AT297152B - Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen - Google Patents

Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen

Info

Publication number
AT297152B
AT297152B AT252670A AT252670A AT297152B AT 297152 B AT297152 B AT 297152B AT 252670 A AT252670 A AT 252670A AT 252670 A AT252670 A AT 252670A AT 297152 B AT297152 B AT 297152B
Authority
AT
Austria
Prior art keywords
liquid
disc cells
cooled assembly
cooled
assembly
Prior art date
Application number
AT252670A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AT297152B publication Critical patent/AT297152B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
  • Aerodynamic Tests, Hydrodynamic Tests, Wind Tunnels, And Water Tanks (AREA)
AT252670A 1969-03-22 1970-03-18 Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen AT297152B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691914790 DE1914790A1 (de) 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Publications (1)

Publication Number Publication Date
AT297152B true AT297152B (de) 1972-03-10

Family

ID=5729065

Family Applications (1)

Application Number Title Priority Date Filing Date
AT252670A AT297152B (de) 1969-03-22 1970-03-18 Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen

Country Status (8)

Country Link
US (1) US3603381A (de)
JP (1) JPS4923627B1 (de)
AT (1) AT297152B (de)
CH (1) CH506185A (de)
DE (1) DE1914790A1 (de)
FR (1) FR2039831A5 (de)
NO (1) NO127076B (de)
SE (1) SE363540B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430194A1 (de) * 1983-08-19 1985-03-07 Jeumont-Schneider, Puteaux Vortariertes element fuer das zusammenhalten und gegeneinanderpressen von halbleitern und radiatoren, die abwechselnd saeulenartig angeordnet sind
WO2003052820A2 (de) * 2001-12-17 2003-06-26 Siemens Aktiengesellschaft Spannvorrichtung

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (de) * 1970-03-05 1972-11-06 Asea Ab
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel
US3864607A (en) * 1972-03-16 1975-02-04 Programmed Power Stackable heat sink assembly
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US3785435A (en) * 1972-11-15 1974-01-15 Avco Corp Thermal damper for plate type heat exchangers
US4010489A (en) * 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
DE2609512C2 (de) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gasisolierte Thyristoranordnung
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene
DE2928388C3 (de) * 1979-07-13 1982-01-28 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule
US4315225A (en) * 1979-08-24 1982-02-09 Mcdonnell Douglas Corporation Heat sink laser diode array
DE3007168C2 (de) * 1980-02-26 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlte Halbleitersäule
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
EP0102654B1 (de) * 1982-09-10 1986-05-28 BBC Aktiengesellschaft Brown, Boveri & Cie. Horizontalachsige Stromrichteranordnung
DE3322288A1 (de) * 1983-06-16 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlanordnung fuer halbleiter-scheibenzellen
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
EP1148547B8 (de) * 2000-04-19 2016-01-06 Denso Corporation Kühlmittelgekühlte Halbleiteranordnung
DE102004059963A1 (de) * 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
JP2005332863A (ja) * 2004-05-18 2005-12-02 Denso Corp パワースタック
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
EP2109885B1 (de) * 2007-01-26 2016-05-04 Inductotherm Corp. Kompressionsklemmung von halbleiterbauelementen
US7773382B2 (en) * 2007-08-22 2010-08-10 Rockwell Automation Technologies, Inc. System and method for supporting one or more heat-generating electrical devices
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
TWM347807U (en) * 2008-05-14 2008-12-21 Kuen Bao Electric Co Ltd Cooling system with high power thyristors
JP2014078599A (ja) * 2012-10-10 2014-05-01 Denso Corp 電力変換装置
US8896023B2 (en) * 2013-02-20 2014-11-25 Alstom Technology Ltd Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
DE102013227000B4 (de) * 2013-12-20 2020-04-16 Siemens Aktiengesellschaft Elektrisches Modul

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE1514406B1 (de) * 1965-02-20 1971-04-01 Siemens Ag Halbleiteranordnung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430194A1 (de) * 1983-08-19 1985-03-07 Jeumont-Schneider, Puteaux Vortariertes element fuer das zusammenhalten und gegeneinanderpressen von halbleitern und radiatoren, die abwechselnd saeulenartig angeordnet sind
WO2003052820A2 (de) * 2001-12-17 2003-06-26 Siemens Aktiengesellschaft Spannvorrichtung
DE10164522A1 (de) * 2001-12-17 2003-07-03 Siemens Ag Spannvorrichtung
WO2003052820A3 (de) * 2001-12-17 2003-11-27 Siemens Ag Spannvorrichtung
DE10164522B4 (de) * 2001-12-17 2005-05-25 Siemens Ag Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung

Also Published As

Publication number Publication date
JPS4923627B1 (de) 1974-06-17
NO127076B (de) 1973-04-30
CH506185A (de) 1971-04-15
SE363540B (de) 1974-01-21
DE1914790A1 (de) 1970-10-01
US3603381A (en) 1971-09-07
FR2039831A5 (de) 1971-01-15

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee