig. 4 are views each showing the result of analyzing a second test piece cut out from a second package using an XPS device.
• 25 (a) and 25 (b) Fig. 4 are views each showing the result of analyzing a third test piece cut out from a third package using an XPS device.
• 26 (a) and 26 (b) Fig. 4 are views each showing the result of analyzing a fourth test piece cut out from a fourth package using an XPS device.
• 27A Fig. 12 is a view showing a step of calculating a background line of a total iron peak from the iron 2P _3/2 orbit.
• 27B Fig. 12 is a view showing a step of separating a peak of iron alone from the total iron peak.
• 27C Fig. 12 is a view showing a step of calculating a peak area of iron alone.
• 27D Fig. 12 is a view showing a result of separating peaks of iron oxide and iron hydroxide as a reference.
• 28A Fig. 12 is a view showing a step of calculating a background line of a total peak from the nickel 2P _3/2 orbit.
• 28B Fig. 11 is a view showing a step of separating a peak of nickel alone from the total nickel peak.
• 28C Fig. 12 is a view showing a step of calculating a peak area of nickel alone.
• 28D Fig. 12 is a view showing a result of separating peaks of nickel oxide and nickel hydroxide as a reference.
• 29 Fig. 12 is a view showing an example in which a part of a resist pattern peels off from a metal sheet in a developing solution.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

An embodiment of the present invention will be described below with reference to the drawings. In the drawings accompanying the description, a scale dimension, an aspect ratio, etc. are changed and exaggerated with respect to the actual values for easy illustration and understanding.

The 1 to 20th 14 are views for explaining an embodiment of the present invention and its modification example. For example, in the embodiment and modification example below, a method of manufacturing a deposition mask for use in patterning an organic material in a desired pattern on a substrate when an organic EL display is manufactured is explained. However, without being limited thereto, the present invention can be applied to a method of manufacturing a deposition mask for various applications.

In this description, the terms “sheet metal”, “film” and “film” are not distinguished from one another solely on the basis of the difference in terms. For example, “sheet metal” is a concept that includes an element that can be called a foil or film. As a result, for example, a “sheet of metal” is not differentiated from an element called a “metal foil” or “metal film” based on the difference in terms only.

In addition, the term “sheet level (film level, film level)” stands for the level that corresponds to a plane direction of a sheet-like (film-like, film-like) element as a target, if the sheet-like (film-like, film-like) element is generally considered as a whole as a target. The vertical direction in relation to the sheet-like (film-like, film-like) element stands for the vertical direction in relation to a sheet metal plane (film surface, film surface) of the element.

Furthermore, in this description, terms that designate shapes, geometric conditions or states and their degrees, such as “parallel”, “vertical”, “identical”, “similar”, etc., are not based on them strict definitions, but to be understood as encompassing an area that can perform a corresponding function.

(Deposition mask device)

First, an example of a deposition mask device, including deposition masks to be manufactured, will be described primarily with reference to FIG 1 to 6 described. The 1 FIG. 12 is a plan view showing an example of the deposition mask device that includes the deposition masks. The 2nd FIG. 10 is a view for explaining a method of using the in FIG 1 Deposition mask device shown. The 3rd Fig. 12 is a plan view showing the deposition mask viewed from a first surface side. The 4th to 6 are sectional views viewed from the respective position of the 3rd .

The deposition mask device 10th that in the 1 and 2nd is shown includes a plurality of deposition masks 20th , each of which is made of sheet metal 21 is formed with a substantially rectangular shape, and a frame 15 on the edges of the deposition masks 20th is appropriate. Any deposition mask 20th has a number of through holes 25th on by etching the metal sheet 21 that a first surface 21a and a second surface 21b that of the first surface 21a opposite, has, from both sides of the first surface 21a and the second surface 21b have been trained here. As in the 2nd is shown, the deposition mask device 10th used to deposit a deposition material on a substrate. The deposition mask device 10th is like that in a separator 90 kept that deposition mask 20th on a lower surface of the substrate 92 such as a glass substrate on which the deposition material is to be deposited.

In the separator 90 become the deposition mask 20th and the glass substrate 92 brought into close contact with each other by a magnetic force of magnets not shown. In the separator 90 are below the deposition mask device 10th a crucible 94 which is a deposition material (e.g. an organic luminescent material) 98 picks up, and a heater 96 for heating the crucible 94 arranged. The deposition material 98 in the crucible 94 is caused by heat from the heater 96 is applied, evaporated or sublimed so that it is on the surface of the substrate 92 is liable. As described above, the deposition material adheres 98 because the deposition mask 20th many through holes formed therein 25th has through the through holes 25th on the glass substrate 92 . As a result, a film of the deposition material 98 on the surface of the substrate 92 formed in a desired pattern that corresponds to the positions of the through holes 25th the deposition mask 20th corresponds.

As described above, in this embodiment, the through holes are 25th in every effective area 22 arranged in a predetermined pattern. If a color display is desired, an organic luminescent material for a red color, an organic luminescent material for a green color and an organic luminescent material for a blue color can be sequentially deposited during the deposition mask 20th (Deposition mask device 10th ) and the glass substrate 92 gradually relatively along the arrangement direction of the through holes 25th (the one direction mentioned above). Alternatively, the deposition material 98 on the surface of the substrates 92 using the deposition masks 20th are deposited, which differ depending on the colors of the organic luminescent materials.

The frame 15 the deposition mask device 10th is on the edges of the rectangular deposition masks 20th appropriate. The frame 15 is configured to hold each deposition mask in a taut condition to warp the deposition mask 20th to prevent. The deposition masks 20th and the frame 15 are attached to one another, for example, by spot welding.

The deposition process takes place within the deposition device 90 performed in a high temperature atmosphere. As a result, during the deposition process, the deposition masks 20th , the frame 15 and the substrate 92 that are inside the separator 90 are also heated. Thereby develop each of the deposition masks 20th , the frame 15 and the substrate 92 a dimensional change behavior based on their respective coefficients of thermal expansion. In this case, if the coefficient of thermal expansion of the deposition mask takes place 20th , the frame 15 and the substrate 92 differ greatly from each other, due to the difference in the dimensional change, a positioning shift takes place. As a result, the dimensional accuracy is reduced and the positional accuracy of the deposition material attached to the substrate 92 should be liable. To avoid this problem, the thermal expansion coefficients are the deposition mask 20th and the frame 15 preferably equivalent to the coefficient of thermal expansion of the substrate 92 . For example, if a glass substrate as a substrate 92 An iron alloy can be used as the main material of the deposition mask 20th and the frame 15 be used. For example, an iron alloy containing 30 to 54 mass% of nickel can be used as the material of the metal sheet that forms the deposition masks 20th forms. Concrete examples of a nickel-containing iron alloy can be an Invar material containing 34 to 38% by weight of nickel, a Superinvar material containing cobalt in addition to nickel, or a plated Fe-Ni-based alloy which Contains 38 to 54% by mass of nickel. In this description, a range of numbers represented by the "-" symbol includes numerical values surrounding the "-" symbol. For example, a range of numbers specified by the expression "34 to 38% by weight" is identical to a range of numbers specified by the expression "not less than 34% by weight and not more than 38% by weight" is.

(Deposition mask)

Next is the deposition mask 20th described in detail. As in the 1 is shown in this embodiment is each deposition mask 20th from the metal sheet 21 formed and has an outline with a substantially square shape in plan view, in particular with a substantially rectangular shape in plan view. The metal sheet 21 the deposition mask 20th covers the effective range 22 , In which the through holes 25th are formed in a regular arrangement, and a peripheral area 23 which is the effective area 22 surrounds. The peripheral area 23 is an area for supporting the effective area 22 and is not an area through which the deposition material to be deposited on the substrate passes. For example, in the deposition mask 20th the effective area for use in depositing an organic luminescent material for an organic EL display device 22 an area in the deposition mask 20th that is directed to a portion of the substrate on which the organic luminescent material is deposited to form pixels, that is, a portion of the substrate that provides a display surface of the manufactured substrate for an organic EL display device. For various reasons, however, the peripheral area 23 have a through hole and / or a recess. In the in the 1 The example shown shows each effective area 22 an outline with a substantially square shape in plan view, in particular with a substantially rectangular shape in plan view.

In the example shown, the effective ranges are 22 the deposition mask 20th with predetermined intervals therebetween along a direction parallel to a longitudinal direction of the deposition mask 20th aligned. In the example shown, an effective range corresponds to 22 an organic EL display device. In particular, the deposition mask device enables 10th (Separation masks 20th ) in the 1 is shown a diverse deposition.

As in the 3rd is shown, in the example shown, is a plurality of the through holes 25th in every effective area 22 arranged at predetermined distances along two directions perpendicular to each other. An example of the through hole 25th that in the metal sheet 21 is formed, with reference primarily to the 3rd to 6 described in more detail.

Like it in the 4th to 6 is shown, a plurality of the through holes 25th from the first surface 20a one side along a perpendicular direction of the deposition mask 20th is to the second surface 20b the other side along the perpendicular direction of the deposition mask 20th is. In the example shown, first recesses become, as will be described in more detail below 30th in the first surface of the metal sheet 21 serving as one side in the perpendicular direction of the deposition mask, formed by an etching process, and second recesses 35 are in the second surface 21b formed that as the other side in the vertical direction of the metal sheet 21 serves. Each of the first cutouts 30th is like this with each of the second recesses 35 connected that the second recess 35 and the first recess 30th are designed to communicate with each other. Every through hole 25th is from the second recess 35 and the first recess 30th with the second recess 35 is connected.

Like it in the 3rd to 6 is shown, the cross-sectional area takes up from each first recess 30th in a cross section along a sheet metal plane of the deposition mask 20th at any position along the vertical direction of the deposition mask 20th from the side of the first surface 20a the deposition mask 20th in the direction of the side of the second surface 20b gradually. Accordingly, one takes Cross-sectional area of every second recess 35 in a cross section along the sheet plane of the deposition mask 20th at any position along the vertical direction of the deposition mask 20th from the side of the second surface 20b the deposition mask 20th in the direction of the side of the first surface 20a gradually.

Like it in the 4th to 6 is shown are a wall surface 31 the first recess 30th and a wall surface 36 the second recess 35 by means of a circumferential connection section 41 connected. The connecting section 41 is defined by a ridge line of a protruding part, in which the wall surface 31 the first recess 30th that are related to the vertical direction of the deposition mask 20th is inclined, and the wall surface 36 the second recess 35 that are related to the vertical direction of the deposition mask 20th is inclined to converge. The connecting section 41 defines a passage section 42 tightly covering an area of the through hole 25th in the top view of the deposition mask 20th is minimal.

Like it in the 4th to 6 are shown, the adjacent two through holes 25th in the other side surface along the perpendicular direction of the deposition mask, that is, in the second surface 20b the deposition mask 20th , spaced apart along the sheet plane of the deposition mask. In particular, as in the manufacturing process described below, if the second recesses remain 35 by etching the metal sheet 21 from the side of the second surface 21b of the metal sheet 21 be made that of the second surface 20b the deposition mask 20th corresponds to the second surface 21b of the metal sheet 21 between the adjacent two cutouts 35 .

