US3823771A - Cooling box for installation in stacks of disk-cells - Google Patents

Cooling box for installation in stacks of disk-cells Download PDF

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Publication number
US3823771A
US3823771A US00311568A US31156872A US3823771A US 3823771 A US3823771 A US 3823771A US 00311568 A US00311568 A US 00311568A US 31156872 A US31156872 A US 31156872A US 3823771 A US3823771 A US 3823771A
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cooling
connector
disk
pots
stacks
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US00311568A
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K Ludwig
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Siemens AG
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Siemens AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • ABSTRACT A flat cooling. box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. lnflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.
  • This invention is concerned with a cooling box for installation in stacks of disk-cells and consists of two round cooling pots having their flat heat-transmitting surfaces at both sides of a platelike connector hermetically joined thereto, for connecting the device to cooling-fluid connectors and current connectors, in which the connecting piece has inflow and outflow channels directed from its edge to its interior, with each having its outlet in a passage perpendicular thereto and going through the wall-thickness of the connecting piece, with which the fluid-distributors of the two cooling pots are in communication.
  • a known cooling box of this type (German Exhibited Text DT-OS 1,914,790) has a substantially rectangular connecting plate, which carries the two cooling 'pots. These cooling pots have relatively wide and thick flanges at their periphery, which serve to fasten them to the connecting piece. The part of the cooling pots projecting above the connecting piece is used as a current-connection. In the interior of the cooling pots a fluid-distributor is located. This distributor is formed of a number of webs, which are connected to each other by means of a central and an eccentric passage so that a great pressure-drop prevails in the'i'nterior of the cooling pot and, moreover, the heat-exchange area is limited.
  • the fundamental problem solved by the invention is to save material and simplify manufacture while making a cooling box having a relatively large heatexchanger surface over which the cooling fluid flows and a relatively smaller pressure drop to thus diminish the heat buildup in the cooling box.
  • the solution of the problem posed is achieved by'using a connecting piece having a round plate with inflow and outflow channels directed through and aligned with the center of the circle, and having passages disposed symmetrically of the center of. the circle. Further it carries axial rimprojections on both sides which by annular riveting are brought into engagement with radial projections from the cooling pots.
  • the cooling pots have in their interior, concentric, continuous, annular channels that extend to the faces-and are in communication with the passages.
  • the flat heat-transfer surfaces of the cooling pot are formed as annular surfaces extending from the outer rim of the cooling pot to the middle zone and are offset from one another.
  • the annular surfaces and the annular channels permit the manufacture of the cooling pots on automatic lathes.
  • the connecting piece can also be produced from bar material in automatic lathes, needing only a subsequent machining in boring machines.
  • FIG. 1 illustrates a side view of a cooling box, a portion of which is illustrated as a cross sectional view
  • FIG. 2 illustrates a plan view of a connecting piece
  • FIG. 3 illustrates a cross sectional view of a cooling pot
  • FIG. 4 illustrates a plan view of the device of FIG. 1.
  • the cooling box which is held at both sides in electric contact with adjacent disk-cells (not shown), consists of a central round connecting piece 1 having parallel faces 6. and 7, carrying axial rim-projections 6a and 7a, by which, through annular riveting, it is connected with the two round cooling pots 8 and 9.
  • the fluid-tight arrangement isobtained by conventional seal-rings inserted in annular grooves in the cooling pots.
  • the round connecting piece 1 has two inflow and outflow channels 2 and 3, directed to, and aligned with, the center of the circle, and into which are screwed the connector-pieces 2a and 3a. Passages 4 and 5 are provided symmetrical to the center of the circle, and, perpendicular to the inflow and outflow channels 2 and 3.
  • the passages 4 and 5 thereupon pass through the wall thickness of the connecting piece.
  • In the interior of the cooling pots 8 and 9 are continuous concentric annular channels 10, which extend to the faces 6 and 7 of the connecting piece, and are connected to the passages 4 and 5.
  • Each cooling pot 8 and 9 has annular surfaces 8b and 9b protruding from the rim and middle zone. In the event of tilting of the contact surfaces, these surfaces keep the mechanical bending stress on the sensitive thyristor disks so small that breakage of the disk is avoided. The electrical and thermal transfer resistance .is hereby scarcely impaired.
  • a current-connector 13 can be screwed on, making it possible to have a series and/or parallel hook-up of the disk-cells.
  • a cooling box for installation in stacks of disk-cells comprising,
  • the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
  • cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A flat cooling box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. Inflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.

