WO2021079900A1 - 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板 - Google Patents

樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板 Download PDF

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Publication number
WO2021079900A1
WO2021079900A1 PCT/JP2020/039516 JP2020039516W WO2021079900A1 WO 2021079900 A1 WO2021079900 A1 WO 2021079900A1 JP 2020039516 W JP2020039516 W JP 2020039516W WO 2021079900 A1 WO2021079900 A1 WO 2021079900A1
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Prior art keywords
filler
resin composition
resin
volume
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2020/039516
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English (en)
French (fr)
Japanese (ja)
Inventor
章裕 山内
斉藤　英一郎
伸郎 柴田
幸一 青木
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2021553486A priority Critical patent/JP7603262B2/ja
Priority to DE112020005161.7T priority patent/DE112020005161T5/de
Priority to ATA9323/2020A priority patent/AT524642A3/de
Priority to US17/771,079 priority patent/US11814502B2/en
Priority to CN202080071396.2A priority patent/CN114555703B/zh
Publication of WO2021079900A1 publication Critical patent/WO2021079900A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
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Definitions

  • the present disclosure relates to a resin composition, a resin film, a metal foil with a resin, a prepreg, a metal-clad laminate, and a printed wiring board.
  • the present invention relates to a film, a metal foil with a resin made from the resin composition, a prepreg made from the resin composition, a metal-clad laminate made from the resin composition, and a printed wiring board made from the resin composition. ..
  • Patent Document 1 discloses a thermally conductive resin composition.
  • This thermally conductive resin composition contains 60 to 95% by mass in total of two or more kinds of inorganic fillers. Further, the Mohs hardness of the first inorganic filler is 4 or more, and the Mohs hardness of the second inorganic filler is 3 or less. Further, the ratio of the first inorganic filler to the second inorganic filler is 1: 1 to 0.01.
  • the subject of the present disclosure is a resin composition having excellent moldability, a resin film made from the resin composition, a metal foil with a resin made from the resin composition, a prepreg made from the resin composition, and the like. It is an object of the present invention to provide a metal-clad laminate made from a resin composition and a printed wiring board made from the resin composition.
  • the resin composition according to one aspect of the present disclosure contains a thermosetting resin (A) and an inorganic filler (B).
  • the inorganic filler (B) contains a first filler (B1) and a nano-sized second filler (B2) having a smaller particle size than the first filler (B1).
  • the first filler (B1) contains an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2).
  • the ratio of the first filler (B1) to the total solid content in the resin composition is 50% by volume or more and 90% by volume or less, and the ratio of the second filler (B2) is 0.1% by volume or more 2 It is 0.0% by volume or less.
  • the resin film according to one aspect of the present disclosure contains the resin composition, a dried product of the resin composition, or a semi-cured product of the resin composition.
  • the metal leaf with a resin includes a resin layer containing the resin composition, a dried product of the resin composition, or a semi-cured product of the resin composition, and a metal foil overlapping the resin layer. To be equipped with.
  • the prepreg according to one aspect of the present disclosure includes a base material, the resin composition impregnated in the base material, a dried product of the resin composition, or a semi-cured product of the resin composition.
  • the metal-clad laminate according to one aspect of the present disclosure includes an insulating layer containing a cured product of the resin composition and a metal foil that overlaps the insulating layer.
  • the printed wiring board according to one aspect of the present disclosure includes an insulating layer containing a cured product of the resin composition and a conductor layer overlapping the insulating layer.
  • FIG. 1 is a schematic cross-sectional view of a resin film according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic cross-sectional view of the metal leaf with resin according to the embodiment of the present disclosure.
  • FIG. 3 is a schematic cross-sectional view of the prepreg according to the embodiment of the present disclosure.
  • FIG. 4 is a schematic cross-sectional view of the metal-clad laminate according to the embodiment of the present disclosure.
  • FIG. 5A is a schematic cross-sectional view of a printed wiring board according to an embodiment of the present disclosure.
  • FIG. 5B is a schematic cross-sectional view of a multilayer printed wiring board according to an embodiment of the present disclosure.
  • inorganic fillers are used to improve performance such as thermal conductivity and heat resistance.
  • Inorganic filler tends to cause deterioration of moldability.
  • a resin composition containing an inorganic filler is molded to prepare an insulating layer and a conductor wiring is embedded in the insulating layer, in order to sufficiently fill the gap between the conductor wirings with the insulating layer, The resin composition preferably has good fluidity during molding.
  • the resin composition does not have excessive fluidity.
  • the blending amount of the inorganic filler is adjusted in order to impart an appropriate fluidity to the resin composition, but it is difficult to impart an appropriate fluidity to the resin composition by itself.
  • the inventor has completed the present disclosure as a result of conducting research in order to develop a resin composition containing an inorganic filler and having excellent moldability.
  • the resin composition according to this embodiment contains a thermosetting resin (A) and an inorganic filler (B).
  • the inorganic filler (B) contains a first filler (B1) and a nano-sized second filler (B2) having a smaller particle size than the first filler (B1).
  • the first filler (B1) contains an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2).
