DE1914790A1 - Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen - Google Patents

Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Info

Publication number
DE1914790A1
DE1914790A1 DE19691914790 DE1914790A DE1914790A1 DE 1914790 A1 DE1914790 A1 DE 1914790A1 DE 19691914790 DE19691914790 DE 19691914790 DE 1914790 A DE1914790 A DE 1914790A DE 1914790 A1 DE1914790 A1 DE 1914790A1
Authority
DE
Germany
Prior art keywords
piece
cooling pot
assembly according
channel
channel piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691914790
Other languages
German (de)
English (en)
Inventor
Klaus Ludwig
Friedrich Scherbaum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19691914790 priority Critical patent/DE1914790A1/de
Priority to CH223170A priority patent/CH506185A/de
Priority to NO00950/70A priority patent/NO127076B/no
Priority to SE03635/70A priority patent/SE363540B/xx
Priority to AT252670A priority patent/AT297152B/de
Priority to US20699A priority patent/US3603381A/en
Priority to FR7010229A priority patent/FR2039831A5/fr
Priority to JP45024370A priority patent/JPS4923627B1/ja
Publication of DE1914790A1 publication Critical patent/DE1914790A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Aerodynamic Tests, Hydrodynamic Tests, Wind Tunnels, And Water Tanks (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
DE19691914790 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen Pending DE1914790A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE19691914790 DE1914790A1 (de) 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
CH223170A CH506185A (de) 1969-03-22 1970-02-17 Baugruppe mit mindestens einer flüssigkeitsgekühlten, elektrischen Scheibenzelle
NO00950/70A NO127076B (enrdf_load_stackoverflow) 1969-03-22 1970-03-17
SE03635/70A SE363540B (enrdf_load_stackoverflow) 1969-03-22 1970-03-18
AT252670A AT297152B (de) 1969-03-22 1970-03-18 Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen
US20699A US3603381A (en) 1969-03-22 1970-03-18 Liquid-cooled assembly of disc cells
FR7010229A FR2039831A5 (enrdf_load_stackoverflow) 1969-03-22 1970-03-20
JP45024370A JPS4923627B1 (enrdf_load_stackoverflow) 1969-03-22 1970-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691914790 DE1914790A1 (de) 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Publications (1)

Publication Number Publication Date
DE1914790A1 true DE1914790A1 (de) 1970-10-01

Family

ID=5729065

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691914790 Pending DE1914790A1 (de) 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Country Status (8)

Country Link
US (1) US3603381A (enrdf_load_stackoverflow)
JP (1) JPS4923627B1 (enrdf_load_stackoverflow)
AT (1) AT297152B (enrdf_load_stackoverflow)
CH (1) CH506185A (enrdf_load_stackoverflow)
DE (1) DE1914790A1 (enrdf_load_stackoverflow)
FR (1) FR2039831A5 (enrdf_load_stackoverflow)
NO (1) NO127076B (enrdf_load_stackoverflow)
SE (1) SE363540B (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2109116A1 (de) * 1970-03-05 1971-09-16 Asea Ab Halbleiteranordnung
US3823771A (en) * 1971-12-04 1974-07-16 Siemens Ag Cooling box for installation in stacks of disk-cells
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
DE2609512A1 (de) * 1976-03-08 1978-01-26 Siemens Ag Gasisolierte thyristoranordnung
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
DE2928388A1 (de) * 1979-07-13 1981-01-15 Siemens Ag Vorrichtung zum auswechseln von scheibenthyristoren einer thyristorsaeule
DE3007168A1 (de) * 1980-02-26 1981-09-03 Siemens AG, 1000 Berlin und 8000 München Fluessigkeitsgekuehlte halbleitersaeule
EP0102654A1 (de) * 1982-09-10 1984-03-14 BBC Aktiengesellschaft Brown, Boveri & Cie. Horizontalachsige Stromrichteranordnung
DE3322288A1 (de) * 1983-06-16 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlanordnung fuer halbleiter-scheibenzellen
EP2056441A1 (en) * 2007-10-31 2009-05-06 General Electric Company Semiconductor clamp system

