GB1405604A - Cooling component for a stack of semiconductor components - Google Patents

Cooling component for a stack of semiconductor components

Info

Publication number
GB1405604A
GB1405604A GB5501672A GB5501672A GB1405604A GB 1405604 A GB1405604 A GB 1405604A GB 5501672 A GB5501672 A GB 5501672A GB 5501672 A GB5501672 A GB 5501672A GB 1405604 A GB1405604 A GB 1405604A
Authority
GB
United Kingdom
Prior art keywords
cooling
plates
coolant
devices
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5501672A
Inventor
K Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1405604A publication Critical patent/GB1405604A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1405604 Cooling semi-conductor devices SIEMENS AG 28 Nov 1972 [4 Dec 1971] 55016/72 Heading H1K Cooling components located between the semi-conductor elements of a stack of devices such as rectifiers or thyristors each comprise two disc-shaped cooling plates 8, 9 connected in fluid-tight manner to opposite ends of a cylindrical connecting member 1. The member I has diametrically opposed inlet and outlet coolant ducts 2, 3 which communicate with bores 4, 5 extending longitudinally along the member 1 and symmetrically disposed with respect to the central axis of the member 1. At their outer ends the bores 4, 5 connect with series of uninterrupted annular ducts 10 in the plates 8, 9, thus providing a symmetrical flow of coolant through the cooling component. The improved flow conditions resulting from this may permit a coolant with lower heat-dissipating capacity than water to be used, this being of advantage in high voltage installations. The seal between the plates 8, 9 and the member 1 relies upon the coaction of peripheral flanges 6a-9a, and a sealing ring is preferably also provided. Electrical connection to the cooled devices may be made via a terminal arrangement on the member 1.
GB5501672A 1971-12-04 1972-11-28 Cooling component for a stack of semiconductor components Expired GB1405604A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160302A DE2160302C3 (en) 1971-12-04 1971-12-04 Cooling box for installation in disc cell stacks

Publications (1)

Publication Number Publication Date
GB1405604A true GB1405604A (en) 1975-09-10

Family

ID=5827055

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5501672A Expired GB1405604A (en) 1971-12-04 1972-11-28 Cooling component for a stack of semiconductor components

Country Status (14)

Country Link
US (1) US3823771A (en)
JP (1) JPS5145229B2 (en)
BE (1) BE792068A (en)
CA (1) CA987027A (en)
CH (1) CH548670A (en)
DE (1) DE2160302C3 (en)
DK (1) DK143625C (en)
FR (1) FR2162074B1 (en)
GB (1) GB1405604A (en)
IT (1) IT971389B (en)
NL (1) NL7215169A (en)
NO (1) NO131810C (en)
SE (1) SE374978B (en)
ZA (1) ZA728262B (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
DE2606157C2 (en) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line
DE2609512C2 (en) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gas-insulated thyristor arrangement
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
DE2643072C2 (en) * 1976-09-24 1982-06-03 Siemens AG, 1000 Berlin und 8000 München Cooling box for thyristors
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
DE2826898A1 (en) * 1978-06-19 1980-01-03 Siemens Ag HEAT SINK FOR ELECTRICAL COMPONENTS
DE2926342C2 (en) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Cooling box for disk-shaped semiconductor components
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
DE3175489D1 (en) * 1981-09-19 1986-11-20 Bbc Brown Boveri & Cie Semiconductor power device with fluid cooling
DE3137408A1 (en) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING OR LIQUID COOLING
DE3137407A1 (en) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING
FR2524760B1 (en) * 1982-03-30 1986-10-10 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
DE3740235C2 (en) * 1987-11-27 1994-03-10 Asea Brown Boveri Cooling box for dissipating the heat loss from semiconductor elements
DE3818428C2 (en) * 1987-11-27 1993-11-04 Asea Brown Boveri REFRIGERATION SOCKET FOR REMOVING THE LOST HEAT OF SEMICONDUCTOR ELEMENTS
DE3740233A1 (en) * 1987-11-27 1989-06-08 Asea Brown Boveri Cooling box for conducting away the waste heat from semiconductors
DE4322932A1 (en) * 1993-07-09 1995-01-19 Abb Patent Gmbh Liquid cooling body with insulating discs, electrical contact plates and an insulation ring
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
EP3745834A1 (en) * 2019-05-31 2020-12-02 ABB Schweiz AG Apparatus for conducting heat

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE967450C (en) * 1952-08-27 1957-11-14 Siemens Ag Cooling device for dry rectifier with cooling ducts
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
FR1479193A (en) * 1965-05-13 1967-04-28 Siemens Ag Semiconductor cell cooling device
DE1914790A1 (en) * 1969-03-22 1970-10-01 Siemens Ag Liquid-cooled assembly with disc cells

Also Published As

Publication number Publication date
DK143625B (en) 1981-09-14
NL7215169A (en) 1973-06-06
FR2162074B1 (en) 1977-04-22
IT971389B (en) 1974-04-30
NO131810C (en) 1975-08-06
FR2162074A1 (en) 1973-07-13
NO131810B (en) 1975-04-28
CH548670A (en) 1974-04-30
CA987027A (en) 1976-04-06
DE2160302C3 (en) 1975-07-17
SE374978B (en) 1975-03-24
DE2160302B2 (en) 1974-11-07
US3823771A (en) 1974-07-16
BE792068A (en) 1973-05-29
ZA728262B (en) 1973-07-25
DE2160302A1 (en) 1973-06-07
DK143625C (en) 1982-02-22
JPS4873078A (en) 1973-10-02
JPS5145229B2 (en) 1976-12-02

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee