US3603381A - Liquid-cooled assembly of disc cells - Google Patents

Liquid-cooled assembly of disc cells Download PDF

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Publication number
US3603381A
US3603381A US20699A US3603381DA US3603381A US 3603381 A US3603381 A US 3603381A US 20699 A US20699 A US 20699A US 3603381D A US3603381D A US 3603381DA US 3603381 A US3603381 A US 3603381A
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US
United States
Prior art keywords
channel member
pan
cooling pan
coolant
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US20699A
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English (en)
Inventor
Friedrich Scherbaum
Klaus Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of US3603381A publication Critical patent/US3603381A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Assembly includes a stack of members having at least one disc cell with a coolant member coordinated therewith and at least one insulating member, and a forcestoring member clamping the members of the stack between two opposing bearings of a framework, the disc cell including a cooling pan having a hollow inner space, a channel member having means for supplying thereto and discharging therefrom a liquid coolant, the channel member being located adjacent the cooling pan, so as to close off the inner space of the cooling pan, and sealing means disposed intermediate the cooling pan and the channel member, the force-storing device having such a biasing force as to form a liquidtight force fit between the cooling pan and the channel member.
  • LIQUID-COOLED ASSEMBLY OF DISC CELLS Our invention relates to assembly of a stack of members including at least one disc cell having a coolant member therewith and at least one insulating member, the stack being clamped by a force-storing member between two opposing bearings of a framework. It is an object of our invention to provide assembly of the foregoing type wherein the conventional air cooling is replaced by liquid cooling. It is accordingly a further object of the invention to provide such liquid cooling whereby a large number of circuit variations, such as series circuits, parallel circuits and series-parallel circuits can be produced with least possible identical members.
  • assembly comprising a stack of members including at least one disc cell having a coolant member coordinated therewith and at least one insulating member, and a force-storing member clamping the members of the stack between two opposing bearings of a framework, the disc cell comprising a cooling pan having a hollow inner space, a channel member having means for supplying thereto and discharging therefrom a liquid coolant, the channel member being located adjacent the cooling pan so as to close off the inner space of the cooling pan, and sealing means I .disposed intermediate the cooling pan and the channel member, the force-storing device having such a biasing force as to form a liquidtight force fit between the cooling pan and the channel member.
  • a special advantage afforded by our invention is that clamping members for clamping the individual cooling pans and the channel members associated therewith together, can be dispensed with because the force required to effect sealing therebetween is provided by the force-storing device which also produces contact pressure.
  • the individual cooling pans are connected to the channel members coordinated therewith with the aid of pairs of relatively small screws. These screws thereby. exercise essentially the function of centering means and are of such dimension that a compression force required for effecting sealing between the channel member and the cooling pan is capable of attainment.
  • FIG. 1 is a side elevational view, partly in section, of an assembly having six series-connected disc cells, according to our invention
  • FIG. la is an enlarged fragmentary view in section of FIG. 1;
  • FIG. 2 is a front elevational view, partly in section, of FIG. 1 as seen in the direction of the arrow II;
  • FIG. 3 is an enlarged fragmentary side view, partly in section, of FIG. 2, showing a cooling pan thereof;
  • FIG. 4 is a top plan view of the cooling pan of FIG. 3;
  • FIG. 5 is a much enlarged top plan view of a channel member forming part of the assembly of FIGS. 1 and 2;
  • FIG. 6 is a sectional view of FIG. 5 taken along the line VI-
  • FIG. 7 is a sectional view of FIG. 5 taken along the line VII-VII;
  • FIG. 8 is an enlarged bottom plan view of a distributor member forming part of the cooling pan of FIG. 3 as seen from the bottom of FIG. 3 or in the direction of the arrow VIII in FIG. 10;
  • FIG. 9 is a top plan view of FIG. 8 or as seen in the direction of the arrow IX in FIG. 10;
  • FIG. 10 is a sectional view of FIG. 9 taken along the line X--X;
  • FIG. 11 is a much enlarged top plan view of a sealing disc forming part of the assembly of FIGS. 1 and 2;
  • FIG. 12 is a diametrical sectional view of FIG. 11.
  • disc cell there is meant herein a semiconductor component (rectifier or thyristor) having a disc. or wafershaped construction, the semiconductor member or element of the component being mounted in a disc-shaped housing having on the exterior thereof two contact surfaces extending parallel to one another.
  • a semiconductor component rectifier or thyristor
