DE102006037273B4 - Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte - Google Patents

Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte Download PDF

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Publication number
DE102006037273B4
DE102006037273B4 DE102006037273.5A DE102006037273A DE102006037273B4 DE 102006037273 B4 DE102006037273 B4 DE 102006037273B4 DE 102006037273 A DE102006037273 A DE 102006037273A DE 102006037273 B4 DE102006037273 B4 DE 102006037273B4
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DE
Germany
Prior art keywords
printed circuit
circuit board
resin
photo
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102006037273.5A
Other languages
German (de)
English (en)
Other versions
DE102006037273A9 (de
DE102006037273A1 (de
Inventor
Kiyoshi Sato
Yukihiro Koga
Kazunori Kitamura
Shouji Fujitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
San Ei Kagaku Co Ltd
Original Assignee
San Ei Kagaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Co Ltd filed Critical San Ei Kagaku Co Ltd
Publication of DE102006037273A1 publication Critical patent/DE102006037273A1/de
Publication of DE102006037273A9 publication Critical patent/DE102006037273A9/de
Application granted granted Critical
Publication of DE102006037273B4 publication Critical patent/DE102006037273B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE102006037273.5A 2005-08-11 2006-08-09 Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte Active DE102006037273B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005259874A JP4915639B2 (ja) 2005-08-11 2005-08-11 多層プリント配線板及びその製造方法
JP2005-259874 2005-08-11

Publications (3)

Publication Number Publication Date
DE102006037273A1 DE102006037273A1 (de) 2007-03-29
DE102006037273A9 DE102006037273A9 (de) 2007-07-26
DE102006037273B4 true DE102006037273B4 (de) 2020-07-09

Family

ID=37832772

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006037273.5A Active DE102006037273B4 (de) 2005-08-11 2006-08-09 Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte

Country Status (3)

Country Link
JP (1) JP4915639B2 (ja)
DE (1) DE102006037273B4 (ja)
TW (1) TWI331002B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010074121A1 (ja) 2008-12-25 2010-07-01 三菱電機株式会社 プリント配線板の製造方法
US8299366B2 (en) * 2009-05-29 2012-10-30 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP5467469B2 (ja) 2011-01-04 2014-04-09 山栄化学株式会社 プリント配線基板に表面実装する方法
CN110831338B (zh) * 2019-11-28 2020-08-28 南京宏睿普林微波技术股份有限公司 一种使用压机进行树脂塞孔的工艺方法
WO2023167267A1 (ja) * 2022-03-02 2023-09-07 太陽ホールディングス株式会社 硬化性樹脂組成物、硬化物およびプリント配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015909A (ja) 1999-06-30 2001-01-19 Ngk Spark Plug Co Ltd プリント配線板の製造方法及びマスク
JP2001111214A (ja) 1999-10-12 2001-04-20 Nippon Circuit Kogyo Kk 保護膜の形成方法
JP2002236229A (ja) * 2000-12-06 2002-08-23 Ibiden Co Ltd 多層プリント配線板
EP1298155A1 (en) * 2001-09-27 2003-04-02 San-Ei Kagaku Co. Ltd. Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board
JP2004075967A (ja) 2002-08-14 2004-03-11 Sanei Kagaku Kk 光・熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198929A (ja) * 1992-01-20 1993-08-06 Nec Toyama Ltd 印刷配線板の製造方法
JPH05191020A (ja) * 1992-07-20 1993-07-30 Ibiden Co Ltd ソルダーレジスト被膜を形成したプリント配線板
JPH10335837A (ja) * 1997-04-02 1998-12-18 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2001237543A (ja) * 1997-04-02 2001-08-31 Ibiden Co Ltd プリント配線板
JP2937951B2 (ja) * 1997-06-12 1999-08-23 富山日本電気株式会社 多層印刷配線板の製造方法
JP2954163B1 (ja) * 1998-05-26 1999-09-27 富山日本電気株式会社 多層印刷配線板の製造方法
JP2000349440A (ja) * 1999-06-09 2000-12-15 Hitachi Chem Co Ltd 内層回路入り多層銅張積層板の製造方法
JP2001267740A (ja) * 2000-03-14 2001-09-28 Sumitomo Metal Electronics Devices Inc 電子部品用多層配線基板の製造方法
JP2004027145A (ja) * 2002-06-28 2004-01-29 Tamura Kaken Co Ltd 塗工用硬化性樹脂組成物、多層プリント配線板、プリント配線板及びドライフィルム
JP2003341010A (ja) * 2003-06-20 2003-12-03 Micro-Tec Co Ltd スクリーン印刷機及びスクリーン印刷方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015909A (ja) 1999-06-30 2001-01-19 Ngk Spark Plug Co Ltd プリント配線板の製造方法及びマスク
JP2001111214A (ja) 1999-10-12 2001-04-20 Nippon Circuit Kogyo Kk 保護膜の形成方法
JP2002236229A (ja) * 2000-12-06 2002-08-23 Ibiden Co Ltd 多層プリント配線板
EP1298155A1 (en) * 2001-09-27 2003-04-02 San-Ei Kagaku Co. Ltd. Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board
JP2003105061A (ja) 2001-09-27 2003-04-09 Sanei Kagaku Kk 光・熱硬化性樹脂組成物、並びに穴詰プリント配線（基）板の製造方法及び穴詰プリント配線（基）板
DE60205072T2 (de) * 2001-09-27 2006-04-20 San-Ei Kagaku Co. Ltd. Foto- und wärmehärtbare Harzzusammensetzung und Verfahren zur Herstellung einer gedruckten Leiterplatte mit verschlossenen Durchgangslöchern
JP2004075967A (ja) 2002-08-14 2004-03-11 Sanei Kagaku Kk 光・熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板

Also Published As

Publication number Publication date
JP2007049106A (ja) 2007-02-22
DE102006037273A9 (de) 2007-07-26
DE102006037273A1 (de) 2007-03-29
JP4915639B2 (ja) 2012-04-11
TW200718311A (en) 2007-05-01
TWI331002B (en) 2010-09-21

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Effective date: 20110318

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