  • the ratio of the first filler (B1) to the total solid content in the resin composition is 50% by volume or more and 90% by volume or less, and the ratio of the second filler (B2) is 0.1% by volume or more and 2.0% by volume. % Or less.
  • the solid content is a component in the resin composition excluding volatile components such as a solvent (components that do not remain in the cured product).
  • a resin film can be produced from the resin composition.
  • a metal leaf with a resin can also be produced from the resin composition.
  • a prepreg can also be made from the resin composition.
  • a metal-clad laminate and a printed wiring board can also be produced from each of a resin film, a metal leaf with a resin, and a prepreg.
  • the alumina filler (b2) has a particularly high heat resistance, so that the cured product of the resin composition can have a high heat resistance. Further, since the anhydrous magnesium carbonate filler (b1) does not have water of crystallization, it has good heat resistance, so that it is difficult to inhibit the heat resistance of the cured product. Further, the hardness of the anhydrous magnesium carbonate filler (b1) is lower than that of the alumina filler (b2). Therefore, the anhydrous magnesium carbonate filler (b1) can make it difficult for the drill to be worn when the cured product of the resin composition is drilled. Therefore, the cured product of the resin composition tends to have high heat resistance and drill workability.
  • the resin composition can have an appropriate fluidity at the time of molding by the second filler (B2).
  • the second filler (B2) As a result, particularly when the resin composition is molded to produce an insulating layer and the conductor wiring is embedded in the insulating layer, the insulating layer is likely to be sufficiently filled in the gap between the wirings in the conductor wiring. Further, excessive flow of the resin composition during molding is suppressed, and for example, the resin composition is less likely to flow out from the insulating layer, and molding defects of the insulating layer are less likely to occur.
  • the thermosetting resin (A) contains, for example, at least one of a monomer and a prepolymer.
  • the prepolymer may contain oligomers.
  • the type of polymerization reaction of the thermosetting resin (A) is not particularly limited. Specific examples of the polymerization reaction include chain polymerization and step-growth polymerization. A typical example of chain polymerization is radical polymerization. A typical example of step-growth polymerization is double addition.
  • thermosetting resin (A) is, for example, an epoxy resin (a), a phenoxy resin, a polyimide resin, a polyester resin, a triazine resin, a maleimide resin, a polyphenylene ether resin, and a functional body containing a CC unsaturated bond in one molecule. It contains a polyphenylene ether resin having a group and at least one selected from the group consisting of derivatives of these resins.
  • the thermosetting resin (A) contains at least one of the epoxy resin (a) and the phenoxy resin.
  • the epoxy resin (a) preferably contains a resin having two or more epoxy rings (oxylan rings) in one molecule.
  • the epoxy resin (a) may be liquid or solid.
  • the epoxy resin (a) includes, for example, a bisphenol type epoxy resin, a novolak type epoxy resin, an arylalkylene type epoxy resin, a naphthalene skeleton modified epoxy resin, a trifunctional epoxy resin, a phenoxy resin, a triphenylmethane type epoxy resin, and an anthracene type epoxy resin.
  • Dicyclopentadiene type epoxy resin norbornen type epoxy resin, fluorene type epoxy resin, flame-retardant epoxy resin obtained by halogenating any of the above epoxy resins, epoxy resin modified with a phosphorus compound, reserve of epoxy resin and polyphenylene ether resin It contains at least one selected from the group consisting of reaction products, preliminary reaction products of epoxy resins and acid anhydrides, and derivatives of these resins.
  • the bisphenol type epoxy resin contains, for example, at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and derivatives of these resins.
  • the novolac type epoxy resin contains, for example, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, and at least one selected from the group consisting of derivatives of these resins.
  • the arylalkylene type epoxy resin is, for example, a biphenyl type epoxy resin, a xylylene type epoxy resin, a phenol aralkyl type epoxy resin, a biphenyl aralkyl type epoxy resin, a biphenyl novolac type epoxy resin, a biphenyl dimethylene type epoxy resin, or a trisphenol methane novolac type epoxy resin. And tetramethylbiphenyl type epoxy resins, and at least one selected from the group consisting of derivatives of these resins.
  • the naphthalene skeleton-modified epoxy resin is, for example, naphthalene-type epoxy resin, naphthalene skeleton-modified cresol novolac-type epoxy resin, naphthalenediol aralkyl-type epoxy resin, naphthol-aralkyl-type epoxy resin, methoxynaphthalene-modified cresol novolac-type epoxy resin, and methoxynaphthalenedimethylene-type epoxy. It contains at least one selected from the group consisting of resins and derivatives of these resins.
  • Phenoxy resin is a resin obtained by linearly polymerizing bisphenol A type epoxy resin.
  • thermosetting resin (A) preferably contains a liquid resin (for example, an epoxy resin that is liquid at room temperature).
  • the epoxy resin (a) preferably contains the epoxy resin (a1) having a softening point of 75 ° C. or lower.
  • the ratio of the epoxy resin (a1) is preferably 30% by mass or more with respect to the epoxy resin (a).