  • FIGS. 1 and 2 thereof such disc cells are identified by the reference numeral 3. From the sectional portion of FIG. 2, it is readily apparent that the disc cells 3 of the illustrated embodiment are formed with central recesses on both sides thereof wherein the contact surfaces thereof are located. A cooling pan 1 is received respectively in these central recesses of the disc cells 3.
  • the assemblies of our invention in the illustrated embodiment of FIGS. 1 and 2, contain six serially connected disc cells 3, each of which is disposed in a stack between two coordinated cooling pans l and two channel members 2, respectively. At the very ends of the six disc cells 3 and the cooling pans l and channel members 2 associated therewith, there are located respective sealing discs 7 and insulating members 6.
  • a compression member 40 is furthermore located at one end of the stack in abutment with one of the insulating members. The entire stacked assembly is clamped in a framework made up of two bolts 45 and 46 and two clamping; plates 43 and 44.
  • One of the insulating members 6 is fastened to the clamping plate 43 by a screw, while the other insulating member 6 lies on one side of the compression member 40.
  • the other side of the compression member 40 is formed with a concave recess wherein a correspondingly shaped end member 93 of a buffer or cushioning member 9 is received.
  • the buffer member 9 as shown more clearly in the enlargement of FIG. 1a, has a shaft 91 which is guided in a bore 423 formed in a bearing 422.
  • An external thread is provided on the bearing 422, which is screwed thereby into a corresponding internal thread formed in a suitable bore of the compression plate 44.
  • the bearing 42 is additionally formed with a bore 422 which is larger in diameter than the bore 423 and is provided with an annular groove of even greater diameter wherein a snapring serving as a stop member is seated.
  • the buffer member 9 is provided with a collar 92 which also serves as a stop member Between the collar 92 and a shoulder 425 formed in the bearing 42 at the junction between the two bores 422 and 423 therein, a forcestoring device 5 consisting of a plate spring is disposed.
  • the plate spring 5 is of such dimension and construction that, in the illustrated position of the buffer member 9 in FIGS. 1 and 1a, a considerable prestressing is exhibited.
  • the contact pressure exerted at the contact surfaces of the disc cells 3 can constantly be accurately adjusted, unaffected by thread friction; a scale standardized or calibrated to the contact pressure can be applied to the clamping plate 44 and a corresponding indicator mark can be placed on the bearing 42 so that the surface pressure corresponding to a specific position of the bearing can be read directly therefrom.
  • centering members 8 are also shown whose sole function is to maintain the disc cells 3 as well as the channel members 2 and cooling pans 1 in a given position relative to the bolts 45 and 46.
  • each pan 1 has a base 14, a sidewall 15, a flange 17 formed with an annular groove 18 for receiving a sealing ring and with two bores 16 serving for centering the pan 1.
  • a distributor member 12 is inserted in the interior space 11 of the pan 1 and has a construction that is now clearly shown in the enlarged views of FIGS. 8 to 10.
  • the distributor member 12 is formed of a tube having a central bore 13 and formed with four grooves 131 extending radially outwardly from the central bore 13.
  • the distributor member 12, when inserted in the cooling pan 1, as shown in FIG. 3, has its upper surface 19 disposed in the same plane as the surface of the flange 17 of the cooling pan 1.
  • a representative channel member 2 is formed of a metal plate having two opposite and parallel flat sides 23 and being formed with two adjacent transverse bores 21 and 22 extending perpendicularly to the two parallel flat sides 23.
  • a longitudinal bore 25 also formed in the plate 2 extends from the transverse bore 21 to a narrow end 26 (also see FIG. 7) of the plate 2; correspondingly, another longitudinal bore 24 formed in the plate 2 extends from the transverse bore 22 to a narrow end 27 (also see FIG. 6).
  • Nozzles 241 and 251 are soldered, respectively, into the longitudinal bores 24 and 25, tubes of insulating material, such as rubber or plastic material, for example, being attachable to the nozzles 241 and 251 for supplying tO'and discharging from the channel member 2 a suitable liquid coolant, such as water, for example.
  • a suitable liquid coolant such as water, for example.
  • the longitudinal channels formed by the bores 24 and 25 are disposed at an angle of substantially 70 to one another.
  • the channel member 2 is also formed with two bores 23' extending transversely to the parallel flat sides 23, which act as centering means for the channel member.
  • the channel member and the cooling pan can be secured to one another in superposed position as shown in FIGS. 3 and 5.
  • FIG. 3 the channel member 2 is shown in phantom
  • FIG. 5 the cooling pan 1 is shown in phantom. It is believed to be readily apparent from FIGS. 3 and 5 that the centering function afforded by the bores 23' of the channel member 2 and the bores 16 of the cooling pan 1, assures that the transverse bore 21 in the channel member 2 extributor member 12. If a liquid coolant is then supplied through the longitudinal channel 25 of the channel member 2,