Accordingly, as in the 4th and 6 is shown, the two adjacent first recesses 30th along the plane of the deposition mask on one side along the perpendicular direction of the deposition mask, that is, on the side of the first surface 20a the deposition mask 20th , be spaced apart. In particular, the first surface 21a of the metal sheet 21 between the two adjacent first cutouts 30th remain. In the description below is a section of the effective range 22 the first surface 21a of the metal sheet 21 , which is not etched and therefore remains, also as an upper section 43 designated. By creating the deposition mask 20th such that an upper section 43 remains, the deposition mask 20th have sufficient strength. As a result, for example, the deposition mask can be prevented 20th is damaged during transportation. If the width β of the top section 43 however, it is too large, there is a possibility that a shadow appears in the deposition step, which affects the efficiency of use of the deposition material 98 reduced. Consequently, the deposition mask 20th preferably generated such that the width β of the top section 43 is excessively large. For example, the width is β of the top section 43 preferably 2 µm or less. Generally the width varies β of the top section 43 depending on a direction along which the deposition mask 20th is separated. For example, the width β of the top section 43 , the Indian 4th is shown, and that of 6 differentiate from each other. In this case, the deposition mask 30th be designed so that the width β of the top section 43 Is 2 µm or less regardless of a direction along which the deposition mask 20th is separated.

As in the 5 is shown, the etching process can be carried out so that the two adjacent first recesses 30th depending on their positions. In particular, there may be a part in which there is no first surface 21a of the metal sheet 21 between two adjacent first cutouts 30th remains.

As in the 2nd is the deposition mask device 10th in the separator 90 added. In this case, as is indicated by the two-dot chain lines in the 4th is shown the first surface 20a the deposition mask 20th on the side of the crucible 94 in which the deposition material 98 is included, and the second surface 20b the deposition mask 20th is on the glass substrate 92 directed. As a result, the deposition material is liable 98 on the substrate 92 through the first recess 30th whose cross-sectional area gradually decreases. As indicated by the arrow in the 4th is shown, which is from the first surface 20a to the second surface 20b extends, the deposition material moves 98 not just from the crucible 94 in the direction of the substrate 92 along the vertical direction of the substrate 92 , but sometimes moves along a direction that is relative to the perpendicular direction of the substrate 92 is strongly inclined. It reaches when the thickness of the deposition mask 20th is large, most of the diagonally moving deposition material 98 the wall surface 31 the first recess 30th before the deposition material 98 through the through hole 25th passes through and the substrate 92 reached. Consequently, it is believed that it will improve usage efficiency the deposition material 98 it is preferred that the thickness t the deposition mask 20th is reduced so that the heights of the wall surface 31 the first recess 30th and the wall surface 36 the second recess 35 are reduced. In particular, it can be assumed that it is preferred that the metal sheet 21 , the smallest possible thickness t as long as the strength of the deposition mask 20th is ensured than the metal sheet 21 to form the deposition mask 20th is used. Taking this point into account, the thickness t the deposition mask 20th in this embodiment, preferably set to 85 μm or less, for example within a range from 5 to 85 μm. The fat t is a thickness of the peripheral area 23 , that is, a thickness of part of the deposition mask 20th where the first recess 30th and the second recess 35 are not trained. Hence the thickness t as the thickness of the metal sheet 21 be accepted.

In the 4th becomes a minimal angle, through a line L1 by the connecting section 41 with the minimum cross-sectional area of the through hole 25th and another given position of the wall surface 31 the first recess 30th runs with respect to the vertical direction N the deposition mask 20th is set by the symbol θ1 shown. In order to be able to cause the diagonally moving deposition material 98 the substrate 92 as far as possible without causing it to hit the wall surface 31 reached, it is advantageous that the angle θ1 is enlarged. To enlarge the angle θ1 it is effective to have the above width β of the top section 43 decrease and also the thickness t the deposition mask 20th to diminish.

In the 6 represents the symbol α the width of a section (hereinafter also referred to as a “rib section”) of the effective area 22 the second surface 21b of the metal sheet 21 which is not etched and therefore remains. The width α of the rib section and the size r ₂ of the passage section 42 are appropriately determined depending on the size of an organic EL display device and its display pixels. Table 1 shows examples of display pixels, one width α of the rib section and a size r ₂ of the pass-through portion required depending on the display pixels in a 5 inch organic EL display device. Table 1 Display pixels Width of the rib section Size of the passage section FHD 20 µm 40 µm ("Full High Definition") WQHD 15 µm 30 µm ("Wide Quad High Definition") UHD 10 µm 20 µm ("Ultra High Definition")

Although there is no limitation in this regard, the deposition mask is 20th according to this embodiment, particularly effective when manufacturing an organic EL display device with a pixel density of 450 ppi or more. Below is a size example of the deposition mask 20th required to manufacture an organic EL display device with such a high pixel density. The 7 Fig. 3 is an enlarged sectional view showing the through hole 25th the deposition mask 20th that in the 4th and shows an area close to it.

In the 7 is used as a parameter, which is the shape of the through hole 25th concern a distance from the second surface 20b the deposition mask 20th up to the connecting section 41 of which along the vertical direction of the deposition mask 20th , ie, a height of the wall surface 36 the second recess 35 , by the symbol r ₁ shown. Furthermore, a size of the second recess 35 in a part where the second recess 35 with the first recess 30th is connected, that is, a size of the passage portion 42 , by the symbol r ₂ shown. In addition, in the 7 an angle through a line L2 that the connecting section 41 and a distal edge of the second recess 35 in the second surface 21b of the metal sheet 21 connects, with respect to the vertical line N of the metal sheet 21 is set by the symbol θ2 shown.

When an organic EL display device with a pixel density of 450 ppi or more is manufactured, the size becomes r ₂ of the passage section 42 preferably set within a range of 10 to 60 microns. Because of this size, a deposition mask can be provided that can produce an organic EL display device with a high pixel density. Preferably the height r ₁ the second wall surface 36 the second recess 35 set to 6 µm or less.

Next, the above angle θ2 described in the 7 is shown. The angle θ2 corresponds to a maximum value of an angle of inclination of the deposition material 98 which is the substrate 92 can achieve from the deposition material 98 that in relation to the vertical direction N of the metal sheet 21 is inclined and through the passage section 42 near the connection section 41 passes through. This is due to the fact that the deposition material 98 that is at an angle of inclination greater than the angle θ2 is present on the wall surface 36 the second recess 35 adheres before the deposition material 98 the substrate 92 reached. Consequently, by decreasing the angle θ2 prevent the deposition material 98 , which is at a large angle of wetting and through the passage section 42 passes through on the substrate 92 is liable. Therefore, the deposition material can be prevented 98 on a portion of the substrate 92 is liable that is outside of a part that is connected to the passage section 42 overlaps. In particular, reducing the angle θ2 a variation in the plane dimension and the thickness of the deposition material 98 that on the substrate 92 sticks, prevent. In this regard, the through hole 25th designed such that the angle θ2 Is 45 degrees or less. The 7 shows an example in which the size of the second recess 35 in the second surface 21b , that is, an opening size of the through hole 25th in the second surface 21b , is larger than the size r ₂ the second recess 35 in the connection section 41 . In particular, the value of the angle θ2 a positive value. Although this is not shown, the size may vary r ₂ the second recess 35 at the connection section 41 be larger than the size of the second recess 35 in the connection section 41 . In particular, the value of the angle θ2 be a negative value.

Problems that may occur when the deposition mask 20th will be produced. First, a method of making the deposition mask 20th schematically with reference to the 8 (a) to 8 (c) described.

In the manufacturing steps for the deposition mask 20th will first like it in the 8 (a) is shown, a metal sheet 21 with a first surface 21a and a second surface 21b manufactured. In addition, as it is in the 8 (a) a first photoresist pattern is shown 65a on the first surface 21a of the metal sheet 21 formed and a first photoresist pattern 65b is on the second surface 21b educated. After that, as it is in the 8 (b) a second surface etching step of forming a second recess is shown 35 by etching a portion of the second surface 21b of the metal sheet 21 that doesn't match the first photoresist pattern 65b is covered. Then, as in the 8 (c) a first etching step of forming a first surface recess is shown 30th by etching a portion of the first surface 21a of the metal sheet 21 that doesn't match the first photoresist pattern 65a is covered.

As described above, it is for increasing the efficiency of use of the deposition material 98 while the deposition mask 20th has sufficient strength, preferred that the upper portion 43 remains with the smallest possible width. In this case, according to such an upper section 43 the width w of the first photoresist pattern 65a that on the first surface 21a of the metal sheet 21 is also less. Like it in the 8 (a) and 8 (b) ablation takes place in the metal sheet 21 by the etching steps not only in the vertical direction (thickness direction) of the metal sheet 21 instead, but also in a direction along the plane of the metal sheet 21 . Consequently, when the width dissolves w of the first photoresist pattern 65a is less than the degree of removal in the direction along the sheet plane of the sheet metal 21 occurs, the photoresist pattern 65a from the first surface 21a of the metal sheet 21 during the etching step. It is assumed that the erosion is in the direction along the sheet plane of the sheet metal 21 takes place, is at least about 3 microns on one side. Taking this point into account, the width w of the first photoresist pattern 65a preferably set at least 6 µm larger than the width β of the above section 43 . For example, the width is w of the first photoresist pattern 65a within a range of 20 to 40 µm.

For the precise creation of the first photoresist pattern 65a with a narrow width must have a photoresist film described below 65c to form the photoresist pattern 65a have a high resolution. For example, as the photoresist film 65c a so-called dry film such as a photoresist film containing a light-curing acrylic-based resin is preferred. An example of the dry film is RY3310 by Hitachi Chemical Co., Ltd. is manufactured. In addition, there are other examples of the UFG-052 and ATP-053 dry film manufactured by ASAHI KASEI E-materials Corp. be made, etc.

The dry film stands for a film that is attached to an object, such as the metal sheet 21 , is attached to form a photoresist film on the object. The dry film comprises at least one base film made of PET, for example, and a photosensitive layer having photosensitivity laminated on the base film. The photosensitive layer contains a photosensitive material such as an acrylic-based resin, an epoxy-based resin, a polyimide-based resin, a styrene-based resin, etc.

By making the first photoresist pattern 65a the first photoresist pattern can be made using a dry film with a high resolution 65a with a narrow width w on the first surface 21a of the metal sheet 21 be trained precisely. On the other hand, if the width w of the first photoresist pattern 65 becomes small, becomes a planar contact dimension between the first surface 21a of the metal sheet 21 and the first photoresist pattern 65a also low. Consequently, the photoresist film described below must be used 65c to form the first photoresist pattern 65a high adhesive force on the first surface 21a of the metal sheet 21 exhibit.

However, the present inventors have made extensive studies and found that although the dry film adheres strongly to copper and a copper alloy, the dry film adheres poorly to an iron-nickel alloy such as an Invar material. Accordingly, the conventional manufacturing method for the deposition mask 20th Difficulties in that the first photoresist pattern 65a and / or the second photoresist pattern 65b from the metal sheet 21 detach or detach. For example, in one development step, the exposed photoresist film described below was developed 65c , 65d to form a photoresist pattern 65a , 65b found that a developing solution between the metal sheet 21 and the photoresist film 65c , 65d had penetrated so that the photoresist film 65c , 65d from the metal sheet 21 replaced. In addition, after the development step and a firing step, the photoresist pattern was fired 65a , 65b for attaching the photoresist pattern 65a , 65b on the metal sheet 21 found with greater certainty that the photoresist film 65c , 65d from the metal sheet 21 replaced.

In addition to the dry film mentioned above, a liquid photoresist material is known as an etching photoresist that is applied to an object while it is in a flowable state, such as in a liquid state. The liquid photoresist material is, for example, a casein photoresist. In this case, a photoresist film is placed on an object such as a metal sheet 21 , formed by applying the liquid photoresist material to the object and allowing the liquid to solidify. The liquid photoresist material comes into contact with the article while it is in the liquid state. Accordingly, even if the surface of the article has a concavity and / or a convexity, the liquid solidifies so that it becomes a photoresist film after the liquid has followed the concavity and / or the convexity. As a result, the adhesive properties between the liquid resist material and the article are high.

