DE112020005161T5 - Harzzusammensetzung, harzfilm, metallfolie mit harz, prepreg, metallplattiertes laminat und leiterplatte - Google Patents

Harzzusammensetzung, harzfilm, metallfolie mit harz, prepreg, metallplattiertes laminat und leiterplatte Download PDF

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Publication number
DE112020005161T5
DE112020005161T5 DE112020005161.7T DE112020005161T DE112020005161T5 DE 112020005161 T5 DE112020005161 T5 DE 112020005161T5 DE 112020005161 T DE112020005161 T DE 112020005161T DE 112020005161 T5 DE112020005161 T5 DE 112020005161T5
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Prior art keywords
resin composition
filler
resin
equal
volume
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DE112020005161.7T
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German (de)
English (en)
Inventor
Akihiro Yamauchi
Eiichiro Saito
Nobuo Shibata
Kouichi Aoki
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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    • C08J5/18—Manufacture of films or sheets
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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    • C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
DE112020005161.7T 2019-10-25 2020-10-21 Harzzusammensetzung, harzfilm, metallfolie mit harz, prepreg, metallplattiertes laminat und leiterplatte Pending DE112020005161T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-194706 2019-10-25
JP2019194706 2019-10-25
PCT/JP2020/039516 WO2021079900A1 (ja) 2019-10-25 2020-10-21 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板

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DE112020005161T5 true DE112020005161T5 (de) 2022-07-14

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US (1) US11814502B2 (https=)
JP (1) JP7603262B2 (https=)
CN (1) CN114555703B (https=)
AT (1) AT524642A3 (https=)
DE (1) DE112020005161T5 (https=)
WO (1) WO2021079900A1 (https=)

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JP6742593B2 (ja) * 2015-01-05 2020-08-19 日本電気硝子株式会社 支持ガラス基板の製造方法及び積層体の製造方法
WO2021079900A1 (ja) * 2019-10-25 2021-04-29 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板
EP4343949A4 (en) * 2021-05-28 2025-04-16 LG Energy Solution, Ltd. Separator for electrochemical device, and electrochemical device comprising same
WO2024057803A1 (ja) * 2022-09-16 2024-03-21 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JPWO2024062923A1 (https=) * 2022-09-21 2024-03-28
CN121574499A (zh) * 2026-01-23 2026-02-27 湖北珍正峰新材料有限公司 一种耐温型多官能团环氧树脂及其制备方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2012087250A (ja) 2010-10-21 2012-05-10 Panasonic Corp 熱伝導性樹脂組成物、樹脂シート、プリプレグ、金属積層板およびプリント配線板

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