KR20130101511A - 발광 다이오드 조립체 및 열 제어 블랭킷 및 이에 관련된 방법 - Google Patents
발광 다이오드 조립체 및 열 제어 블랭킷 및 이에 관련된 방법 Download PDFInfo
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- KR20130101511A KR20130101511A KR20137006652A KR20137006652A KR20130101511A KR 20130101511 A KR20130101511 A KR 20130101511A KR 20137006652 A KR20137006652 A KR 20137006652A KR 20137006652 A KR20137006652 A KR 20137006652A KR 20130101511 A KR20130101511 A KR 20130101511A
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- KR
- South Korea
- Prior art keywords
- polyimide
- dianhydride
- bis
- weight
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 27
- 229920001721 polyimide Polymers 0.000 claims description 488
- 239000004642 Polyimide Substances 0.000 claims description 480
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 101
- 229910000679 solder Inorganic materials 0.000 claims description 82
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 73
- 239000000945 filler Substances 0.000 claims description 73
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 68
- 239000012463 white pigment Substances 0.000 claims description 67
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 51
- 150000004985 diamines Chemical class 0.000 claims description 47
- 239000002245 particle Substances 0.000 claims description 40
- 239000004408 titanium dioxide Substances 0.000 claims description 36
- 239000000203 mixture Substances 0.000 claims description 34
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- 229920000647 polyepoxide Polymers 0.000 claims description 33
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- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000008393 encapsulating agent Substances 0.000 claims description 19
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 18
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- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 claims description 14
- DNEHKUCSURWDGO-UHFFFAOYSA-N aluminum sodium Chemical compound [Na].[Al] DNEHKUCSURWDGO-UHFFFAOYSA-N 0.000 claims description 13
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- 239000002478 γ-tocopherol Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 241000396922 Pontia daplidice Species 0.000 claims description 9
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 8
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 8
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 claims description 8
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- 125000005641 methacryl group Chemical group 0.000 claims description 8
- JGGQWILNAAODRS-UHFFFAOYSA-N n-methyl-4-[4-(methylamino)phenyl]aniline Chemical compound C1=CC(NC)=CC=C1C1=CC=C(NC)C=C1 JGGQWILNAAODRS-UHFFFAOYSA-N 0.000 claims description 8
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 claims description 7
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 claims description 7
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 claims description 7
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 7
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- OAXARSVKYJPDPA-UHFFFAOYSA-N tert-butyl 4-prop-2-ynylpiperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(CC#C)CC1 OAXARSVKYJPDPA-UHFFFAOYSA-N 0.000 claims description 7
- 125000001834 xanthenyl group Chemical class C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 5
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- 239000010439 graphite Substances 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 239000002923 metal particle Substances 0.000 claims description 5
- IEEZJIBNKVIUBD-UHFFFAOYSA-N 1-phenyl-3-(trifluoromethyl)benzene Chemical group FC(F)(F)C1=CC=CC(C=2C=CC=CC=2)=C1 IEEZJIBNKVIUBD-UHFFFAOYSA-N 0.000 claims description 4
- FXGQUGCFZKMIJW-UHFFFAOYSA-N 2,4,5,6-tetrafluorobenzene-1,3-diamine Chemical compound NC1=C(F)C(N)=C(F)C(F)=C1F FXGQUGCFZKMIJW-UHFFFAOYSA-N 0.000 claims description 4
