FR2524760B1 - HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART - Google Patents

HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART

Info

Publication number
FR2524760B1
FR2524760B1 FR8205439A FR8205439A FR2524760B1 FR 2524760 B1 FR2524760 B1 FR 2524760B1 FR 8205439 A FR8205439 A FR 8205439A FR 8205439 A FR8205439 A FR 8205439A FR 2524760 B1 FR2524760 B1 FR 2524760B1
Authority
FR
France
Prior art keywords
semiconductor
power device
holding part
semiconductor power
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8205439A
Other languages
French (fr)
Other versions
FR2524760A1 (en
Inventor
Max Binet
Claude Jacques
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auxilec SA
Original Assignee
Auxilec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auxilec SA filed Critical Auxilec SA
Priority to FR8205439A priority Critical patent/FR2524760B1/en
Priority to DE19833311712 priority patent/DE3311712A1/en
Publication of FR2524760A1 publication Critical patent/FR2524760A1/en
Application granted granted Critical
Publication of FR2524760B1 publication Critical patent/FR2524760B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8205439A 1982-03-30 1982-03-30 HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART Expired FR2524760B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8205439A FR2524760B1 (en) 1982-03-30 1982-03-30 HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
DE19833311712 DE3311712A1 (en) 1982-03-30 1983-03-30 Semiconductor mounting and power semiconductor switching device equipped therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8205439A FR2524760B1 (en) 1982-03-30 1982-03-30 HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART

Publications (2)

Publication Number Publication Date
FR2524760A1 FR2524760A1 (en) 1983-10-07
FR2524760B1 true FR2524760B1 (en) 1986-10-10

Family

ID=9272563

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8205439A Expired FR2524760B1 (en) 1982-03-30 1982-03-30 HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART

Country Status (2)

Country Link
DE (1) DE3311712A1 (en)
FR (1) FR2524760B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101524B2 (en) * 1985-09-18 1994-12-12 株式会社東芝 Cooling element for semiconductor element
DE4322933A1 (en) * 1993-07-09 1995-01-12 Abb Patent Gmbh Liquid-cooling body with hydraulic coolant connection

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2103982C3 (en) * 1971-01-28 1980-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Power converter cooled with insulating liquid
DE2160302C3 (en) * 1971-12-04 1975-07-17 Siemens Ag Cooling box for installation in disc cell stacks
DE2348207A1 (en) * 1973-09-25 1975-04-17 Siemens Ag THYRISTOR COLUMN
FR2277433A1 (en) * 1974-07-05 1976-01-30 Auxilec Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation
DE2515046C3 (en) * 1975-04-07 1980-03-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor column
DE2659527A1 (en) * 1976-12-30 1978-07-06 Licentia Gmbh Water-cooled power rectifier system - has individual units arranged in round elements stacked together with corresponding bus=bars
FR2479566A1 (en) * 1980-03-26 1981-10-02 Comptoir Cal Importation Heat sink for thyristor - uses two coolant tubes to which are moulded heat resistant insulating bodies formed around wire structure

Also Published As

Publication number Publication date
DE3311712A1 (en) 1983-10-06
FR2524760A1 (en) 1983-10-07
DE3311712C2 (en) 1992-12-17

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