NO127076B - - Google Patents
Download PDFInfo
- Publication number
- NO127076B NO127076B NO00950/70A NO95070A NO127076B NO 127076 B NO127076 B NO 127076B NO 00950/70 A NO00950/70 A NO 00950/70A NO 95070 A NO95070 A NO 95070A NO 127076 B NO127076 B NO 127076B
- Authority
- NO
- Norway
- Prior art keywords
- piece
- dress box
- duct piece
- assembly group
- dress
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 description 2
- 239000002775 capsule Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Aerodynamic Tests, Hydrodynamic Tests, Wind Tunnels, And Water Tanks (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691914790 DE1914790A1 (de) | 1969-03-22 | 1969-03-22 | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
Publications (1)
Publication Number | Publication Date |
---|---|
NO127076B true NO127076B (de) | 1973-04-30 |
Family
ID=5729065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO00950/70A NO127076B (de) | 1969-03-22 | 1970-03-17 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3603381A (de) |
JP (1) | JPS4923627B1 (de) |
AT (1) | AT297152B (de) |
CH (1) | CH506185A (de) |
DE (1) | DE1914790A1 (de) |
FR (1) | FR2039831A5 (de) |
NO (1) | NO127076B (de) |
SE (1) | SE363540B (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE350874B (de) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
DE2160302C3 (de) * | 1971-12-04 | 1975-07-17 | Siemens Ag | Kühldose zum Einbau in Scheibenzellenstapel |
US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
US3800191A (en) * | 1972-10-26 | 1974-03-26 | Borg Warner | Expandible pressure mounted semiconductor assembly |
US3808471A (en) * | 1972-10-26 | 1974-04-30 | Borg Warner | Expandible pressure mounted semiconductor assembly |
US3785435A (en) * | 1972-11-15 | 1974-01-15 | Avco Corp | Thermal damper for plate type heat exchangers |
US4010489A (en) * | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
DE2609512C2 (de) * | 1976-03-08 | 1982-11-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gasisolierte Thyristoranordnung |
DE2617776A1 (de) * | 1976-04-23 | 1977-10-27 | Siemens Ag | Kuehldose fuer einen thyristor |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
FR2451632A1 (fr) * | 1979-03-12 | 1980-10-10 | Alsthom Atlantique | Montage de semi-conducteurs de puissance refroidis par un flugene |
DE2928388C3 (de) * | 1979-07-13 | 1982-01-28 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule |
US4315225A (en) * | 1979-08-24 | 1982-02-09 | Mcdonnell Douglas Corporation | Heat sink laser diode array |
US4338652A (en) * | 1980-02-26 | 1982-07-06 | Westinghouse Electric Corp. | Stack module and stack loader therefor |
DE3007168C2 (de) * | 1980-02-26 | 1984-11-22 | Siemens AG, 1000 Berlin und 8000 München | Flüssigkeitsgekühlte Halbleitersäule |
DE3363736D1 (en) * | 1982-09-10 | 1986-07-03 | Bbc Brown Boveri & Cie | Horizontal axis rectifier device |
DE3322288A1 (de) * | 1983-06-16 | 1984-12-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kuehlanordnung fuer halbleiter-scheibenzellen |
FR2550887B1 (fr) * | 1983-08-19 | 1986-11-07 | Jeumont Schneider | Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance |
FR2748888B1 (fr) * | 1996-05-14 | 1998-06-19 | Gec Alsthom Transport Sa | Dispositif a elements semi-conducteurs de puissance |
USD420335S (en) * | 1998-01-16 | 2000-02-08 | Inductotherm Corp. | Location device |
EP1148547B8 (de) * | 2000-04-19 | 2016-01-06 | Denso Corporation | Kühlmittelgekühlte Halbleiteranordnung |
DE10164522B4 (de) * | 2001-12-17 | 2005-05-25 | Siemens Ag | Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung |
DE102004059963A1 (de) * | 2003-12-18 | 2005-08-11 | Denso Corp., Kariya | Einfach zusammengesetzter Kühler |
JP2005332863A (ja) * | 2004-05-18 | 2005-12-02 | Denso Corp | パワースタック |
US20060219396A1 (en) * | 2005-04-04 | 2006-10-05 | Denso Corporation | Lamination-type cooler |
EP2109885B1 (de) * | 2007-01-26 | 2016-05-04 | Inductotherm Corp. | Kompressionsklemmung von halbleiterbauelementen |
