DE112011102726B4 - Leuchtdioden-Baugruppe und thermische Sicherungsdecke - Google Patents

Leuchtdioden-Baugruppe und thermische Sicherungsdecke Download PDF

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Publication number
DE112011102726B4
DE112011102726B4 DE112011102726.5T DE112011102726T DE112011102726B4 DE 112011102726 B4 DE112011102726 B4 DE 112011102726B4 DE 112011102726 T DE112011102726 T DE 112011102726T DE 112011102726 B4 DE112011102726 B4 DE 112011102726B4
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Germany
Prior art keywords
polyimide
polyimide layer
weight
bis
filled
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Expired - Fee Related
Application number
DE112011102726.5T
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German (de)
English (en)
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DE112011102726T5 (de
Inventor
Christopher Dennis Simone
Thomas Edward Carney
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DuPont Electronics Inc
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EI Du Pont de Nemours and Co
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Publication of DE112011102726T5 publication Critical patent/DE112011102726T5/de
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00—Cosmonautic vehicles
    • B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
    • B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Environmental Sciences (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
DE112011102726.5T 2010-08-18 2011-06-01 Leuchtdioden-Baugruppe und thermische Sicherungsdecke Expired - Fee Related DE112011102726B4 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US37487810P 2010-08-18 2010-08-18
US37486110P 2010-08-18 2010-08-18
US37484410P 2010-08-18 2010-08-18
US61/374,861 2010-08-18
US61/374,844 2010-08-18
US61/374,878 2010-08-18
US37846210P 2010-08-31 2010-08-31
US61/378,462 2010-08-31
PCT/US2011/038657 WO2012024009A1 (en) 2010-08-18 2011-06-01 Light emitting diode assembly and thermal control blanket and methods relating thereto

Publications (2)

Publication Number Publication Date
DE112011102726T5 DE112011102726T5 (de) 2013-10-10
DE112011102726B4 true DE112011102726B4 (de) 2022-02-03

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Family Applications (1)

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DE112011102726.5T Expired - Fee Related DE112011102726B4 (de) 2010-08-18 2011-06-01 Leuchtdioden-Baugruppe und thermische Sicherungsdecke

Country Status (7)

Country Link
US (1) US8969909B2 (enExample)
JP (1) JP2013541181A (enExample)
KR (1) KR20130101511A (enExample)
CN (1) CN103081145B (enExample)
DE (1) DE112011102726B4 (enExample)
TW (1) TW201208879A (enExample)
WO (1) WO2012024009A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9062198B2 (en) * 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
CN103031075B (zh) * 2011-09-30 2014-07-30 达迈科技股份有限公司 聚合物膜及其在发光装置中的应用
US20150147567A1 (en) * 2012-06-22 2015-05-28 E. I. Du Pont De Nemours And Company Polyimide metal clad laminate
WO2013192466A1 (en) * 2012-06-22 2013-12-27 E. I. Du Pont De Nemours And Company Polyimide metal clad laminate
JP5841570B2 (ja) * 2012-10-19 2016-01-13 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板
KR101602686B1 (ko) * 2013-10-22 2016-03-11 코오롱인더스트리 주식회사 폴리아믹산, 폴리이미드 및 표시소자
EP2876129B1 (en) * 2013-11-25 2021-05-12 Samsung Electronics Co., Ltd. Composition for preparing polyimide, polyimide, and article including same
KR102276288B1 (ko) * 2013-11-25 2021-07-12 삼성전자주식회사 폴리이미드 제조용 조성물, 폴리이미드, 상기 폴리이미드를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치
US20150361264A1 (en) * 2014-06-12 2015-12-17 E I Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
KR102225509B1 (ko) * 2014-07-24 2021-03-08 삼성전자주식회사 폴리이미드-무기입자 복합체 제조용 조성물, 폴리이미드-무기입자 복합체, 및 상기 복합체를 포함하는 성형품
EP3002310B1 (en) * 2014-10-02 2020-11-25 Samsung Electronics Co., Ltd. Composition for preparing polyimide-inorganic particle composite, polyimide-inorganic particle composite, article, and optical device
CN107428934B (zh) * 2015-03-31 2020-10-02 旭化成株式会社 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体
KR102302417B1 (ko) * 2016-08-31 2021-09-15 가부시키가이샤 가네카 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드 막, 적층체 및 플렉시블 디바이스, 그리고 폴리이미드 막의 제조 방법
US11225191B2 (en) 2017-06-28 2022-01-18 Honda Motor Co., Ltd. Smart leather with wireless power
US11665830B2 (en) 2017-06-28 2023-05-30 Honda Motor Co., Ltd. Method of making smart functional leather
US10682952B2 (en) 2017-06-28 2020-06-16 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US11751337B2 (en) 2019-04-26 2023-09-05 Honda Motor Co., Ltd. Wireless power of in-mold electronics and the application within a vehicle

