DK143625B - COOLING BOX FOR BUILT IN STACKS OF DISCOVERED BODIES - Google Patents
COOLING BOX FOR BUILT IN STACKS OF DISCOVERED BODIES Download PDFInfo
- Publication number
- DK143625B DK143625B DK598172AA DK598172A DK143625B DK 143625 B DK143625 B DK 143625B DK 598172A A DK598172A A DK 598172AA DK 598172 A DK598172 A DK 598172A DK 143625 B DK143625 B DK 143625B
- Authority
- DK
- Denmark
- Prior art keywords
- cooling
- connection
- refrigerant
- pots
- cooling box
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
(19) DANMARK(19) DENMARK
|j| (12) FREMLÆGGELSESSKRIFT ου 143625 B| J | (12) PRESENTATION WRITING ου 143625 B
DIREKTORATET FOR PATENT- OG VAREMÆRKEVÆSENETDIRECTORATE OF THE PATENT AND TRADEMARKET SYSTEM
(21) Ansøgning nr. 5981/72 (51) Intel.* Η 01 L 23/46 (22) Indleveringsdag 50· nov. 1972 H 01 L 25/14 (24) Løbedag 30. nov. 1972 // F 28 F 3/12 (41) Aim. tilgængelig 5. Jun. 1973 (44) Fremlagt 14. S ep. 1981 (86) International ansøgning nr. - (86) International indleveringsdag (85) Videreførelsesdag - (62) Stamansøgning nr. -(21) Application No. 5981/72 (51) Intel. * Η 01 L 23/46 (22) Filing Day 50 · Nov. 1972 H 01 L 25/14 (24) Race day 30 Nov. 1972 // F 28 F 3/12 (41) Aim. available Jun 5 1973 (44) Presented 14. S ep. 1981 (86) International application # - (86) International filing day (85) Continuation day - (62) Master application no -
(30) Prioritet 4. dec. 1971, 2160302, DE(30) Priority 4 Dec. 1971, 2160302, DE
(71) Ansøger SJEMENS AKTIENGESELLSCHAFT, Berlin und Nuenehen, 8 Muenchen 2, DE.(71) Applicant SJEMENS AKTIENGESELLSCHAFT, Berlin und Nuenehen, 8 Muenchen 2, DE.
(72) Opfinder Klaus Ludwig, DE.(72) Inventor Klaus Ludwig, DE.
(74) Fuldmægtig Ingeniørfirmaet Giereing & Stellinger.(74) The Giereing & Stellinger Engineering Company.
(54) Køledåse til indbygning i stabler af skiveformede organer.(54) Cooling boxes for installation in stacks of disc-shaped members.
Den foreliggende opfindelse angår en køledåse til indbygning i en stabel, som er sammensat skiftevis af kølediser og skiveformede halvlederorganer, bestående af to med deres flade varmeovergangsflader mod de skiveformede organer anliggende runde kølepotter og en mellem disse liggende, med disse tæt forbundet, pladeformet tilslutningsdel for kølemiddel- og strømtilslutninger, hvorhos tilslutningsdelen har fra randen indad rettede indløbs- og udløbskanaler, som hver udmunder i en q omtrent vinkelret på disse gennem tilslutningsdelen forløbende gennemløbsibning, q hvorigennem kølemidlet via indløbskanalen, gennem en første gennemløbsibning, ^ kølepotterne og en anden gennemløbsibning føres frem til udløbskanalen.The present invention relates to a cooling box for incorporation in a stack composed alternately of cooling dies and disc-shaped semiconductor members, consisting of two round cooling pots adjacent to the disc-shaped members and their round cooling pots adjacent to these disc-shaped plate-shaped connection parts for refrigerant and power connections, wherein the connection portion has inwardly directed inlet and outlet ducts, each of which terminates in a q approximately perpendicular to the throughflow passage extending through the connection portion, q through which the refrigerant through the inlet channel, through a first throughput and forward to the outlet duct.
O En køledlse af denne art, der er kendt fra tysk offentliggørelsesskrift nr.O A refrigerator of this kind known from German Publication No.
