ZA728262B - Cooling component for a stack of semiconductor components - Google Patents

Cooling component for a stack of semiconductor components

Info

Publication number
ZA728262B
ZA728262B ZA728262A ZA728262A ZA728262B ZA 728262 B ZA728262 B ZA 728262B ZA 728262 A ZA728262 A ZA 728262A ZA 728262 A ZA728262 A ZA 728262A ZA 728262 B ZA728262 B ZA 728262B
Authority
ZA
South Africa
Prior art keywords
stack
semiconductor components
cooling component
cooling
component
Prior art date
Application number
ZA728262A
Inventor
K Ludwig
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ZA728262B publication Critical patent/ZA728262B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ZA728262A 1971-12-04 1972-11-22 Cooling component for a stack of semiconductor components ZA728262B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160302A DE2160302C3 (en) 1971-12-04 1971-12-04 Cooling box for installation in disc cell stacks

Publications (1)

Publication Number Publication Date
ZA728262B true ZA728262B (en) 1973-07-25

Family

ID=5827055

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA728262A ZA728262B (en) 1971-12-04 1972-11-22 Cooling component for a stack of semiconductor components

Country Status (14)

Country Link
US (1) US3823771A (en)
JP (1) JPS5145229B2 (en)
BE (1) BE792068A (en)
CA (1) CA987027A (en)
CH (1) CH548670A (en)
DE (1) DE2160302C3 (en)
DK (1) DK143625C (en)
FR (1) FR2162074B1 (en)
GB (1) GB1405604A (en)
IT (1) IT971389B (en)
NL (1) NL7215169A (en)
NO (1) NO131810C (en)
SE (1) SE374978B (en)
ZA (1) ZA728262B (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
DE2606157C2 (en) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line
DE2609512C2 (en) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gas-insulated thyristor arrangement
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
DE2643072C2 (en) * 1976-09-24 1982-06-03 Siemens AG, 1000 Berlin und 8000 München Cooling box for thyristors
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
DE2826898A1 (en) * 1978-06-19 1980-01-03 Siemens Ag HEAT SINK FOR ELECTRICAL COMPONENTS
DE2926342C2 (en) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Cooling box for disk-shaped semiconductor components
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
DE3137408A1 (en) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING OR LIQUID COOLING
EP0075036B1 (en) * 1981-09-19 1986-10-15 BROWN, BOVERI & CIE Aktiengesellschaft Mannheim Semiconductor power device with fluid cooling
DE3137407A1 (en) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau PERFORMANCE SEMICONDUCTOR COMPONENT FOR BOILER COOLING
FR2524760B1 (en) * 1982-03-30 1986-10-10 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
DE3740235C2 (en) * 1987-11-27 1994-03-10 Asea Brown Boveri Cooling box for dissipating the heat loss from semiconductor elements
DE3818428C2 (en) * 1987-11-27 1993-11-04 Asea Brown Boveri REFRIGERATION SOCKET FOR REMOVING THE LOST HEAT OF SEMICONDUCTOR ELEMENTS
DE3740233A1 (en) * 1987-11-27 1989-06-08 Asea Brown Boveri Cooling box for conducting away the waste heat from semiconductors
DE4322932A1 (en) * 1993-07-09 1995-01-19 Abb Patent Gmbh Liquid cooling body with insulating discs, electrical contact plates and an insulation ring
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
EP3745834A1 (en) * 2019-05-31 2020-12-02 ABB Schweiz AG Apparatus for conducting heat

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE967450C (en) * 1952-08-27 1957-11-14 Siemens Ag Cooling device for dry rectifier with cooling ducts
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
FR1479193A (en) * 1965-05-13 1967-04-28 Siemens Ag Semiconductor cell cooling device
DE1914790A1 (en) * 1969-03-22 1970-10-01 Siemens Ag Liquid-cooled assembly with disc cells

Also Published As

Publication number Publication date
BE792068A (en) 1973-05-29
DE2160302A1 (en) 1973-06-07
NL7215169A (en) 1973-06-06
GB1405604A (en) 1975-09-10
NO131810C (en) 1975-08-06
CA987027A (en) 1976-04-06
NO131810B (en) 1975-04-28
IT971389B (en) 1974-04-30
DE2160302C3 (en) 1975-07-17
DK143625B (en) 1981-09-14
JPS4873078A (en) 1973-10-02
DK143625C (en) 1982-02-22
DE2160302B2 (en) 1974-11-07
US3823771A (en) 1974-07-16
FR2162074B1 (en) 1977-04-22
SE374978B (en) 1975-03-24
FR2162074A1 (en) 1973-07-13
CH548670A (en) 1974-04-30
JPS5145229B2 (en) 1976-12-02

Similar Documents

Publication Publication Date Title
ZA728262B (en) Cooling component for a stack of semiconductor components
IL39277A0 (en) A semiconductor integrated circuit
GB1357831A (en) Etchants for semiconductor compounds
JPS52144984A (en) Semiconductor device
JPS55160466A (en) Semiconductor device
GB1345818A (en) Semiconductor devices
CA961173A (en) Semiconductor device package
JPS53111284A (en) Charge coupled semiconductor
CA978660A (en) Beam-lead semiconductor component
CA987790A (en) High voltage semiconductor rectifier
AU4397372A (en) Semiconductor device
JPS568880A (en) Semiconductor device
CA958768A (en) Thyristor hard-firing circuit
GB1404603A (en) Compositions for photographic processes
ZA721782B (en) Monolithic semiconductor device
CA970079A (en) Method of soldering a semiconductor plate
ZA724729B (en) Method for the manufacturing of a semiconductor device
GB1395238A (en) Semiconductor devices
GB1345186A (en) Semiconductor devices
CA956390A (en) Semiconductor components
AU4728572A (en) Manufacturing semiconductor devices
AU459637B2 (en) Semiconductor circuit
CA941075A (en) Cooling scheme for a high-current semiconductor device
GB1342627A (en) Semiconductor devices
GB1363796A (en) Semiconductor lasers