TW200718311A - Flattened resin coating printed-wiring board - Google Patents

Flattened resin coating printed-wiring board

Info

Publication number
TW200718311A
TW200718311A TW095128091A TW95128091A TW200718311A TW 200718311 A TW200718311 A TW 200718311A TW 095128091 A TW095128091 A TW 095128091A TW 95128091 A TW95128091 A TW 95128091A TW 200718311 A TW200718311 A TW 200718311A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
photo
flattened
steps
Prior art date
Application number
TW095128091A
Other languages
Chinese (zh)
Other versions
TWI331002B (en
Inventor
Kiyoshi Sato
Yukihiro Koga
Kazunori Kitamura
Shouji Fujitsu
Original Assignee
San Ei Kagaku Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Co filed Critical San Ei Kagaku Co
Publication of TW200718311A publication Critical patent/TW200718311A/en
Application granted granted Critical
Publication of TWI331002B publication Critical patent/TWI331002B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

It is an object of the invention to manufacture, without reguiring polish, a flattened, resin coated printed wiring board in which the both surfaces of a printed wiring board are extremely highly flattened and the thickness of the printed wiring board is fixed in all the areas (that is, all portions and parts) of the printed wiring board, thereby excelling in the component mountability (bump bondability and the like) and impedance characteristics (impedance stability and the like). Furthermore, it is another object of the invention to provide a printed wiring board which is manufactured from such a printed wiring board and of which both the surfaces are very highly flattened, for example, a multilayer printed wiring board (particularly, a four-layer printed wiring board) useful as an inner layer, and a printed wiring board (particularly, a double-sided printed wiring board) useful as an external layer. A method for manufacturing a printed wiring board, comprises the steps of: applying a photo/thermosetting resin composition onto one surface and through hole of a printed wiring board having the through hole; sequentially performing the following steps (1) and (2); applying the photo/thermosetting resin composition onto the other surface of the printed wiring board; and sequentially performing the following steps (1) to (3): (1) flattening the surface of the applied resin; (2) photo-setting the applied resin; and (3) thermosetting the photo-cured resin.
TW095128091A 2005-08-11 2006-08-01 Flattened resin coating printed-wiring board TWI331002B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005259874A JP4915639B2 (en) 2005-08-11 2005-08-11 Multilayer printed wiring board and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200718311A true TW200718311A (en) 2007-05-01
TWI331002B TWI331002B (en) 2010-09-21

Family

ID=37832772

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128091A TWI331002B (en) 2005-08-11 2006-08-01 Flattened resin coating printed-wiring board

Country Status (3)

Country Link
JP (1) JP4915639B2 (en)
DE (1) DE102006037273B4 (en)
TW (1) TWI331002B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5581218B2 (en) 2008-12-25 2014-08-27 三菱電機株式会社 Method for manufacturing printed wiring board
US8299366B2 (en) * 2009-05-29 2012-10-30 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP5467469B2 (en) 2011-01-04 2014-04-09 山栄化学株式会社 Method of surface mounting on printed wiring board
CN110831338B (en) * 2019-11-28 2020-08-28 南京宏睿普林微波技术股份有限公司 Process method for plugging holes with resin by using press
WO2023167267A1 (en) * 2022-03-02 2023-09-07 太陽ホールディングス株式会社 Curable resin composition, cured product, and printed wiring board