  • the proportion of the epoxy resin (a1) is preferably 30% by mass or more, and more preferably 50% by mass or more.
  • the proportion of the epoxy resin (a1) may be 100% by mass.
  • the softening point of the epoxy resin (a1) is more preferably 70 ° C. or lower, and even more preferably 65 ° C. or lower.
  • the softening point can be measured by the ring-and-ball method using a softening point measuring device in accordance with JISK7231 (general rule of test method for epoxy resin and curing agent).
  • the resin composition preferably further contains a curing agent.
  • the curing agent contains, for example, at least one selected from the group consisting of dicyandiamides, phenol resins, acid anhydrides and cyanate esters.
  • the curing agent preferably contains dicyandiamide. In that case, the resin film 1 tends to have good flexibility.
  • the phenol resin may contain a phosphorus-containing phenol resin. In this case, the flame retardancy of the resin composition can be improved.
  • the resin composition may further contain a catalyst.
  • the catalyst can accelerate the reaction between the thermosetting resin (A) and the curing agent.
  • the catalyst contains, for example, at least one selected from the group consisting of metal salts of organic acids (such as metal soaps), tertiary amines and imidazoles.
  • the metal salt of the organic acid is, for example, at least one selected from the group consisting of metal salts of organic acids such as octanoic acid, stearic acid, acetylacetonate, naphthenic acid, salicylic acid and octylic acid, such as Zn, Cu and Fe. contains.
  • An example of a metal salt of an organic acid is zinc octylate (zinc bis (2-ethylhexanoic acid)).
  • the tertiary amine contains at least one selected from the group consisting of, for example, triethylamine and triethanolamine.
  • the imidazoles contain at least one selected from the group consisting of, for example, 2-ethyl-4-methylimidazole and 4-methylimidazole.
  • the resin composition contains the inorganic filler (B), and the inorganic filler (B) contains the first filler (B1) and a nano-sized particle having a smaller particle size than the first filler (B1).
  • the particle size of the first filler (B1) is the median diameter by the laser diffraction / scattering method, and the particle size of the second filler (B2) is calculated from the BET specific surface area of the second filler (B2). The value.
  • the ratio of the first filler (B1) to the total solid content is 50% by volume or more and 90% by volume or less
  • the ratio of the second filler (B2) is 0.1% by volume or more and 2.0% by volume. It is as follows. Therefore, the resin composition tends to have good moldability. That is, when the ratio of the first filler (B1) is 50% by volume or more, the thermal conductivity and heat resistance of the resin composition can be improved, and when it is 90% by volume or less, the insulating layer is molded. It is possible to prevent defects from occurring. Further, when the ratio of the second filler (B2) is 0.1% by volume or more, appropriate fluidity can be imparted to the resin composition, and when it is 2.0% by volume or less, the insulating layer is molded. It is possible to prevent defects from occurring.
  • the ratio of the first filler (B1) is more preferably 60% by volume or more, and further preferably 65% by volume or more. Further, the ratio of the first filler (B1) is more preferably 87% by volume or less, and further preferably 85% by volume or less.
  • the ratio of the second filler (B2) is more preferably 0.2% by volume or more, and even more preferably 0.3% by volume or more. Further, the ratio of the second filler (B2) is more preferably 1.7% by volume or less, and further preferably 1.5% by volume or less.
  • the ratio of the second filler (B2) to the solid content excluding the inorganic filler (B) is 1.0% by volume or more and 8.0% by volume or less.
  • the gap in the conductor wiring is more likely to be filled with the insulating layer, and the resin composition is less likely to flow out from the insulating layer. That is, when the ratio of the second filler (B2) is 1.0% by volume or more, appropriate fluidity can be imparted to the resin composition, and when it is 8.0% by volume or less, the insulating layer Molding defects can be less likely to occur.
  • the ratio of the second filler (B2) is 1.1% by volume or more, and further preferably 1.2% by volume or more. Further, it is more preferable that the ratio of the second filler (B2) is 7.0% by volume or less, and further preferably 5.0% by volume or less.
  • the first filler (B1) contains, for example, an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2).
  • the anhydrous magnesium carbonate filler (b1) has high heat resistance because it does not have water of crystallization.
  • the alumina filler (b2) has higher heat resistance than the anhydrous magnesium carbonate filler (b1). Therefore, when the first filler (B1) contains the anhydrous magnesium carbonate filler (b1) and the alumina filler (b2), heat resistance can be imparted to the resin composition.
  • the shape of the particles of the anhydrous magnesium carbonate filler (b1) is, for example, a polyhedral shape, but preferably a rounded shape. Since anhydrous magnesium carbonate does not have water of crystallization, it is superior in thermal stability to anhydrous magnesium carbonate dihydrate, trihydrate and pentahydrate. Therefore, when the first filler (B1) contains the anhydrous magnesium carbonate filler (b1), the heat resistance of the resin composition is likely to be improved. In order to further improve the heat resistance of the resin composition, the first filler (B1) does not contain magnesium carbonate hydrate, or the magnesium carbonate hydrate in the first filler (B1). Is preferably only a trace amount of impurities unavoidably mixed.