£ 1.914.790, er sammensat af en i det væsentlige rektangulær tilslutningsplade og to uden om denne anbragte kølepotter. Disse kølepotter udviser relativt brede og tykke 3£ 1,914,790, is composed of one substantially rectangular connection plate and two outside this placed cooling pots. These cooling pots exhibit relatively wide and thick 3
2 1 A362S2 1 A362S
bånd anbragt på deres omkreds tjenende til skrueforbindelse med tilslutningsdelen. Tilslutningspladens fra kølepotterne fremspringende del benyttes også som strømtilslutning. Kølepotterne indeholder i deres indre en væskefordeler med flere gennemstrømningsveje, som står i forbindelse med en gennemstrømningsåbning, således at der i kølepottens indre befinder sig en usymmetrisk væskestrøm med et forholdsvis højt tryktab. Som følge af trykkets formindskelse opstår der en relativ høj varmemodstand. Denne varmemodstand bestemmer, hvor meget varme, der kan bortledes fra de skiveformede halvlederorganer til kølemidlet. Betinget af kølepottemes konstruktive udformning er endvidere varmeudvekslingsfladen begrænset. Med varmeudvekslingsflade forstås den del af kølepotternes overflade, henover hvilken der umiddelbart flyder kølemiddel.ribbons disposed on their perimeter serving for screw connection to the connecting member. The protruding part of the connecting plate protruding from the cooling pots is also used as a power connection. The cooling pots contain in their interior a liquid distributor with several flow paths, which are connected to a flow opening, so that there is in the interior of the cooling pot an asymmetrical liquid flow with a relatively high pressure drop. As a result of the pressure reduction, a relatively high heat resistance occurs. This heat resistance determines how much heat can be dissipated from the disc-shaped semiconductor means to the refrigerant. Furthermore, depending on the constructive design of the cooling pots, the heat exchange surface is limited. Heat exchange surface means the part of the surface of the cooling pots over which coolant immediately flows.
Den særlige form for kølemiddelfordeling i form af ribbeformede gennemstrømningsveje kræver desuden en speciel bearbejdning af kølepotteme. Disse kølepotter kan f.eks. ikke fremsilles som drejeemner i automatdrejebænke.The particular form of refrigerant distribution in the form of rib-shaped flow paths also requires special processing of the cooling pots. These cooling pots can e.g. not produced as lathes in automatic lathes.
Den foreliggende opfindelse har til opgave at tilvejebringe en køledåse med meget stor varmeudvekslingsflade og med meget lille varmemodstand, og som er enklere at fremstille end de hidtil kendte køledåser.The object of the present invention is to provide a cooling box with a very large heat exchange surface and with very little heat resistance, which is easier to manufacture than the previously known cooling boxes.
Denne opgave løses ved en køledåse af den indledningsvis nævnte art ved, at tilslutningsdelen er en cirkelformet plade med radialt rettede, indbyrdes flugtende ind- og udløbskanaler og med symmetrisk i forhold til tilslutningsdelens centrum anbragte gennemløbsåbninger i form af gennemløbsudboringer, og at kølepotterne på den mod tilslutningsdelen vendende side er forsynet med ubrudte, koncentriske ringkanaler, hvis skillevægge når frem til tilslutningsdelens endeflader og hver står i forbindelse med gennemløbsudboringerne. Denne konstruktive udformning af køledåserne tillader en enkel fremstilling af kølepotterne som drejeemner i automatdrejebænke. Også tilslutningsdelen kan fremstilles af stangformet materiale i automatdrejebænke og kræver herefter kun en videre forarbejdning i boreværker. Ved anvendelse af koncentriske og udbrudte ringkanaler til at føre kølemidlet, hvorved alle i forhold til hinanden parallelle ringkanaler samtidigt tilføres kølemiddel via gennemløbsudboringerne fra indløbskanalen, opnås der en meget lav varmemodstand i køledåsen. Endvidere muliggør kølemiddelføringen i indbyrdes koncentriske ringkanaler en udnyttelse af køledåsens samlede flade som varmeudvekslingsflade.This task is solved by a cooling box of the type mentioned in the introduction, in that the connection part is a circular plate with radially directed, mutually flushing inlet and outlet channels and with symmetrically arranged through-holes in the form of the passage part and the cooling pots the facing side of the connector is provided with uninterrupted concentric annular channels, the partitions of which reach the end faces of the connector and each communicate with the through-bores. This constructive design of the cooling boxes allows for simple preparation of the cooling pots as swivels in automatic lathes. Also, the connection part can be made of rod-shaped material in automatic lathes and then requires only further processing in drilling. By using concentric and erupted annular ducts to conduct the refrigerant, whereby all refrigerant channels which are parallel to one another are simultaneously supplied with refrigerant via the through-bores from the inlet duct, a very low heat resistance is obtained in the refrigeration box. Furthermore, the refrigerant guide in mutually concentric annular ducts enables the utilization of the overall surface of the cooling box as a heat exchange surface.
