CH548670A - COOLER FOR INSTALLATION IN DISC CELL STACKS. - Google Patents

COOLER FOR INSTALLATION IN DISC CELL STACKS.

Info

Publication number
CH548670A
CH548670A CH1591572A CH1591572A CH548670A CH 548670 A CH548670 A CH 548670A CH 1591572 A CH1591572 A CH 1591572A CH 1591572 A CH1591572 A CH 1591572A CH 548670 A CH548670 A CH 548670A
Authority
CH
Switzerland
Prior art keywords
cooler
installation
cell stacks
disc cell
disc
Prior art date
Application number
CH1591572A
Other languages
German (de)
Inventor
K Ludwig
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH548670A publication Critical patent/CH548670A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH1591572A 1971-12-04 1972-11-01 COOLER FOR INSTALLATION IN DISC CELL STACKS. CH548670A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160302A DE2160302C3 (en) 1971-12-04 1971-12-04 Cooling box for installation in disc cell stacks

Publications (1)

Publication Number Publication Date
CH548670A true CH548670A (en) 1974-04-30

Family

ID=5827055

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1591572A CH548670A (en) 1971-12-04 1972-11-01 COOLER FOR INSTALLATION IN DISC CELL STACKS.

Country Status (14)

Country Link
US (1) US3823771A (en)
JP (1) JPS5145229B2 (en)
BE (1) BE792068A (en)
CA (1) CA987027A (en)
CH (1) CH548670A (en)
DE (1) DE2160302C3 (en)
DK (1) DK143625C (en)
FR (1) FR2162074B1 (en)
GB (1) GB1405604A (en)
IT (1) IT971389B (en)
NL (1) NL7215169A (en)
NO (1) NO131810C (en)
SE (1) SE374978B (en)
ZA (1) ZA728262B (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
DE2606157C2 (en) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line
DE2609512C2 (en) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gas-insulated thyristor arrangement
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
DE2643072C2 (en) * 1976-09-24 1982-06-03 Siemens AG, 1000 Berlin und 8000 München Cooling box for thyristors
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
DE2826898A1 (en) * 1978-06-19 1980-01-03 Siemens Ag HEAT SINK FOR ELECTRICAL COMPONENTS
DE2926342C2 (en) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Cooling box for disk-shaped semiconductor components
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
EP0075036B1 (en) * 1981-09-19 1986-10-15 BROWN, BOVERI & CIE Aktiengesellschaft Mannheim Semiconductor power device with fluid cooling
DE3137407A1 (en) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING
DE3137408A1 (en) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING OR LIQUID COOLING
FR2524760B1 (en) * 1982-03-30 1986-10-10 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
DE3818428C2 (en) * 1987-11-27 1993-11-04 Asea Brown Boveri REFRIGERATION SOCKET FOR REMOVING THE LOST HEAT OF SEMICONDUCTOR ELEMENTS
DE3740233A1 (en) * 1987-11-27 1989-06-08 Asea Brown Boveri Cooling box for conducting away the waste heat from semiconductors
DE3740235C2 (en) * 1987-11-27 1994-03-10 Asea Brown Boveri Cooling box for dissipating the heat loss from semiconductor elements
DE4322932A1 (en) * 1993-07-09 1995-01-19 Abb Patent Gmbh Liquid cooling body with insulating discs, electrical contact plates and an insulation ring
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
EP3745834A1 (en) * 2019-05-31 2020-12-02 ABB Schweiz AG Apparatus for conducting heat

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE967450C (en) * 1952-08-27 1957-11-14 Siemens Ag Cooling device for dry rectifier with cooling ducts
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
FR1479193A (en) * 1965-05-13 1967-04-28 Siemens Ag Semiconductor cell cooling device
DE1914790A1 (en) * 1969-03-22 1970-10-01 Siemens Ag Liquid-cooled assembly with disc cells

Also Published As

Publication number Publication date
IT971389B (en) 1974-04-30
FR2162074B1 (en) 1977-04-22
NO131810C (en) 1975-08-06
JPS5145229B2 (en) 1976-12-02
DE2160302C3 (en) 1975-07-17
US3823771A (en) 1974-07-16
DK143625B (en) 1981-09-14
DE2160302A1 (en) 1973-06-07
GB1405604A (en) 1975-09-10
DE2160302B2 (en) 1974-11-07
SE374978B (en) 1975-03-24
NO131810B (en) 1975-04-28
BE792068A (en) 1973-05-29
FR2162074A1 (en) 1973-07-13
NL7215169A (en) 1973-06-06
DK143625C (en) 1982-02-22
ZA728262B (en) 1973-07-25
JPS4873078A (en) 1973-10-02
CA987027A (en) 1976-04-06

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Legal Events

Date Code Title Description
PL Patent ceased