On the other hand, as described above, the dry film comes into contact with the article while it is in the state of a film containing a photosensitive layer. Consequently, if there is or is a concavity and / or convexity on the surface of the article, the photosensitive layer of the dry film cannot fully follow the concavity and / or the convexity. As a result, the adhesive properties between the dry film and the article are inferior to the adhesive properties between the liquid resist material and the article.

Table 2 shows a comparison result between the dry film and the liquid photoresist material with regard to the resolution, the adhesive properties and the cost. The term “adhesive properties” stands for the lightness of the dry film or the liquid photoresist material on the Invar material. As shown in Table 2, the conventional dry film has poor adhesive properties to the Invar material and is expensive while having excellent resolution compared to the liquid resist material. Table 2 resolution Adhesive properties costs Dry film Outstanding Not good Not good Liquid photoresist material Not good Good Outstanding

The dry film has been conventionally used to make copper wiring by etching a copper foil for a printing substrate. In this case, the dry film is provided on the copper foil. As described above, since the dry film adheres strongly to copper and a copper alloy, a problem regarding the adhesive properties of the dry film has not received any specific attention. It is believed that the problem of poor adhesive properties of the dry film on an iron-nickel alloy, e.g. an Invar material, attention is paid when a small width photoresist pattern is precisely formed on a metal sheet made of an iron-nickel alloy.

For the stable formation of the first photoresist pattern 65a with a narrow width w on the first surface 21a of the metal sheet 21 , which is made of an iron-nickel alloy, it is important to determine the adhesive force between the first photoresist pattern 65a and the first surface 21a to increase. The present inventors have conducted extensive studies and found that the adhesive force between the first resist pattern 65a and the first surface 21a of the presence of a nickel compound in the first surface 21a of the metal sheet 21 depends. The fact found by the present inventors is described below.

Generally, when a surface of a metal sheet made of a nickel-containing iron alloy is oxidized, the metal sheet includes a main layer made of a nickel-containing iron alloy and a surface layer containing iron oxide, iron hydroxide, nickel oxide, and nickel hydroxide contains. In particular, iron oxide and iron hydroxide are present on a part closest to the surface of the metal sheet, and nickel oxide and nickel hydroxide are present between the iron oxide and the iron hydroxide and the main layer.

The present inventors have analyzed a composition of the metal sheet whose surface is oxidized using an X-ray photoelectron spectroscopy (hereinafter also referred to as an XPS method), and found that a main layer made of a nickel-containing iron alloy is in a position within several nanometers from the surface of the metal sheet. In particular, it can be assumed that a surface layer containing nickel oxide and nickel hydroxide is present at a position within several nanometers from the surface of the metal sheet.

Furthermore, as shown in the examples described below, the present inventors evaluated the adhesive properties of the metal sheet on a photoresist pattern and found that compared to a metal sheet with very good adhesive properties on a photoresist pattern, a metal sheet with poor adhesive properties on a photoresist pattern had more nickel oxide and nickel hydroxide in the surface layer of the metal sheet. When it is considered that compounds present in the surface layer of the metal sheet are iron oxide, iron hydroxide, nickel oxide and nickel hydroxide, the state where "there is more nickel oxide and nickel hydroxide in the surface layer of the metal plate" than a state in which its ratio of Nickel oxide and nickel hydroxide relative to iron oxide and iron hydroxide is higher in the surface layer of the metal sheet ”. Furthermore, as shown in the examples described below, the present inventors evaluated the adhesive properties of various metal sheets on a photoresist pattern and found that when the ratio of nickel oxide and nickel hydroxide relative to iron oxide and iron hydroxide was 0.4 or less , the adhesive properties of a metal sheet to a photoresist pattern could be sufficiently ensured, and if the above ratio exceeded 0.4, the adhesive properties of a metal sheet to a photoresist pattern were insufficient.

In addition, with respect to a metal sheet with very good adhesive properties to a photoresist pattern and a metal sheet with poor adhesive properties to a photoresist pattern, the present inventors examined the difference in manufacturing steps between these metal sheets. The present inventors found that the metal sheet with poor adhesive properties on one A resist pattern was subjected to a tempering step of tempering the metal sheet in a reducing atmosphere containing a large amount of a reducing gas such as hydrogen. Consequently, it can be assumed that in a reducing atmosphere, nickel oxide and nickel hydroxide tend to deposit on the surface of the metal sheet. In addition, as shown in the reaction formula described below, in a reducing atmosphere containing a large amount of a reducing gas such as hydrogen, nickel hydroxide is produced according to a reduction reaction of nickel oxide. As a result, nickel hydroxide is believed to have a greater negative impact on the adhesion properties to a photoresist pattern than nickel oxide.

On the basis of the above-mentioned investigation, it can be assumed that the adhesive properties of a metal sheet on a photoresist pattern based on a proportion of nickel hydroxide in the surface layer of the metal sheet can be expected. As shown in the examples described below, in XPS analysis it is not easy to separate a peak corresponding to nickel oxide and a peak corresponding to nickel hydroxide. With this in mind, this embodiment uses a method of obtaining information regarding the adhesive properties on a resist pattern based on a ratio of nickel oxide and nickel hydroxide relative to iron oxide and iron hydroxide. A concrete relationship of the presence and details of the method for examining respective connections in the first surface 21a of the metal sheet 21 will be described later.

Next, the operation and an effect of this embodiment structured in the manner described above will be described.

First, a method of manufacturing a metal sheet used for manufacturing a deposition mask will be described below. Then, a method of manufacturing a deposition mask using the obtained metal sheet will be described.

Then, a method of depositing a deposition material on a substrate using the obtained deposition mask will be described.

(Method of Manufacturing Metal Sheet)

First, a method of manufacturing a metal sheet will be described with reference to FIG 9 (a) and 9 (b) described. The 9 (a) Fig. 12 is a view showing a step of rolling a base metal to obtain a metal sheet with a desired thickness. The 9 (b) Fig. 12 is a view showing a step of tempering the metal sheet obtained by the rolling step.

<Rolling step>

As in the 9 (a) is shown is a base metal 55 manufactured, which is made of a nickel-containing iron alloy, and the base metal 55 is going in the direction of a rolling device 56 that a pair of reduction rollers 56a and 56b along a direction of transport indicated by the arrow D1 is shown transported. The base metal 55 that between the pair of reduction rollers 56a and 56b has arrived, is through the pair of reduction rollers 56a and 56b rolled. Consequently, the thickness of the base metal 55 reduced and it is elongated along the direction of transport. As a result, a sheet metal element 64X with a thickness t ₀ be preserved. As in the 9 (a) Is shown, a winding body 62 by winding up the sheet metal element 64X around a nucleus 61 be formed. A concrete value of the thickness t ₀ is within a range of 5 to 85 µm as described above.

The 9 (a) shows the rolling step only schematically, and a concrete structure and method for performing the rolling step are not particularly limited. For example, the rolling step may be a hot rolling step in which the base metal is at a temperature not less than the recrystallization temperature of the Invar material, which is the base metal 55 is processed, and includes a cold rolling step in which the base metal is processed at a temperature not higher than the recrystallization temperature of the Invar material. It is also an orientation along which the base metal 55 and the sheet metal element 64X between the reduction rollers 56a and 56b step through, not limited to one direction. For example, according to the 9 (a) and 9 (b) the base metal 55 and the sheet metal element 64X by repeatedly passing the base metal through 55 and the sheet metal element 64X between the pair of reduction rollers 56a and 56b in an orientation from the left side to the right side in a layer plane and in an orientation from the right side to the left side in the layer plane.

<Slot step>

Thereafter, a slitting step can be performed to slit both ends of the sheet metal element 64X obtained by the rolling step in the width direction thereof for a range of 3-5 mm. The slitting step is carried out to remove a crack on both ends of the sheet metal element 64X can be generated due to the rolling step. Due to the slit step, a breaking phenomenon of the sheet metal element can be prevented 64X , which is a so-called sheet cut, takes place starting from the crack as a starting point.

<Starting step>

Thereafter, to remove residual stress caused by the rolling process in the sheet metal element 64X has accumulated as in the 9 (b) is shown, the sheet metal element 64X through a starting device 57 tempered so that an elongated metal sheet is obtained. As in the 9 (b) is shown, the tempering step can be carried out while the sheet metal element 64X or the elongated metal sheet 64 is pulled in the transport direction (longitudinal direction). In particular, the tempering step can be carried out as a continuous tempering process while the elongated metal sheet is being transported, instead of a batch-type tempering process. The duration of the tempering step depends on the thickness of the elongated metal sheet 64 and a reduction ratio set in an appropriate manner. For example, the tempering step is carried out at 500 ° C for 60 seconds or more. The above "60 seconds" mean that it is for the sheet metal element 64X 60 Lasts seconds through a space in the starting device 57 pass through, which is heated to a temperature of 500 ° C.

The above-mentioned tempering step is preferably carried out in a non-reducing atmosphere or an inert gas atmosphere. The non-reducing atmosphere here stands for an atmosphere that is free of a reducing gas, such as hydrogen. The expression "free of a reducing gas" means that the concentration of a reducing gas such as hydrogen is 10% or less. In addition, the inert gas atmosphere is an atmosphere in which 90% or more of an inert gas such as argon gas, helium gas or nitrogen gas is present. By performing the tempering step in the non-reducing atmosphere or the inert gas atmosphere, the above-mentioned nickel hydroxide can be prevented from being on a first surface 64a and a second surface 64b of the elongated metal sheet 64 is produced.

By performing the tempering step, an elongated metal sheet can 64 with a thickness t ₀ can be obtained from which the residual stress has been removed to a certain extent. The fat t ₀ is generally with the thickness t the deposition mask 20th identical.

The elongated metal sheet 64 with the thickness t ₀ can be manufactured by repeating the above rolling step, slitting step and tempering step several times. The 9 (b) shows an example in which the tempering step is performed while the elongated metal sheet 64 is pulled in the longitudinal direction. Without being limited to this, the tempering step can be done with the elongated metal sheet 64 be carried out around the nucleus 61 is wrapped. In particular, a batch type tempering process can be carried out. If the tempering step is performed while the elongated metal sheet 64 around the core 61 is wound, the elongated metal sheet 64 a tendency to warp according to a winding diameter of the winding body 62 exhibit. It is therefore dependent on a winding diameter of the winding body 62 and / or a material which is the base metal 55 forms, advantageously to perform the tempering step while the elongated metal sheet 64 is pulled in the longitudinal direction.

<Separation step>

Then a separation step is carried out in which both ends of the elongated metal sheet 64 in the width direction thereof are cut off in a predetermined range so that the width of the elongated metal sheet 64 is set to a desired width. In this way, the elongated metal sheet 64 can be obtained with a desired thickness and a desired width.

<Test step>

After that, a test step of testing the composition of the material is carried out, which is the first surface 64a of the elongated metal sheet obtained 64 forms. Here an example is explained in which a composition analysis of the first surface 64a of the elongated metal sheet 64 with an XPS Procedure is carried out. The XPS method is a method in which a test specimen is irradiated with X-rays and the energy distribution of photoelectrons emitted by the test specimen is measured in order to provide information about the types of constituent elements and / or their amount within a range of several Obtain nanometers from a surface of the test specimen. In this case, in a spectrum measured by the X-ray photoelectron spectroscopy, the present amount of each constituent element is proportional to a planar dimension peak value calculated by integrating a planar dimension peak value corresponding to each constituent element. Thus, a planar dimension peak value corresponding to each constituent element is first calculated, then a total of the planar dimension peak values of the respective constituent elements is calculated, and then the atomic% of a target constituent element can be calculated by dividing a planar dimension peak value of the target constituent element by Total value and multiplying the value by 100 can be calculated. A relationship between a given amount of a given constituent element and a planar dimension peak value thereof may differ depending on the sensitivity to X-rays, etc. In this case, the above total value and atomic% after multiplying each constituent element by a relative sensitivity coefficient can be calculated to compensate for the sensitivity difference, so that a compensated planar dimension peak value is calculated.