Fortrinsvis har kølepotterne og tilslutningsdelen randfremspring, som står i indgreb med hinanden ved hjælp af ringnitteforbindelser. Hverved opnås der en lettere fremstillelig og simpel forbindelse mellem kølepotterne og tilslutningsstykket. Denne forbindelse tillader materialebesparelse i sammenligning med de kendte skrueforbindelser mellem kølepotterne og tilslutningsdelen.Preferably, the cooling pots and the connection portion have rim projections which engage each other by means of rivet joints. In this way, a more easily manufactured and simple connection is obtained between the cooling pots and the connection piece. This connection allows material saving in comparison with the known screw connections between the cooling pots and the connection part.
Tilslutningsdelen kan på den ene side af dens rand mellem ind- og udløbskanalen være forsynet med to gevindboringer til påskruning af et strømtilslutningsarmatur. Ved påskruning efter ønske af strømtilslutningsarmaturet gøres det muligt at anvende køledåsen universelt ved forskelligartede sammenstablinger af 3 143625 organer, der skal sammenkobles. Efter behov kan der siledes påskrues eller udelades et strømtilslutningsarmatur.The connection part may be provided on one side of its edge between the inlet and outlet duct with two threaded bores for screwing on a current connection luminaire. By screwing on the power connection fitting as desired, it is possible to use the cooling box universally by various stackings of 3 143625 means to be connected. If required, a strainer can be screwed on or left out.
En udførelsesform ifølge opfindelsen beskrives nærmere i det følgende under henvisning til tegningen, pi hvilken fig. 1 viser i snit langs linjen I-I på fig. 2 en køledlse set fra siden delvis gennemskåret og med påsatte studse, fig. 2 viser en tilslutningsdel set fra oven, fig. 3 viser en kølepotte i tværsnit, og fig. 4 viser det samme som fig. 1, men set fra oven og med påskruet strømtilslutningsarmatur.An embodiment of the invention is described in more detail below with reference to the drawing, in which: FIG. 1 is a sectional view taken along line I-I of FIG. 2 is a side view of the cooling section partially cut away and with plugs attached; FIG. 2 is a top view of a connector; FIG. 3 shows a cross-sectional cooling pot, and FIG. 4 shows the same as FIG. 1, but seen from above and with screwed-on power connection fixture.
Den i fig. 1 viste køledåse består af en tilslutningsdel 1 og to kølepotter 8,9. Ved en her ikke vist indbygning af køledasen i en stabel, som er skiftevis sammensat af køledåser og skiveformede halvlederorganer, vil kølepotternes indbyrdes parallelle endeflader 8b,9b ligge an mod de skiveformede halvlederorganer. Til forbindelse af kølepotterne 8,9 og tilslutningsdelen 1 har kølepotterne radiale randfremspring 8a,9a og tilslutningsdelen aksiale randfremspring 6a,7a. Disse randfremspring holdes sammen ved hjælp af ringnitteforbindelser. En over for kølemidlet tæt forbindelse mellem kølepotterne og tilslutningsstykket tilvejebringes ved hjælp af i ringnoter 81,91 i kølepotterne 8,9 indlagte tætningsringe.The FIG. 1, the cooling boxes shown consist of a connection part 1 and two cooling pots 8,9. By incorporating the cooling case not shown here in a stack alternately composed of cooling boxes and disc-shaped semiconductor means, the parallel end surfaces 8b, 9b of the cooling pots will abut against the disc-shaped semiconductor means. For connection of the cooling pots 8,9 and the connection part 1, the cooling pots have radial edge projections 8a, 9a and the connection part axial edge projections 6a, 7a. These rim protrusions are held together by ring rivet connections. A close connection to the refrigerant between the cooling pots and the connection piece is provided by means of sealing rings embedded in ring notes 81.91 in the cooling pots 8.9.
