WO2003052820A3 - Spannvorrichtung - Google Patents

Spannvorrichtung Download PDF

Info

Publication number
WO2003052820A3
WO2003052820A3 PCT/DE2002/004506 DE0204506W WO03052820A3 WO 2003052820 A3 WO2003052820 A3 WO 2003052820A3 DE 0204506 W DE0204506 W DE 0204506W WO 03052820 A3 WO03052820 A3 WO 03052820A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
pressing plate
mounting plate
clamping device
clamping
Prior art date
Application number
PCT/DE2002/004506
Other languages
English (en)
French (fr)
Other versions
WO2003052820A2 (de
Inventor
Jens Meyer
Original Assignee
Siemens Ag
Jens Meyer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Jens Meyer filed Critical Siemens Ag
Publication of WO2003052820A2 publication Critical patent/WO2003052820A2/de
Publication of WO2003052820A3 publication Critical patent/WO2003052820A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

Um bei einer Spannvorrichtung (1) zum Verspannen von Halbleiterbauelementen (12) mit einer Grundplatte (2), einer dieser axial gegenüberliegenden und axial beweglichen Druckplatte (9), Zugankern, die mit der Grundplatte (2) verbunden und zum Abstützen der Druckplatte (9) eingerichtet sind, einer Spanneinheit (3) zur Erzeugung einer Andruckkraft und einem an der Spanneinheit (3) abgestützten Federelement (18), wobei ein Kraftübertragungsmittel vorgesehen ist, das die Andruckkraft auf die Druckplatte (9) überträgt, die Andruckkraft möglichst flächig und gleichmäßig über die Andruckfläche verteilt in das Halbleiterbauelement einzuleiten, wird vorgeschlagen, dass das Kraftübertragungsmittel ein Fluid ist, das in einer von der Druckplatte teilweise begrenzten druckfesten Druckkammer (19) angeordnet ist.
PCT/DE2002/004506 2001-12-17 2002-12-05 Spannvorrichtung WO2003052820A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001164522 DE10164522B4 (de) 2001-12-17 2001-12-17 Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung
DE10164522.8 2001-12-17

Publications (2)

Publication Number Publication Date
WO2003052820A2 WO2003052820A2 (de) 2003-06-26
WO2003052820A3 true WO2003052820A3 (de) 2003-11-27

Family

ID=7711175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/004506 WO2003052820A2 (de) 2001-12-17 2002-12-05 Spannvorrichtung

Country Status (2)

Country Link
DE (1) DE10164522B4 (de)
WO (1) WO2003052820A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1528596A1 (de) * 2003-10-27 2005-05-04 ABB Schweiz AG Haltevorrichtung für mindestens einen Halbleiterstapelverband sowie ein elektrisches System mit solchen Haltevorrichtungen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1539325A1 (de) * 1966-08-04 1969-12-11 Siemens Ag Druckstueck zur oertlichen Fixierung eines thermoelektrischen Bauelements
AT297152B (de) * 1969-03-22 1972-03-10 Siemens Ag Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (de) * 1970-03-05 1972-11-06 Asea Ab
DE4426646C2 (de) * 1994-07-16 1997-03-20 Abb Daimler Benz Transp Spannvorrichtung für Scheibenzellenhalbleiter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1539325A1 (de) * 1966-08-04 1969-12-11 Siemens Ag Druckstueck zur oertlichen Fixierung eines thermoelektrischen Bauelements
AT297152B (de) * 1969-03-22 1972-03-10 Siemens Ag Flüssigkeitsgekühlte Baugruppe mit Scheibenzellen
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors

Also Published As

Publication number Publication date
DE10164522A1 (de) 2003-07-03
WO2003052820A2 (de) 2003-06-26
DE10164522B4 (de) 2005-05-25

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