  • the coolant flows through the transverse bore 21 and the bore 13 of the distributor member 12 against the bore 14 of the cooling pan 1 and from there through the grooves 131 (note also FIGS. 8 to 10) of the distributor member 12 as well as through the inner space 11 between the wall 15 of the cooling pan 1 and the distributor member 12 into the transverse bore 22 and then through the longitudinal be e 24.
  • two cooling pans 1 can be placed, respectively, at both flat sides 23 of a single channel member 2 as can be seen in FIGS. 1 and 2.
  • the coolant flowing in through the longitudinal channel 25, then divides and then flows along the indicated path in parallel flow through both cooling pans.
  • a sealing disc 7 according to FIGS. 11 and 12 in order thereby to prevent discharge of the coolant from the one flat side of the member 2.
  • Such sealing discs 7 are placed on both endmost channel members 2 of the stack assembly shown in FIGS. 1 and 2.
  • the sealing discs 7 are formed with a central recess 73 as guide for the insulating members 6 as shown in FIGS. 1 and 2 and an annular flange 71 formed with an annular groove 72 for receiving a nonillustrated sealing ring therein. Also, this sealing disc 7, as seen in FIG. 2, is fastened to the channel member 2 with the aid of a screw.
  • the forcestoring device or plate spring 5 also produces the sealing pressure between the insulating members 6 and the respective sealing discs 7.
  • two or more channel members 2 will be employed as connecting pieces or terminals and will be given a length such as is shown in FIG. 7 and at the ends and center of the stack in FIG. 2 for the purpose of being used as connecting pieces or terminals. If, on the other hand, the channel members 2 are not required to be used as connecting pieces or terminals, the part thereof shown on the side of the dotted line 29 at the top of F IG. 5 can be dispensed with.
  • These shorter channel members 2 are the two channel members 2 located between the respective end-- most elongated channel members 2 and the center elongated channel member 2 in FIG. 2.
  • the assembly of the illustrated embodiment is made up of, respectively, three serially connected disc cells 3 between two terminal members or elongated channel members 2, respectively. Depending upon the polarity of the inserted disc cells, the resultant assembly corresponds to two branches of a bridge circuit or to both branches of a rectifier with center-tap connection.
  • a disc cell assembly comprising a stack of members including at least one disc cell having a coolant member coordinated therewith and at least one insulating member, and a force-storing member clamping the members of said stack between two opposing bearings of a framework, said coolant member comprising a cooling pan having a hollow inner' space, a channel member having means for supplying thereto and discharging therefrom a liquid coolant, said channel member being located adjacent said cooling pan so as to close off the inner space of said cooling pan, and sealing means disposed intermediate said cooling pan and said channel member, said force-storing device having such a biasing force as to form a liquidtight force fit between said cooling pan and said channel member.
  • cooling pan is formed with a flange having a surface on which said channel member is supported, said flange being formed with an annular groove in said surface thereof for receiving a seal therein, said distributor member having a surface disposed in the same plane as said surface of said flange.
  • said channel member comprises a plate having opposite flat sides extending substantially parallel to one another, said plate being formed with two transverse bores extending through said plate substantially, perpendicularly to said flat sides thereof, and including centering means located on both sides of said channel member and on one side of said cooling pan for mutually aligning said channel member and said cooling pan so that one of the transverse bores formed in said channel member communicates with the central bore of said distributor member, the other transverse bore formed in said channel member being in communication said inner space of said cooling pan between said lateral wall of said coolant pan and said distributor member, said channel member having apair of narrow sides located at one end thereof, and including a longitudinal bore formed in said plate and extending parallel to said flat sides thereof from each transverse bore, respectively, through a respective narrow side to the outside of said plate.
  • Assembly according to claim 4 including an insulating member located at one side of said channel member, and a sealing disc interposed therebetween for closing off the transverse bores formed in said channel member.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Aerodynamic Tests, Hydrodynamic Tests, Wind Tunnels, And Water Tanks (AREA)
  • Rectifiers (AREA)
US20699A 1969-03-22 1970-03-18 Liquid-cooled assembly of disc cells Expired - Lifetime US3603381A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691914790 DE1914790A1 (de) 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