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198929A (en) * 1992-01-20 1993-08-06 Nec Toyama Ltd Manufacture of printed wiring board
JPH05191020A (en) * 1992-07-20 1993-07-30 Ibiden Co Ltd Printed wiring board with solder resist film
JP2001237543A (en) * 1997-04-02 2001-08-31 Ibiden Co Ltd Printed wiring board
JPH10335837A (en) * 1997-04-02 1998-12-18 Ibiden Co Ltd Manufacture of multilayered printed wiring board
JP2937951B2 (en) * 1997-06-12 1999-08-23 富山日本電気株式会社 Method for manufacturing multilayer printed wiring board
JP2954163B1 (en) * 1998-05-26 1999-09-27 富山日本電気株式会社 Method for manufacturing multilayer printed wiring board
JP2000349440A (en) * 1999-06-09 2000-12-15 Hitachi Chem Co Ltd Manufacture of multilayer copper clad circuit board containing inner layer circuit
JP3459380B2 (en) 1999-06-30 2003-10-20 日本特殊陶業株式会社 Manufacturing method of printed wiring board and mask
JP2001111214A (en) 1999-10-12 2001-04-20 Nippon Circuit Kogyo Kk Method of forming protective film
JP2001267740A (en) * 2000-03-14 2001-09-28 Sumitomo Metal Electronics Devices Inc Method for manufacturing multilayer wiring board for electronic part
JP4789381B2 (en) * 2000-12-06 2011-10-12 イビデン株式会社 Multilayer printed circuit board
JP2003105061A (en) * 2001-09-27 2003-04-09 Sanei Kagaku Kk Photo-thermally curable resin composition, production method for hole-filled printed circuit board, and hole- filled printed circuit board
JP2004027145A (en) * 2002-06-28 2004-01-29 Tamura Kaken Co Ltd Curable resin composition for coating, multilayer printed circuit board, printed circuit board, and dry film
JP3799551B2 (en) 2002-08-14 2006-07-19 山栄化学株式会社 Photo / thermosetting resin composition, smooth plate manufacturing method and smooth plate
JP2003341010A (en) * 2003-06-20 2003-12-03 Micro-Tec Co Ltd Screen printing machine and screen printing method

Also Published As

Publication number Publication date
TWI331002B (en) 2010-09-21
DE102006037273B4 (en) 2020-07-09
DE102006037273A1 (en) 2007-03-29
JP4915639B2 (en) 2012-04-11
DE102006037273A9 (en) 2007-07-26
JP2007049106A (en) 2007-02-22

Similar Documents

Publication Publication Date Title
TW200721932A (en) Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
WO2003011583A3 (en) Multi-layer composites formed from compositions having improved adhesion, coating compositions, and methods related thereto
WO2007017195A3 (en) Metal effect pigments comprising a mixed inorganic/organic layer, method for the production of such metal effect pigments, and use thereof
WO2005039868A3 (en) Structuring of electrical functional layers by means of a transfer film and structuring the adhesive
TW200718311A (en) Flattened resin coating printed-wiring board
DE502004007078D1 (en) THIN-LAYER ASSEMBLY AND METHOD FOR PRODUCING SUCH A THIN-LAYER ASSEMBLY
ATE548483T1 (en) METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS WITH HOLES REQUIRING SURFACE COATING WITH COPPER
EP1355519A3 (en) An improved method to embed thick film components
TW200625485A (en) Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
WO2009005042A1 (en) Metal material, method for producing the same, and electrical electronic component using the same
WO2007109594A3 (en) Articles and methods including patterned substrates formed from densified, adhered metal powders
WO2005072938A3 (en) Composite products and methods of forming such products
DE602005018540D1 (en) LIQUID COATING COMPOSITIONS COMPRISING A COMPOUND OF AT LEAST ONE POLYFUNCTIONAL ISOCYANURATE, CORRESPONDING MULTILAYER COMPOSITE COATINGS, PROCESSES AND COATED SUBSTRATES
WO2008103794A3 (en) Conductive pattern formation method
WO2008102113A3 (en) Printed circuit boards
TW200509761A (en) Copper foil with an extremely thin adhesive layer and the method thereof
JP2009509752A5 (en)
WO2008088449A3 (en) A new coating composition for proppant and the method of making the same
SE0100860D0 (en) A process for the manufacture of decorative boards
EP1998222A3 (en) Coating compositions
WO2008009575A3 (en) Method of bonding
TW200720483A (en) Method for improved adhesion of polymeric materials to copper or copper alloy surfaces
SG150377A1 (en) Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor
TW200601599A (en) Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
WO2003071596A3 (en) Electronic component with an adhesive layer and method for the production thereof