TW201208879A - Light emitting diode assembly and thermal control blanket and methods relating thereto - Google Patents
Light emitting diode assembly and thermal control blanket and methods relating thereto Download PDFInfo
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- TW201208879A TW201208879A TW100119167A TW100119167A TW201208879A TW 201208879 A TW201208879 A TW 201208879A TW 100119167 A TW100119167 A TW 100119167A TW 100119167 A TW100119167 A TW 100119167A TW 201208879 A TW201208879 A TW 201208879A
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Classifications
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- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Environmental Sciences (AREA)
- Remote Sensing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Biodiversity & Conservation Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37487810P | 2010-08-18 | 2010-08-18 | |
| US37486110P | 2010-08-18 | 2010-08-18 | |
| US37484410P | 2010-08-18 | 2010-08-18 | |
| US37846210P | 2010-08-31 | 2010-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201208879A true TW201208879A (en) | 2012-03-01 |
Family
ID=44454096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100119167A TW201208879A (en) | 2010-08-18 | 2011-06-01 | Light emitting diode assembly and thermal control blanket and methods relating thereto |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8969909B2 (enExample) |
| JP (1) | JP2013541181A (enExample) |
| KR (1) | KR20130101511A (enExample) |
| CN (1) | CN103081145B (enExample) |
| DE (1) | DE112011102726B4 (enExample) |
| TW (1) | TW201208879A (enExample) |
| WO (1) | WO2012024009A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI490286B (zh) * | 2012-10-19 | 2015-07-01 | Taiyo Ink Mfg Co Ltd | A hardened resin composition, a hardened resin composition for forming a solder resist, a hardened coating film, and a printed wiring board |
| TWI553913B (zh) * | 2011-04-14 | 2016-10-11 | 堤康那責任有限公司 | 用於發光二極體組件之含白色顏料的反射器 |
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| CN103031075B (zh) * | 2011-09-30 | 2014-07-30 | 达迈科技股份有限公司 | 聚合物膜及其在发光装置中的应用 |
| US20150147567A1 (en) * | 2012-06-22 | 2015-05-28 | E. I. Du Pont De Nemours And Company | Polyimide metal clad laminate |
| WO2013192466A1 (en) * | 2012-06-22 | 2013-12-27 | E. I. Du Pont De Nemours And Company | Polyimide metal clad laminate |
| KR101602686B1 (ko) * | 2013-10-22 | 2016-03-11 | 코오롱인더스트리 주식회사 | 폴리아믹산, 폴리이미드 및 표시소자 |
| EP2876129B1 (en) * | 2013-11-25 | 2021-05-12 | Samsung Electronics Co., Ltd. | Composition for preparing polyimide, polyimide, and article including same |
| KR102276288B1 (ko) * | 2013-11-25 | 2021-07-12 | 삼성전자주식회사 | 폴리이미드 제조용 조성물, 폴리이미드, 상기 폴리이미드를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치 |
| US20150361264A1 (en) * | 2014-06-12 | 2015-12-17 | E I Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
| KR102225509B1 (ko) * | 2014-07-24 | 2021-03-08 | 삼성전자주식회사 | 폴리이미드-무기입자 복합체 제조용 조성물, 폴리이미드-무기입자 복합체, 및 상기 복합체를 포함하는 성형품 |
| EP3002310B1 (en) * | 2014-10-02 | 2020-11-25 | Samsung Electronics Co., Ltd. | Composition for preparing polyimide-inorganic particle composite, polyimide-inorganic particle composite, article, and optical device |
| CN107428934B (zh) * | 2015-03-31 | 2020-10-02 | 旭化成株式会社 | 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体 |
| KR102302417B1 (ko) * | 2016-08-31 | 2021-09-15 | 가부시키가이샤 가네카 | 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드 막, 적층체 및 플렉시블 디바이스, 그리고 폴리이미드 막의 제조 방법 |
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| US11665830B2 (en) | 2017-06-28 | 2023-05-30 | Honda Motor Co., Ltd. | Method of making smart functional leather |
| US10682952B2 (en) | 2017-06-28 | 2020-06-16 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
| US11751337B2 (en) | 2019-04-26 | 2023-09-05 | Honda Motor Co., Ltd. | Wireless power of in-mold electronics and the application within a vehicle |
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2011
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- 2011-06-01 US US13/814,755 patent/US8969909B2/en active Active
- 2011-06-01 TW TW100119167A patent/TW201208879A/zh unknown
- 2011-06-01 CN CN201180039744.9A patent/CN103081145B/zh not_active Expired - Fee Related
- 2011-06-01 WO PCT/US2011/038657 patent/WO2012024009A1/en not_active Ceased
- 2011-06-01 DE DE112011102726.5T patent/DE112011102726B4/de not_active Expired - Fee Related
- 2011-06-01 KR KR20137006652A patent/KR20130101511A/ko not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI553913B (zh) * | 2011-04-14 | 2016-10-11 | 堤康那責任有限公司 | 用於發光二極體組件之含白色顏料的反射器 |
| TWI490286B (zh) * | 2012-10-19 | 2015-07-01 | Taiyo Ink Mfg Co Ltd | A hardened resin composition, a hardened resin composition for forming a solder resist, a hardened coating film, and a printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| US8969909B2 (en) | 2015-03-03 |
| KR20130101511A (ko) | 2013-09-13 |
| DE112011102726T5 (de) | 2013-10-10 |
| WO2012024009A1 (en) | 2012-02-23 |
| US20130126940A1 (en) | 2013-05-23 |
| CN103081145A (zh) | 2013-05-01 |
| DE112011102726B4 (de) | 2022-02-03 |
| CN103081145B (zh) | 2016-11-16 |
| JP2013541181A (ja) | 2013-11-07 |
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