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US3603381A true US3603381A (en) 1971-09-07

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US20699A Expired - Lifetime US3603381A (en) 1969-03-22 1970-03-18 Liquid-cooled assembly of disc cells

Country Status (8)

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US (1) US3603381A (de)
JP (1) JPS4923627B1 (de)
AT (1) AT297152B (de)
CH (1) CH506185A (de)
DE (1) DE1914790A1 (de)
FR (1) FR2039831A5 (de)
NO (1) NO127076B (de)
SE (1) SE363540B (de)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3785435A (en) * 1972-11-15 1974-01-15 Avco Corp Thermal damper for plate type heat exchangers
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US3864607A (en) * 1972-03-16 1975-02-04 Programmed Power Stackable heat sink assembly
US4010489A (en) * 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
US4301465A (en) * 1979-03-12 1981-11-17 Alsthom-Atlantique Cover mounted multi-columnar semiconductor assembly
US4315225A (en) * 1979-08-24 1982-02-09 Mcdonnell Douglas Corporation Heat sink laser diode array
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
US5883431A (en) * 1996-05-14 1999-03-16 Gec Alsthom Transport Sa Device with power semiconductor components
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US20030090873A1 (en) * 2000-04-19 2003-05-15 Denso Corporation Coolant cooled type semiconductor device
US20050259402A1 (en) * 2004-05-18 2005-11-24 Denso Corporation Power stack
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
US20080211157A1 (en) * 2007-01-26 2008-09-04 Fishman Oleg S Compression clamping of semiconductor components
US20090008061A1 (en) * 2003-12-18 2009-01-08 Denso Corporation Easily assembled cooler
US20090052141A1 (en) * 2007-08-22 2009-02-26 Kingston Murray P System and Method for Supporting One or More Heat-Generating Electrical Devices
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
US20090284922A1 (en) * 2008-05-14 2009-11-19 Kuen-Cheng Wang High-power thyristor module having cooling effect
US20140098496A1 (en) * 2012-10-10 2014-04-10 Denso Corporation Power conversion apparatus including semiconductor modules and cooler
US20140231869A1 (en) * 2013-02-20 2014-08-21 Alstom Technology Ltd Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart A Faulty Silicon Device In Said Stack Assembly
DE102013227000A1 (de) * 2013-12-20 2015-06-25 Siemens Aktiengesellschaft Elektrisches Modul

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (de) * 1970-03-05 1972-11-06 Asea Ab
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel
DE2609512C2 (de) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gasisolierte Thyristoranordnung
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
DE2928388C3 (de) * 1979-07-13 1982-01-28 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule
DE3007168C2 (de) * 1980-02-26 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlte Halbleitersäule
DE3363736D1 (en) * 1982-09-10 1986-07-03 Bbc Brown Boveri & Cie Horizontal axis rectifier device
DE3322288A1 (de) * 1983-06-16 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlanordnung fuer halbleiter-scheibenzellen
FR2550887B1 (fr) * 1983-08-19 1986-11-07 Jeumont Schneider Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance
DE10164522B4 (de) * 2001-12-17 2005-05-25 Siemens Ag Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung

Citations (3)

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US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
GB1121395A (en) * 1965-02-20 1968-07-24 Siemens Ag Semiconductor arrangement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
GB1121395A (en) * 1965-02-20 1968-07-24 Siemens Ag Semiconductor arrangement