Description

United States Patent 1191 Ludwig [11] 3,823,771 [45.1 July 16, 1974 1 COOLING BOX FOR INSTALLATION IN v STACKS OF DISK-CELLS [75] Inventor: Klaus Ludwig, Munich, Germany [73] Assignee: Siemens Aktiengesellschaft, Munich,
' Germany [22] Filed: Dec. 4, 1972 [21] Appl. No.: 311,568
301 Foreign Application Priority Data' I Dec. 4, 1971 Germany 2160302 [52] U.S. Cl 165/80, 165/168, 165/170,
[51] Int. Cl. .Q ..H0113/00 58 Field ofSearch 165/168, 170,317/23412,
[56] References Cited UNITED STATES PATENTS 2,179,293 11/1939 Hein ..317/234B 2,504,281 4/1950 Spanne 165/168 2,942,165 6/1960 Jackson et al 317/234 B FOREIGN PATENTS OR APPLlCATlONS 1,914,790 10/1970 Germany 317/234 B Primary Examiner-Albert W. Davis, Jr.
Assistant Examiner-S. F. Richter Attorney, Agent, or Firm-Kenyon & Kenyon Reilly Carr & Chapin [57] ABSTRACT A flat cooling. box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. lnflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.
5 Claims, 4 Drawing Figures PATENTEU JUL 1 s 1914 Bh (9 b) I Fig.3
Fig.4
BACKGROUND OF THE INVENTION 1. Field of the Invention This invention is concerned with a cooling box for installation in stacks of disk-cells and consists of two round cooling pots having their flat heat-transmitting surfaces at both sides of a platelike connector hermetically joined thereto, for connecting the device to cooling-fluid connectors and current connectors, in which the connecting piece has inflow and outflow channels directed from its edge to its interior, with each having its outlet in a passage perpendicular thereto and going through the wall-thickness of the connecting piece, with which the fluid-distributors of the two cooling pots are in communication.
2. Description of the Prior Art A known cooling box of this type (German Exhibited Text DT-OS 1,914,790) has a substantially rectangular connecting plate, which carries the two cooling 'pots. These cooling pots have relatively wide and thick flanges at their periphery, which serve to fasten them to the connecting piece. The part of the cooling pots projecting above the connecting piece is used as a current-connection. In the interior of the cooling pots a fluid-distributor is located. This distributor is formed of a number of webs, which are connected to each other by means of a central and an eccentric passage so that a great pressure-drop prevails in the'i'nterior of the cooling pot and, moreover, the heat-exchange area is limited.
This special type of web arrangement, however, requires special machining, so that such cooling pots can not be made on automatic lathes. Further the-shape of the connecting piece requires more material.
SUMMARY OF THE INVENTION The fundamental problem solved by the invention is to save material and simplify manufacture while making a cooling box having a relatively large heatexchanger surface over which the cooling fluid flows and a relatively smaller pressure drop to thus diminish the heat buildup in the cooling box.
In accordance with the invention the solution of the problem posed is achieved by'using a connecting piece having a round plate with inflow and outflow channels directed through and aligned with the center of the circle, and having passages disposed symmetrically of the center of. the circle. Further it carries axial rimprojections on both sides which by annular riveting are brought into engagement with radial projections from the cooling pots. The cooling pots have in their interior, concentric, continuous, annular channels that extend to the faces-and are in communication with the passages.
In order to avoid destruction of the stacked disk-cells (thyristor plates), which are held together by the action of external forces and are liable to breakage through inevitable irregularities of the clamping device, it is advantageous if the flat heat-transfer surfaces of the cooling pot, which extend against the adjacent disk-cells, are formed as annular surfaces extending from the outer rim of the cooling pot to the middle zone and are offset from one another.
The annular surfaces and the annular channels permit the manufacture of the cooling pots on automatic lathes. The connecting piece can also be produced from bar material in automatic lathes, needing only a subsequent machining in boring machines.
BRIEF DESCRIPTION OF THE DRAWINGS The drawings illustrate one embodiment for carrying out the features of my invention, which are explained in more detail in the following and in which:
FIG. 1 illustrates a side view of a cooling box, a portion of which is illustrated as a cross sectional view;
FIG. 2 illustrates a plan view of a connecting piece;
FIG. 3 illustrates a cross sectional view of a cooling pot; and
FIG. 4 illustrates a plan view of the device of FIG. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT The cooling box, which is held at both sides in electric contact with adjacent disk-cells (not shown), consists of a central round connecting piece 1 having parallel faces 6. and 7, carrying axial rim- projections 6a and 7a, by which, through annular riveting, it is connected with the two round cooling pots 8 and 9. The fluid-tight arrangement isobtained by conventional seal-rings inserted in annular grooves in the cooling pots. The round connecting piece 1 has two inflow and outflow channels 2 and 3, directed to, and aligned with, the center of the circle, and into which are screwed the connector- pieces 2a and 3a. Passages 4 and 5 are provided symmetrical to the center of the circle, and, perpendicular to the inflow and outflow channels 2 and 3.
The passages 4 and 5 thereupon pass through the wall thickness of the connecting piece. In the interior of the cooling pots 8 and 9 are continuous concentric annular channels 10, which extend to the faces 6 and 7 of the connecting piece, and are connected to the passages 4 and 5. Thus two similar paths of coolant flow are achieved from one passage through the annular channels to the other passage, that is, there is a symmetrical division of the cooling fluid, making possible improved flow conditions with less pressure drop. Together with this increased optimum heat-exchange area in the interior of the cooling box, greatly diminished heat resistance is also obtained so that instead of water as coolant, electrical insulating fluids having lower heatdissipation can be used. These fluids may be necessary, particularly in the case of hightension equipment.
Each cooling pot 8 and 9 has annular surfaces 8b and 9b protruding from the rim and middle zone. In the event of tilting of the contact surfaces, these surfaces keep the mechanical bending stress on the sensitive thyristor disks so small that breakage of the disk is avoided. The electrical and thermal transfer resistance .is hereby scarcely impaired. At two screw-threaded inserts 11 and 12 at the rim of the connecting piece I, a current-connector 13 can be screwed on, making it possible to have a series and/or parallel hook-up of the disk-cells.
In the foregoing, the invention has been described in reference to specific exemplary embodiments. It will be evident, however, that variations and modifications as well as the substitution of equivalent constructions and arrangements for those shown for illustration, may be made without departing from the broader scope and spirit of the invention as set forth in the appended claims. The specification and drawings are accordingly to be regarded in an illustrative rather than in a restrictive sense.
What is claimed is: l. A cooling box for installation in stacks of disk-cells comprising,
radial projections on the cooling pots, said projections being secured to the axial rim projections of the connector to form an hermetic seal between the connectors and the pots; and
the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
2. A cooling box for installation in stacks of disk-cells as in claim 1 wherein two current connecting fittings are connected to the connector for permitting the connection of current to the connector.
3. A cooling box for installationin stacks of diskcells as in claim 2 wherein the flat heat transmitting surface of the cooling pot is a round surface set back from the outer rim and extending into the interior of the pot.
4. A cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.
5. A cooling box for installation in'stacks for diskcells as in claim 1 wherein the axial rim projections and the radial projections on the cooling pots are joined by annular riveting.

