DE102006037273A1 - Flattened, resin coated printed circuit board - Google Patents

Abstract

It is an object of the invention to produce a flattened resin coated printed circuit board that does not require polishing, wherein the two surfaces of the printed circuit board are extremely flattened and the thickness of the printed circuit board in all areas (ie all portions and parts) of the printed circuit board, whereby an excellent component mounting capability (bump bonding capability and the like) and excellent impedance characteristics (impedance stability and the like) are obtained. It is still a further object of the invention to provide a printed circuit board which has been made from such a printed circuit board and in which both surfaces are very much flattened, e.g. A multi-layered printed circuit board (especially a four-layered printed circuit board) usable as an inner layer, and a printed circuit board (particularly a double-sided printed circuit board) usable as an outer layer. DOLLAR A A method of manufacturing the printed circuit board comprises the steps of: applying a photo / thermosetting resin composition to a surface and the through hole of a printed circuit board having the through hole; successively performing the following steps (1) and (2); Applying the photo / thermosetting ...

Description

BACKGROUND THE INVENTION

1 , Field of the invention

The The present invention relates to a printed circuit board and a Process for their preparation. The invention particularly relates a printed circuit board with both surfaces (front and backsides) strongly flattened or strongly balanced and (in particular the the whole area of which) is coated with a resin and, for example, a flattened or matched and resin coated printed circuit board, a four-layer printed circuit board that serves as an inner layer is usable, and a double-sided printed circuit board, the as an outer layer is usable, as well as a method for producing the same.

2. Description of the relevant state of the technique

When a method of making a flattened and pleated with or closed holes provided Printed circuit board is already known a method in which First, a through hole of the printed circuit board with a thermosetting Resin composition is plugged or closed and then the entered resin is thermoset and a hardened one Part of the resin from the surface of the printed circuit board is removed by performing a polishing, around the surface to flatten (Patent Document 1).

This However, the method has a problem that the number of stages of manufacture is increased by the polishing and that the polishing costs increased become. The method is also with another problem Afflicted by polishing a deformation (or a dimensional change) the printed circuit board is done.

Then, a method for flattening the surface of the printed circuit board without polishing has been sought. As such a method, the method according to Patent Document 2 has been proposed. That is, in this method, first, the through hole of the printed circuit board is plugged with a hardening resin [ 7A . 705 ]. Then, the printed circuit board with curing resists is sandwiched in the curing resists by thermal compression with the printed circuit board. 7B . 727 ]. Thereafter, the applied resin and the hardening resist are fully cured by high-temperature heating [ 7C . 728 ].

However, in this process it is difficult for the resist to 7B . 727 ] at a recess [ 7B . 704a ] completely adheres between the circuits and. in particular in a part with many circuits, even if a vacuum press is performed. As a result, a gap is easily formed between the recess and the resist film, and in some cases, air remains in the gap. Therefore, on the surface of the resist film [ 7B . 725 ], the so-called "popcorn phenomenon" in which the remaining air is thermally expanded in the subsequent high-temperature heating and sometimes bubbles occur on the surface of the resist film.

On the other hand, because a large amount of the resist resin [ 7B . 727 ] is used to make a recess [ 7B . 704b ] is used between the circuits in a part with few circuits, sometimes a notch on the surface of the resist after heat curing. [ 7C . 726 ).

Therefore is because a printed produced by such a method Circuit board a surface with bubbles and notches and this is not completely flattened, the component mounting capability (Bump bonding ability and the like) of the printed circuit board.

Furthermore, the surface of the printed circuit board has bubbles and notches, the thickness of an insulating layer, in particular, the thickness of an insulating layer formed on a conductive circuit layer. 7C . 702 ] is not stabilized, thereby causing a reduction in impedance characteristics such as an increase in impedance fluctuation.

That is, in a peripheral bladder part [ 7C . 729 ] is the thickness [ 8A . 831 ] of the insulating Layer formed on the conductive circuit layer 8A . 802 ] gradually increases towards a central part of the bladder. On the other hand, in a notch peripheral part [ 7C . 730 ] the fat [ 8B . 831 ] of the insulating layer formed on the conductive circuit layer [ 8B . 802 ] gradually decreases towards the central part of the notch.

Also itself is printed in one using such a Printed circuit board as an inner layer or outer layer produced multilayer printed circuit board, which is not completely flattened, a reduction component mounting capability (Bump bonding ability and the like) and the impedance characteristic or the like caused.

• Patent Document 1] Japanese Patent Application Laid-Open (JP-A) No. 2001-15903
• [Patent Document 2] Japanese Patent Application Laid-Open (JP-A) No. 2001-111214

in the In view of the above situation, it is an object of the present Invention, a flattened, resin coated printed circuit board in which both surfaces of the printed circuit board extremely flattened and the thickness of the printed circuit board in all areas (ie all portions and parts) of the printed circuit board or is fixed, whereby the component mounting capability (Bump bonding ability and the like) and the impedance characteristics (impedance stability and the like) to be made excellent without requiring polishing is. It is further an object of the present invention to provide a printed circuit board available to make that made from such a printed circuit board and where both surfaces are heavily flattened, e.g. a multilayer printed circuit board (in particular a four-layer printed circuit board) serving as an inner layer is suitable, and a printed circuit board (in particular a double-sided printed circuit board), which is suitable as an outer layer.