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864607A (en) * 1972-03-16 1975-02-04 Programmed Power Stackable heat sink assembly
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US3785435A (en) * 1972-11-15 1974-01-15 Avco Corp Thermal damper for plate type heat exchangers
US4010489A (en) * 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
US4301465A (en) * 1979-03-12 1981-11-17 Alsthom-Atlantique Cover mounted multi-columnar semiconductor assembly
US4315225A (en) * 1979-08-24 1982-02-09 Mcdonnell Douglas Corporation Heat sink laser diode array
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
US5883431A (en) * 1996-05-14 1999-03-16 Gec Alsthom Transport Sa Device with power semiconductor components
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US7027302B2 (en) * 2000-04-19 2006-04-11 Denso Corporation Coolant cooled type semiconductor device
US7250674B2 (en) 2000-04-19 2007-07-31 Denso Corporation Coolant cooled type semiconductor device
US6845012B2 (en) 2000-04-19 2005-01-18 Denso Corporation Coolant cooled type semiconductor device
US20050040515A1 (en) * 2000-04-19 2005-02-24 Denso Corporation Coolant cooled type semiconductor device
US20040144996A1 (en) * 2000-04-19 2004-07-29 Denso Corporation Coolant cooled type semiconductor device
US20030090873A1 (en) * 2000-04-19 2003-05-15 Denso Corporation Coolant cooled type semiconductor device
US20060120047A1 (en) * 2000-04-19 2006-06-08 Denso Corporation Coolant cooled type semiconductor device
US7106592B2 (en) 2000-04-19 2006-09-12 Denso Corporation Coolant cooled type semiconductor device
US20060232939A1 (en) * 2000-04-19 2006-10-19 Denso Corporation Coolant cooled type semiconductor device
US7248478B2 (en) 2000-04-19 2007-07-24 Denso Corporation Coolant cooled type semiconductor device
US20090008061A1 (en) * 2003-12-18 2009-01-08 Denso Corporation Easily assembled cooler
US8151868B2 (en) * 2003-12-18 2012-04-10 Denso Corporation Easily assembled cooler
US20050259402A1 (en) * 2004-05-18 2005-11-24 Denso Corporation Power stack
US7200007B2 (en) * 2004-05-18 2007-04-03 Denso Corporation Power stack
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
US8134835B2 (en) * 2007-01-26 2012-03-13 Inductotherm Corp. Compression clamping of semiconductor components
US20080211157A1 (en) * 2007-01-26 2008-09-04 Fishman Oleg S Compression clamping of semiconductor components
EP2028689A3 (de) * 2007-08-22 2010-06-16 Rockwell Automation Technologies, Inc. System und Verfahren zur Unterstützung eines oder mehrerer elektrischer Wärmeerzeugungsgeräte
US20090052141A1 (en) * 2007-08-22 2009-02-26 Kingston Murray P System and Method for Supporting One or More Heat-Generating Electrical Devices
US7773382B2 (en) * 2007-08-22 2010-08-10 Rockwell Automation Technologies, Inc. System and method for supporting one or more heat-generating electrical devices
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
US7804689B2 (en) * 2008-05-14 2010-09-28 Kuen-Cheng Wang High-power thyristor module having cooling effect
US20090284922A1 (en) * 2008-05-14 2009-11-19 Kuen-Cheng Wang High-power thyristor module having cooling effect
US20140098496A1 (en) * 2012-10-10 2014-04-10 Denso Corporation Power conversion apparatus including semiconductor modules and cooler
US20140231869A1 (en) * 2013-02-20 2014-08-21 Alstom Technology Ltd Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart A Faulty Silicon Device In Said Stack Assembly
US8896023B2 (en) * 2013-02-20 2014-11-25 Alstom Technology Ltd Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
DE102013227000A1 (de) * 2013-12-20 2015-06-25 Siemens Aktiengesellschaft Elektrisches Modul
DE102013227000B4 (de) * 2013-12-20 2020-04-16 Siemens Aktiengesellschaft Elektrisches Modul

Also Published As

Publication number Publication date
DE1914790A1 (de) 1970-10-01
AT297152B (de) 1972-03-10
NO127076B (de) 1973-04-30
FR2039831A5 (de) 1971-01-15
JPS4923627B1 (de) 1974-06-17
CH506185A (de) 1971-04-15
SE363540B (de) 1974-01-21

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