Claims (5)

1. A cooling box for installation in stacks of disk-cells comprising, two circular disk-shaped cooling pots having flat internal heat transmitting surfaces; a disk-shaped coolant and electrical connector joined to the flat heat transmitting surfaces of the cooling pots, the connector having an inlet and an outlet channel aligned With one another and passing from the outer cirumference of the connector, towards the center of the disk each of said channels being connected to an internal passage within the connector, each of the passages being substantial perpendicular to the inlet and outlet channels; axial rim projections on both sides of the connector; radial projections on the cooling pots, said projections being secured to the axial rim projections of the connector to form an hermetic seal between the connectors and the pots; and the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
2. A cooling box for installation in stacks of disk-cells as in claim 1 wherein two current connecting fittings are connected to the connector for permitting the connection of current to the connector.
3. A cooling box for installation in stacks of diskcells as in claim 2 wherein the flat heat transmitting surface of the cooling pot is a round surface set back from the outer rim and extending into the interior of the pot.
4. A cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.
5. A cooling box for installation in stacks for diskcells as in claim 1 wherein the axial rim projections and the radial projections on the cooling pots are joined by annular riveting.
US00311568A 1971-12-04 1972-12-04 Cooling box for installation in stacks of disk-cells Expired - Lifetime US3823771A (en)