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199650A (en) 1978-11-07 1980-04-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modification of the electrical and optical properties of polymers
WO2002097829A1 (en) 2001-05-14 2002-12-05 The Boeing Company Charge-dissipating, white thermal control film, and structures utilizing the thermal control film
EP1749850A1 (en) 2005-08-03 2007-02-07 E.I. Dupont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions related thereto
DE102006005042A1 (de) 2006-02-03 2007-08-09 Tridonic Optoelectronics Gmbh Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff
US7270891B2 (en) 2004-11-17 2007-09-18 Northrop Grumman Corporation Mixed germanium-silicon thermal control blanket
DE112006001634T5 (de) 2005-06-27 2008-04-30 Cree, Inc. Oberflächenmontierbare elektrische Lichtemissionsvorrichtung mit einem Kühlkörper
US7431479B2 (en) 2004-07-15 2008-10-07 Lumination Llc LED lighting system with reflective board
US20090227050A1 (en) 2006-04-21 2009-09-10 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285941A (ja) 1985-10-11 1987-04-20 ニツカン工業株式会社 カバ−レイフイルム
JPS63243145A (ja) 1987-03-30 1988-10-11 Asahi Chem Ind Co Ltd パラ配向型ポリアミド着色フイルムの製造法
US5428102A (en) 1987-07-15 1995-06-27 The United States Of America As Represented By The United States National Aeronautics And Space Administration Low dielectric polyimides
JPH03158456A (ja) * 1989-11-14 1991-07-08 Mitsui Toatsu Chem Inc 積層体
US5215824A (en) 1990-12-05 1993-06-01 General Electric Co. RF-transparent spacecraft thermal control barrier
US5302652A (en) 1992-12-15 1994-04-12 E. I. Du Pont De Nemours And Company Process for preparing a pigmented polyimide shaped article
JPH06350210A (ja) 1993-06-07 1994-12-22 Asahi Chem Ind Co Ltd フレキシブルプリント配線基板
GB2283242B (en) 1993-10-28 1998-01-14 Kobe Steel Europ Ltd Polyimides
DE69527148T2 (de) 1994-08-19 2003-02-20 Asahi Kasei Kabushiki Kaisha, Osaka Aromatische polyamidfolie, verfahren zu ihrer herstellung und daraus hergestellte magnetische aufzeichnungsmittel und solarzelle
US6329605B1 (en) 1998-03-26 2001-12-11 Tessera, Inc. Components with conductive solder mask layers
JP2000143984A (ja) 1998-11-05 2000-05-26 Showa Denko Kk フッ素化ポリイミド樹脂組成物及びその製造方法
JP2000226517A (ja) 1999-02-08 2000-08-15 Unitika Ltd 黒色ペースト及びそれから得られる遮光性皮膜
US6492031B1 (en) 1999-03-12 2002-12-10 Dupont-Toray Co. Ltd. Reflector substrate for illumination device and reflector for illumination device
DE19943909A1 (de) 1999-09-14 2001-03-15 Wolff Walsrode Ag Mehrschichtig coextrudierte biaxial gereckte Hochbarriere-Kunststoffhülle mit verminderter Haftung zum Füllgut sowie deren Verwendung als Nahrungsmittelhülle
TW465123B (en) 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
US6279857B1 (en) 2000-04-25 2001-08-28 Trw Inc. Silicon thermal control blanket
US6395625B1 (en) 2001-10-12 2002-05-28 S & S Technology Corporation Method for manufacturing solder mask of printed circuit board
US6623826B2 (en) 2001-10-29 2003-09-23 Space Systems/Loral Passive intermodulation free multilayer thermal blanket
JP4117130B2 (ja) 2001-12-26 2008-07-16 大塚化学ホールディングス株式会社 紫外線発生源用反射板材料
JP2006506278A (ja) 2002-09-03 2006-02-23 エンテグリス・インコーポレーテッド 電子機器処理アプリケーションで使用するための高温高強度着色可能材料
US7709568B2 (en) 2002-10-15 2010-05-04 Solvay Advanced Polymers, Llc Anti-yellowing polycondensation polymer compositions and articles
US6730940B1 (en) * 2002-10-29 2004-05-04 Lumileds Lighting U.S., Llc Enhanced brightness light emitting device spot emitter
KR100994399B1 (ko) 2002-10-31 2010-11-16 도레이 카부시키가이샤 폴리아미드 및 폴리아미드 필름
EP1455398A3 (en) * 2003-03-03 2011-05-25 Toyoda Gosei Co., Ltd. Light emitting device comprising a phosphor layer and method of making same
US7208206B2 (en) 2003-03-10 2007-04-24 Nitto Denko Corporation Glass crack prevention laminate and liquid crystal display device
JP2005129184A (ja) 2003-10-27 2005-05-19 Fuji Photo Film Co Ltd 磁気記録媒体
ATE397531T1 (de) * 2004-03-04 2008-06-15 Evonik Degussa Gmbh Durch farbmittel transparent, transluzent oder gedeckt eingefärbte laserschweissbare kunststoffmaterialien
JP2006018191A (ja) 2004-07-05 2006-01-19 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物の製造方法並びに半導体装置及び表示素子
CN101005948B (zh) * 2004-08-23 2012-03-21 三菱瓦斯化学株式会社 覆金属箔白色层压体
JP2006093438A (ja) 2004-09-24 2006-04-06 Denso Corp プリント基板及びその製造方法
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
DE102005013957A1 (de) * 2005-03-26 2006-09-28 Clariant Produkte (Deutschland) Gmbh Phosphorhaltige thermostabilisierte Flammschutzmittelagglomerate
US20090226642A1 (en) 2005-08-03 2009-09-10 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
KR100769718B1 (ko) * 2005-11-29 2007-10-24 삼성전기주식회사 발광소자용 반사부재 및 이를 사용한 발광다이오드 패키지
EP1813424A1 (en) 2006-01-30 2007-08-01 A. Schulman Plastics Filler composition for use in a multi-layered tubular food casing
US20070232734A1 (en) 2006-03-31 2007-10-04 Karthikeyan Kanakarajan Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto
US20080144322A1 (en) 2006-12-15 2008-06-19 Aizar Abdul Karim Norfidathul LED Light Source Having Flexible Reflectors
JP2008169237A (ja) * 2007-01-09 2008-07-24 Toyobo Co Ltd 白色ポリイミドフィルム
JP2008168439A (ja) 2007-01-09 2008-07-24 Toyobo Co Ltd 金属白色ポリイミド積層体とその製造方法
EP2170982A1 (en) 2007-07-23 2010-04-07 DSM IP Assets B.V. Plastic component for a lighting systems
TWI349013B (en) 2007-10-03 2011-09-21 Univ Nat Taiwan Polyimide-titania hybrid materials and method of preparing thin films
US8168744B2 (en) 2008-02-19 2012-05-01 E. I. Du Pont De Nemours And Company Polyimide film for molding, its manufacturing method and molding product
DE112009001229B4 (de) 2008-05-20 2015-10-29 E.I. Du Pont De Nemours And Co. Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen
KR101293346B1 (ko) * 2008-09-26 2013-08-06 코오롱인더스트리 주식회사 폴리이미드 필름
KR101292886B1 (ko) * 2009-09-29 2013-08-02 코오롱인더스트리 주식회사 내용제성이 개선된 무색투명한 폴리이미드 필름

