DE102009014609B4 - Fotomaskenrohling, Fotomaske und Verfahren zu ihrer Herstellung - Google Patents
Fotomaskenrohling, Fotomaske und Verfahren zu ihrer Herstellung Download PDFInfo
- Publication number
- DE102009014609B4 DE102009014609B4 DE102009014609.1A DE102009014609A DE102009014609B4 DE 102009014609 B4 DE102009014609 B4 DE 102009014609B4 DE 102009014609 A DE102009014609 A DE 102009014609A DE 102009014609 B4 DE102009014609 B4 DE 102009014609B4
- Authority
- DE
- Germany
- Prior art keywords
- layer
- light
- photomask
- pattern
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/46—Antireflective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008093517A JP5530075B2 (ja) | 2008-03-31 | 2008-03-31 | フォトマスクブランク、フォトマスク及びこれらの製造方法 |
| JP2008-093517 | 2008-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102009014609A1 DE102009014609A1 (de) | 2009-12-17 |
| DE102009014609B4 true DE102009014609B4 (de) | 2020-11-19 |
Family
ID=41117763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009014609.1A Expired - Fee Related DE102009014609B4 (de) | 2008-03-31 | 2009-03-24 | Fotomaskenrohling, Fotomaske und Verfahren zu ihrer Herstellung |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8029948B2 (enExample) |
| JP (1) | JP5530075B2 (enExample) |
| KR (2) | KR101615284B1 (enExample) |
| DE (1) | DE102009014609B4 (enExample) |
| TW (1) | TWI481949B (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5562834B2 (ja) * | 2008-03-31 | 2014-07-30 | Hoya株式会社 | フォトマスクブランク、フォトマスクおよびフォトマスクブランクの製造方法 |
| TWI567483B (zh) * | 2008-09-30 | 2017-01-21 | Hoya股份有限公司 | A mask substrate, a mask, a manufacturing method thereof, and a method of manufacturing the semiconductor element |
| EP2209048B1 (en) * | 2009-01-15 | 2013-09-04 | Shin-Etsu Chemical Co., Ltd. | Method for manufacturing a photomask, and dry etching method |
| JP4853684B2 (ja) * | 2009-03-31 | 2012-01-11 | 信越化学工業株式会社 | フォトマスクブランク及びフォトマスク |
| JP4847629B2 (ja) * | 2009-06-18 | 2011-12-28 | Hoya株式会社 | 転写用マスクの製造方法 |
| JP4797114B2 (ja) * | 2009-10-12 | 2011-10-19 | Hoya株式会社 | 転写用マスクの製造方法及び半導体デバイスの製造方法 |
| JP6084391B2 (ja) * | 2011-09-28 | 2017-02-22 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクの製造方法および半導体デバイスの製造方法 |
| US9110281B2 (en) * | 2011-12-22 | 2015-08-18 | Qualcomm Mems Technologies, Inc. | Vertically etched facets for display devices |
| KR101269062B1 (ko) | 2012-06-29 | 2013-05-29 | 주식회사 에스앤에스텍 | 블랭크 마스크 및 이를 이용한 포토 마스크 제조방법 |
| JP6371032B2 (ja) * | 2012-08-01 | 2018-08-08 | スリーエム イノベイティブ プロパティズ カンパニー | 反射防止ハードコートおよび反射防止物品 |
| JP5596111B2 (ja) * | 2012-12-05 | 2014-09-24 | Hoya株式会社 | 半導体デバイスの製造方法 |
| JP6263051B2 (ja) * | 2013-03-13 | 2018-01-17 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランクの製造方法 |
| US9041135B2 (en) * | 2013-03-13 | 2015-05-26 | The Aerospace Corporation | Monolithic sun sensors assemblies thereof |
| JP2014191176A (ja) * | 2013-03-27 | 2014-10-06 | Dainippon Printing Co Ltd | フォトマスクブランクス、フォトマスク及びその製造方法 |
| WO2015015693A1 (ja) * | 2013-07-29 | 2015-02-05 | パナソニックIpマネジメント株式会社 | 回折光学素子、回折光学素子の製造方法および回折光学素子の製造方法に用いられる型 |
| WO2015037392A1 (ja) * | 2013-09-10 | 2015-03-19 | Hoya株式会社 | マスクブランク、転写用マスクおよび転写用マスクの製造方法 |
| JP6264238B2 (ja) * | 2013-11-06 | 2018-01-24 | 信越化学工業株式会社 | ハーフトーン位相シフト型フォトマスクブランク、ハーフトーン位相シフト型フォトマスク及びパターン露光方法 |
| US9933698B2 (en) | 2014-03-18 | 2018-04-03 | Hoya Corporation | Mask blank, phase-shift mask and method for manufacturing semiconductor device |
| JP5775631B2 (ja) * | 2014-08-06 | 2015-09-09 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクの製造方法、および半導体デバイスの製造方法 |
| JP2016057577A (ja) * | 2014-09-12 | 2016-04-21 | 信越化学工業株式会社 | フォトマスクブランク |
| KR102286886B1 (ko) * | 2014-11-18 | 2021-08-09 | 삼성디스플레이 주식회사 | 포토 마스크 및 이의 제조 방법 |
