CS190866B1 - High-capacity semiconductor detail - Google Patents

High-capacity semiconductor detail

Info

Publication number
CS190866B1
CS190866B1 CS108877A CS108877A CS190866B1 CS 190866 B1 CS190866 B1 CS 190866B1 CS 108877 A CS108877 A CS 108877A CS 108877 A CS108877 A CS 108877A CS 190866 B1 CS190866 B1 CS 190866B1
Authority
CS
Czechoslovakia
Prior art keywords
detail
capacity semiconductor
semiconductor
capacity
semiconductor detail
Prior art date
Application number
CS108877A
Other languages
Czech (cs)
Inventor
Petr Novak
Michal Pellant
Jaroslav Zuna
Jindrich Kratina
Pavel Reichel
Pavel Kafunek
Original Assignee
Petr Novak
Michal Pellant
Jaroslav Zuna
Jindrich Kratina
Pavel Reichel
Pavel Kafunek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Petr Novak, Michal Pellant, Jaroslav Zuna, Jindrich Kratina, Pavel Reichel, Pavel Kafunek filed Critical Petr Novak
Priority to CS108877A priority Critical patent/CS190866B1/en
Priority to SE7714533A priority patent/SE437587B/en
Priority to DE19772758166 priority patent/DE2758166C2/en
Priority to CH167178A priority patent/CH629337A5/en
Priority to PL20473678A priority patent/PL115317B2/en
Publication of CS190866B1 publication Critical patent/CS190866B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CS108877A 1977-02-18 1977-02-18 High-capacity semiconductor detail CS190866B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CS108877A CS190866B1 (en) 1977-02-18 1977-02-18 High-capacity semiconductor detail
SE7714533A SE437587B (en) 1977-02-18 1977-12-20 SEMICONDUCTOR DEVICE
DE19772758166 DE2758166C2 (en) 1977-02-18 1977-12-27 Semiconductor device
CH167178A CH629337A5 (en) 1977-02-18 1978-02-15 Semiconductor arrangement with improved cooling capacity
PL20473678A PL115317B2 (en) 1977-02-18 1978-02-17 Semiconductor structural component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS108877A CS190866B1 (en) 1977-02-18 1977-02-18 High-capacity semiconductor detail

Publications (1)

Publication Number Publication Date
CS190866B1 true CS190866B1 (en) 1979-06-29

Family

ID=5344335

Family Applications (1)

Application Number Title Priority Date Filing Date
CS108877A CS190866B1 (en) 1977-02-18 1977-02-18 High-capacity semiconductor detail

Country Status (5)

Country Link
CH (1) CH629337A5 (en)
CS (1) CS190866B1 (en)
DE (1) DE2758166C2 (en)
PL (1) PL115317B2 (en)
SE (1) SE437587B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4302816C2 (en) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Arrangement for cooling pressure contactable power disc semiconductors
DE10334354B4 (en) * 2002-07-25 2016-12-22 Gva Leistungselektronik Gmbh Arrangement comprising a liquid cooler and a power semiconductor element
DE102007001234A1 (en) * 2007-01-08 2008-07-10 Robert Bosch Gmbh Semiconductor module for connection to a transformer winding and transformer arrangement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1729293U (en) * 1955-03-14 1956-09-06 Licentia Gmbh DRY RECTIFIER ELEMENT WITH PLATE-SHAPED ELECTRODES.
DE1514679A1 (en) * 1966-01-29 1969-06-19 Siemens Ag Arrangement for liquid cooling of a rectifier cell
CH487504A (en) * 1968-03-09 1970-03-15 Mitsubishi Electric Corp Semiconductor device
GB1306224A (en) * 1969-02-24 1973-02-07
SE337263B (en) * 1969-03-24 1971-08-02 Asea Ab
DE2160302C3 (en) * 1971-12-04 1975-07-17 Siemens Ag Cooling box for installation in disc cell stacks

Also Published As

Publication number Publication date
DE2758166C2 (en) 1982-12-30
CH629337A5 (en) 1982-04-15
PL204736A1 (en) 1978-11-06
SE437587B (en) 1985-03-04
SE7714533L (en) 1978-08-19
PL115317B2 (en) 1981-03-31
DE2758166A1 (en) 1978-08-24

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