For tilslutning af kølemiddelkredsløbet har køledasen en tilslutningsstuds 2a,3a henholdsvis én for kølemidlets ind- og udløb. Dette kølemiddel ledes nu f.eks. via tilslutningsstudsen 2a til køledasen. Det strømmer herefter igennem en indløbskanal 2 til en omtrent vinkelret på denne indløbskanal forløbende gennemløbsudboring 4 i indbyrdes koncentriske, ubrudte ringkanaler 10 i kølepotterne 8, 9. Gennemløbsudboringerne 4,5 er si store, at kølemidlet kan strømme samtidigt i alle ringkanalerne 10 i kølepotterne. Der er herved tilvejebragt en parallel føring af kølemidlet i kølepotterne. Efter gennemstrømning af ringkanalerne 10 strømmer kølemidlet via gennemløbsudboringen 5 ind i udløbskanalen 3 og tilføres derfra kølemiddelkredsløbet via udløbsstudsen 3a.For connection of the refrigerant circuit, the cooling case has a connector 2a, 3a and one for the inlet and outlet of the refrigerant respectively. This refrigerant is now conducted e.g. via the connector 2a to the cooling duct. It then flows through an inlet channel 2 to a approximately perpendicular to this inlet channel bore 4 in mutually concentric, unbroken annular ducts 10 in the cooling pots 8, 9. The through-hole bores 4,5 are large enough that the refrigerant can flow simultaneously in all the cooling ducts 10 in the cooling ducts. Hereby, a parallel flow of the refrigerant is provided in the cooling pots. After flowing through the annulus 10, the refrigerant flows through the through bore 5 into the outlet duct 3 and from there the refrigerant circuit is supplied via the outlet nozzle 3a.
I fig. 2 er tilslutningsdelen l's cirkelformede grundrids samt arrangementet af de forskellige boringer særlig tydeligt vist. Set fra oven er vist gennemløbsboringerne 4,5, som er anbragt symmetrisk i forhold til tilslutningsdelen l’s centrum. Disse gennemløbsudboringer gennembyrder den skiveformede tilslutningsdel i dennes fulde bredde. Fra siden er indført to yderligere boringer 2,3 til gennemløbsudboringerne 4,5. Disse boringer udgør ind- og udløbskanalerne, i hvilke tilslutningsstudsene 2a,3a er indstukket. Ud over disse kanaler har tilslutningsdelen på den side af randen mellem ind- og udløbskanal 2,3 to gevindboringer 11,12 til piskruning af et strømtilslutningsarmatur 13, som er vist på fig. 4.In FIG. 2, the circular base of the connection part 1 and the arrangement of the various bores are particularly clearly shown. Seen from above are shown the boreholes 4,5, which are symmetrically arranged with respect to the center of the connection part 1. These passage bores pierce the disc-shaped connection portion to its full width. From the side, two additional bores 2,3 have been introduced to the passage bores 4,5. These bores constitute the inlet and outlet ducts into which the connecting studs 2a, 3a are inserted. In addition to these channels, the connecting part on the side of the rim between the inlet and outlet ducts 2,3 has two threaded bores 11, 12 for whisking a current connection fitting 13 shown in FIG. 4th
4 1436254 143625
Fig. 3 viser en kølepotte 8,9. Denne kølepotte er rotationssymmetrisk om en symmetriakse A. Dette tillader en særlig enkel fremstilling af denne kølepotte som et drejeemne i en automatdrejebænk. Ved konstruktionen med de indbyrdes koncentriske, udburdte ringkanaler 10 er der tilvejebragt en køledåse, der sammenbygget har en symmetrisk opdeling af kølemidlet. Herved findes der to ens delkølestrømme, som muliggør en forbedring af strømningsforholdene med et ringere trykfald, end det var muligt at opnå ved de kendte kølediser. Endvidere kan varmeudvekslingsfladen i køledisens indre forøges. Begge foranstaltninger, parallelle delkølestrømme og forøget varmeudvekslingsflade, bevirker