The 10th Fig. 12 is a view showing a first surface composition analysis 64a of the elongated metal sheet 64 is performed using X-ray photoelectron spectroscopy. As in the 10th is shown in an example of the composition analysis of the first surface 64a of the elongated metal sheet 64 an x-ray X1 from an irradiation unit 81 on the elongated metal sheet 64 radiated and the angle of incidence of a photoelectron X2 that of the elongated metal sheet 64 is set to 90 degrees. In this case, types of constituent elements and their present amounts can be in a range within a range of several nanometers, such as 5 nm, from the first surface 64a of the elongated metal sheet 64 be measured in a more reproducible manner. As in the 10th is shown, the "angle of incidence" is an angle defined by a direction along which the photoelectron X2 that of the elongated metal sheet 64 is delivered so that there is a registration unit 82 reached, moved when the photoelectron X2 from the elongated metal sheet 64 is released, and the first surface 64a of the elongated metal sheet 64 is set.

After the composition analysis of the first surface 64a of the elongated metal sheet 64 has been carried out by means of the XPS process, the selection of an elongated metal sheet 64 performed using only the elongated metal sheet 64 which meets the following condition (1) in a manufacturing step for the deposition mask 20th is used, which is described below.

(1) If the composition analysis of the first surface 64a of the elongated metal sheet 64 performed using the X-ray photoelectron spectroscopy, the ratio A1 / A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension peak value of nickel hydroxide, and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide.

The above condition (1) is a condition for sufficiently ensuring an adhesive force between the first photoresist pattern described below 65a and the first surface 21a . As described above, nickel hydroxide and nickel oxide act to have the adhesive force between the resist pattern 65a and the first surface 21a Reduce. Accordingly, setting upper limits of nickel oxide and a planar dimension peak value of nickel oxide as determined by the above condition (1) is effective in ensuring a minimum adhesive force, which is the adhesive force between the first resist pattern 65a and the first surface 21a is required.

As described later, in an analysis using X-ray photoelectron spectroscopy, since a peak corresponding to nickel oxide and a peak corresponding to nickel hydroxide are extremely close to each other, it is difficult to surely distinguish these peaks. Accordingly, since a peak corresponding to iron oxide and a peak corresponding to iron hydroxide are extremely close to each other, it is difficult to surely distinguish these peaks. From this analytical point of view, in this embodiment, whether an adhesive force between the first resist pattern 65a and the first surface 21a can be sufficiently ensured based on a relationship between a sum of a planar dimension peak value of nickel oxide and a planar dimension peak value of nickel hydroxide and a sum of a planar dimension peak value of iron oxide and a planar dimension peak value of Iron hydroxide was evaluated instead of a relationship between a planar dimension peak of nickel hydroxide and a planar dimension peak of iron hydroxide.

The present inventors have made extensive studies and found that when an atmosphere contains a reducing gas such as hydrogen in the tempering step, nickel hydroxide is likely to be on the first surface 64a and the second surface 64b of the elongated metal sheet 64 is generated, so it is likely that the adhesive force between the first resist pattern 65a and the first surface 21a decreases. If an atmosphere in the tempering step was a non-reducible atmosphere or an inert gas atmosphere, nickel hydroxide on the first surface could be prevented 64a and the second surface 64b of the elongated metal sheet 64 was generated. As a result, since the above A1 / A2 was set to 0.4 or less, the adhesive force between the first resist pattern could 65a and the first surface 21a be adequately ensured.

In a reducing atmosphere containing a reducing gas such as hydrogen, as shown by the reaction formula below, it is assumed that a part of nickel oxide that is already on the surface of the elongated metal sheet 64 has been formed, is reduced to produce nickel and, at the same time, thus nickel hydroxide on the surface of the elongated metal sheet 64 is produced. 2NiO + H ₂ → Ni (OH) ₂ + Ni

To ensure sufficient adhesion between the first photoresist pattern 65a and the first surface 21a it is important to have a nickel reduction reaction on the surface of the elongated metal sheet 64 , such as the first surface 64a and the second surface 64b to prevent, so that the production of nickel hydroxide is prevented.

The present inventors have made extensive studies and found that when A1 / A2 becomes lower, the adhesive properties between the first resist pattern 65a and the first surface 21a tend to improve. Consequently, to improve the adhesive properties between the first resist pattern 65a and the first surface 21a A1 / A2 is preferably 0.3 or less, and more preferably A1 / A2 is 0.2 or less.

In the above description, the testing step for testing the elongated metal sheet 64 based on the above condition (1), for example, for selecting the elongated metal sheet 64 used. However, the use of condition (1) is not limited to this.

For example, the above condition (1) for optimizing a condition for manufacturing the elongated metal sheet 64 can be used, such as a tempering temperature, a tempering period, etc. In particular, the condition (1) can be used for a process in which the elongated metal sheets 64 at different tempering temperatures for different tempering periods, compositions of a surface of each elongated metal sheet obtained 64 are analyzed and the analysis result and the condition (1) are compared with one another, so that a suitable manufacturing condition is set which satisfies the condition (1). In this case, it is not necessary to make the selection based on condition (1) for all elongated metal sheets 64 carried out, which are obtained in the actual manufacturing steps. For example, a sample test with respect to condition (1) can only be performed for some of the elongated metal sheets 64 be performed. Alternatively, once a manufacturing condition is set, the check on condition (1) cannot be performed at all.

(Process for making the deposition mask)

Next is a method of making the deposition mask 20th using the elongated metal sheet selected in the manner described above 64 with reference to the 11 to 19th described. In the deposition mask manufacturing process described below 20th as it is in the 11 is shown, the elongated sheet metal 64 fed the through holes 25th are in the elongated metal sheet 64 trained and the elongated metal sheet 64 is separated so that the deposition masks 20th can be obtained, each of them from the sheet-like metal sheet 21 is trained.

In particular, the method for producing a deposition mask comprises 20th a step of feeding an elongated metal sheet 64 which extends like a strip, a step of etching the elongated metal strip 64 using a photolithographic technique to form a first recess 30th in the elongated metal sheet 64 from the side of a first surface 64a forth, and a step of etching the elongated metal sheet 64 using the photolithographic technique to form a second recess 35 in the elongated metal sheet 64 from the side of a second surface 64b . If the first recess 30th and the second recess 35 that in the elongated metal sheet 64 are formed, communicate with each other, the through hole 25th in the elongated metal sheet 64 educated. In the in the 12th to 19th The example shown is the step of forming the second recess 35 before the step of forming the first recess 30th In addition, between the step of forming the second recess is carried out 35 and the step of forming the first recess 30th a step of sealing the second recess thus produced 35 provided. Details of each step are described below.

The 11 shows a manufacturing device 60 for the production of the deposition masks 20th . As in the 11 is shown, the winding body is first 62 manufactured the core 61 around which the elongated metal sheet 64 is wrapped. By turning the core 61 for unwinding the winding body 62 becomes the elongated metal sheet 64 , which extends like a strip, as shown in the 11 is shown. After making the through holes 25th in the elongated metal sheet 64 represents the elongated metal sheet 64 the sheet-like metal sheets 21 and also the deposition masks 20th ready.

The supplied elongated metal sheet 64 is through the transport rollers 72 to an etching device (etching device) 70 transported. The respective in the 12th to 19th Processes are shown by means of the etching device 70 carried out. In this embodiment, a plurality of the deposition masks are 20th in the width direction of the elongated metal sheet 64 assigned. In particular, the deposition masks 20th made from an area having a predetermined position of the elongated metal sheet 64 occupies in the longitudinal direction. In this case it is preferred that the deposition masks 20th the elongated metal sheet 64 be assigned such that the longitudinal direction of each deposition mask 20th the rolling direction D1 of the elongated metal sheet 64 corresponds.

As in the 12th is shown first, photoresist films 65c and 65d each containing a negative type photosensitive resist material on the first surface 64a and the second surface 64b of the elongated metal sheet 64 educated. As a method of forming the photoresist films 65c and 65d a method is used in which a film is formed on which a layer containing a light-sensitive photoresist material such as a light-curing acrylic-based resin is formed, that is, a so-called dry film on the first surface 64a and the second surface 64b of the elongated metal sheet 64 appropriate. As described above, the elongated metal sheet 64 manufactured so that the present amount of nickel hydroxide in the first surface 64a meets the above condition (1). The photoresist film 65c is on such a first surface 64a appropriate.

Then exposure masks 85a and 85b that prevent light from passing through areas from the photoresist films 65c and 65d should be exempt. As in the 13 the masks are shown 85a and 85d on the photoresist films 65c and 65d . For example, as the exposure masks 85a and 85d dry glass plates are used to prevent light from passing through areas away from the photoresist films 65c and 65d should be exempt. After that, the exposure masks 85a and 85b by vacuum bonding into sufficiently close contact with the photoresist films 65c and 65d brought.

A positive type photosensitive resist material can be used. In this case, an exposure mask is used which allows light to pass through an area to be stripped of the photoresist film.

After that, the photoresist films 65c and 65d through the exposure masks 85a and 85b exposed. Furthermore, the photoresist films 65c and 65d developed (developing step) so that an image on the exposed photoresist films 65c and 65d is formed. Consequently, as in the 14A a first photoresist pattern is shown 65a on the first surface 64a of the elongated metal sheet 64 are formed, and a second photoresist pattern 65b can on the second surface 64b of the elongated metal sheet 64 be formed. The development step may include a photoresist heating step to increase the hardness of the photoresist films 65c and 65d or to attach the photoresist films 65c and 65d on the elongated metal film 64 include with greater certainty. The photoresist heating step is, for example, in one Atmosphere of an inert gas such as argon gas, helium gas, nitrogen gas or the like is carried out at a temperature within a range of 100 to 400 ° C.

The 14B is a partial top view of the elongated metal sheet 64 of 14A on which the first and the second photoresist pattern 65a and 65b are provided if this from the side of the first surface 64a is considered here. In the 14B is an area on which the first photoresist pattern 64a is provided, shaded. In addition, there is a first recess 30th , a wall surface 31 , a connecting section 41 and an upper section 43 that are to be formed by the subsequent etching step are shown by dashed lines.

Then, as in the 15 a second surface etching step of etching the region of the second surface 64b of the elongated metal sheet 64 that doesn't match the second photoresist pattern 65b is covered using a second etchant. For example, the second etchant is from a nozzle located on the side facing the second surface 64b of the transported elongated metal sheet 64 is directed in the direction of the second surface 64b of the elongated metal sheet 64 through the first photoresist pattern 65b pushed out. As a result, as stated in the 15 areas of the elongated metal sheet is shown 64 that do not match the photoresist pattern 65b are covered, removed by the second etchant. As a result, there will be many second cutouts 35 in the second surface 64b of the elongated metal sheet 64 educated. The second etchant to be used is an etchant containing an iron (III) chloride solution and hydrochloric acid.

After that, as in the 16 is shown, the second recesses 35 with a resin 69 coated, which is resistant to a first etchant used in a subsequent first surface etching step. In particular, the second recesses 35 through the resin 69 , which is resistant to the first etchant, sealed. In the example in the 16 is a film of the resin 69 trained so that it not only formed the second recesses 35 , but also the second surface 64b (Photoresist pattern 65b) covered.

Then, as in the 17th the first surface etching step of etching a portion of the first surface 64a of the elongated metal sheet 64 that doesn't match the first photoresist pattern 65a covered, performed so that a first recess 30th in the first surface 64a is formed. The first surface etching step is performed until every second recess 35 and every first recess 30th communicate with each other so that a through hole 25th is formed. According to the second etchant mentioned above, the first etchant to be used is an etchant containing an iron (III) chloride solution and hydrochloric acid.