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864607A (en) * 1972-03-16 1975-02-04 Programmed Power Stackable heat sink assembly
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US3785435A (en) * 1972-11-15 1974-01-15 Avco Corp Thermal damper for plate type heat exchangers
US4010489A (en) * 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene
US4315225A (en) * 1979-08-24 1982-02-09 Mcdonnell Douglas Corporation Heat sink laser diode array
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
FR2550887B1 (fr) * 1983-08-19 1986-11-07 Jeumont Schneider Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
EP1742265B1 (en) * 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
DE10164522B4 (de) * 2001-12-17 2005-05-25 Siemens Ag Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung
DE102004059963A1 (de) * 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
JP2005332863A (ja) * 2004-05-18 2005-12-02 Denso Corp パワースタック
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
BRPI0806533B1 (pt) * 2007-01-26 2018-10-09 Inductotherm Corp dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor
US7773382B2 (en) * 2007-08-22 2010-08-10 Rockwell Automation Technologies, Inc. System and method for supporting one or more heat-generating electrical devices
TWM347807U (en) * 2008-05-14 2008-12-21 Kuen Bao Electric Co Ltd Cooling system with high power thyristors
JP2014078599A (ja) * 2012-10-10 2014-05-01 Denso Corp 電力変換装置
US8896023B2 (en) * 2013-02-20 2014-11-25 Alstom Technology Ltd Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
DE102013227000B4 (de) * 2013-12-20 2020-04-16 Siemens Aktiengesellschaft Elektrisches Modul

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE1514406B1 (de) * 1965-02-20 1971-04-01 Siemens Ag Halbleiteranordnung

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2109116A1 (de) * 1970-03-05 1971-09-16 Asea Ab Halbleiteranordnung
US3823771A (en) * 1971-12-04 1974-07-16 Siemens Ag Cooling box for installation in stacks of disk-cells
DE2609512A1 (de) * 1976-03-08 1978-01-26 Siemens Ag Gasisolierte thyristoranordnung
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
DE2928388A1 (de) * 1979-07-13 1981-01-15 Siemens Ag Vorrichtung zum auswechseln von scheibenthyristoren einer thyristorsaeule
DE3007168A1 (de) * 1980-02-26 1981-09-03 Siemens AG, 1000 Berlin und 8000 München Fluessigkeitsgekuehlte halbleitersaeule
EP0102654A1 (de) * 1982-09-10 1984-03-14 BBC Aktiengesellschaft Brown, Boveri & Cie. Horizontalachsige Stromrichteranordnung
DE3322288A1 (de) * 1983-06-16 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlanordnung fuer halbleiter-scheibenzellen
EP2056441A1 (en) * 2007-10-31 2009-05-06 General Electric Company Semiconductor clamp system

Also Published As

Publication number Publication date
FR2039831A5 (enrdf_load_stackoverflow) 1971-01-15
US3603381A (en) 1971-09-07
SE363540B (enrdf_load_stackoverflow) 1974-01-21
CH506185A (de) 1971-04-15
AT297152B (de) 1972-03-10
JPS4923627B1 (enrdf_load_stackoverflow) 1974-06-17
NO127076B (enrdf_load_stackoverflow) 1973-04-30

Similar Documents

Publication Publication Date Title
DE1914790A1 (de) Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
DE2160302B2 (de) Kühldose zum Einbau in Scheibenzellenstapel
DE3744353C1 (en) Cooling body for a semiconductor component
DE1814660C3 (de) Schneidwerkzeug für die spanabhebende Bearbeitung
EP0111145A2 (de) Druckgefäss mit einer flanschartigen Öffnung
DE2707231C3 (de) Halter für Küvetten
DE1281095B (de) Mehrlochspinndüse
DE4337861A1 (de) Modulare keilförmige Halteelemente
DE2505882A1 (de) Veraenderbarer kondensator
DE10212725A1 (de) Haltevorrichtung für Bauteile auf einer Leiterplatte vor und während eines Lötvorgangs, insbesondere für Lötrahmen
DE9412935U1 (de) Schlitzdüse zum Auftragen von fließfähigen Materialien
DE2351637A1 (de) Halter fuer ein halbleiterbauelement
DE397648C (de) Stahlhalter
DE2005287A1 (de) Steuerwahlvorrichtung zum Betätigen eines Verschlußapparates für ein unter Druck stehendes Kraftfluidum
DE805479C (de) Befestigung von Porzellangriffen mit der Spindel von Zapfventilen, insbesondere Wasserleitungsventilen
DE3129451A1 (de) "werkzeug zum gewindeschneiden aus im wesentlichen einer schneidplatte und einem schneidplattenhalter"
AT236722B (de) Geschwindigkeitssteuerventil
DE3532124A1 (de) Wasserwaage
DE811733C (de) Befestigung von Messerschneiden an Waagebalken u. dgl.
DE935878C (de) Schwenkbarer Vielfachstahlhalter fuer Drehbaenke
DE3302722A1 (de) Vorrichtung zur parallelen ausrichtung der kanten viereckiger frontrahmen von einer in einer schalttafel eingebauten schaltung
CH468860A (de) Schneideinsatz für spanabhebende Werkzeuge
DE1986081U (de) Einrichtung zur fluessigkeitskuehlung von gleichrichterzellen.
DE3804410C2 (de) Rotierende Füllmaschine zum Abfüllen von Getränken und dgl.
DD289886A7 (de) Vorrichtung zum lagergerechten sortieren, vereinzeln und ordnen von stiftartigen werkstuecken mit einem abgesetzten zapfen