en formindskelse af varmemodstanden, således at der som kølemiddel i stedet for vand også kan anvendes elektrisk isolerende væsker med ringere varmebortledningsevne, hvilket navnlig kan være af betydning ved højspændingsnalæg. Af fig. 3 fremgår det ligeledes, at hver kølepotte har en fra randen og midterzonen udgående, fremspringende ringflade 8b, 9b. Ved eventuel "kantning" af kontaktfladen mellem kølepotte og skiveformet halvlederorgan i en stabel muliggøres en ringe indbyrdes "forkantning" mellem de to dele ved indlægningen i stablen, således at de sædvanligt forekommende mekaniske bøjningspåvirkninger ikke straks bevirker en itubrydning af sarte, indspændte, skiveformede halvlederorganer. Den elektriske og termiske overgangsmodstand påvirkes i praksis næppe mærkbart som følge af denne forringelse af berøringsflade.FIG. 3 shows a cooling pot 8.9. This cooling pot is rotationally symmetric about a axis of symmetry A. This allows a particularly simple preparation of this cooling pot as a rotary in an automatic lathe. In the construction with the mutually concentric, annular annular channels 10, a cooling box is provided which has a symmetrical distribution of the refrigerant together. Hereby, there are two similar partial cooling streams, which enable an improvement of the flow conditions with a lower pressure drop than was possible in the known cooling distances. Furthermore, the heat exchange surface in the interior of the cooling nozzle can be increased. Both measures, parallel partial cooling currents and increased heat exchange surface, reduce the heat resistance, so that, as a refrigerant, instead of water, electrically insulating fluids with poor heat dissipation can be used, which can be particularly important in high voltage shocks. In FIG. 3 it also appears that each cooling pot has a projecting ring surface 8b, 9b extending from the rim and the middle zone. Any "edging" of the contact surface between the cooling pot and disc-shaped semiconductor means in a stack allows for a slight "pre-cutting" between the two parts upon insertion into the stack, so that the usual mechanical bending effects do not immediately cause a breakage of delicate, clamped, half-shaped discs . In practice, the electrical and thermal transition resistance is hardly noticeable due to this deterioration of the contact surface.
I fig. 4 er der vist et på køledisen påskruet strømtilslutningsarmatur 13. Anvendelse efter ønske af dette strømtilslutningsarmatur muliggør en anvendelse efter foreliggende behov af køledåsen i serie og/eller parallelkoblinger af skiveformede organer. Samtidig fremgår det af fig. 4, at ind- og udløbskanaleme er anbragt indbyrdes flugtende og radialt rettede. Ved den fuldstændig symmetriske føring af kølemidlet i to indbyrdes ens delkølestrømme er det muliggjort at anvende tilslutningsstudsene 2a,3a efter ønske som tilslutning for indløbs- eller udløbskanal .In FIG. 4, there is shown a power connection fixture screwed onto the cooling nozzle 13. Use as desired of this power connection fixture enables an application according to the present need for the cooling box in series and / or parallel connections of disc-shaped members. At the same time, it can be seen from FIG. 4 shows that the inlet and outlet channels are flush and radially aligned. By completely symmetrical conducting of the refrigerant in two mutually identical partial cooling streams, it is possible to use the connecting studs 2a, 3a as desired for connection for inlet or outlet ducts.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2160302A DE2160302C3 (en) | 1971-12-04 | 1971-12-04 | Cooling box for installation in disc cell stacks |