  • Anhydrous magnesium carbonate filler (b1) has a relatively high thermal conductivity as an inorganic substance. Therefore, the anhydrous magnesium carbonate filler (b1) can improve the thermal conductivity of the resin composition.
  • the anhydrous magnesium carbonate filler (b1) is a crystal having a relatively low Mohs hardness, the drill can be less likely to be worn when the insulating layer made from the resin composition is drilled. That is, the anhydrous magnesium carbonate filler (b1) tends to improve the drilling workability of the insulating layer.
  • the median diameter of the anhydrous magnesium carbonate filler (b1) by the laser diffraction / scattering method is 8 ⁇ m or more and 30 ⁇ m or less.
  • the contact area between the anhydrous magnesium carbonate filler (b1) and the thermosetting resin (A) can be reduced, and the thermal conductivity of the cured product of the resin composition can be less likely to be lowered.
  • the median diameter is 30 ⁇ m or less, it is possible to make it difficult to reduce the electrical insulating property of the cured product of the resin composition.
  • the median diameter of the anhydrous magnesium carbonate filler (b1) is more preferably 8 ⁇ m or more and 25 ⁇ m or less, and further preferably 8 ⁇ m or more and 20 ⁇ m or less.
  • the thermal conductivity and heat resistance of the cured product of the resin composition can be further improved.
  • the shape of the particles of the alumina filler (b2) is rounded.
  • the rounded shape means a shape that does not have a sharply protruding portion.
  • rounded shapes include spherical and spheroidal shapes, but not plate, polyhedral, rectangular parallelepiped, rod, needle, and scaly shapes.
  • the median diameter of the alumina filler (b2) is small. Specifically, the median diameter of the alumina filler (b2) is preferably 0.1 ⁇ m or more and 5 ⁇ m or less. In this case, when the cured product of the resin composition is drilled, the drill is less likely to be worn.
  • the median diameter of the alumina filler (b2) is more preferably 0.1 ⁇ m or more and 4.0 ⁇ m or less, and further preferably 0.1 ⁇ m or more and 3.0 ⁇ m or less.
  • the ratio of the anhydrous magnesium carbonate filler (b1) is preferably 25% by volume or more and 75% by volume or less with respect to the inorganic filler (B).
  • the proportion of the anhydrous magnesium carbonate filler (b1) is less than 35% by volume, the proportion of the alumina filler (b2) is relatively large. Since the alumina filler (b2) has a high hardness, the drilling workability tends to decrease as the proportion of the alumina filler (b2) increases.
  • the proportion of the anhydrous magnesium carbonate filler (b1) exceeds 65% by volume, the proportion of the alumina filler (b2) is relatively small.
  • the proportion of the anhydrous magnesium carbonate filler (b1) is more preferably 30% by volume or more and 70% by volume or less, and further preferably 35% by volume or more and 65% by volume or less.
  • the proportion of the alumina filler (b2) is preferably 25% by volume or more and 75% by volume or less, more preferably 30% by volume or more and 70% by volume or less, and 35% by volume, based on the inorganic filler (B). It is more preferable if it is% or more and 65% by volume or less.
  • the median diameter of the anhydrous magnesium carbonate filler (b1) is larger than the median diameter of the alumina filler (b2).
  • the first filler (B1) is likely to be densely filled in the resin composition and the cured product thereof.
  • the particles of the anhydrous magnesium carbonate filler (b1) and the alumina filler (b2) are close to each other to easily form a heat conduction path, so that the heat conductivity of the resin composition and its cured product is likely to increase.
  • the median diameter of the anhydrous magnesium carbonate filler (b1) is 8 ⁇ m or more and 30 ⁇ m or less
  • the median diameter of the alumina filler (b2) is 5 ⁇ m or less. In this case, the thermal conductivity tends to be further increased.
  • the first filler (B1) may further contain components other than the anhydrous magnesium carbonate filler (b1) and the alumina filler (b2).
  • the first filler (B1) may further contain an inorganic filler (b3) on which a molybdenum compound is supported.
  • the particles of the inorganic filler (b3) have, for example, an inorganic core and a molybdenum compound supported on the core.
  • a part or all of the surface of the core is covered with a molybdenum compound.
  • the inorganic substance in the inorganic filler (b3) is not particularly limited.
  • the inorganic substance contains at least one selected from the group consisting of, for example, carbonates, metal oxides, silicates and metal hydroxides.
  • the carbonate contains, for example, calcium carbonate.
  • the metal oxide contains, for example, zinc oxide.
  • the silicate contains, for example, talc.
  • the metal hydroxide contains, for example, magnesium hydroxide.
  • the molybdenum compound is not particularly limited.
  • Molybdenum compounds include, for example, zinc molybdenum, calcium molybdenum, magnesium molybdenum, molybdenum trioxide, ammonium molybdenum, barium molybdenum, sodium molybdenum, potassium molybdenum, phosphoric acid, ammonium phosphate, sodium phosphate. , Molybdenum silicate, molybdenum boride, molybdenum nikei, molybdenum nitride, molybdenum carbide and the like. From the viewpoint of chemical stability, moisture resistance and insulating property, the molybdenum compound preferably contains at least one selected from the group consisting of zinc molybdate, calcium molybdate and magnesium molybdate.
