US3823771A - Cooling box for installation in stacks of disk-cells - Google Patents
Cooling box for installation in stacks of disk-cells Download PDFInfo
- Publication number
- US3823771A US3823771A US00311568A US31156872A US3823771A US 3823771 A US3823771 A US 3823771A US 00311568 A US00311568 A US 00311568A US 31156872 A US31156872 A US 31156872A US 3823771 A US3823771 A US 3823771A
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- US
- United States
- Prior art keywords
- cooling
- connector
- disk
- pots
- stacks
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- ABSTRACT A flat cooling. box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. lnflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.
- This invention is concerned with a cooling box for installation in stacks of disk-cells and consists of two round cooling pots having their flat heat-transmitting surfaces at both sides of a platelike connector hermetically joined thereto, for connecting the device to cooling-fluid connectors and current connectors, in which the connecting piece has inflow and outflow channels directed from its edge to its interior, with each having its outlet in a passage perpendicular thereto and going through the wall-thickness of the connecting piece, with which the fluid-distributors of the two cooling pots are in communication.
- a known cooling box of this type (German Exhibited Text DT-OS 1,914,790) has a substantially rectangular connecting plate, which carries the two cooling 'pots. These cooling pots have relatively wide and thick flanges at their periphery, which serve to fasten them to the connecting piece. The part of the cooling pots projecting above the connecting piece is used as a current-connection. In the interior of the cooling pots a fluid-distributor is located. This distributor is formed of a number of webs, which are connected to each other by means of a central and an eccentric passage so that a great pressure-drop prevails in the'i'nterior of the cooling pot and, moreover, the heat-exchange area is limited.
- the fundamental problem solved by the invention is to save material and simplify manufacture while making a cooling box having a relatively large heatexchanger surface over which the cooling fluid flows and a relatively smaller pressure drop to thus diminish the heat buildup in the cooling box.
- the solution of the problem posed is achieved by'using a connecting piece having a round plate with inflow and outflow channels directed through and aligned with the center of the circle, and having passages disposed symmetrically of the center of. the circle. Further it carries axial rimprojections on both sides which by annular riveting are brought into engagement with radial projections from the cooling pots.
- the cooling pots have in their interior, concentric, continuous, annular channels that extend to the faces-and are in communication with the passages.
- the flat heat-transfer surfaces of the cooling pot are formed as annular surfaces extending from the outer rim of the cooling pot to the middle zone and are offset from one another.
- the annular surfaces and the annular channels permit the manufacture of the cooling pots on automatic lathes.
- the connecting piece can also be produced from bar material in automatic lathes, needing only a subsequent machining in boring machines.
- FIG. 1 illustrates a side view of a cooling box, a portion of which is illustrated as a cross sectional view
- FIG. 2 illustrates a plan view of a connecting piece
- FIG. 3 illustrates a cross sectional view of a cooling pot
- FIG. 4 illustrates a plan view of the device of FIG. 1.
- the cooling box which is held at both sides in electric contact with adjacent disk-cells (not shown), consists of a central round connecting piece 1 having parallel faces 6. and 7, carrying axial rim-projections 6a and 7a, by which, through annular riveting, it is connected with the two round cooling pots 8 and 9.
- the fluid-tight arrangement isobtained by conventional seal-rings inserted in annular grooves in the cooling pots.
- the round connecting piece 1 has two inflow and outflow channels 2 and 3, directed to, and aligned with, the center of the circle, and into which are screwed the connector-pieces 2a and 3a. Passages 4 and 5 are provided symmetrical to the center of the circle, and, perpendicular to the inflow and outflow channels 2 and 3.
- the passages 4 and 5 thereupon pass through the wall thickness of the connecting piece.
- In the interior of the cooling pots 8 and 9 are continuous concentric annular channels 10, which extend to the faces 6 and 7 of the connecting piece, and are connected to the passages 4 and 5.
- Each cooling pot 8 and 9 has annular surfaces 8b and 9b protruding from the rim and middle zone. In the event of tilting of the contact surfaces, these surfaces keep the mechanical bending stress on the sensitive thyristor disks so small that breakage of the disk is avoided. The electrical and thermal transfer resistance .is hereby scarcely impaired.
- a current-connector 13 can be screwed on, making it possible to have a series and/or parallel hook-up of the disk-cells.
- a cooling box for installation in stacks of disk-cells comprising,
- the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
- cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A flat cooling box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. Inflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.