US7773382B2 (en) * | 2007-08-22 | 2010-08-10 | Rockwell Automation Technologies, Inc. | System and method for supporting one or more heat-generating electrical devices |
US20090108441A1 (en) * | 2007-10-31 | 2009-04-30 | General Electric Company | Semiconductor clamp system |
TWM347807U (en) * | 2008-05-14 | 2008-12-21 | Kuen Bao Electric Co Ltd | Cooling system with high power thyristors |
JP2014078599A (ja) * | 2012-10-10 | 2014-05-01 | Denso Corp | 電力変換装置 |
US8896023B2 (en) * | 2013-02-20 | 2014-11-25 | Alstom Technology Ltd | Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly |
DE102013227000B4 (de) * | 2013-12-20 | 2020-04-16 | Siemens Aktiengesellschaft | Elektrisches Modul |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2179293A (en) * | 1938-08-25 | 1939-11-07 | Westinghouse Electric & Mfg Co | Cooled contact rectifier |
US2504281A (en) * | 1946-04-18 | 1950-04-18 | Ericsson Telefon Ab L M | Device for condensers |
DE1514406B1 (de) * | 1965-02-20 | 1971-04-01 | Siemens Ag | Halbleiteranordnung |
-
1969
- 1969-03-22 DE DE19691914790 patent/DE1914790A1/de active Pending
-
1970
- 1970-02-17 CH CH223170A patent/CH506185A/de not_active IP Right Cessation
- 1970-03-17 NO NO00950/70A patent/NO127076B/no unknown
- 1970-03-18 SE SE03635/70A patent/SE363540B/xx unknown
- 1970-03-18 AT AT252670A patent/AT297152B/de not_active IP Right Cessation
- 1970-03-18 US US20699A patent/US3603381A/en not_active Expired - Lifetime
- 1970-03-20 FR FR7010229A patent/FR2039831A5/fr not_active Expired
- 1970-03-23 JP JP45024370A patent/JPS4923627B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1914790A1 (de) | 1970-10-01 |
AT297152B (de) | 1972-03-10 |
US3603381A (en) | 1971-09-07 |
FR2039831A5 (de) | 1971-01-15 |
JPS4923627B1 (de) | 1974-06-17 |
CH506185A (de) | 1971-04-15 |
SE363540B (de) | 1974-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO127076B (de) | ||
GB1239116A (de) | ||
FR73814E (fr) | Machine pour la fabrication en continu de bois lamellés ou autres matériaux exigeant une pression entre deux surfaces parallèles | |
ES408360A1 (es) | Perfeccionamientos en valvulas de derivacion sensibles a latemperatura. | |
ES2088321T3 (es) | Recipiente para acumuladores de carga rapida, que tiene unos canales moldeados en la tapa para distribuir el electrolito. | |
GB901952A (en) | Improvements in or relating to heat exchangers of the indirect plate pack type | |
GB1062529A (en) | Heat exchangers of the plate type | |
FR2238917A1 (en) | Liquid meter which may easily be changed - has self-contained, exchangeable measurement cassette on connecting part, protected by cover | |
GB827924A (en) | Dialyzers | |
ES308203A1 (es) | Separador de fases para circuito de gas licuado. | |
GB1256201A (en) | Evaporate cooling device for rubbing seal interface | |
SE323651B (de) | ||
GB1224444A (en) | Multiple outlet valve | |
GB615905A (en) | Improvements relating to heat exchangers | |
FR2044199A5 (en) | Seal ring for high pressure high capacity - vessel | |
US615539A (en) | Electric battery | |
US3253953A (en) | Fuel cell floating elements | |
US2065646A (en) | High pressure liquid level gauge | |
FR1198045A (fr) | Container souple démontable pour l'emmagasinage de tous matériaux pulvérulents ou fluides | |
FR1195439A (fr) | Connecteur monobloc de dérivation à vis centrale de pression | |
GB1019893A (en) | Coulometric cells | |
NO134426B (de) | ||
CARPENTIER et al. | Study of the deformation of beryllium under hydrostatic pressure reaching 15 kilobars(Beryllium deformation under hydrostatic pressure) | |
FILIPPOV et al. | Determination of time required for pressure equilibrium of gas flow in two interconnected vessels, with an opening of the known area | |
CARAFOLI et al. | Plane supersonic flows separated by a jet having the shape of a thin film(Plane supersonic flows separated by thin film shaped jet, deriving pressure as function of deviation) |