  • the molybdenum compound is supported on the core of the inorganic material in the inorganic filler (b3), so that the drilling workability of the cured product of the resin composition is further improved. It's easy to do. In particular, if the core of the inorganic filler (b3) is talc, the drilling workability can be further improved.
  • the proportion of the inorganic filler (b3) is preferably 10% by volume or less with respect to the inorganic filler (B).
  • the heat resistance of the inorganic filler (b3) may be lower than that of the anhydrous magnesium carbonate filler (b1) and the alumina filler (b2). Therefore, when the proportion of the inorganic filler (b3) is 10% by volume or less, it is possible to suppress a decrease in heat resistance of the resin composition.
  • the first filler (B1) is preferably surface-treated with a coupling agent.
  • the surface treatment method may be a wet treatment method or a dry treatment method. It is also preferable that at least one of the anhydrous magnesium carbonate filler (b1) and the alumina filler (b2) is surface-treated with a coupling agent.
  • the coupling agent is not particularly limited as long as it has a reactive group that chemically bonds with an inorganic material and a reactive group that chemically bonds with an organic material in one molecule.
  • Specific examples of the reactive group that chemically bonds with the inorganic material include an ethoxy group and a methoxy group.
  • Specific examples of the reactive group that chemically bonds with the organic material include an epoxy group, an amino group, an isocyanate group, a hydroxy group, a phenolic hydroxy group and an acid anhydride group.
  • the coupling agent includes a silane coupling agent.
  • Silane coupling agents include, for example, epoxy silanes, aminosilanes, isocyanate silanes and acid anhydride silanes.
  • Specific examples of the epoxysilane include 3-glycidoxypropyltrimethoxysilane and 3-glycidoxypropyltriethoxysilane.
  • Specific examples of aminosilane include 3-aminopropyltriethoxysilane.
  • isocyanatesilane include 3-isocyanatepropyltriethoxysilane.
  • the particle size of the second filler (B2) is nano-sized as described above, and is smaller than the particle size of the first filler (B1). Therefore, since the second filler (B2) has a larger specific surface area than the first filler (B1), it is possible to impart appropriate fluidity to the resin composition.
  • the particle size of the second filler (B2) is preferably less than 100 nm, more preferably 50 nm or less. In this case, a smaller amount can impart appropriate fluidity to the resin composition.
  • the specific surface area of the second filler (B2) by the BET method is preferably 100 m 2 / g or more and 400 m 2 / g or less.
  • the specific surface area is 100 m 2 / g or more, appropriate fluidity can be imparted to the resin composition, and when it is 400 m 2 / g or less, molding defects of the insulating layer can be less likely to occur.
  • the specific surface area is more preferably 130 m 2 / g or more and 350 m 2 / g or less, and further preferably 150 m 2 / g or more and 300 m 2 / g or less.
  • the second filler (B2) preferably contains at least one of silica and alumina.
  • the silica contains at least one of a dry silica such as fumed silica and a wet silica produced by a wet method such as a sol-gel method, and the alumina contains a dry alumina such as fumed alumina.
  • the second filler (B2) is preferably hydrophobized.
  • the second filler (B2) is preferably treated with at least one surface treatment agent selected from the group consisting of alkylsilanes, silicone oils, epoxysilanes, aminosilanes, isocyanatesilanes and acid anhydride silanes.
  • the second filler (B2) is likely to disperse well in the resin composition even if the particle size is small, and therefore the fluidity of the resin composition is not easily impaired.
  • the resin composition may further contain additives other than the above.
  • Additives include at least one selected from the group consisting of, for example, flame retardants, coupling agents, dispersants and the like.
  • the flame retardant may be an organic flame retardant or an inorganic flame retardant.
  • the organic flame retardant contains at least one selected from the group consisting of, for example, halogen compounds and phosphorus compounds.
  • the phosphorus compound contains at least one selected from, for example, a phosphoric acid ester-based flame retardant, a phosphazene-based flame retardant, a bisdiphenylphosphine oxide-based flame retardant, a phosphine salt-based flame retardant, and the like.
  • the phosphoric acid ester flame retardant contains, for example, a condensed phosphoric acid ester of dixylenyl phosphate.
  • the phosphazene-based flame retardant contains, for example, phenoxyphosphazene.
  • the bisdiphenylphosphine oxide-based flame retardant contains, for example, xylylene bisdiphenylphosphine oxide.
  • the phosphinate-based flame retardant contains, for example, a metal salt of phosphinate, which is an aluminum salt of dialkylphosphinic acid.
  • the inorganic flame retardant contains, for example, a metal hydroxide.
  • the coupling agent is not particularly limited as long as it has a reactive group that chemically bonds with an inorganic material and a reactive group that chemically bonds with an organic material in one molecule.
  • Specific examples of the reactive group that chemically bonds with the inorganic material include an ethoxy group and a methoxy group.