Description
United States Patent 1191 Ludwig [11] 3,823,771 [45.1 July 16, 1974 1 COOLING BOX FOR INSTALLATION IN v STACKS OF DISK-CELLS [75] Inventor: Klaus Ludwig, Munich, Germany [73] Assignee: Siemens Aktiengesellschaft, Munich,
' Germany [22] Filed: Dec. 4, 1972 [21] Appl. No.: 311,568
301 Foreign Application Priority Data' I Dec. 4, 1971 Germany 2160302 [52] U.S. Cl 165/80, 165/168, 165/170,
[51] Int. Cl. .Q ..H0113/00 58 Field ofSearch 165/168, 170,317/23412,
[56] References Cited UNITED STATES PATENTS 2,179,293 11/1939 Hein ..317/234B 2,504,281 4/1950 Spanne 165/168 2,942,165 6/1960 Jackson et al 317/234 B FOREIGN PATENTS OR APPLlCATlONS 1,914,790 10/1970 Germany 317/234 B Primary Examiner-Albert W. Davis, Jr.
Assistant Examiner-S. F. Richter Attorney, Agent, or Firm-Kenyon & Kenyon Reilly Carr & Chapin [57] ABSTRACT A flat cooling. box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. lnflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.
5 Claims, 4 Drawing Figures PATENTEU JUL 1 s 1914 Bh (9 b) I Fig.3
Fig.4
BACKGROUND OF THE INVENTION 1. Field of the Invention This invention is concerned with a cooling box for installation in stacks of disk-cells and consists of two round cooling pots having their flat heat-transmitting surfaces at both sides of a platelike connector hermetically joined thereto, for connecting the device to cooling-fluid connectors and current connectors, in which the connecting piece has inflow and outflow channels directed from its edge to its interior, with each having its outlet in a passage perpendicular thereto and going through the wall-thickness of the connecting piece, with which the fluid-distributors of the two cooling pots are in communication.
2. Description of the Prior Art A known cooling box of this type (German Exhibited Text DT-OS 1,914,790) has a substantially rectangular connecting plate, which carries the two cooling 'pots. These cooling pots have relatively wide and thick flanges at their periphery, which serve to fasten them to the connecting piece. The part of the cooling pots projecting above the connecting piece is used as a current-connection. In the interior of the cooling pots a fluid-distributor is located. This distributor is formed of a number of webs, which are connected to each other by means of a central and an eccentric passage so that a great pressure-drop prevails in the'i'nterior of the cooling pot and, moreover, the heat-exchange area is limited.
This special type of web arrangement, however, requires special machining, so that such cooling pots can not be made on automatic lathes. Further the-shape of the connecting piece requires more material.
SUMMARY OF THE INVENTION The fundamental problem solved by the invention is to save material and simplify manufacture while making a cooling box having a relatively large heatexchanger surface over which the cooling fluid flows and a relatively smaller pressure drop to thus diminish the heat buildup in the cooling box.
In accordance with the invention the solution of the problem posed is achieved by'using a connecting piece having a round plate with inflow and outflow channels directed through and aligned with the center of the circle, and having passages disposed symmetrically of the center of. the circle. Further it carries axial rimprojections on both sides which by annular riveting are brought into engagement with radial projections from the cooling pots. The cooling pots have in their interior, concentric, continuous, annular channels that extend to the faces-and are in communication with the passages.
In order to avoid destruction of the stacked disk-cells (thyristor plates), which are held together by the action of external forces and are liable to breakage through inevitable irregularities of the clamping device, it is advantageous if the flat heat-transfer surfaces of the cooling pot, which extend against the adjacent disk-cells, are formed as annular surfaces extending from the outer rim of the cooling pot to the middle zone and are offset from one another.
The annular surfaces and the annular channels permit the manufacture of the cooling pots on automatic lathes. The connecting piece can also be produced from bar material in automatic lathes, needing only a subsequent machining in boring machines.