The first etchant removes it in a section of the elongated metal sheet 64 that is in contact with the first etchant. As a result, the erosion does not develop only in the vertical direction (thickness direction) of the elongated metal sheet 64 , but also in a direction along the sheet plane of the elongated sheet metal 64 . The first surface etching step is preferably completed before the two first cutouts 30th , which are each formed at positions on two adjacent holes 66a of the photoresist pattern 65a are directed to the back of a bridge section 67a be united between the two holes 66a is arranged. Consequently, as in the 18th the above upper section is shown 43 on the first surface 64a of the elongated metal sheet 64 stay behind.

After that, as it is in the 19th the resin is shown 69 from the elongated metal sheet 64 away. For example, the resin 69 removed using an alkali-based stripping liquid. If the alkali-based stripping liquid is used, as in the 19th is shown, the photoresist patterns 65a and 65b at the same time as the resin is removed 69 away. After removal of the resin, however, the photoresist patterns can 65a and 65b separate from the resin 69 be removed.

The elongated metal sheet 64 with many through holes formed in it 25th is through the transport rollers 72 , 72 that are rotated while the elongated metal sheet 64 is sandwiched between them, to a cutting or separating device (cutting or separating device) 73 transported. The feed core described above 61 is caused by a tension (tension) caused by the rotation of the transport rollers 72 , 72 on the elongated metal sheet 64 is exercised, rotated so that the elongated metal sheet 64 from the bobbin 62 is fed.

Then the elongated metal sheet 64 in which many through holes 25th are formed by the cutting or separating device (cutting or separating device) 73 cut or separated so that it has a predetermined length and a predetermined width, whereby the foil-like metal sheets 21 that have many through holes formed therein 25th can be obtained.

In this way, the deposition mask 20th made from the metal sheet 21 with many through holes formed in it 25th trained to be obtained. According to this embodiment, the elongated metal sheet 64 from which the metal sheet 21 is made so that the amount of nickel hydroxide present in the first surface 64a fulfills the above condition (1). The above-mentioned photoresist pattern 65a and the photoresist film 65c , of which the photoresist pattern 65a stems from such a first surface 64a appropriate. Consequently, the adhesive force between the first surface 64a of the elongated metal sheet 64 and the first photoresist pattern 65c be adequately ensured. It is also called a photoresist film 65c a so-called dry film with a high resolution, such as a photoresist film containing a light-curing resin based on acrylic, is used. Accordingly, according to this embodiment, the first resist pattern can 65a with a narrow width precisely on the first surface 64a of the elongated metal sheet 64 are formed during difficulties such as peeling off the first photoresist pattern 65a from the metal sheet 21 , be prevented. Consequently, the deposition mask 20th used to manufacture an organic EL display device with a high pixel density with a high throughput.

Furthermore, according to this embodiment, since the first resist pattern 65a with a desired width precisely on the first surface 64a of the elongated metal sheet 64 can be formed, the deposition mask 20th that the top section 43 with a desired width β has to be produced. Consequently, the above angle θ1 be enlarged as much as possible while the deposition mask 20th has sufficient strength.

(Deposition step)

Next is a method of depositing the deposition material on the substrate 92 using the obtained deposition mask 20th described. As in the 2nd is the deposition mask 20th first in close contact with the substrate 92 brought the second surface 20b the deposition mask 20th using magnets, not shown, in close contact with the surface of the substrate 92 to be brought. In addition, as it is in the 1 is shown, the deposition masks 20th on the frame 15 attached in a taut condition so that the surface of each deposition mask 20th parallel to the surface of the glass substrate 92 is. Thereafter, by heating the deposition material 98 in the crucible 94 the deposition material 98 evaporates or sublimates. The vaporized or sublimed deposition material 98 sticks through the through holes 25th in the deposition masks 20th on the substrate 92 . As a result, a film of the deposition material 98 on the surface of the substrate 92 formed in a desired pattern that corresponds to the positions of the through holes 25th the deposition masks 20th corresponds.

According to this embodiment, since the upper section 43 with a desired width β on the side of the first surface 20a can be left, the deposition mask 20th have sufficient strength.

The above embodiment can be modified in various ways. Modification examples are described below as necessary with reference to the drawings. In the following description and the drawings used in the following description, a part that may be formed in accordance with the above embodiment has the same reference numeral as the corresponding part in the above embodiment, and an overlapping description is omitted. In addition, if the effect obtained by the above-mentioned embodiment is obviously contained in the modification examples, a corresponding description may be omitted.

In the above embodiment, the “first surface” specified by the above condition (1) is a surface of the elongated metal sheet 64 or the metal sheet 21 on which the deposition material 98 is arranged in the deposition step. However, the “first surface” defined by the above condition (1) may be a surface of the elongated metal sheet 64 or the metal sheet 21 be on the substrate 92 is arranged. In this case, a photoresist pattern can be found on the side of the elongated metal sheet 64 or the metal sheet 21 be attached on which the substrate 92 is arranged securely on the elongated metal sheet 64 or the metal sheet 21 be attached. As a result, recesses can be precise on the side of the elongated metal sheet 64 or the metal sheet 21 on which the substrate 92 is arranged to be formed with a high throughput.

In particular, in this embodiment, the above condition (1) can be expressed as below.

“When a composition analysis of at least one surface of a surface of a metal sheet and the other surface, which is opposite to one surface, is carried out using X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of the X-ray photoelectron spectroscopy is 0 , 4 or less, where A1 is the sum of a planar dimension peak of nickel oxide and a planar dimension peak of nickel hydroxide, and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide. "

Furthermore, according to this embodiment, if the result of the composition analysis of at least one surface of one surface of the metal sheet and the other surface thereof that is opposite to one surface meets the above condition, recesses in the surface of the metal sheet can be made high Throughput can be formed precisely.

In addition, the condition where “a ratio A1 / A2 obtained by the result of X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension peak value of nickel hydroxide, and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide ”, both through the first surface 64a as well as the second surface 64b of the metal sheet 64 be fulfilled.

In addition, in the above embodiment, a plurality of the deposition masks are 20th in the width direction of the elongated metal sheet 64 assigned. In addition, in the deposition step, the plurality of deposition masks 20th on the frame 15 assembled. Without limitation, however, as in the 20th deposition masks are shown 20th used a majority of the effective areas 22 have, which like a grid along both the width direction and the longitudinal direction of the metal sheet 21 are arranged.

In addition, in the above embodiment, the photoresist heating step is carried out in the development step. If the elongated metal sheet 64 however, it is made to meet the above condition (1), thereby reducing the adhesive force between the elongated metal sheet 64 and the photoresist film 65c can be sufficiently ensured, the photoresist heating step can be omitted. If the resist heating step is not performed, the hardness of the first resist pattern is 65a less than in a case where the photoresist heating step is performed. Consequently, after the formation of the through holes 25th the photoresist pattern 65a are easier to remove.

Furthermore, in the above embodiment, a metal sheet having a desired thickness is obtained by rolling a base metal to produce a sheet metal member and then tempering the sheet metal member. Without limitation, a metal sheet having a desired thickness can be manufactured by a film forming step using a plating process. In the film forming step, for example, while rotating a stainless steel drum partially immersed in a plating liquid, a plating film is formed on a surface of the drum. By removing the plating film, an elongated metal sheet can be produced in a roll-to-roll manner. When a metal sheet is made of a nickel-containing iron alloy, a mixed solution of a solution containing a nickel compound and a solution of an iron compound can be used as the plating liquid. For example, a mixed solution of a solution containing nickel sulfamate and a solution containing iron sulfamate can be used. An additive such as e.g. Malonic acid or saccharin may be included.

Then, the above-mentioned tempering step can be carried out with the metal sheet thus obtained. In addition, after the tempering step, the above-mentioned cutting or separating step of separating both ends of the metal sheet can be carried out, so that the width of the metal sheet is adjusted to a desired width.

Even if a metal sheet is manufactured using a plating process, by performing the step of forming the photoresist pattern 65a and 65b and the step of etching the first surface and the second surface of the metal sheet, the deposition mask having the plurality of through holes formed therein 25th corresponding to that obtained in the above embodiment. In addition, the use of the condition (1) can optimize the judgment of a metal sheet and the manufacturing conditions.

EXAMPLES

Next, the present invention will be described in more detail based on examples, and the present invention is not limited to the description of the examples below as long as the present invention does not depart from the spirit thereof.

example 1

(First winding body)

A base metal made of an iron alloy containing 34 to 38% by mass of nickel, chromium, the balance iron and unavoidable impurities was produced. Then, the base metal was subjected to the rolling step, the slitting step and the tempering step described above, so that a winding body (first winding body) around which an elongated metal sheet with a thickness of 20 µm was wound was produced.

[Composition analysis]

After that, the elongated metal sheet 64 cut with scissors to a predetermined area, such as 30 × 30 mm, so that a first test specimen was obtained. The composition of a surface of the first test specimen was then analyzed using the XPS method. An XPS ESCALAB 220i-XL manufactured by Thermo Fisher Scientific Company was used as a measuring device.

• Einfallender Röntgenstrahl: Monochromatisch gemachter Al kα (monochromatisch gemachter Röntgenstrahl, hv = 1486,6 eV)
• Röntgenausgangsleistung: 10kV • 16mA (160 W)
• Blendenöffnungsgrad: F.O.V. = offen, A.A. = offen
• Gemessener Bereich: 700 µmø
• Röntgenstrahl-Einfallswinkel ø1 (vgl. die 10): 45 Grad
• Photoelektron-Auftreffwinkel: 90 Grad

The XPS device was set up in the composition analysis in the following manner.

• Incident X-ray: Monochromatic Al kα (monochromatic X-ray, hv = 1486.6 eV)
• X-ray output power: 10kV • 16mA (160 W)
• Degree of aperture: FOV = open, AA = open
• Measured area: 700 µmø
• X-ray angle of incidence ø1 (see 10th ): 45 degrees
• Photoelectron impact angle: 90 degrees

The 21 (a) and 21 (b) show results of an analysis of the first test body, which has been cut off from the first winding body, by means of the XPS device. In the 21 (a) and 21 (b) the axis of abscissa shows a photoelectron binding energy (binding energy) of an electron trajectory of the first test piece, which corresponds to the intensity of photoelectrons from the first test piece, and the axis of ordinate shows an intensity of the photoelectrons from the first test piece. The 21 (a) shows a case where the value of the abscissa axis is about 700 to 740 eV, and the 21 (b) shows a case where the value of the abscissa axis is about 850 to 890 eV.

In the composition analysis using the XPS method, a peak that corresponds to a content of a constituent element contained in the first test specimen appears at a given position that corresponds to the constituent element in the abscissa axis. For example, in the 21 (a) a peak indicated by the symbol P1 is indicated, iron oxide and iron hydroxide contained in the first test specimen and a peak indicated by the symbol P2 corresponds to iron contained in the first test specimen. In addition, in the 21 (b) a peak indicated by the symbol P3 is indicated, nickel oxide and nickel hydroxide contained in the first test specimen, and a peak indicated by the symbol P4 is indicated corresponds to nickel contained in the first test specimen.

The reference shows 22 (a) a result of analyzing nickel oxide (NiO) manufactured as a first reference specimen by the XPS method. In addition, the 22 (b) a result of analyzing nickel hydroxide (Ni (OH) ₂ ), which was produced as a second reference specimen, by means of the XPS method. As in the 22 (a) is shown, a peak corresponding to nickel oxide appears at a position at which the value of the axis of abscissa is a first value E1 = 853.8 eV. On the other hand, as it appears in the 22 (b) a peak corresponding to nickel hydroxide is shown at a position where the value of the axis of abscissa is a second value E2 = 855.9 eV.

In the 21 (b) are a position of the first value as a reference E1 at which the peak corresponding to nickel oxide appears and a position of the second value E2 at which the peak corresponding to nickel hydroxide appears is shown by the broken lines. Since the values of E1 and E2 are close to each other, as in the 21 (b) shown comprises the peak in the measurement result of the first test specimen P3 both a detection result of photoelectrons corresponding to nickel oxide and a detection result of photoelectrons corresponding to nickel hydroxide. The peak is not easy P3 , the Indian 21 (b) is shown to separate into a peak corresponding to nickel oxide and a peak corresponding to nickel hydroxide. With this point in mind, in the above condition (1), an adhesive force between the metal sheet and the resist pattern is evaluated using a value that is the sum of the detection result of photoelectrons corresponding to nickel oxide and the detection result of photoelectrons corresponding to nickel hydroxide .

After the peaks P1 to P4 that in the 21 (a) and 21 (b) planar dimension peak values were calculated by integrating the planar dimensions of the respective peaks. The results were: The planar dimension peak value of the peak P1 , which corresponds to the iron oxide and the iron hydroxide, was 22329.3, the planar dimension peak value of the peak P2 , which corresponds to iron, was 4481.8, the planar dimension peak value of the peak P3 corresponding to the nickel oxide and nickel hydroxide was 9090.5, and the planar dimension peak value of the peak P4 , which corresponds to nickel, was 4748.9. Therefore, when the sum of the planar dimension peak value of nickel oxide and the planar dimension peak value of nickel hydroxide is represented as A1, and the sum of the planar dimension peak value of iron oxide and the planar dimension peak value of iron hydroxide is represented as A2, A1 / A2 = 0 , 41. Consequently, it can be assumed that the first winding former from which the first test specimen was removed does not meet the above-mentioned condition (1).

The planar dimension peak values of the respective peaks P1 to P4 were calculated using an analysis function of the XPS device. In order to prevent a measurement result from varying depending on an analysis device, the Shirley method was always used as the background calculation method.

A method of calculating the above A1 / A2 based on the analysis result by the XPS method will be described in detail below.

Setting the XPS device

• Einstellungsbedingung 1: Ag 3d_5/2 368,26 ± 0,05 eV
• Einstellungsbedingung 2: Au 4f_7/2 83,98 ± 0,05 eV
• Einstellungsbedingung 3: Cu 2p_3/2 932,67 ± 0,05 eV

First, adjustment of a spectrograph energy axis of the XPS was carried out so that the following setting conditions 1 to 3 were met.

• Setting condition 1: Ag 3d _5/2 368.26 ± 0.05 eV
• Setting condition 2: Au 4f _7/2 83.98 ± 0.05 eV
• Setting condition 3: Cu 2p _3/2 932.67 ± 0.05 eV

Setting condition 1 means that the spectrograph energy axis was set so that the photoelectron binding energy obtained based on a silver 3d _5/2 orbit was within a range of 368.26 ± 0.05 eV. Accordingly, the setting condition 2 means that the spectrograph energy axis was set so that a photoelectron binding energy obtained on the basis of a gold 4f _7/2 orbit was within a range of 83.98 ± 0.05 eV . Accordingly, the setting condition 3 means that the spectrograph energy axis was set so that a photoelectron binding energy obtained on the basis of a copper 2p _3/2 orbit was within a range of 932.67 ± 0.05 eV .

In addition, a charge correction of the XPS device was set so that a photoelectron binding energy obtained based on CC bonding of a carbon 1s orbit was within a range of 284.7 to 285.0 (eV) .

Thereafter, a test piece made of an iron-nickel alloy was analyzed by the XPS device set in the above-described manner, and the above-mentioned A1 / A2 was calculated. First, a method of calculating the above A2 based on the peaks P1 and P2 of iron with reference to the 27A to 27D described.

Analysis of iron

The 27A shows enlarged a result of analyzing a certain test specimen, which is made of an iron-nickel alloy, by means of the XPS device, in particular a result in which the value of the abscissa axis lies within a range from 700 to 740 eV. As in the 27A is shown, the result in which the value of the abscissa axis is within a range of 700 to 740 eV includes a graph showing an intensity distribution of photoelectrons obtained on the basis of an iron 2p _1/2 orbit, and a graph showing an intensity distribution of photoelectrons obtained on the basis of an iron 2p _3/2 orbit. Here, an example will be described in which the above-mentioned A2 was calculated based on the graph showing an intensity distribution of photoelectrons obtained based on an iron 2p _3/2 orbit (hereinafter referred to as “total iron peak P_Fe " designated).

[Background Line Calculation Step]

• Unterer Grenzwert B1: 703,6 ± 0,2 eV
• Oberer Grenzwert B2: 717,0 ± 0,2 eV

First is a step to calculate the background line BG_Fe in the total iron peak P_Fe described. A lower limit B1 and an upper limit B2 values of the photoelectron binding energy of the abscissa axis in the 2p _3/2 orbit of iron to be analyzed were determined as follows.

• Lower limit B1 : 703.6 ± 0.2 eV
• upper limit B2 : 717.0 ± 0.2 eV

Then there was a background line BG_Fe in the total iron peak P_Fe within the range of the lower limit B1 to the upper limit B2 calculated using the Shirley method. The "± 0.2 eV" in the lower limit B1 and the upper limit B2 that have been mentioned above means that lower limit values B2 and the upper limit B2 were slightly adjusted for each test specimen to cause a noise of a measurement result to be a calculation result of the background line BG_Fe not influenced.

[Separation step of the peak from iron alone]

Next is a step of separating a peak of iron alone from the total iron peak P_Fe according to the 27B described. The 27B is an enlarged view of the total iron peak P_Fe shows who in the 27A is shown. Here is a result of separating the peak of iron alone from the total iron peak P_Fe explained after the total iron peak P_Fe has been subjected to a smoothing process. A known method such as averaging or the like can be used as the smoothing method.

First was a peak position E_Fe1 of a peak determined by iron alone. In particular, it was determined whether a peak that occurred with respect to iron alone was the peak P1 or P2 was that in the total iron peak P_Fe was involved. In the field of the XPS method, it is known that the photoelectron binding energy based on a 2p _3/2 orbit of iron alone is approximately 707 eV. As a result, the peak P2 identified as the peak that occurred with iron alone. Then a position of the peak P2 searched. If a peak position of the peak P2 was within a range of 706.9 ± 0.2 eV, the position of the peak P2 than the peak position E_Fe1 of the peak of iron used alone.

Then a full width at half maximum W_Fe1 of the peak of iron alone was set at 1.54 eV. Thereafter, using the analysis function of the XPS device, a peak whose peak position E_Fe1 was and its full width at half maximum W_Fe1 was of the total iron peak P_Fe Cut. In the 27B is the peak of iron thus obtained by the symbol alone P_Fe1 specified. When analyzed by the XPS device, there is a possibility that the full width at half maximum of the peak obtained P_Fe1 based on the set half-value width W_Fe1 varies. In this case a variation within a range of ± 0.1 eV was permissible.

Regarding terms related to total iron peak P_Fe are the "Peak." P_Fe1 of iron alone ”and the“ Peak P_Fe2 "And" Peak P_Fe3 “Peaks by dissolving the total iron peak P_Fe into a plurality of peaks based on an element alone and a compound contained in a test piece. In particular, the aforementioned “peaks P1 and P2 “Peaks by the shape of the total iron peak P_Fe can be distinguished, and the “peaks P_Fe1 , P_Fe2 and P_Fe3 “Are peaks by dissolving the total iron peak P_Fe can be obtained on the basis of a physical theory.

[Step of Calculating the Planar Dimension Peak of Iron Alone]

Then became a planar dimension S_Fe1 of the peak P_Fe1 calculated by iron alone. The planar dimension S_Fe1 is a planar dimension of an area (hatched area) through the peak P_Fe1 and the background line BG_Fe in the 27C is surrounded.

It also became a planar dimension of the total iron peak P_Fe calculated. The planar dimension of the total iron peak P_Fe is a planar dimension of an area defined by the total iron peak P_Fe and the background line BG_Fe in the 27C is surrounded.

Then became a planar dimension S_Fe (REST) that in the 27C is shown by subtracting the planar dimension S_Fe1 of the peak P_Fe1 of iron alone from the planar dimension of the total iron peak P_Fe calculated. The planar dimension calculated in the manner described above S_Fe (REST) was used as the above-mentioned A2, that is, the sum of the planar dimension peak of iron oxide and the planar dimension peak of iron hydroxide.

For reference purposes, the shows 27D a result of separating the total peak P_Fe assuming that the total iron peak P_Fe includes the following three peaks, ie, the peak P_Fe1 , the peak P_Fe2 and the peak P_Fe3 . As described above, the peak is P_Fe1 a peak of iron alone. In addition, the peak P_Fe2 and the peak P_Fe3 a peak of iron oxide and a peak of iron hydroxide.

If the total iron peak P_Fe is separated into a plurality of peaks, as in the 27D shown corresponds to the planar dimension mentioned above S_Fe (REST) a total of the planar dimension peak value excluding the peak P_Fe1 of iron alone. In particular, the planar dimension corresponds S_Fe (REST) the sum of the planar dimension peak value of iron oxide and the planar dimension peak value of iron hydroxide.

Although the position at which a peak of iron alone was already known, there are a plurality of positions of iron oxide and iron hydroxide. Consequently, a peak of iron oxide and a peak of iron hydroxide do not necessarily appear like the two peaks (peak P_Fe2 and peak P_Fe3 ) in the 27 are shown. As a result, it is difficult to accurately calculate the rate of iron oxide or iron hydroxide in a surface layer of a test piece. With this point in mind, the sum of the planar dimension peak value of iron oxide and the planar dimension peak value of iron hydroxide is used as the aforementioned A2.

The planar dimension S_Fe1 of the peak P_Fe1 of iron alone is sometimes called the planar dimension value of the peak P2 designated and the planar dimension S_Fe (REST) is sometimes called the planar dimension value of the peak P1 designated.

Analysis of nickel

Next, the analysis of nickel will be described. The 28A shows enlarged a result of the analysis of a particular test specimen which has been produced from an iron-nickel alloy by means of the XPS device, in particular a result in which an abscissa axis value lies in the range from 850 to 890 eV. As in the 28A is shown, the result in which an abscissa axis value is in the range of 850 to 890 eV includes a graph showing an intensity distribution of photoelectrons obtained on the basis of a nickel 2p _1/2 orbit, and a graph , which shows an intensity distribution of photoelectrons obtained on the basis of a nickel 2p _3/2 orbit. Here, an example is described in which the above-mentioned A1 was calculated on the basis of the graph showing an intensity distribution of photoelectrons obtained on the basis of a nickel 2p _3/2 orbit (hereinafter referred to as “nickel Total peak P_Ni " designated). Regarding an operation in the process for Calculating A1, which is similar to that of the calculation method for A2 for iron, a detailed description thereof is omitted.

[Background Line Calculation Step]

• Unterer Grenzwert B3: 849,5 ± 0,2 eV
• Oberer Grenzwert B4: 866,9 ± 0,2 eV

A background line BG_Ni in the total nickel peak P_Ni was calculated using the Shirley method. A lower limit B3 and an upper limit B4 values of a photoelectron binding energy of the abscissa axis in the 2p _3/2 orbit of nickel to be analyzed were determined as follows.

• Lower limit B3 : 849.5 ± 0.2 eV
• upper limit B4 : 866.9 ± 0.2 eV

[Separation step of the peak from nickel alone]

Then as it was in the 28B a peak of nickel alone from the total nickel peak is shown P_Ni Cut. In particular, the total nickel peak P_Ni a peak position of the peak P4 that occurred with nickel alone. If a peak position of the peak P4 the position of the peak was within a range of 852.6 ± 0.2 eV P4 than the peak position E_Ni1 of the peak of nickel used alone.