| JP6544964B2 (ja) * | 2015-03-31 | 2019-07-17 | Hoya株式会社 | マスクブランク、位相シフトマスクの製造方法、及び、半導体デバイスの製造方法 |
| US10018905B2 (en) * | 2015-04-06 | 2018-07-10 | S & S Tech Co., Ltd | Phase shift blankmask and photomask |
| JP6621626B2 (ja) * | 2015-09-18 | 2019-12-18 | Hoya株式会社 | マスクブランク、位相シフトマスクおよび半導体デバイスの製造方法 |
| JP6558326B2 (ja) * | 2016-08-23 | 2019-08-14 | 信越化学工業株式会社 | ハーフトーン位相シフトマスクブランクの製造方法、ハーフトーン位相シフトマスクブランク、ハーフトーン位相シフトマスク及びフォトマスクブランク用薄膜形成装置 |
| KR20220006098A (ko) * | 2019-05-13 | 2022-01-14 | 코닝 인코포레이티드 | 낮은 반사율 전극 구조를 갖는 액체 렌즈 및 액체 렌즈 물품 |
| JP7163505B2 (ja) * | 2019-09-05 | 2022-10-31 | Hoya株式会社 | マスクブランク、位相シフトマスク及び半導体デバイスの製造方法 |
| JP7303077B2 (ja) * | 2019-09-10 | 2023-07-04 | アルバック成膜株式会社 | マスクブランクスの製造方法及びフォトマスクの製造方法、マスクブランクス及びフォトマスク |
| KR102850182B1 (ko) * | 2021-06-15 | 2025-08-25 | 주식회사 에스앤에스텍 | 극자외선 리소그래피용 위상반전 블랭크마스크 및 포토마스크 |
| KR102882817B1 (ko) * | 2021-06-15 | 2025-11-07 | 주식회사 에스앤에스텍 | 극자외선 리소그래피용 위상반전 블랭크마스크 및 포토마스크 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070212618A1 (en) * | 2006-03-10 | 2007-09-13 | Shin-Etsu Chemical Co., Ltd. | Photomask blank and photomask |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002229183A (ja) * | 2000-12-01 | 2002-08-14 | Hoya Corp | リソグラフィーマスクブランク及びその製造方法 |
| JP2003322954A (ja) | 2002-03-01 | 2003-11-14 | Hoya Corp | ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク |
| JP4619043B2 (ja) * | 2004-06-02 | 2011-01-26 | Hoya株式会社 | 位相シフトマスクの製造方法及びテンプレートの製造方法 |
| JP4407815B2 (ja) * | 2004-09-10 | 2010-02-03 | 信越化学工業株式会社 | フォトマスクブランク及びフォトマスク |
| JP2006078825A (ja) * | 2004-09-10 | 2006-03-23 | Shin Etsu Chem Co Ltd | フォトマスクブランクおよびフォトマスクならびにこれらの製造方法 |
| JP4339214B2 (ja) | 2004-09-13 | 2009-10-07 | Hoya株式会社 | マスクブランク用透明基板とその製造方法及びマスクブランクとその製造方法 |
| JP4764214B2 (ja) * | 2006-03-10 | 2011-08-31 | 凸版印刷株式会社 | ハーフトーン型位相シフトマスク及びその製造方法 |
| JP4883278B2 (ja) * | 2006-03-10 | 2012-02-22 | 信越化学工業株式会社 | フォトマスクブランク及びフォトマスクの製造方法 |
| JP4881633B2 (ja) * | 2006-03-10 | 2012-02-22 | 凸版印刷株式会社 | クロムレス位相シフトマスク用フォトマスクブランク、クロムレス位相シフトマスク、及びクロムレス位相シフトマスクの製造方法 |
| JP2008093517A (ja) | 2006-10-06 | 2008-04-24 | Nakatomi Kogyo Kk | 循環式水洗トイレの廃棄物濾過装置 |
-
2008
- 2008-03-31 JP JP2008093517A patent/JP5530075B2/ja active Active
-
2009
- 2009-03-24 DE DE102009014609.1A patent/DE102009014609B4/de not_active Expired - Fee Related
- 2009-03-30 KR KR1020090026983A patent/KR101615284B1/ko active Active
- 2009-03-31 TW TW098110706A patent/TWI481949B/zh active
- 2009-03-31 US US12/415,429 patent/US8029948B2/en active Active
-
2011
- 2011-08-31 US US13/223,140 patent/US8323858B2/en active Active
-
2016
- 2016-04-08 KR KR1020160043501A patent/KR101724046B1/ko active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070212618A1 (en) * | 2006-03-10 | 2007-09-13 | Shin-Etsu Chemical Co., Ltd. | Photomask blank and photomask |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201003297A (en) | 2010-01-16 |
| KR101724046B1 (ko) | 2017-04-06 |
| US20090246647A1 (en) | 2009-10-01 |
| KR20160045652A (ko) | 2016-04-27 |
| KR101615284B1 (ko) | 2016-04-25 |
| JP5530075B2 (ja) | 2014-06-25 |
| US8029948B2 (en) | 2011-10-04 |
| KR20090104733A (ko) | 2009-10-06 |
| US20110318674A1 (en) | 2011-12-29 |
| JP2009244752A (ja) | 2009-10-22 |
| DE102009014609A1 (de) | 2009-12-17 |
| US8323858B2 (en) | 2012-12-04 |
| TWI481949B (zh) | 2015-04-21 |
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| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: G03F0001080000 Ipc: G03F0001540000 Effective date: 20120112 |
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| R012 | Request for examination validly filed | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |