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1970-03-05 |
1972-11-06 |
Asea Ab |
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DE2160302C3
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1971-12-04 |
1975-07-17 |
Siemens Ag |
Kühldose zum Einbau in Scheibenzellenstapel
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1972-03-16 |
1975-02-04 |
Programmed Power |
Stackable heat sink assembly
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1972-10-26 |
1974-03-26 |
Borg Warner |
Expandible pressure mounted semiconductor assembly
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1972-10-26 |
1974-04-30 |
Borg Warner |
Expandible pressure mounted semiconductor assembly
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1972-11-15 |
1974-01-15 |
Avco Corp |
Thermal damper for plate type heat exchangers
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1975-05-19 |
1977-03-01 |
General Motors Corporation |
High power semiconductor device cooling apparatus and method
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DE2609512C2
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1976-03-08 |
1982-11-25 |
Siemens Ag, 1000 Berlin Und 8000 Muenchen |
Gasisolierte Thyristoranordnung
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DE2617776A1
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1976-04-23 |
1977-10-27 |
Siemens Ag |
Kuehldose fuer einen thyristor
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1977-05-04 |
1980-02-19 |
Ckd Praha, Oborovy Podnik |
Liquid cooler for semiconductor power elements
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FR2451632A1
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1979-03-12 |
1980-10-10 |
Alsthom Atlantique |
Montage de semi-conducteurs de puissance refroidis par un flugene
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1979-07-13 |
1982-01-28 |
Siemens AG, 1000 Berlin und 8000 München |
Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule
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1979-08-24 |
1982-02-09 |
Mcdonnell Douglas Corporation |
Heat sink laser diode array
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1980-02-26 |
1982-07-06 |
Westinghouse Electric Corp. |
Stack module and stack loader therefor
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DE3007168C2
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1980-02-26 |
1984-11-22 |
Siemens AG, 1000 Berlin und 8000 München |
Flüssigkeitsgekühlte Halbleitersäule
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1982-09-10 |
1986-07-03 |
Bbc Brown Boveri & Cie |
Horizontal axis rectifier device
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1983-06-16 |
1984-12-20 |
Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt |
Kuehlanordnung fuer halbleiter-scheibenzellen
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FR2550887B1
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1983-08-19 |
1986-11-07 |
Jeumont Schneider |
Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance
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FR2748888B1
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1996-05-14 |
1998-06-19 |
Gec Alsthom Transport Sa |
Dispositif a elements semi-conducteurs de puissance
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1998-01-16 |
2000-02-08 |
Inductotherm Corp. |
Location device
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EP1742265B1
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2000-04-19 |
2013-08-07 |
Denso Corporation |
Kühlmittelgekühlte Halbleiteranordnung
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(de)
*
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2001-12-17 |
2005-05-25 |
Siemens Ag |
Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung
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DE102004059963A1
(de)
*
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2003-12-18 |
2005-08-11 |
Denso Corp., Kariya |
Einfach zusammengesetzter Kühler
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JP2005332863A
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2004-05-18 |
2005-12-02 |
Denso Corp |
パワースタック
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2005-04-04 |
2006-10-05 |
Denso Corporation |
Lamination-type cooler
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KR101360012B1
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2007-01-26 |
2014-02-11 |
인덕터썸코포레이션 |
반도체 컴포넌트의 압축 클램핑
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2007-08-22 |
2010-08-10 |
Rockwell Automation Technologies, Inc. |
System and method for supporting one or more heat-generating electrical devices
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2007-10-31 |
2009-04-30 |
General Electric Company |
Semiconductor clamp system
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2008-05-14 |
2008-12-21 |
Kuen Bao Electric Co Ltd |
Cooling system with high power thyristors
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JP2014078599A
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2012-10-10 |
2014-05-01 |
Denso Corp |
電力変換装置
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2013-02-20 |
2014-11-25 |
Alstom Technology Ltd |
Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
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DE102013227000B4
(de)
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2013-12-20 |
2020-04-16 |
Siemens Aktiengesellschaft |
Elektrisches Modul
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