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199650A (en) 1978-11-07 1980-04-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modification of the electrical and optical properties of polymers
WO2002097829A1 (en) 2001-05-14 2002-12-05 The Boeing Company Charge-dissipating, white thermal control film, and structures utilizing the thermal control film
US7431479B2 (en) 2004-07-15 2008-10-07 Lumination Llc LED lighting system with reflective board
US7270891B2 (en) 2004-11-17 2007-09-18 Northrop Grumman Corporation Mixed germanium-silicon thermal control blanket
DE112006001634T5 (de) 2005-06-27 2008-04-30 Cree, Inc. Oberflächenmontierbare elektrische Lichtemissionsvorrichtung mit einem Kühlkörper
EP1749850A1 (en) 2005-08-03 2007-02-07 E.I. Dupont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions related thereto
DE102006005042A1 (de) 2006-02-03 2007-08-09 Tridonic Optoelectronics Gmbh Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff
US20090227050A1 (en) 2006-04-21 2009-09-10 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof

Also Published As

Publication number Publication date
TW201208879A (en) 2012-03-01
US8969909B2 (en) 2015-03-03
KR20130101511A (ko) 2013-09-13
DE112011102726T5 (de) 2013-10-10
WO2012024009A1 (en) 2012-02-23
US20130126940A1 (en) 2013-05-23
CN103081145A (zh) 2013-05-01
CN103081145B (zh) 2016-11-16
JP2013541181A (ja) 2013-11-07

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