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DE2160302A DE2160302C3 (en) 1971-12-04 1971-12-04 Cooling box for installation in disc cell stacks

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BE (1) BE792068A (en)
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DE (1) DE2160302C3 (en)
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FR (1) FR2162074B1 (en)
GB (1) GB1405604A (en)
IT (1) IT971389B (en)
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
DE2758166A1 (en) * 1977-02-18 1978-08-24 Ckd Praha POWER SEMICONDUCTOR COMPONENT
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
US4161980A (en) * 1976-09-24 1979-07-24 Siemens Aktiengesellschaft Cooling capsule for thyristors
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4366497A (en) * 1979-06-29 1982-12-28 Siemens Aktiengesellschaft Cooling capsule for disc-shaped semiconductor components
US4520384A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for cooling by boiling or liquids
US4520383A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for boiling cooling
US4521170A (en) * 1981-09-19 1985-06-04 Brown, Boveri & Cie. Ag Power semiconductor component for liquid cooling
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US11412637B2 (en) * 2019-05-31 2022-08-09 Abb Schweiz Ag Apparatus for conducting heat

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2606157C2 (en) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line
DE2609512C2 (en) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gas-insulated thyristor arrangement
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
DE2826898A1 (en) * 1978-06-19 1980-01-03 Siemens Ag HEAT SINK FOR ELECTRICAL COMPONENTS
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
FR2524760B1 (en) * 1982-03-30 1986-10-10 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
DE3740233A1 (en) * 1987-11-27 1989-06-08 Asea Brown Boveri Cooling box for conducting away the waste heat from semiconductors
DE3818428C2 (en) * 1987-11-27 1993-11-04 Asea Brown Boveri REFRIGERATION SOCKET FOR REMOVING THE LOST HEAT OF SEMICONDUCTOR ELEMENTS
DE3740235C2 (en) * 1987-11-27 1994-03-10 Asea Brown Boveri Cooling box for dissipating the heat loss from semiconductor elements
DE4322932A1 (en) * 1993-07-09 1995-01-19 Abb Patent Gmbh Liquid cooling body with insulating discs, electrical contact plates and an insulation ring

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
DE1914790A1 (en) * 1969-03-22 1970-10-01 Siemens Ag Liquid-cooled assembly with disc cells

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Publication number Priority date Publication date Assignee Title
DE967450C (en) * 1952-08-27 1957-11-14 Siemens Ag Cooling device for dry rectifier with cooling ducts
FR1479193A (en) * 1965-05-13 1967-04-28 Siemens Ag Semiconductor cell cooling device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
DE1914790A1 (en) * 1969-03-22 1970-10-01 Siemens Ag Liquid-cooled assembly with disc cells

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4161980A (en) * 1976-09-24 1979-07-24 Siemens Aktiengesellschaft Cooling capsule for thyristors
DE2758166A1 (en) * 1977-02-18 1978-08-24 Ckd Praha POWER SEMICONDUCTOR COMPONENT
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
US4366497A (en) * 1979-06-29 1982-12-28 Siemens Aktiengesellschaft Cooling capsule for disc-shaped semiconductor components
US4520384A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for cooling by boiling or liquids
US4520383A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for boiling cooling
US4521170A (en) * 1981-09-19 1985-06-04 Brown, Boveri & Cie. Ag Power semiconductor component for liquid cooling
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
US11412637B2 (en) * 2019-05-31 2022-08-09 Abb Schweiz Ag Apparatus for conducting heat

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GB1405604A (en) 1975-09-10
DE2160302A1 (en) 1973-06-07
NO131810C (en) 1975-08-06
ZA728262B (en) 1973-07-25
JPS4873078A (en) 1973-10-02
NO131810B (en) 1975-04-28
NL7215169A (en) 1973-06-06
FR2162074B1 (en) 1977-04-22
SE374978B (en) 1975-03-24
IT971389B (en) 1974-04-30
BE792068A (en) 1973-05-29
DK143625C (en) 1982-02-22
CA987027A (en) 1976-04-06
JPS5145229B2 (en) 1976-12-02
CH548670A (en) 1974-04-30
FR2162074A1 (en) 1973-07-13
DE2160302B2 (en) 1974-11-07
DE2160302C3 (en) 1975-07-17
DK143625B (en) 1981-09-14

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