| DE2160302 | 1971-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK143625B true DK143625B (en) | 1981-09-14 |
| DK143625C DK143625C (en) | 1982-02-22 |
Family
ID=5827055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK598172A DK143625C (en) | 1971-12-04 | 1972-11-30 | COOLING BOX FOR BUILT IN STACKS OF DISCOVERED BODIES |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US3823771A (en) |
| JP (1) | JPS5145229B2 (en) |
| BE (1) | BE792068A (en) |
| CA (1) | CA987027A (en) |
| CH (1) | CH548670A (en) |
| DE (1) | DE2160302C3 (en) |
| DK (1) | DK143625C (en) |
| FR (1) | FR2162074B1 (en) |
| GB (1) | GB1405604A (en) |
| IT (1) | IT971389B (en) |
| NL (1) | NL7215169A (en) |
| NO (1) | NO131810C (en) |
| SE (1) | SE374978B (en) |
| ZA (1) | ZA728262B (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3999105A (en) * | 1974-04-19 | 1976-12-21 | International Business Machines Corporation | Liquid encapsulated integrated circuit package |
| DE2606157C2 (en) * | 1976-02-17 | 1983-11-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line |
| DE2609512C2 (en) * | 1976-03-08 | 1982-11-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gas-insulated thyristor arrangement |
| DE2640000C2 (en) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same |
| DE2643072C2 (en) * | 1976-09-24 | 1982-06-03 | Siemens AG, 1000 Berlin und 8000 München | Cooling box for thyristors |
| CS190866B1 (en) * | 1977-02-18 | 1979-06-29 | Petr Novak | High-capacity semiconductor detail |
| US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
| US4159740A (en) * | 1977-08-29 | 1979-07-03 | Amf Incorporated | Direct expansion jacket for horizontal dough mixers |
| DE2826898A1 (en) * | 1978-06-19 | 1980-01-03 | Siemens Ag | HEAT SINK FOR ELECTRICAL COMPONENTS |
| DE2926342C2 (en) * | 1979-06-29 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | Cooling box for disk-shaped semiconductor components |
| JPS5610948A (en) * | 1979-07-06 | 1981-02-03 | Hitachi Ltd | Water cooling fin for semiconductor element |
| DE3137408A1 (en) * | 1981-09-19 | 1983-04-07 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING OR LIQUID COOLING |
| EP0075036B1 (en) * | 1981-09-19 | 1986-10-15 | BROWN, BOVERI & CIE Aktiengesellschaft Mannheim | Semiconductor power device with fluid cooling |
| DE3137407A1 (en) * | 1981-09-19 | 1983-04-07 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING |
| FR2524760B1 (en) * | 1982-03-30 | 1986-10-10 | Auxilec | HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART |
| DE3740235C2 (en) * | 1987-11-27 | 1994-03-10 | Asea Brown Boveri | Cooling box for dissipating the heat loss from semiconductor elements |
| DE3818428C2 (en) * | 1987-11-27 | 1993-11-04 | Asea Brown Boveri | REFRIGERATION SOCKET FOR REMOVING THE LOST HEAT OF SEMICONDUCTOR ELEMENTS |
| DE3740233A1 (en) * | 1987-11-27 | 1989-06-08 | Asea Brown Boveri | Cooling box for conducting away the waste heat from semiconductors |
| DE4322932A1 (en) * | 1993-07-09 | 1995-01-19 | Abb Patent Gmbh | Liquid cooling body with insulating discs, electrical contact plates and an insulation ring |
| US6111749A (en) * | 1996-09-25 | 2000-08-29 | International Business Machines Corporation | Flexible cold plate having a one-piece coolant conduit and method employing same |
| US5983991A (en) * | 1997-06-30 | 1999-11-16 | Franks; James W. | Tissue chuck |
| EP3745834A1 (en) * | 2019-05-31 | 2020-12-02 | ABB Schweiz AG | Apparatus for conducting heat |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2179293A (en) * | 1938-08-25 | 1939-11-07 | Westinghouse Electric & Mfg Co | Cooled contact rectifier |
| US2504281A (en) * | 1946-04-18 | 1950-04-18 | Ericsson Telefon Ab L M | Device for condensers |