- ZQQOGBKIFPCFMJ-UHFFFAOYSA-N 2-(trifluoromethyl)benzene-1,4-diamine Chemical compound NC1=CC=C(N)C(C(F)(F)F)=C1 ZQQOGBKIFPCFMJ-UHFFFAOYSA-N 0.000 claims description 4
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 4
- UVUCUHVQYAPMEU-UHFFFAOYSA-N 3-[2-(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC(C(C=2C=C(N)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 UVUCUHVQYAPMEU-UHFFFAOYSA-N 0.000 claims description 4
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 claims description 4
- GYSKATZDEIJVEB-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(trifluoromethoxy)aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1OC(F)(F)F GYSKATZDEIJVEB-UHFFFAOYSA-N 0.000 claims description 4
- PJWQLRKRVISYPL-UHFFFAOYSA-N 4-[4-amino-3-(trifluoromethyl)phenyl]-2-(trifluoromethyl)aniline Chemical compound C1=C(C(F)(F)F)C(N)=CC=C1C1=CC=C(N)C(C(F)(F)F)=C1 PJWQLRKRVISYPL-UHFFFAOYSA-N 0.000 claims description 4
- 229920006332 epoxy adhesive Polymers 0.000 claims description 4
- KZSXRDLXTFEHJM-UHFFFAOYSA-N 5-(trifluoromethyl)benzene-1,3-diamine Chemical compound NC1=CC(N)=CC(C(F)(F)F)=C1 KZSXRDLXTFEHJM-UHFFFAOYSA-N 0.000 claims description 3
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 claims description 3
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- 230000000712 assembly Effects 0.000 abstract description 3
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- 239000010410 layer Substances 0.000 description 208
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- 229920005575 poly(amic acid) Polymers 0.000 description 29
- 230000008901 benefit Effects 0.000 description 25
- 239000002002 slurry Substances 0.000 description 22
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- 230000008859 change Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 description 17
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 16
- 239000005020 polyethylene terephthalate Substances 0.000 description 16
- -1 polyethylene terephthalates Polymers 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 14
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
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- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
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- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 5
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
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Images
Classifications
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/31721—Of polyimide
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- Environmental & Geological Engineering (AREA)
- Biodiversity & Conservation Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
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| PCT/US2011/038657 WO2012024009A1 (en) | 2010-08-18 | 2011-06-01 | Light emitting diode assembly and thermal control blanket and methods relating thereto |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20150046463A (ko) * | 2013-10-22 | 2015-04-30 | 코오롱인더스트리 주식회사 | 폴리아믹산, 폴리이미드 및 표시소자 |
| KR20160012554A (ko) * | 2014-07-24 | 2016-02-03 | 삼성전자주식회사 | 폴리이미드-무기입자 복합체 제조용 조성물, 폴리이미드-무기입자 복합체, 및 상기 복합체를 포함하는 성형품 |
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| US9062198B2 (en) * | 2011-04-14 | 2015-06-23 | Ticona Llc | Reflectors for light-emitting diode assemblies containing a white pigment |
| CN103031075B (zh) * | 2011-09-30 | 2014-07-30 | 达迈科技股份有限公司 | 聚合物膜及其在发光装置中的应用 |
| US20150147567A1 (en) * | 2012-06-22 | 2015-05-28 | E. I. Du Pont De Nemours And Company | Polyimide metal clad laminate |
| WO2013192466A1 (en) * | 2012-06-22 | 2013-12-27 | E. I. Du Pont De Nemours And Company | Polyimide metal clad laminate |
| JP5841570B2 (ja) * | 2012-10-19 | 2016-01-13 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板 |
| EP2876129B1 (en) * | 2013-11-25 | 2021-05-12 | Samsung Electronics Co., Ltd. | Composition for preparing polyimide, polyimide, and article including same |