Then a full width at half maximum W_Ni1 of the peak of nickel alone was set at 1.15 eV. Thereafter, using the analysis function of the XPS device, a peak whose peak position E_Ni1 and its full width at half maximum W_Ni1 of the total nickel peak P_Ni Cut. In the 28B is the peak of nickel obtained by the symbol alone P_Ni1 specified.

[Step of Calculating the Planar Dimension Peak Value of Nickel Alone]

Then became a planar dimension S_Ni1 of the peak P_Ni1 calculated by nickel alone. The planar dimension S_Ni1 is a planar dimension of an area (hatched area) through the peak P_Ni1 and the background line BG_Ni in the 28C is surrounded.

It also became a planar dimension of the overall nickel peak P_Ni calculated. The planar dimension of the total nickel peak P_Ni is a planar dimension of an area defined by the total nickel peak P_Ni and the background line BG_Ni in the 28C is surrounded.

Then became a planar dimension S_Ni (REST) that in the 28C is shown by subtracting the planar dimension S_Ni1 of the peak P_Ni of nickel alone from the planar dimension of the total nickel peak P_Ni calculated. The planar dimension S_Ni (REST) , which was calculated as above, was used as the aforementioned A1, that is, the sum of the planar dimension peak value of nickel oxide and the planar dimension peak value of nickel hydroxide.

For reference purposes, the shows 28D a result of separating the total peak P_Ni of nickel into the following four peaks, ie, the peak P_Ni1 , the peak P_Ni2 , the peak P_Ni3 and the peak P_Ni4 . As described above, the peak is P_Ni1 a peak of nickel alone. In addition, the peak P_Ni2 , the peak P_Ni3 and the peak P_Ni4 Peaks of nickel oxide or peaks of nickel hydroxide.

If the total nickel peak P_Ni is separated into the plurality of peaks, as in the 28D shown corresponds to the planar dimension mentioned above S_Ni (REST) a total of the planar dimension peak value, excluding the peak P_Ni1 of nickel alone. In particular, the planar dimension corresponds S_Ni (REST) the sum of the planar dimension peak of nickel hydroxide and the planar dimension peak of nickel hydroxide.

The planar dimension S_Ni1 of the peak P_Ni1 Nickel alone is sometimes called the planar dimension value of the peak P4 designated and the planar dimension S_Ni (REST) is sometimes called the planar dimension value of the peak P3 designated.

Calculation of A1 / A2

A1 / A2 was calculated based on the A1 and A2 calculated above.

[Evaluation of the adhesive properties on the photoresist pattern]

The above-mentioned elongated metal sheet of the first bobbin was cut to an area of 200 × 200 mm with scissors, so that a first sample was obtained. Then, a dry film comprising a light-sensitive layer having a thickness of 10 μm was attached to a surface of the first sample so that a photoresist film was provided on the surface of the first sample. After that, the photoresist film was exposed such that a grid-like photoresist pattern with a width w was formed as in the 23 is shown. The width w was set to 100 µm. Then, the first sample was immersed in a developing solution, and the time until the 100 µm-width photoresist pattern was peeled from the first sample was measured. As the developing solution, a solution having a concentration of 5.0 g / L of sodium carbonate manufactured by Soda Ash Japan Co., Ltd. was used. The temperature of the developing solution was set at 24 ° C.

In this example, when the photoresist pattern immersed in the developing solution peeled off after 15 minutes or more, it was evaluated so that the adhesive properties were satisfactory. On the other hand, if the photoresist pattern immersed in the developing solution peeled off after less than 15 minutes, it was evaluated so that the adhesive property was unsatisfactory. In this example, the photoresist pattern separated from the first sample after 13 minutes. Consequently, it can be assumed that the adhesive properties between the first winding body from which the first test body has been cut out and the photoresist pattern are unsatisfactory.

Whether or not the photoresist pattern peels off from the metal sheet can be judged based on whether or not the photoresist pattern has a curved portion when the photoresist pattern is viewed along the perpendicular direction of the first surface of the metal sheet. This is because a portion of the photoresist pattern peeling off the metal sheet floats in the developing solution so that it deforms. The 27 FIG. 12 shows an example of a schematic diagram of the metal sheet and the photoresist pattern in which a portion of the lattice-like photoresist pattern peels off from the metal sheet in the developing solution.

(Second to fourth bobbin)

According to the first bobbin, a second bobbin to a fourth bobbin around which an elongated metal sheet with a thickness of 20 µm was wound using a base metal made of an iron alloy containing 34 to 38 mass% of nickel, less than 0 , 1% by mass of chromium, remainder iron and unavoidable impurities. Furthermore, in accordance with the first winding body, the second winding body to the fourth winding body were subjected to the composition analysis and the evaluation of the adhesive properties on the photoresist pattern. The 24 (a) and 24 (b) , the 25 (a) and 25 (b) and the 26 (a) and 26 (b) show the respective results of test specimens which have been cut out of the second winding body, the third winding body and the fourth winding body and which have been analyzed by means of the XPS device mentioned above.

(Summary of evaluation results of the first to fourth bobbin)

Table 3 shows the planar dimension peak values of the above respective peaks P1 to P4 obtained by analyzing the test specimens taken from the elongated metal sheets of the first winding former to the fourth winding former. In addition, Table 3 shows the calculated results of A1 / A2, where A1 is the sum of a planar dimension peak of nickel oxide and a planar dimension peak of nickel hydroxide, and A2 is the sum of a planar dimension peak of iron oxide and a planar dimension peak of iron hydroxide is. As shown in Table 3, the first bobbin and the second bobbin did not meet the above condition (1). On the other hand, the third bobbin and the fourth bobbin did not meet the above condition (1). For reference purposes, Table 4 shows the compositions of the elongated metal sheets of the first bobbin to the fourth bobbin calculated by the composition analysis using the XPS method. Table 3 Peak P1 Peak P2 Peak P3 Peak P4 A1 / A2 First winding body 22329.3 4481.8 9090.5 4748.9 0.41 Second winding body 45167.9 8984.6 20021.6 7849.8 0.44 Third winding body 36717.5 5195.9 8444.0 6138.4 0.23 Fourth winding body 27134.2 3991.4 7948.8 4690.9 0.29 Table 4 Composition (atomic%) C. N O Fe Ni First winding body 12.7 1.0 46.5 32.1 7.7 Second winding body 15.6 0.8 47.4 29.5 6.7 Third winding body 32.7 0.8 40.4 22.2 4.0 Fourth winding body 18.4 1.2 45.9 28.5 6.1

(Summary of evaluation results regarding the adhesive properties on the photoresist pattern)

Table 5 shows results of the evaluation of the adhesive properties on the photoresist pattern, which was carried out on the samples cut out from the elongated metal sheets of the first winding body to the fourth winding body. In the "Adhesive Properties" column of Table 5, "Satisfactory" means that the resist pattern immersed in the developing solution was peeled off from the resist pattern after 15 minutes or more, and "Unsatisfactory" means that the resist pattern immersed in the developing solution was removed in less than 15 Minutes from the photoresist pattern. Table 5 Peeling time Adhesive properties First winding body 13 Not satisfactory Second winding body 14 Not satisfactory Third winding body 35 Adequate Fourth winding body 33 Satisfactory

As shown in Table 3 and Table 5, the samples cut out from the third bobbin and the fourth bobbin had satisfactory adhesive properties on the photoresist pattern. On the other hand, the samples cut out of the first package and the second package did not have sufficient adhesive properties on the photoresist pattern. Based on these results, it can be assumed that it is effective that the ratio of nickel oxide and nickel hydroxide relative to iron oxide and iron hydroxide is reduced in the surface of the metal sheet, in particular that the aforementioned A1 / A2 is set to less than 0.4, to ensure the adhesive properties on the photoresist pattern.

(Fifth to ninth packages)

According to the first bobbin, a fifth to eighth bobbin around which an elongated metal sheet with a thickness of 20 µm was wound and a ninth bobbin around which an elongated metal sheet with a thickness of 18 µm was wound using a base metal which was made of an iron alloy containing 34 to 38% by mass of nickel, less than 0.1% by mass of chromium, the remainder being iron and inevitable impurities. Furthermore, in accordance with the first winding body, the fifth winding body to the ninth winding body were subjected to the composition analysis and the evaluation of the adhesive properties on the photoresist pattern.

(Summary of the evaluation results of the first to fourth bobbin)

Table 6 shows the planar dimension peak values of the above respective peaks P1 to P4 obtained by analyzing the test specimens taken from the elongated metal sheets of the fifth winding body to the ninth winding body. Table 6 also shows the calculated results of A1 / A2. As shown in Table 6, the sixth bobbin did not meet the above condition (1). On the other hand, the fifth bobbin and the seventh bobbin to ninth bobbins met the above condition (1). For reference purposes, Table 7 shows compositions of the elongated metal sheets of the fifth bobbin through the ninth bobbin calculated by the composition analysis using the XPS method. Table 6 Peak P1 Peak P2 Peak P3 Peak P4 A1 / A2 Fifth winding body 24528.3 3176.6 9165.0 4292.1 0.37 Sixth winding body 28969.1 5527.5 13102.1 5083.0 0.45 Seventh package 33256.9 1043.7 6615.7 2013.6 0.20 Eighth package 30606.3 3739.6 8098.6 6506.4 0.26 Ninth winding body 97247.0 6789.0 19847.0 12266.0 0.20 Table 7 Composition (atomic%) C. N O Fe Ni Fifth winding body 16.2 1.0 45.1 30.6 7.1 Sixth winding body 33.3 2.1 41.6 18.4 4.7 Seventh package 24.6 0.8 47.7 24.2 2.7 Eighth package 25.9 0.6 42.0 27.0 4.6 Ninth winding body 34.6 1.3 42.6 17.4 4.1

(Summary of evaluation results of the adhesive properties on the photoresist pattern)

Table 8 shows results of the evaluation of the adhesive properties on the photoresist pattern, which was carried out on the samples cut out from the elongated metal sheets of the fifth winding body to the ninth winding body. Table 8 Adhesive properties Fifth winding body Satisfactory Sixth winding body Not satisfactory Seventh package Satisfactory Eighth package Adequate Ninth winding body Adequate

As shown in Table 6 and Table 8, the samples cut out from the fifth bobbin and the seventh bobbin to ninth bobbins had satisfactory adhesive properties on the photoresist pattern. On the other hand, the sample cut out from the sixth package did not have sufficient adhesive properties on the photoresist pattern. Based on these results, it can be considered that it is effective that the above-mentioned A1 / A2 is set to less than 0.4 in order to improve the adhesive property on the resist pattern ensure. In particular, the above condition (1) is a powerful evaluation method for selecting a metal sheet.

Reference list

20th

Deposition mask

21

metal sheet

21a

First surface of a metal sheet

21b

Second surface of a metal sheet

22

Effective area

23

Peripheral area

25th

Through hole

30th

First recess

31

Wall surface

35

Second recess

36

Wall surface

43

Upper section

64

Elongated sheet metal

64a

First surface of the elongated metal sheet

64b

Second surface of the elongated metal sheet

65a

First photoresist pattern

65b

Second photoresist pattern

65c

First photoresist film

65d

Second photoresist film

81

Irradiation unit

82

Registration unit

98

Separation material

1. 1. Verfahren zur Herstellung eines Metallblechs, das zur Herstellung einer Abscheidungsmaske mit einer Mehrzahl von darin ausgebildeten Durchgangslöchern verwendet wird, wobei das Verfahren einen Herstellungsschritt des Herstellens eines Blechelements, das aus einer Nickel-enthaltenden Eisenlegierung hergestellt ist, umfasst, wobei:
   • wenn eine Zusammensetzungsanalyse einer ersten Oberfläche des Metallblechs, das von dem Blechelement erhalten worden ist, unter Verwendung einer Röntgenphotoelektronenspektroskopie durchgeführt wird, ein Verhältnis A1/A2, das durch das Ergebnis der Röntgenphotoelektronenspektroskopie erhalten wird, 0,4 oder weniger beträgt, wobei A1 die Summe eines Planardimension-Peakwerts von Nickeloxid und eines Planardimension-Peakwerts von Nickelhydroxid ist und A2 die Summe eines Planardimension-Peakwerts von Eisenoxid und eines Planardimension-Peakwerts von Eisenhydroxid ist; und
   • in der Zusammensetzungsanalyse der ersten Oberfläche des Metallblechs mittels der Röntgenphotoelektronenspektroskopie ein Einfallswinkel eines Röntgenstrahls, der zu dem Metallblech auf die erste Oberfläche emittiert wird, 45 Grad beträgt, und ein Auftreffwinkel von Photoelektronen, die von dem Metallblech abgegeben werden, 90 Grad beträgt.
2. 2. Verfahren zur Herstellung eines Metallblechs nach dem Gegenstand 1, das ferner einen Anlassschritt des Anlassens des Blechelements zum Erhalten des Metallblechs umfasst.
3. 3. Verfahren zur Herstellung eines Metallblechs nach dem Gegenstand 2, bei dem der Anlassschritt in einer Inertgasatmosphäre durchgeführt wird.
4. 4. Verfahren zur Herstellung eines Metallblechs nach einem der Gegenstände 1 bis 3, bei dem der Herstellungsschritt einen Walzschritt des Walzens eines Basismetalls, das aus einer Nickel-enthaltenden Eisenlegierung hergestellt ist, umfasst.
5. 5. Verfahren zur Herstellung eines Metallblechs nach einem der Gegenstände 1 bis 3, bei dem der Herstellungsschritt einen Folienerzeugungsschritt des Erzeugens eines Plattierungsfilms durch die Verwendung einer Plattierungsflüssigkeit, die eine Lösung, die eine Nickelverbindung enthält, und eine Lösung umfasst, die eine Eisenverbindung enthält, umfasst.
6. 6. Verfahren zur Herstellung eines Metallblechs nach einem der Gegenstände 1 bis 5, bei dem die Dicke des Metallblechs 85 µm oder weniger beträgt.
7. 7. Verfahren zur Herstellung eines Metallblechs nach einem der Gegenstände 1 bis 6, bei dem das Metallblech zur Herstellung der Abscheidungsmaske durch Belichten und Entwickeln eines trockenen Films, der an der ersten Oberfläche des Metallblechs angebracht ist, so dass ein erstes Photolackmuster gebildet wird, und durch Ätzen eines Bereichs der ersten Oberfläche des Metallblechs, wobei der Bereich nicht mit dem ersten Photolackmuster bedeckt ist, dient.
8. 8. Metallblech, das zur Herstellung einer Abscheidungsmaske mit einer Mehrzahl von darin ausgebildeten Durchgangslöchern verwendet wird, wobei:
   • wenn eine Zusammensetzungsanalyse einer ersten Oberfläche des Metallblechs unter Verwendung einer Röntgenphotoelektronenspektroskopie durchgeführt wird, ein Verhältnis A1/A2, das durch das Ergebnis der Röntgenphotoelektronenspektroskopie erhalten wird, 0,4 oder weniger beträgt, wobei A1 die Summe eines Planardimension-Peakwerts von Nickeloxid und eines Planardimension-Peakwerts von Nickelhydroxid ist, und A2 die Summe eines Planardimension-Peakwerts von Eisenoxid und eines Planardimension-Peakwerts von Eisenhydroxid ist; und
   • in der Zusammensetzungsanalyse der ersten Oberfläche des Metallblechs mittels der Röntgenphotoelektronenspektroskopie ein Einfallswinkel eines Röntgenstrahls, der zu dem Metallblech auf die erste Oberfläche emittiert wird, 45 Grad beträgt, und ein Auftreffwinkel von Photoelektronen, die von dem Metallblech abgegeben werden, 90 Grad beträgt.
9. 9. Metallblech nach dem Gegenstand 8, bei dem die Dicke des Metallblechs 85 µm oder weniger beträgt.
10. 10. Metallblech nach dem Gegenstand 8 oder 9, bei dem das Metallblech zur Herstellung der Abscheidungsmaske durch Belichten und Entwickeln eines trockenen Films, der an der ersten Oberfläche des Metallblechs angebracht ist, so dass ein erstes Photolackmuster gebildet wird, und durch Ätzen eines Bereichs der ersten Oberfläche des Metallblechs, wobei der Bereich nicht mit dem ersten Photolackmuster bedeckt ist, dient.
11. 11. Verfahren zur Herstellung einer Abscheidungsmaske mit einer Mehrzahl von darin ausgebildeten Durchgangslöchern, wobei das Verfahren umfasst:
    • einen Schritt des Herstellens eines Metallblechs;
    • einen erstes Photolackmuster-Bildungsschritt des Bildens eines ersten Photolackmusters auf einer ersten Oberfläche des Metallblechs; und
    • einen Ätzschritt des Ätzens eines Bereichs der ersten Oberfläche des Metallblechs, wobei der Bereich nicht mit dem Photolackmuster bedeckt ist, so dass erste Aussparungen zum Festlegen der Durchgangslöcher in der ersten Oberfläche des Metallblechs ausgebildet werden;
    • wobei:
      • wenn eine Zusammensetzungsanalyse einer ersten Oberfläche des Metallblechs unter Verwendung einer Röntgenphotoelektronenspektroskopie durchgeführt wird, ein Verhältnis A1/A2, das durch das Ergebnis der Röntgenphotoelektronenspektroskopie erhalten wird, 0,4 oder weniger beträgt, wobei A1 die Summe eines Planardimension-Peakwerts von Nickeloxid und eines Planardimension-Peakwerts von Nickelhydroxid ist, und A2 die Summe eines Planardimension-Peakwerts von Eisenoxid und eines Planardimension-Peakwerts von Eisenhydroxid ist; und
      • in der Zusammensetzungsanalyse der ersten Oberfläche des Metallblechs mittels der Röntgenphotoelektronenspektroskopie ein Einfallswinkel eines Röntgenstrahls, der zu dem Metallblech auf die erste Oberfläche emittiert wird, 45 Grad beträgt, und ein Auftreffwinkel von Photoelektronen, die von dem Metallblech abgegeben werden, 90 Grad beträgt.
12. 12. Verfahren zur Herstellung einer Abscheidungsmaske nach dem Gegenstand 11, bei dem die Dicke des Metallblechs 85 µm oder weniger beträgt.
13. 13. Verfahren zur Herstellung einer Abscheidungsmaske nach dem Gegenstand 11 oder 12, bei dem der erstes Photolackmuster-Bildungsschritt einen Schritt des Anbringens eines trockenen Films an der ersten Oberfläche des Metallblechs und einen Schritt des Belichtens und Entwickelns des trockenen Films zum Bilden des ersten Photolackmusters umfasst.

The present invention further relates to the following items 1 to 13:

1. 1. A method of manufacturing a metal sheet used for manufacturing a deposition mask having a plurality of through holes formed therein, the method comprising a manufacturing step of manufacturing a sheet metal member made of a nickel-containing iron alloy, wherein:
   • when a composition analysis of a first surface of the metal sheet obtained from the sheet member is performed using an X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, A1 being the sum a planar dimension peak value of nickel oxide and a planar dimension peak value of nickel hydroxide and A2 is the sum of a planar dimension peak value of iron oxide and a planar dimension peak value of iron hydroxide; and
   • in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees, and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.
2. 2. A method of manufacturing a metal sheet according to the item 1, further comprising a tempering step of tempering the sheet metal member to obtain the metal sheet.
3. 3. A method of manufacturing a metal sheet according to item 2, in which the tempering step is carried out in an inert gas atmosphere.
4. 4. A method of manufacturing a metal sheet according to any one of the items 1 to 3, wherein the manufacturing step comprises a rolling step of rolling a base metal made of a nickel-containing iron alloy.
5. 5. A method of manufacturing a metal sheet according to any one of the items 1 to 3, wherein the manufacturing step includes a film forming step of forming a plating film by using a plating liquid comprising a solution containing a nickel compound and a solution containing an iron compound. includes.
6. 6. A method of manufacturing a metal sheet according to any one of items 1 to 5, wherein the thickness of the metal sheet is 85 µm or less.
7. 7. A method of manufacturing a metal sheet according to any one of the items 1 to 6, wherein the metal sheet for manufacturing the deposition mask by exposing and developing a dry film attached to the first surface of the metal sheet to form a first photoresist pattern, and by etching a portion of the first surface of the metal sheet, the portion not being covered with the first photoresist pattern.
8. 8. A metal sheet used to manufacture a deposition mask having a plurality of through holes formed therein, wherein:
   • when a compositional analysis of a first surface of the metal sheet is performed using X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension -Peak value of nickel hydroxide, and A2 is the sum of a planar dimension peak value of iron oxide and a planar dimension peak value of iron hydroxide; and
   • in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees, and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.
9. 9. Metal sheet according to the item 8, in which the thickness of the metal sheet is 85 microns or less.
10. 10. A metal sheet according to item 8 or 9, wherein the metal sheet for forming the deposition mask by exposing and developing a dry film attached to the first surface of the metal sheet to form a first photoresist pattern and by etching a portion of the serves the first surface of the metal sheet, wherein the area is not covered with the first photoresist pattern.
11. 11. A method of making a deposition mask having a plurality of through holes formed therein, the method comprising:
    • a step of manufacturing a metal sheet;
    • a first photoresist pattern forming step of forming a first photoresist pattern on a first surface of the metal sheet; and
    • an etching step of etching a portion of the first surface of the metal sheet, the portion not being covered with the photoresist pattern, so that first recesses for defining the through holes are formed in the first surface of the metal sheet;
    • in which:
      • when a compositional analysis of a first surface of the metal sheet is performed using X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension -Peak value of nickel hydroxide, and A2 is the sum of a planar dimension peak value of iron oxide and a planar dimension peak value of iron hydroxide; and
      • in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees, and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees.
12. 12. A method of manufacturing a deposition mask according to the item 11, in which the thickness of the metal sheet is 85 µm or less.
13. 13. A method of manufacturing a deposition mask according to the item 11 or 12, wherein the first resist pattern forming step includes a step of applying a dry film to the first surface of the metal sheet and a step of exposing and developing the dry film to form the first resist pattern .

QUOTES INCLUDE IN THE DESCRIPTION

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Patent literature cited

• JP 2014148740 A [0006]

Claims (1)

A metal sheet for producing a deposition mask having a plurality of through holes formed therein, the metal sheet being made of an iron alloy containing 30 to 54 mass% of nickel, the thickness of the metal sheet being 85 µm or less, and in which: when a compositional analysis of a first surface of the metal sheet is performed using X-ray photoelectron spectroscopy, a ratio A1 / A2 obtained by the result of X-ray photoelectron spectroscopy is 0.4 or less, where A1 is the sum of a planar dimension peak value of nickel oxide and a planar dimension -Peak value of nickel hydroxide and A2 is the sum of a planar dimension peak value of iron oxide and a planar dimension peak value of iron hydroxide; and in the composition analysis of the first surface of the metal sheet by means of X-ray photoelectron spectroscopy, an angle of incidence of an X-ray beam emitted to the metal sheet on the first surface is 45 degrees and an angle of incidence of photoelectrons emitted from the metal sheet is 90 degrees; wherein the method of calculating the ratio A1 / A2 based on the analysis result by the XPS method is carried out as specified in the description; and wherein the background line calculation is performed using the Shirley method as set forth in the description.

Images