  • Specific examples of the reactive group that chemically bonds with the organic material include an epoxy group, an amino group, an isocyanate group, a hydroxy group, a phenolic hydroxy group and an acid anhydride group.
  • the coupling agent includes a silane coupling agent.
  • Silane coupling agents include, for example, epoxy silanes, aminosilanes, isocyanate silanes and acid anhydride silanes.
  • epoxysilane examples include 3-glycidoxypropyltrimethoxysilane and 3-glycidoxypropyltriethoxysilane.
  • aminosilane examples include 3-aminopropyltriethoxysilane.
  • isocyanatesilane examples include 3-isocyanatepropyltriethoxysilane.
  • the dispersant is a kind of surfactant and is not particularly limited.
  • the resin composition further contains a dispersant, the dispersibility of the first filler (B1) and the second filler (B2) tends to increase.
  • the resin composition can be prepared by mixing the above components.
  • the thermosetting resin (A) is solid at room temperature, it is preferable that the resin composition further contains a solvent.
  • the solvent is not particularly limited as long as it can dissolve at least the thermosetting resin (A), and examples thereof include methyl ethyl ketone.
  • the thermosetting resin (A) is liquid at room temperature, it is not necessary to further add a solvent.
  • the resin film 1 contains a resin composition, a dried product of the resin composition, or a semi-cured product of the resin composition.
  • the resin film 1 is produced, for example, by applying the resin composition to the support film and then heating the resin composition.
  • the resin film 1 is used after being peeled from the support film.
  • the support film is, for example, a polyethylene terephthalate (PET) film.
  • the insulating layer 40 of the metal-clad laminate 4 and the insulating layer 50 of the printed wiring board 5 can be produced.
  • the thickness of the resin film 1 is, for example, 50 ⁇ m or more and 200 ⁇ m or less, but is not limited to this.
  • the resin-attached metal foil 2 includes a resin layer 20 and a metal foil 21 that overlaps the resin layer 20.
  • the resin layer 20 contains a resin composition, a dried product of the resin composition, or a semi-cured product of the resin composition.
  • the resin-attached metal foil 2 is manufactured, for example, by applying the resin composition to the metal foil 21 and then heating the resin composition to prepare the resin layer 20.
  • the insulating layer 40 of the metal-clad laminate 4 and the insulating layer 50 of the printed wiring board 5 can be produced.
  • the prepreg 3 according to the present embodiment includes a base material, a resin composition impregnated in the base material, a dried product of the resin composition, or a semi-cured product of the resin composition.
  • the prepreg 3 is produced, for example, by impregnating a base material 31 with a resin composition and then heating the base material 31.
  • the base material 31 is, for example, a glass cloth.
  • the insulating layer 40 of the metal-clad laminate 4 and the insulating layer 50 of the printed wiring board 5 can be produced.
  • the metal-clad laminate 4 includes an insulating layer 40 and a metal foil 41.
  • the insulating layer 40 contains a cured product of the resin composition.
  • the metal foil 41 is adhered to the insulating layer 40.
  • the metal foil 41 is, for example, a copper foil.
  • the thickness of the metal foil 41 is not particularly limited, but is preferably 12 ⁇ m or more and 420 ⁇ m or less, and more preferably 18 ⁇ m or more and 210 ⁇ m or less.
  • the ten-point average roughness Rzjis of the metal foil 41 is also not particularly limited, but is preferably 3 ⁇ m or more, and more preferably 5 ⁇ m or more. When the ten-point average roughness Rzjis of the metal foil 41 is 3 ⁇ m or more, the adhesion between the insulating layer 40 and the metal foil 41 can be further improved.
  • the metal-clad laminate 4 is manufactured, for example, by heat-breathing a laminate obtained by laminating one prepreg 3 or two or more prepregs 3 and laminating a metal foil 41 on one side or both sides. Can be done.
  • the surface of the metal foil 41 (at least the surface overlapping the prepreg 3) is treated with a coupling agent before overlaying the metal foil 41 on the prepreg 3.
  • the coupling agent further improves the adhesion between the insulating layer 40 and the metal foil 41 by binding the organic material in the prepreg 3 and the metal foil 41. Can be improved.
  • the coupling agent the above-mentioned ones can be used.
  • FIG. 4 shows a metal-clad laminate 4 having two base materials 31 in the insulating layer 40.
  • the resin composition since the resin composition has an appropriate fluidity, the resin composition, the dried product of the resin composition, or the resin composition is obtained from the prepreg prepared from the resin composition when the laminate is hot-pressed. Semi-cured material does not easily flow out. Therefore, molding defects are unlikely to occur.
  • the printed wiring board 5 includes an insulating layer 50 and a conductor layer 51.
  • the insulating layer 50 contains a cured product of the resin composition.
  • the conductor layer 51 is adhered to the insulating layer 50.
  • the conductor layer 51 refers to a conductive layer such as a signal layer, a power supply layer, and a ground layer.
  • the conductor layer 51 may be a conductor wiring or a metal foil having no pattern.