| KR102276288B1 (ko) * | 2013-11-25 | 2021-07-12 | 삼성전자주식회사 | 폴리이미드 제조용 조성물, 폴리이미드, 상기 폴리이미드를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치 |
| US20150361264A1 (en) * | 2014-06-12 | 2015-12-17 | E I Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
| EP3002310B1 (en) * | 2014-10-02 | 2020-11-25 | Samsung Electronics Co., Ltd. | Composition for preparing polyimide-inorganic particle composite, polyimide-inorganic particle composite, article, and optical device |
| CN107428934B (zh) * | 2015-03-31 | 2020-10-02 | 旭化成株式会社 | 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体 |
| KR102302417B1 (ko) * | 2016-08-31 | 2021-09-15 | 가부시키가이샤 가네카 | 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드 막, 적층체 및 플렉시블 디바이스, 그리고 폴리이미드 막의 제조 방법 |
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| US11665830B2 (en) | 2017-06-28 | 2023-05-30 | Honda Motor Co., Ltd. | Method of making smart functional leather |
| US10682952B2 (en) | 2017-06-28 | 2020-06-16 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
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| KR100769718B1 (ko) * | 2005-11-29 | 2007-10-24 | 삼성전기주식회사 | 발광소자용 반사부재 및 이를 사용한 발광다이오드 패키지 |
| EP1813424A1 (en) | 2006-01-30 | 2007-08-01 | A. Schulman Plastics | Filler composition for use in a multi-layered tubular food casing |
| DE102006005042A1 (de) | 2006-02-03 | 2007-08-09 | Tridonic Optoelectronics Gmbh | Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff |
| US20070232734A1 (en) | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto |
| KR100735310B1 (ko) | 2006-04-21 | 2007-07-04 | 삼성전기주식회사 | 다층 반사 면 구조를 갖는 엘이디 패키지 및 그 제조방법 |
| US20080144322A1 (en) | 2006-12-15 | 2008-06-19 | Aizar Abdul Karim Norfidathul | LED Light Source Having Flexible Reflectors |
| JP2008169237A (ja) * | 2007-01-09 | 2008-07-24 | Toyobo Co Ltd | 白色ポリイミドフィルム |
| JP2008168439A (ja) | 2007-01-09 | 2008-07-24 | Toyobo Co Ltd | 金属白色ポリイミド積層体とその製造方法 |
| EP2170982A1 (en) | 2007-07-23 | 2010-04-07 | DSM IP Assets B.V. | Plastic component for a lighting systems |
| TWI349013B (en) | 2007-10-03 | 2011-09-21 | Univ Nat Taiwan | Polyimide-titania hybrid materials and method of preparing thin films |
| US8168744B2 (en) | 2008-02-19 | 2012-05-01 | E. I. Du Pont De Nemours And Company | Polyimide film for molding, its manufacturing method and molding product |
| DE112009001229B4 (de) | 2008-05-20 | 2015-10-29 | E.I. Du Pont De Nemours And Co. | Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen |
| KR101293346B1 (ko) * | 2008-09-26 | 2013-08-06 | 코오롱인더스트리 주식회사 | 폴리이미드 필름 |
| KR101292886B1 (ko) * | 2009-09-29 | 2013-08-02 | 코오롱인더스트리 주식회사 | 내용제성이 개선된 무색투명한 폴리이미드 필름 |
-
2011
- 2011-06-01 JP JP2013524846A patent/JP2013541181A/ja active Pending
- 2011-06-01 US US13/814,755 patent/US8969909B2/en active Active
- 2011-06-01 TW TW100119167A patent/TW201208879A/zh unknown
- 2011-06-01 CN CN201180039744.9A patent/CN103081145B/zh not_active Expired - Fee Related
- 2011-06-01 WO PCT/US2011/038657 patent/WO2012024009A1/en not_active Ceased
- 2011-06-01 DE DE112011102726.5T patent/DE112011102726B4/de not_active Expired - Fee Related
- 2011-06-01 KR KR20137006652A patent/KR20130101511A/ko not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150046463A (ko) * | 2013-10-22 | 2015-04-30 | 코오롱인더스트리 주식회사 | 폴리아믹산, 폴리이미드 및 표시소자 |
| KR20160012554A (ko) * | 2014-07-24 | 2016-02-03 | 삼성전자주식회사 | 폴리이미드-무기입자 복합체 제조용 조성물, 폴리이미드-무기입자 복합체, 및 상기 복합체를 포함하는 성형품 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201208879A (en) | 2012-03-01 |
| US8969909B2 (en) | 2015-03-03 |
| DE112011102726T5 (de) | 2013-10-10 |
| WO2012024009A1 (en) | 2012-02-23 |
| US20130126940A1 (en) | 2013-05-23 |
| CN103081145A (zh) | 2013-05-01 |
| DE112011102726B4 (de) | 2022-02-03 |
| CN103081145B (zh) | 2016-11-16 |
| JP2013541181A (ja) | 2013-11-07 |
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