JP2008041553A - Mask for vapor deposition, and manufacturing method of mask for vapor deposition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mask for a large scale high-precision vapor deposition. <P>SOLUTION: The mask is composed of a frame body with an open mouth and non-rarefaction rolled copper foil, and at a position to face the open mouth, there is arranged a patterning region comprising a plurality of penetrating holes arranged for penetration of a depositing material, and there is provided a mask main body which is stretched and fixed on the frame body, in a peripheral part of the patterning region and where the patterning region is processed with high precision. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a vapor deposition mask suitable for use in vapor deposition of an organic layer, for example, in the production of an organic light emitting display, and a method for producing the vapor deposition mask.

  In general, this organic layer is formed by vapor deposition to form an organic layer in the manufacture of an organic light emitting display. A vapor deposition mask is used to deposit the organic layer.

  Conventionally, as shown in FIGS. 1 and 2, for example, the vapor deposition mask has a peripheral portion of a mask body 120 having a pattern region 130 composed of a plurality of passage holes 131 arranged for passage of vapor deposition material with respect to the frame 110. It is fixed and stretched. FIG. 2 shows an example in which the stress relaxation pattern 140 is provided in the example of the evaporation mask of FIG.

  The stress relaxation pattern 140 is composed of a plurality of pores between the pattern region 130 and the fixed portion. In this vapor deposition mask, the stress of the mask main body 120 is efficiently dispersed by the pores, and the passage holes 131 are formed. The position accuracy can be improved. The pores of the stress relaxation pattern 140 and the passage holes 131 of the pattern region 130 do not necessarily have to be arranged with the same shape and the same interval, and the shapes and arrangement intervals may be different, but as shown in FIG. It is preferable that they are arranged in the same shape and at the same interval because the manufacturing process of the mask body 120 can be simplified.

  Conventionally, as a mask main body 120 of this vapor deposition mask, a metal thin film is etched to form a pattern region 130 composed of a plurality of passage holes 131, and a pattern composed of a plurality of passage holes 131 by plating (electroforming). Some of the regions 130 were formed.

  In the case of forming the mask main body 120 of the vapor deposition mask by etching the metal thin film, for example, an invar material or a SUS material having a small thermal expansion is used as the metal thin film, and the invar material generally has a thickness of 50 μm. The above is the limit that can be obtained, and it has been difficult to realize a thinner material.

  In general, in order to ensure the film thickness uniformity of the vapor deposition material, it is necessary to reduce the shadow effect of the opening edge on the vapor deposition source side of the mask main body 120, and the size (dimension) of the passage hole 131 is set to the workpiece (covered). Means such as taper etching had to be used so as to be larger than the deposit) side.

  In addition, in terms of etching accuracy, it is difficult to obtain a desired dimension with high accuracy due to the influence of side etching, etc., so the thickness of the portion that forms the effective opening of the passage hole 131 is reduced. Conventionally, a method of removing by etching from the deposition source side so as to reduce as much as possible has been taken (Patent Document 1).

  On the other hand, in the case where the mask main body 120 of the vapor deposition mask is prepared by plating (electroforming), electronickel plating is performed on the glass master for forming the pattern region to finish to a desired film thickness. When the pattern region 130 composed of the plurality of passage holes 131 is formed by this plating, the pattern accuracy is good until it is peeled off from the glass master.

Conventionally, there has been proposed a method in which a pattern region 130 including a plurality of through holes 131 having a two-layer structure with high accuracy is formed by a hybrid method of an etching process and a plating process (Patent Document 2).
JP 2005-183153 A JP 2005-314787 A

  However, when an invar material or SUS material metal thin film is etched to form a pattern region 130 composed of a plurality of passage holes 131, the invar material or SUS material metal thin film has a thickness of 50 μm or more. It was difficult to obtain a mask body 120 of a relatively thick and highly accurate vapor deposition mask.

  In addition, when the pattern region 130 including the plurality of through holes 131 is formed by plating, the pattern accuracy is good until peeling from the glass master, but the mask body 120 is once peeled from the glass master. After that, due to factors such as variations in residual stress during plating and uniformity of plating tank electrodes and liquid components, variations in plating thickness occur, resulting in pattern distortion that cannot maintain a flat state. To do.

  Further, when the shape of the mask main body 120 of the evaporation mask is finished, a method of pulling while partially adjusting the tension applied to the mask main body 120 to fix the pattern shape to a desired dimension is generally used. Take it. However, even if this method is used, the distortion that has originally deteriorated in dimensional accuracy cannot be completely removed.

  Further, even when the pattern region 130 including a plurality of passage holes 131 is formed by the method disclosed in Patent Document 2, the inclination of the opening of the base connected to the effective opening of the passage hole 131 formed by plating is inclined. Etching control is difficult in order not to interfere with the passage of the vapor deposition material. In an extreme case, if the base portion is removed, only the plating thin film is formed, and since the above-described distortion and good tension for maintaining the flat surface cannot be obtained, sagging and misalignment are likely to occur. There was an inconvenience.

  Therefore, conventionally, there has been a disadvantage that a large-sized high-precision deposition mask cannot be obtained.

  The present invention has been made in view of such points, and an object of the present invention is to provide a large-sized high-precision deposition mask.

  The vapor deposition mask of the present invention, a frame having an opening, and a non-roughened rolled copper foil, and having a pattern region composed of a plurality of through holes arranged for passage of the vapor deposition material at a position corresponding to the opening. And a mask body which is stretched and fixed to the frame body at the peripheral edge of the pattern region and which has processed the pattern region with high accuracy.

  The method of manufacturing a mask for vapor deposition of the present invention includes a step of forming a mask body by providing a pattern region composed of a plurality of through holes arranged for passing a vapor deposition material on a non-roughened rolled copper foil, and a frame having an opening. On the other hand, it includes a step of stretching and fixing at the peripheral edge of the pattern region.

  Moreover, the manufacturing method of the vapor deposition mask of the present invention is the above-described vapor deposition mask manufacturing method, in which the roughened rolled copper foil is provided with a pattern region composed of a plurality of passage holes arranged for vapor deposition material passage. This roughened rolled copper foil is etched to form a plurality of predetermined openings, and then a dry film resist that can be embedded in the hole is laminated on the opposite side of the roughened rolled copper foil to the deposition target. Then, an opening having a size larger than the opening size of the opening hole is formed in the opening hole portion from the side opposite to the deposition object facing side of the non-roughened rolled copper foil by a predetermined depth etching process. .

  Moreover, the manufacturing method of the vapor deposition mask of the present invention is the above-described vapor deposition mask manufacturing method, in which the roughened rolled copper foil is provided with a pattern region composed of a plurality of passage holes arranged for vapor deposition material passage. A first base film having a thickness of 100 μm or more is deposited on the opposite side of the non-roughened rolled copper foil to the deposition target, and then the non-roughened rolled copper foil is etched to form a plurality of predetermined openings. An opening hole is formed, and then, a dry film resist having an embedding property in the hole is laminated on the opposite side of the non-roughened rolled copper foil to the deposition target, and then a second film having a thickness of 100 μm or more is formed on the dry film resist. After that, the first base film is removed, and then the opening dimension of the opening hole is set to the opening hole portion from the opposite side of the non-roughened rolled copper foil to the deposition target side. Larger dimension The method opening is formed by a predetermined depth etching process.

  According to the present invention, since the roughened rolled copper foil is used as the metal thin film of the mask body, a thin mask body of, for example, 6 to 12 μm can be realized, and the etching accuracy can be ensured. The foil has almost no difference between the rolling direction and the direction perpendicular to the rolling direction, and the so-called anisotropy is very small. Therefore, it is possible to obtain a highly accurate deposition mask and suitable for obtaining a large deposition mask. Yes.

  Hereinafter, with reference to the drawings, an example of the best mode for carrying out the evaporation mask and the manufacturing method of the evaporation mask of the present invention will be described.

  First, an example of manufacturing the mask main body 120 of the evaporation mask according to the present example will be described with reference to FIGS.

  In this example, as shown in FIG. 3A, as a material for forming the mask main body 120, a rolled copper foil having a predetermined size that is not roughened (non-roughened rolled copper foil), for example, SHPC or ZSPC manufactured by Microhardware Corporation. Such a high-frequency roughening-free rolled copper foil 1 is prepared.

  As the non-roughened rolled copper foil 1, one having a thickness of 6 to 12 μm is used. By using a non-roughened rolled copper foil 1 having a thickness of 6 to 12 μm, a thin mask body 120 can be realized, which is advantageous in ensuring etching accuracy. As a feature of the non-roughened rolled copper foil 1, the profile after etching can be finished with an accuracy within 1 μm from the shape of the resist. Further, as a feature of the non-roughened rolled copper foil 1, there is almost no difference between the rolling direction and the direction perpendicular thereto, and so-called anisotropy is very small.

  In general, the copper foil of the printed circuit board is roughened on one side surface in order to ensure adhesion with the base material. This roughening process causes deterioration in accuracy when viewed as the material of the mask body 120 and adversely affects the cleaning properties of the deposit deposited on the mask body 120. Therefore, in this example, the roughening process is not performed. It was decided.

  Therefore, when the non-roughened rolled copper foil 1 is used as the material of the mask main body 120, a pattern region 130 composed of a plurality of passage holes 131 that pass through the vapor deposition material of the mask main body 120 can be obtained with high accuracy as intended. It is possible to obtain the desired dimensional accuracy while adjusting the tension in the subsequent process, and even when fixed to the frame 110, the uniformity of thickness (± 10%) is ensured, so the pattern dimensions can be easily secured. it can.