| DE967450C (en) * | 1952-08-27 | 1957-11-14 | Siemens Ag | Cooling device for dry rectifier with cooling ducts |
| US2942165A (en) * | 1957-01-03 | 1960-06-21 | Gen Electric | Liquid cooled current rectifiers |
| FR1479193A (en) * | 1965-05-13 | 1967-04-28 | Siemens Ag | Semiconductor cell cooling device |
| DE1914790A1 (en) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Liquid-cooled assembly with disc cells |
-
1971
- 1971-12-04 DE DE2160302A patent/DE2160302C3/en not_active Expired
-
1972
- 1972-11-01 CH CH1591572A patent/CH548670A/en not_active IP Right Cessation
- 1972-11-09 NL NL7215169A patent/NL7215169A/xx not_active Application Discontinuation
- 1972-11-22 ZA ZA728262A patent/ZA728262B/en unknown
- 1972-11-28 GB GB5501672A patent/GB1405604A/en not_active Expired
- 1972-11-29 FR FR7242452A patent/FR2162074B1/fr not_active Expired
- 1972-11-29 BE BE792068D patent/BE792068A/en unknown
- 1972-11-30 DK DK598172A patent/DK143625C/en active
- 1972-11-30 IT IT32304/72A patent/IT971389B/en active
- 1972-12-01 JP JP47121108A patent/JPS5145229B2/ja not_active Expired
- 1972-12-01 CA CA158,413A patent/CA987027A/en not_active Expired
- 1972-12-01 NO NO4434/72A patent/NO131810C/no unknown
- 1972-12-01 SE SE7215688A patent/SE374978B/xx unknown
- 1972-12-04 US US00311568A patent/US3823771A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| BE792068A (en) | 1973-05-29 |
| DE2160302A1 (en) | 1973-06-07 |
| NL7215169A (en) | 1973-06-06 |
| GB1405604A (en) | 1975-09-10 |
| NO131810C (en) | 1975-08-06 |
| CA987027A (en) | 1976-04-06 |
| NO131810B (en) | 1975-04-28 |
| IT971389B (en) | 1974-04-30 |
| DE2160302C3 (en) | 1975-07-17 |
| JPS4873078A (en) | 1973-10-02 |
| DK143625C (en) | 1982-02-22 |
| DE2160302B2 (en) | 1974-11-07 |
| US3823771A (en) | 1974-07-16 |
| FR2162074B1 (en) | 1977-04-22 |
| SE374978B (en) | 1975-03-24 |
| ZA728262B (en) | 1973-07-25 |
| FR2162074A1 (en) | 1973-07-13 |
| CH548670A (en) | 1974-04-30 |
| JPS5145229B2 (en) | 1976-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK143625B (en) | COOLING BOX FOR BUILT IN STACKS OF DISCOVERED BODIES | |
| US5539617A (en) | Liquid-coolant cooling element | |
| US3481393A (en) | Modular cooling system | |
| US3603381A (en) | Liquid-cooled assembly of disc cells | |
| BRPI0409989A (en) | heat exchanger core | |
| US1654551A (en) | Fluid-heating device | |
| ES2048455T3 (en) | CERAMIC DISCS FOR TAP, AND TAP EQUIPPED WITH SUCH DISCS. | |
| CA1146282A (en) | Cooling capsule for disc-shaped semiconductor components | |
| DK1097346T3 (en) | Multi-circuit heat exchanger | |
| CN209882439U (en) | Double-sided heat dissipation high-performance water-cooling radiator and electrical equipment | |
| JP2000243886A (en) | Cooling body for power semiconductor element | |
| US2513828A (en) | Heat dissipating jacket | |
| US3175075A (en) | Paint heater | |
| US4897763A (en) | Circuit arrangement having a plurality of electrical elements to be cooled | |
| FI74810C (en) | SKIVVAERMEVAEXLARE. | |
| DK165652B (en) | Counter-flow heat exchanger | |
| RU2726021C1 (en) | Device for cooling, heating or heat transfer | |
| CN211930923U (en) | High-efficient waterproof LED switching power supply | |
| CN110214367B (en) | Device for tempering a substrate and corresponding production method | |
| JP2000111205A (en) | Distributor and air conditioner | |
| KR20120013143A (en) | Cooling assembly and cooling unit | |
| KR102492324B1 (en) | Double layer semiconductor cooling device with double structure | |
| CN209787713U (en) | High-power uniform heat dissipation's water-cooled radiator and electrical equipment | |
| SU919602A3 (en) | Mushroom-shaped valve with forced circulation of liquid coolant | |
| CN117316905A (en) | Parallel heat dissipation water channel structure |