BRIEF DESCRIPTION OF THE DRAWINGS The drawings illustrate one embodiment for carrying out the features of my invention, which are explained in more detail in the following and in which:
FIG. 1 illustrates a side view of a cooling box, a portion of which is illustrated as a cross sectional view;
FIG. 2 illustrates a plan view of a connecting piece;
FIG. 3 illustrates a cross sectional view of a cooling pot; and
FIG. 4 illustrates a plan view of the device of FIG. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT The cooling box, which is held at both sides in electric contact with adjacent disk-cells (not shown), consists of a central round connecting piece 1 having parallel faces 6. and 7, carrying axial rim- projections 6a and 7a, by which, through annular riveting, it is connected with the two round cooling pots 8 and 9. The fluid-tight arrangement isobtained by conventional seal-rings inserted in annular grooves in the cooling pots. The round connecting piece 1 has two inflow and outflow channels 2 and 3, directed to, and aligned with, the center of the circle, and into which are screwed the connector- pieces 2a and 3a. Passages 4 and 5 are provided symmetrical to the center of the circle, and, perpendicular to the inflow and outflow channels 2 and 3.
The passages 4 and 5 thereupon pass through the wall thickness of the connecting piece. In the interior of the cooling pots 8 and 9 are continuous concentric annular channels 10, which extend to the faces 6 and 7 of the connecting piece, and are connected to the passages 4 and 5. Thus two similar paths of coolant flow are achieved from one passage through the annular channels to the other passage, that is, there is a symmetrical division of the cooling fluid, making possible improved flow conditions with less pressure drop. Together with this increased optimum heat-exchange area in the interior of the cooling box, greatly diminished heat resistance is also obtained so that instead of water as coolant, electrical insulating fluids having lower heatdissipation can be used. These fluids may be necessary, particularly in the case of hightension equipment.
Each cooling pot 8 and 9 has annular surfaces 8b and 9b protruding from the rim and middle zone. In the event of tilting of the contact surfaces, these surfaces keep the mechanical bending stress on the sensitive thyristor disks so small that breakage of the disk is avoided. The electrical and thermal transfer resistance .is hereby scarcely impaired. At two screw-threaded inserts 11 and 12 at the rim of the connecting piece I, a current-connector 13 can be screwed on, making it possible to have a series and/or parallel hook-up of the disk-cells.
In the foregoing, the invention has been described in reference to specific exemplary embodiments. It will be evident, however, that variations and modifications as well as the substitution of equivalent constructions and arrangements for those shown for illustration, may be made without departing from the broader scope and spirit of the invention as set forth in the appended claims. The specification and drawings are accordingly to be regarded in an illustrative rather than in a restrictive sense.
What is claimed is: l. A cooling box for installation in stacks of disk-cells comprising,
radial projections on the cooling pots, said projections being secured to the axial rim projections of the connector to form an hermetic seal between the connectors and the pots; and
the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
2. A cooling box for installation in stacks of disk-cells as in claim 1 wherein two current connecting fittings are connected to the connector for permitting the connection of current to the connector.
3. A cooling box for installationin stacks of diskcells as in claim 2 wherein the flat heat transmitting surface of the cooling pot is a round surface set back from the outer rim and extending into the interior of the pot.
4. A cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.
5. A cooling box for installation in'stacks for diskcells as in claim 1 wherein the axial rim projections and the radial projections on the cooling pots are joined by annular riveting.
Claims (5)
1. A cooling box for installation in stacks of disk-cells comprising, two circular disk-shaped cooling pots having flat internal heat transmitting surfaces; a disk-shaped coolant and electrical connector joined to the flat heat transmitting surfaces of the cooling pots, the connector having an inlet and an outlet channel aligned With one another and passing from the outer cirumference of the connector, towards the center of the disk each of said channels being connected to an internal passage within the connector, each of the passages being substantial perpendicular to the inlet and outlet channels; axial rim projections on both sides of the connector; radial projections on the cooling pots, said projections being secured to the axial rim projections of the connector to form an hermetic seal between the connectors and the pots; and the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
2. A cooling box for installation in stacks of disk-cells as in claim 1 wherein two current connecting fittings are connected to the connector for permitting the connection of current to the connector.
3. A cooling box for installation in stacks of diskcells as in claim 2 wherein the flat heat transmitting surface of the cooling pot is a round surface set back from the outer rim and extending into the interior of the pot.