  When the mask body 120 is formed from the non-roughened rolled copper foil 1 having a thickness of 6 to 12 μm, the roughened rolled copper foil 1 having a thickness of 6 to 12 μm is very soft and requires handling. Therefore, as shown in FIG. 3B, the thickness of the non-roughened rolled copper foil 1 corresponding to, for example, the glass substrate side, which is an object to be deposited, is 100 μm or more at the time of vapor deposition. The first base film 2 with an adhesive resistant to the above is laminated through this adhesive. The adhesive for the first base film 2 is of a property that loses adhesiveness due to UV (ultraviolet) light.

  Next, as shown in FIG. 3C, a photosensitive resist 3 is applied or laminated on the exposed surface of the non-roughened rolled copper foil 1. Thereafter, exposure is performed as shown in FIG. 4D by using a photomask 4 on which an image pattern is formed in advance so as to be an exact size when tension is applied to the non-roughened rolled copper foil 1. Thereafter, the photomask 4 is removed, and thereafter development is performed as shown in FIG. 4E.

  Next, using the resist 3 as a mask, the non-roughened rolled copper foil 1 is etched from the resist 3 side to form a plurality of opening holes 5 as shown in FIG. 4F. After this etching process is completed, as shown in FIG. 5G, the resist 3 is stripped and removed with an alkaline solution, washed and dried.

  Next, as shown in FIG. 5H, a dry film resist 6 having a hole-embedding property is laminated on the surface of the non-roughened rolled copper foil 1 on the side facing the deposition target. In this case, the embedding of the dry film resist 6 in the hole is to ensure the dimension of the opening hole 5 (passage hole 131) on the side facing the deposition target. In order to ensure the dimension of the opening hole 5 (passage hole 131) on the opposite side of the deposition target, the step of applying the liquid resist may be performed prior to the lamination of the dry film resist 6.

  Next, as shown in FIG. 5I, the dry film resist 6 has a thickness of 100 μm or more for strengthening the strain of the non-roughened rolled copper foil 1 and has a first adhesive with an adhesive that can withstand a corrosive solution and a stripping solution. A second base film 7 similar to the base film 2 is laminated.

  Next, UV light is applied from the side of the first base film 2 that is first laminated to eliminate the adhesive property of the adhesive of the first base film 2, and as shown in FIG. 6J, the first base film 2 To peel off. In this case, the dry film resist 6 laminated on the opposite side (including a liquid resist when it is applied) is sufficiently exposed to a level that can withstand the etching process, or the first film resist 6 is included. After peeling the base film 2, you may make it expose from this peeling side.

  A photosensitive resist 8 is applied or laminated on the surface of the non-roughened rolled copper foil 1 exposed in FIG. 6J, as shown in FIG. 6K. Thereafter, as shown in FIG. 6L, a photomask 9 is used on the resist 8 so as to face the opening hole 5 of the non-roughened rolled copper foil 1 and to be processed to a size that can be processed larger than the opening dimension of the opening hole 5. The resist 8 is exposed. Thereafter, the resist 8 is developed as shown in FIG. 7M.

  Next, as shown in FIG. 7N, using the resist 8 as a mask, the non-roughened rolled copper foil 1 is removed from the deposition source side (the opposite side to the deposition target side) of the non-roughened rolled copper foil 1. Etching process. As the etching solution at this time, for example, a solution that can easily control the etching rate, such as a sulfuric acid / hydrogen peroxide system, is used.

  In this case, the etching is stopped when the etching progresses about 1/2 to 2/3 of the thickness of the non-roughened rolled copper foil 1. At this time, the region near the surface opposite to the deposition target of the non-roughened rolled copper foil 1 on the side opposite to the surface where the etching was started is a dry film resist having a hole-embedding property as shown in FIG. 7N. The effect of adding 6 (liquid resist) is protected from the etching solution, so that necessary dimensional accuracy of the opening hole 5 (passing hole 131) is ensured. Thereby, the passage hole 131 is formed.

  Next, as shown in FIG. 7O, the resist 8 is removed by peeling with an alkaline solution, washed and dried. Next, as shown in FIG. 8P, the exposed surface of the non-roughened rolled copper foil 1 is set on a predetermined jig 10 by vacuum suction or the like, and irradiated with UV light from the second base film 7 side. As shown, the adhesive property of the adhesive of the second base film 7 is lost, and the second base film 7 is peeled off.

  Thereafter, as shown in FIG. 9R, the dry film resist 6 is stripped and removed with an alkaline solution, washed and dried, and a pattern region comprising a plurality of passage holes 131 through which the deposition material passes through the non-roughened rolled copper foil 1. The mask body 120 having 130 is completed.

  Next, as shown in FIG. 9S, the mask main body 120 is attached to the jig 11 that holds the mask main body 120, and the mask main body 120 is plated by electroless nickel alloy to secure corrosion resistance and impart magnetism as necessary. A nickel alloy plating layer 12 is deposited on the surface of the non-roughened rolled copper foil 1.

  Of the nickel alloy plating layer 12, the nickel-boron plating layer has ferromagnetism, but is inferior to the nickel-phosphorous plating layer in corrosion resistance. On the other hand, the nickel-phosphorous plating layer is rich in corrosion resistance, but does not have magnetism, so that heat treatment is required to obtain magnetism. Therefore, it is better to use properly according to the purpose.

  The reason why the mask main body 120 is magnetized is that the mask main body 120 is brought into close contact with a glass substrate, which is a deposition target, using a magnet.

  The thickness of the nickel alloy plating layer 12 is suitably about 5 μm, which does not break the opening size of the passage hole 131 formed with high accuracy. Of course, it is natural to adjust the dimensions of the photomask 9 for performing pattern formation by etching in consideration of the thickness of the nickel alloy plating layer 12.

  Next, a predetermined tension is applied to the mask main body 120 to adjust it to the correct size, and then the tension is fixed to the fixing frame 110 using an adhesive or a resistance welding method as shown in FIGS. Completed as a mask for vapor deposition.

  In this example, as described above, the non-roughened rolled copper foil 1 is used as the metal thin film of the mask main body 120. Therefore, for example, a thin mask main body 120 of 6 to 12 μm can be realized, and the etching accuracy can be ensured. Since the non-roughened rolled copper foil 1 has almost no difference between the rolling direction and the direction perpendicular thereto, so-called anisotropy is very small, so that a highly accurate and favorable vapor deposition mask can be obtained. Suitable for getting.

  Of course, the present invention is not limited to the above-described examples, and various other configurations can be adopted without departing from the gist of the present invention.

It is a disassembled perspective view which shows the example of the mask for vapor deposition. It is a disassembled perspective view which shows the other example of the mask for vapor deposition. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention. It is sectional drawing which shows the process of the example of the best form for enforcing the manufacturing method of the mask for vapor deposition of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Unroughened rolled copper foil, 2, 7 ... Base film, 3, 8 ... Photosensitive resist, 4, 9 ... Photomask, 5 ... Open hole, 10, 11 ... Jig, 12 ... Nickel alloy plating layer, 110 ... Frame, 120 ... Mask body, 131 ... Passing hole

Claims (6)

A frame having an opening;
It is composed of a non-roughened rolled copper foil, and has a pattern region composed of a plurality of passage holes arranged for passage of the vapor deposition material at a position corresponding to the opening, and at the periphery of the pattern region with respect to the frame body And a mask main body obtained by processing the pattern region with high accuracy. The vapor deposition mask according to claim 1,
A vapor deposition mask, wherein the non-roughened rolled copper foil has a thickness of 6 to 12 µm. The vapor deposition mask according to claim 1 or 2,
A vapor deposition mask, wherein the mask body is plated with electroless nickel alloy. Forming a mask body by providing a pattern region composed of a plurality of passage holes arranged for passing the vapor deposition material on the non-roughened rolled copper foil; and
A method of manufacturing a vapor deposition mask, comprising a step of stretching and fixing the frame body having an opening at a peripheral portion of the pattern region. In the manufacturing method of the mask for vapor deposition of Claim 4,
In order to provide the non-roughened rolled copper foil with a pattern region composed of a plurality of passage holes arranged for passing the vapor deposition material, first, the roughened rolled copper foil is etched to form a plurality of predetermined opening holes. And then laminating a dry film resist having a hole embedding property on the opposite side of the non-roughened rolled copper foil to the deposition target, and then from the opposite side of the non-roughened rolled copper foil on the opposite side of the deposition target An evaporation mask manufacturing method, wherein an opening having a size larger than an opening size of the opening hole is formed in the opening hole portion by a predetermined depth etching process. In the manufacturing method of the mask for vapor deposition of Claim 4,
In order to provide the non-roughened rolled copper foil with a pattern region composed of a plurality of passage holes arranged for passing a vapor deposition material, first, the thickness of the non-roughened rolled copper foil is 100 μm or more on the side opposite to the deposition target side. The first base film is deposited, and then the non-roughened rolled copper foil is etched to form a plurality of predetermined openings, and then the non-roughened rolled copper foil is opposite to the deposition target And laminating a dry film resist capable of embedding in a hole, and then depositing a second base film having a thickness of 100 μm or more on the dry film resist, and then removing the first base film, The vapor deposition is characterized in that an opening larger than the opening dimension of the opening hole is formed in the opening hole portion by a predetermined depth etching process from the opposite side of the non-roughened rolled copper foil to the deposition object facing side. Mask Manufacturing method.

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