NO127076B - - Google Patents
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- Publication number
- NO127076B NO127076B NO00950/70A NO95070A NO127076B NO 127076 B NO127076 B NO 127076B NO 00950/70 A NO00950/70 A NO 00950/70A NO 95070 A NO95070 A NO 95070A NO 127076 B NO127076 B NO 127076B
- Authority
- NO
- Norway
- Prior art keywords
- piece
- dress box
- duct piece
- assembly group
- dress
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Aerodynamic Tests, Hydrodynamic Tests, Wind Tunnels, And Water Tanks (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691914790 DE1914790A1 (de) | 1969-03-22 | 1969-03-22 | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO127076B true NO127076B (enrdf_load_stackoverflow) | 1973-04-30 |
Family
ID=5729065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO00950/70A NO127076B (enrdf_load_stackoverflow) | 1969-03-22 | 1970-03-17 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3603381A (enrdf_load_stackoverflow) |
| JP (1) | JPS4923627B1 (enrdf_load_stackoverflow) |
| AT (1) | AT297152B (enrdf_load_stackoverflow) |
| CH (1) | CH506185A (enrdf_load_stackoverflow) |
| DE (1) | DE1914790A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2039831A5 (enrdf_load_stackoverflow) |
| NO (1) | NO127076B (enrdf_load_stackoverflow) |
| SE (1) | SE363540B (enrdf_load_stackoverflow) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE350874B (enrdf_load_stackoverflow) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
| DE2160302C3 (de) * | 1971-12-04 | 1975-07-17 | Siemens Ag | Kühldose zum Einbau in Scheibenzellenstapel |
| US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
| US3808471A (en) * | 1972-10-26 | 1974-04-30 | Borg Warner | Expandible pressure mounted semiconductor assembly |
| US3800191A (en) * | 1972-10-26 | 1974-03-26 | Borg Warner | Expandible pressure mounted semiconductor assembly |
| US3785435A (en) * | 1972-11-15 | 1974-01-15 | Avco Corp | Thermal damper for plate type heat exchangers |
| US4010489A (en) * | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
| DE2609512C2 (de) * | 1976-03-08 | 1982-11-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gasisolierte Thyristoranordnung |
| DE2617776A1 (de) * | 1976-04-23 | 1977-10-27 | Siemens Ag | Kuehldose fuer einen thyristor |
| US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
| FR2451632A1 (fr) * | 1979-03-12 | 1980-10-10 | Alsthom Atlantique | Montage de semi-conducteurs de puissance refroidis par un flugene |
| DE2928388C3 (de) * | 1979-07-13 | 1982-01-28 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule |
| US4315225A (en) * | 1979-08-24 | 1982-02-09 | Mcdonnell Douglas Corporation | Heat sink laser diode array |
| US4338652A (en) * | 1980-02-26 | 1982-07-06 | Westinghouse Electric Corp. | Stack module and stack loader therefor |
| DE3007168C2 (de) * | 1980-02-26 | 1984-11-22 | Siemens AG, 1000 Berlin und 8000 München | Flüssigkeitsgekühlte Halbleitersäule |
| EP0102654B1 (de) * | 1982-09-10 | 1986-05-28 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Horizontalachsige Stromrichteranordnung |
| DE3322288A1 (de) * | 1983-06-16 | 1984-12-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kuehlanordnung fuer halbleiter-scheibenzellen |
| FR2550887B1 (fr) * | 1983-08-19 | 1986-11-07 | Jeumont Schneider | Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance |
| FR2748888B1 (fr) * | 1996-05-14 | 1998-06-19 | Gec Alsthom Transport Sa | Dispositif a elements semi-conducteurs de puissance |
| USD420335S (en) * | 1998-01-16 | 2000-02-08 | Inductotherm Corp. | Location device |
| EP1742265B1 (en) * | 2000-04-19 | 2013-08-07 | Denso Corporation | Coolant cooled type semiconductor device |
| DE10164522B4 (de) * | 2001-12-17 | 2005-05-25 | Siemens Ag | Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung |
| DE102004059963A1 (de) * | 2003-12-18 | 2005-08-11 | Denso Corp., Kariya | Einfach zusammengesetzter Kühler |
| JP2005332863A (ja) * | 2004-05-18 | 2005-12-02 | Denso Corp | パワースタック |
| US20060219396A1 (en) * | 2005-04-04 | 2006-10-05 | Denso Corporation | Lamination-type cooler |
| BRPI0806533B1 (pt) * | 2007-01-26 | 2018-10-09 | Inductotherm Corp | dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor |
| US7773382B2 (en) * | 2007-08-22 | 2010-08-10 | Rockwell Automation Technologies, Inc. | System and method for supporting one or more heat-generating electrical devices |
| US20090108441A1 (en) * | 2007-10-31 | 2009-04-30 | General Electric Company | Semiconductor clamp system |
| TWM347807U (en) * | 2008-05-14 | 2008-12-21 | Kuen Bao Electric Co Ltd | Cooling system with high power thyristors |
| JP2014078599A (ja) * | 2012-10-10 | 2014-05-01 | Denso Corp | 電力変換装置 |
| US8896023B2 (en) * | 2013-02-20 | 2014-11-25 | Alstom Technology Ltd | Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly |
| DE102013227000B4 (de) * | 2013-12-20 | 2020-04-16 | Siemens Aktiengesellschaft | Elektrisches Modul |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2179293A (en) * | 1938-08-25 | 1939-11-07 | Westinghouse Electric & Mfg Co | Cooled contact rectifier |
| US2504281A (en) * | 1946-04-18 | 1950-04-18 | Ericsson Telefon Ab L M | Device for condensers |
| DE1514406B1 (de) * | 1965-02-20 | 1971-04-01 | Siemens Ag | Halbleiteranordnung |
-
1969
- 1969-03-22 DE DE19691914790 patent/DE1914790A1/de active Pending
-
1970
- 1970-02-17 CH CH223170A patent/CH506185A/de not_active IP Right Cessation
- 1970-03-17 NO NO00950/70A patent/NO127076B/no unknown
- 1970-03-18 SE SE03635/70A patent/SE363540B/xx unknown
- 1970-03-18 AT AT252670A patent/AT297152B/de not_active IP Right Cessation
- 1970-03-18 US US20699A patent/US3603381A/en not_active Expired - Lifetime
- 1970-03-20 FR FR7010229A patent/FR2039831A5/fr not_active Expired
- 1970-03-23 JP JP45024370A patent/JPS4923627B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| SE363540B (enrdf_load_stackoverflow) | 1974-01-21 |
| JPS4923627B1 (enrdf_load_stackoverflow) | 1974-06-17 |
| DE1914790A1 (de) | 1970-10-01 |
| FR2039831A5 (enrdf_load_stackoverflow) | 1971-01-15 |
| CH506185A (de) | 1971-04-15 |
| US3603381A (en) | 1971-09-07 |
| AT297152B (de) | 1972-03-10 |
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