4. A cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.
5. A cooling box for installation in stacks for diskcells as in claim 1 wherein the axial rim projections and the radial projections on the cooling pots are joined by annular riveting.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2160302A DE2160302C3 (en) | 1971-12-04 | 1971-12-04 | Cooling box for installation in disc cell stacks |
Publications (1)
Publication Number | Publication Date |
---|---|
US3823771A true US3823771A (en) | 1974-07-16 |
Family
ID=5827055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00311568A Expired - Lifetime US3823771A (en) | 1971-12-04 | 1972-12-04 | Cooling box for installation in stacks of disk-cells |
Country Status (14)
Country | Link |
---|---|
US (1) | US3823771A (en) |
JP (1) | JPS5145229B2 (en) |
BE (1) | BE792068A (en) |
CA (1) | CA987027A (en) |
CH (1) | CH548670A (en) |
DE (1) | DE2160302C3 (en) |
DK (1) | DK143625C (en) |
FR (1) | FR2162074B1 (en) |
GB (1) | GB1405604A (en) |
IT (1) | IT971389B (en) |
NL (1) | NL7215169A (en) |
NO (1) | NO131810C (en) |
SE (1) | SE374978B (en) |
ZA (1) | ZA728262B (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3999105A (en) * | 1974-04-19 | 1976-12-21 | International Business Machines Corporation | Liquid encapsulated integrated circuit package |
DE2758166A1 (en) * | 1977-02-18 | 1978-08-24 | Ckd Praha | POWER SEMICONDUCTOR COMPONENT |
US4159740A (en) * | 1977-08-29 | 1979-07-03 | Amf Incorporated | Direct expansion jacket for horizontal dough mixers |
US4161980A (en) * | 1976-09-24 | 1979-07-24 | Siemens Aktiengesellschaft | Cooling capsule for thyristors |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
US4366497A (en) * | 1979-06-29 | 1982-12-28 | Siemens Aktiengesellschaft | Cooling capsule for disc-shaped semiconductor components |
US4520384A (en) * | 1981-09-19 | 1985-05-28 | Bbc Aktiengesellschaft Brown, Boveri & Cie. | Power semiconductor component for cooling by boiling or liquids |
US4520383A (en) * | 1981-09-19 | 1985-05-28 | Bbc Aktiengesellschaft Brown, Boveri & Cie. | Power semiconductor component for boiling cooling |
US4521170A (en) * | 1981-09-19 | 1985-06-04 | Brown, Boveri & Cie. Ag | Power semiconductor component for liquid cooling |
US5983991A (en) * | 1997-06-30 | 1999-11-16 | Franks; James W. | Tissue chuck |
US6111749A (en) * | 1996-09-25 | 2000-08-29 | International Business Machines Corporation | Flexible cold plate having a one-piece coolant conduit and method employing same |
US11412637B2 (en) * | 2019-05-31 | 2022-08-09 | Abb Schweiz Ag | Apparatus for conducting heat |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2606157C2 (en) * | 1976-02-17 | 1983-11-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line |
DE2609512C2 (en) * | 1976-03-08 | 1982-11-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gas-insulated thyristor arrangement |
DE2640000C2 (en) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same |
DE2826898A1 (en) * | 1978-06-19 | 1980-01-03 | Siemens Ag | HEAT SINK FOR ELECTRICAL COMPONENTS |
JPS5610948A (en) * | 1979-07-06 | 1981-02-03 | Hitachi Ltd | Water cooling fin for semiconductor element |
FR2524760B1 (en) * | 1982-03-30 | 1986-10-10 | Auxilec | HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART |
DE3740233A1 (en) * | 1987-11-27 | 1989-06-08 | Asea Brown Boveri | Cooling box for conducting away the waste heat from semiconductors |
DE3818428C2 (en) * | 1987-11-27 | 1993-11-04 | Asea Brown Boveri | REFRIGERATION SOCKET FOR REMOVING THE LOST HEAT OF SEMICONDUCTOR ELEMENTS |
DE3740235C2 (en) * | 1987-11-27 | 1994-03-10 | Asea Brown Boveri | Cooling box for dissipating the heat loss from semiconductor elements |
DE4322932A1 (en) * | 1993-07-09 | 1995-01-19 | Abb Patent Gmbh | Liquid cooling body with insulating discs, electrical contact plates and an insulation ring |
Citations (4)
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US2179293A (en) * | 1938-08-25 | 1939-11-07 | Westinghouse Electric & Mfg Co | Cooled contact rectifier |