  • the printed wiring board 5 is a concept including a multilayer printed wiring board including three or more conductor layers 51.
  • FIG. 5B shows a multilayer printed wiring board 5 including three conductor layers 51.
  • the printed wiring board 5 can be manufactured, for example, by using the above-mentioned metal-clad laminate 4 as a material and using the subtractive method.
  • the printed wiring board 5 may be multi-layered using the build-up method.
  • the printed wiring board 5 shown in FIG. 5A can be manufactured by producing the conductor wiring as the conductor layer 51 from the metal foil 41 of the metal-clad laminate 4 by a subtractive method or the like.
  • a via may be produced by drilling the metal-clad laminate 4 to produce a hole and plating the inner surface of the hole at the time of producing the conductor wiring. That is, the printed wiring board 5 having vias may be manufactured. In this case, in this embodiment, the drill is less likely to wear.
  • the printed wiring board 5 can also be manufactured as follows.
  • the core material 6 is produced by producing the conductor wiring as the conductor layer 51 from the metal foil 41 of the metal-clad laminate 4 by a subtractive method or the like. That is, the printed wiring board 5 shown in FIG. 5A is used as the core material 6.
  • the core material 6 and the resin-attached metal foil 2 are laminated so that the resin layer 20 of the resin-attached metal foil 2 overlaps one conductor wiring of the core material 6. In this state, the core material 6 and the resin-attached metal foil 2 are hot-pressed.
  • the resin composition since the resin composition has an appropriate fluidity, the resin composition, the dried product of the resin composition, or the semi-cured resin composition is semi-cured from the resin layer 20 produced from the resin composition. Things are hard to flow out. Further, the resin layer 20 easily flows into the gap of the conductor wiring. The insulating layer 22 is produced by curing the resin layer 20, and at this time, the insulating layer 22 is likely to be sufficiently filled in the gaps between the conductor wirings. Subsequently, the conductor wiring which is the conductor layer 51 can be produced from the metal foil 21 derived from the resin-attached metal foil 2 by a subtractive method or the like. As a result, as shown in FIG. 5B, a multi-layer printed wiring board 5 can be manufactured.
  • the multilayer printed wiring board 5 includes an insulating layer 40 derived from the core material 6 and an insulating layer 22 made of the resin layer 20 of the resin-attached metal foil 2 as the insulating layer 50. Further, by using the multilayer printed wiring board 5 as a core material and using the metal foil 2 with resin in the same manner as described above, it is possible to further manufacture the multilayer printed wiring board 5. Vias can also be produced by drilling the printed wiring board 5 to form holes and plating the inner surface of the holes. In this case, the drill is less likely to wear in this embodiment.
  • the printed wiring board 5 can also be manufactured as follows.
  • the core material 6, the resin film 1, and the metal foil are laminated so that the resin film 1 overlaps the conductor wiring of the core material 6 and the metal foil overlaps the resin film 1.
  • the core material 6, the resin film 1, and the metal foil are hot-pressed.
  • the resin composition since the resin composition has an appropriate fluidity, the resin composition, the dried product of the resin composition, or the semi-cured resin composition is semi-cured from the resin film 1 produced from the resin composition. Things are hard to flow out. Further, the resin film 1 easily flows into the gap of the conductor wiring.
  • the resin film 1 is cured to form an insulating layer, and at this time, the insulating layer is likely to be sufficiently filled in the gaps between the conductor wirings.
  • a conductor wiring can be manufactured from the metal foil by a subtractive method or the like.
  • a multi-layer printed wiring board 5 can be manufactured.
  • Vias can also be produced by drilling the printed wiring board 5 to form holes and plating the inner surface of the holes. In this case, the drill is less likely to wear in this embodiment.
  • the core material 6 is produced from the metal-clad laminate 4 provided with the insulating layer 40 produced from the resin composition according to the present embodiment, and the printed wiring board 5 is manufactured from the core material 6.
  • the core material 6 is not limited to the above, that is, the insulating layer 40 in the core material 6 does not have to be made from the resin composition according to the present embodiment.
  • -Phenoxy resin manufactured by Nippon Steel Chemical & Materials Co., Ltd.
  • -Polyphenylene ether resin Made by SABIC Japan.
  • -Phenol resin 1 Phosphorus-containing phenol resin. Made by Dow Chemical Company.
  • -Phenol resin 2 Made by Meiwa Kasei Co., Ltd.
  • -Curing agent dicyandiamide.
  • -Catalyst 2-ethyl-4-methylimidazole.
  • -Flame retardant Made by Daihachi Chemical Industry Co., Ltd. Phosphate ester.
  • Specific gravity 1.26. -Coupling agent Made by Shin-Etsu Chemical Co., Ltd. Silane coupling agent. Product name KBE-403. Specific gravity 1.00. -Dispersant: Made by Big Chemie Japan Co., Ltd. Wet dispersant. Product name BYK-W903. Specific gravity 1.00. -Leveling agent: Made by DIC Corporation. Product name F-556. Specific gravity 1.00. -Anhydrous magnesium carbonate filler: manufactured by Konoshima Chemical Co., Ltd. Synthetic magnesite. Product name MS-PS. Median diameter 12 ⁇ m. Specific gravity 3.04. -Alumina filler: Made by Admatex Co., Ltd. Spherical alumina. Product name AO-502. Median diameter 0.25 ⁇ m.
  • Specific gravity 3.96. -Talc Made by Huber. Calcium carbonate on which calcium molybdate is supported. Product name KG-501. Median diameter 4.5 ⁇ m. Specific gravity 3.00. -Dry silica 1: Made by Evonik. Fused silica. Product name Aerosil R972. BET specific surface area 110 m 2 / g. Specific gravity 2.20. -Dry silica 2: Made by Evonik. Fused silica. Product name Aerosil R974. BET specific surface area 170 m 2 / g. Specific gravity 2.20. -Dry silica 3: Made by Evonik. Fused silica. Product name Aerosil R976S.
  • BET specific surface area 240 m 2 / g. Specific gravity 2.20. -Dry silica 4 Made by Evonik. Fused silica. Product name Aerosil RX200R. BET specific surface area 140 m 2 / g. Specific gravity 2.20. -Dry silica 5: Made by Evonik Industries. Fused silica. Product name Aerosil RX300. BET specific surface area 210 m 2 / g. Specific gravity 2.20. -Dry silica 6: Made by Evonik. Fused silica. Product name Aerosil R805. BET specific surface area 150 m 2 / g. Specific gravity 2.20. -Dry alumina: Made by Evonik. Fumed alumina.
  • Each of the dry silica, the dry alumina, and the wet silica is surface-treated with at least one surface treatment agent selected from alkylsilane, silicone oil, and epoxysilane.
  • a surface treatment method in the case of dry fillers (dry silica and dry alumina), a method of hydrophobizing in a fluidized bed using organohalogensilane or a method of hydrophobizing organopolysiloxane using an alkaline catalyst is performed.
  • wet silica a mixture containing a silylating agent, a hydrophobic organic solvent, alcohol and water is added to hydrophilic colloidal silica, and the alkali is removed or neutralized with an equivalent amount or more of acid.
  • a method of hydrophobizing is performed by aging at 0 ° C. or higher and 100 ° C. or lower.
  • composition After mixing the above raw materials with the compositions shown in Tables 1 to 3, add methyl ethyl ketone and dimethylformamide to a solid content concentration of 80 to 95% by mass, and stir with a planetary mixer. To prepare the composition.
  • the mold-released polyethylene terephthalate films had their mold-released surfaces facing each other, and two stacked samples were placed between them.
  • the sample was hot-pressed together with the polyethylene terephthalate film at 130 ° C. for 5 minutes under the condition of 0.5 MPa (condition 1) to prepare a cured product from the sample.
  • a double-sided copper-clad laminate (manufactured by Panasonic Corporation, product number R-1566, copper foil 35 ⁇ m) was prepared.
  • the copper foil of this double-sided copper-clad laminate was etched to produce a grid-like conductor wiring, and a printed wiring board for testing was obtained.
  • a resin film was laminated on each of the two conductor wirings in the printed wiring board , and heat-pressed at 200 ° C., 2.94 MPa (30 kgf / cm 2 ) for 60 minutes to prepare a laminated body. The same test was performed for each of the cases where the residual copper ratio of the conductor wiring was 20%, 50% and 80%.
  • the thermal diffusivity ⁇ of the resin plate obtained by removing the copper foil of the copper-clad laminate by etching was evaluated by the laser flash method, the specific heat Cp by the DSC method, and the specific gravity ⁇ by the underwater substitution method. From these results, the thermal conductivity ⁇ was calculated by the following formula.

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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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PCT/JP2020/039516 2019-10-25 2020-10-21 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板 Ceased WO2021079900A1 (ja)

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DE112020005161.7T DE112020005161T5 (de) 2019-10-25 2020-10-21 Harzzusammensetzung, harzfilm, metallfolie mit harz, prepreg, metallplattiertes laminat und leiterplatte
ATA9323/2020A AT524642A3 (de) 2019-10-25 2020-10-21 Harzzusammensetzung, Harzfilm, Metallfolie mit Harz, Prepreg, metallplattiertes Laminat und Leiterplatte
US17/771,079 US11814502B2 (en) 2019-10-25 2020-10-21 Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board
CN202080071396.2A CN114555703B (zh) 2019-10-25 2020-10-21 树脂组合物、树脂膜、具有树脂的金属箔、预浸料、覆金属层压体和印刷线路板

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WO2024062923A1 (ja) * 2022-09-21 2024-03-28 東レ株式会社 フィルム、積層体、プラズマ処理装置、及び積層体の製造方法
JP2024521797A (ja) * 2021-05-28 2024-06-04 エルジー エナジー ソリューション リミテッド 電気化学素子用セパレーター及びこれを備えた電気化学素子

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CN121574499A (zh) * 2026-01-23 2026-02-27 湖北珍正峰新材料有限公司 一种耐温型多官能团环氧树脂及其制备方法

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AT524642A3 (de) 2025-05-15
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