US2504281A (en) * | 1946-04-18 | 1950-04-18 | Ericsson Telefon Ab L M | Device for condensers |
US2942165A (en) * | 1957-01-03 | 1960-06-21 | Gen Electric | Liquid cooled current rectifiers |
DE1914790A1 (en) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Liquid-cooled assembly with disc cells |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE967450C (en) * | 1952-08-27 | 1957-11-14 | Siemens Ag | Cooling device for dry rectifier with cooling ducts |
FR1479193A (en) * | 1965-05-13 | 1967-04-28 | Siemens Ag | Semiconductor cell cooling device |
-
1971
- 1971-12-04 DE DE2160302A patent/DE2160302C3/en not_active Expired
-
1972
- 1972-11-01 CH CH1591572A patent/CH548670A/en not_active IP Right Cessation
- 1972-11-09 NL NL7215169A patent/NL7215169A/xx not_active Application Discontinuation
- 1972-11-22 ZA ZA728262A patent/ZA728262B/en unknown
- 1972-11-28 GB GB5501672A patent/GB1405604A/en not_active Expired
- 1972-11-29 FR FR7242452A patent/FR2162074B1/fr not_active Expired
- 1972-11-29 BE BE792068D patent/BE792068A/en unknown
- 1972-11-30 IT IT32304/72A patent/IT971389B/en active
- 1972-11-30 DK DK598172A patent/DK143625C/en active
- 1972-12-01 JP JP47121108A patent/JPS5145229B2/ja not_active Expired
- 1972-12-01 CA CA158,413A patent/CA987027A/en not_active Expired
- 1972-12-01 NO NO4434/72A patent/NO131810C/no unknown
- 1972-12-01 SE SE7215688A patent/SE374978B/xx unknown
- 1972-12-04 US US00311568A patent/US3823771A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2179293A (en) * | 1938-08-25 | 1939-11-07 | Westinghouse Electric & Mfg Co | Cooled contact rectifier |
US2504281A (en) * | 1946-04-18 | 1950-04-18 | Ericsson Telefon Ab L M | Device for condensers |
US2942165A (en) * | 1957-01-03 | 1960-06-21 | Gen Electric | Liquid cooled current rectifiers |
DE1914790A1 (en) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Liquid-cooled assembly with disc cells |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3999105A (en) * | 1974-04-19 | 1976-12-21 | International Business Machines Corporation | Liquid encapsulated integrated circuit package |
US4161980A (en) * | 1976-09-24 | 1979-07-24 | Siemens Aktiengesellschaft | Cooling capsule for thyristors |
DE2758166A1 (en) * | 1977-02-18 | 1978-08-24 | Ckd Praha | POWER SEMICONDUCTOR COMPONENT |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
US4159740A (en) * | 1977-08-29 | 1979-07-03 | Amf Incorporated | Direct expansion jacket for horizontal dough mixers |
US4366497A (en) * | 1979-06-29 | 1982-12-28 | Siemens Aktiengesellschaft | Cooling capsule for disc-shaped semiconductor components |
US4520384A (en) * | 1981-09-19 | 1985-05-28 | Bbc Aktiengesellschaft Brown, Boveri & Cie. | Power semiconductor component for cooling by boiling or liquids |
US4520383A (en) * | 1981-09-19 | 1985-05-28 | Bbc Aktiengesellschaft Brown, Boveri & Cie. | Power semiconductor component for boiling cooling |
US4521170A (en) * | 1981-09-19 | 1985-06-04 | Brown, Boveri & Cie. Ag | Power semiconductor component for liquid cooling |
US6111749A (en) * | 1996-09-25 | 2000-08-29 | International Business Machines Corporation | Flexible cold plate having a one-piece coolant conduit and method employing same |
US5983991A (en) * | 1997-06-30 | 1999-11-16 | Franks; James W. | Tissue chuck |
US11412637B2 (en) * | 2019-05-31 | 2022-08-09 | Abb Schweiz Ag | Apparatus for conducting heat |
Also Published As
Publication number | Publication date |
---|---|
GB1405604A (en) | 1975-09-10 |
DE2160302A1 (en) | 1973-06-07 |
NO131810C (en) | 1975-08-06 |
ZA728262B (en) | 1973-07-25 |
JPS4873078A (en) | 1973-10-02 |
NO131810B (en) | 1975-04-28 |
NL7215169A (en) | 1973-06-06 |
FR2162074B1 (en) | 1977-04-22 |
SE374978B (en) | 1975-03-24 |
IT971389B (en) | 1974-04-30 |
BE792068A (en) | 1973-05-29 |
DK143625C (en) | 1982-02-22 |
CA987027A (en) | 1976-04-06 |
JPS5145229B2 (en) | 1976-12-02 |
CH548670A (en) | 1974-04-30 |
FR2162074A1 (en) | 1973-07-13 |
DE2160302B2 (en) | 1974-11-07 |
DE2160302C3 (en) | 1975-07-17 |
DK143625B (en) | 1981-09-14 |
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