SUMMARY THE INVENTION

to solution In the above object, the named inventors have made investigations and as a result, the following invention is made.

• (1) Abflachen bzw. Abgleichen der Oberfläche des aufgebrachten Harzes;
• (2) Photohärten des aufgebrachten Harzes; und
• (3) Wärmehärten des photogehärteten Harzes.

According to a first embodiment of the present invention, there is provided a method of manufacturing a printed circuit board, comprising the steps of:
Applying a photo / thermosetting resin composition to a surface and the through hole of a printed circuit board having the through hole;
successively performing the following steps (1) and (2);
Applying the photo / thermosetting resin composition to the other surface of the printed circuit board; and
successively performing the following steps (1) to (3):

• (1) flattening the surface of the applied resin;
• (2) photocuring the applied resin; and
• (3) Heat curing of the photocured resin.

• (A) zuerst erfolgende Durchführung der obigen Stufe (3), als Nächstes laminierendes Verpressen der gedruckten Leiterplatte und der Press-Bindungsmaterialien, wobei die gedruckte Leiterplatte sandwichartig zwischen den Press-Bindungsmaterialien angeordnet ist, um die Press-Bindungsmaterialien durch Pressen zu binden, oder
• (B) laminierendes Verpressen der gedruckten Leiterplatte und der Press-Bindungsmaterialien bei der Wärmehärtungstemperatur oder höher des photogehärteten Harzes, wobei die gedruckte Leiterplatte sandwichartig zwischen den Press-Bindungsmaterialien angeordnet ist, um die Press-Bindungsmaterialien durch Pressen zu binden, und auf diese Weise gleichzeitig die genannte Stufe (3) durchzuführen;

Bilden eines Lochs von der Oberfläche des Press-Bindungsmaterials zu einer Leiterschicht, um einen Mikroweg zu bilden;
Aufbringen einer Gesamtflächenplattierung;
Bilden eines Strom- bzw. Schaltkreises von einer Plattierungsschicht; und
Aufschichten eines Resists.According to a second embodiment of the present invention, there is provided a method of manufacturing a multilayer printed circuit board, comprising the steps of:
Applying a photo / thermosetting resin composition to a surface and the through hole of a printed circuit board having the through hole;
successively performing the following steps (1) to (2);
Applying the photo / thermosetting resin composition to the other surface of the printed circuit board;
successively performing the following steps (1) and (2);

• (A) first performing the above step (3) first, then laminating the printed circuit board and the press-bonding materials, the printed circuit board being sandwiched between the press-bonding materials to press-bond the press bonding materials, or
• (B) laminating pressing of the printed circuit board and the press-bonding materials at the thermosetting temperature or higher of the photocured resin, wherein the printed circuit board is sandwiched between the press-bonding materials to press-bond the press bonding materials, and thus simultaneously to carry out the said step (3);

Forming a hole from the surface of the press-bonding material to a conductor layer to form a microweg;
Applying a total surface plating;
Forming a circuit of a plating layer; and
Layering of a resist.

According to one third embodiment The present invention provides a process for producing a multilayer printed circuit board according to the second embodiment to disposal put, with the resist an opening Has.

According to a fourth embodiment of the present invention, there is provided a method of manufacturing a printed circuit board, comprising the steps of:
Applying a photo / thermosetting resin composition to a surface and the through hole of a printed circuit board having the through hole;
successively performing the above steps (1) and (2);
Applying the photo / thermosetting resin composition to the other surface of the printed circuit board; and
successively performing the above steps (1) to (3) and:
Forming an opening in the coated resin layer.

According to one fifth embodiment The present invention provides a process for producing a printed circuit board according to the third or fourth embodiment to disposal put one through the opening exposed surface or a surface at the opening covered with a plating.

According to one sixth embodiment The present invention provides a process for producing a Printed circuit board according to one of the first to fifth embodiments to disposal put, the surface a conductive layer of the printed circuit board with the through hole is roughened.

According to one seventh embodiment the present invention provides a printed circuit board by the manufacturing process according to any one of the first to the sixth embodiment has been produced.

By The invention may, without a polishing is required, a flattened resin coated printed circuit board made the who, in which both surfaces extremely flattened are and the thickness of the printed circuit board in all areas (this means all portions and parts) of the printed circuit board or is fixed, thereby providing excellent fastening ability of components (Bondhügelbindungsfähigkeit and the like) and excellent impedance characteristic (impedance stability and the like) to be obtained. Furthermore, the invention may be a printed circuit board to disposal make that made from such a printed circuit board has been flattened and both surfaces extremely flattened are, for example, a multilayer printed circuit board (in particular a four-layered printed circuit board) acting as an inner Layer is suitable, and a printed circuit board (in particular a double-sided printed circuit board), as an outer layer suitable is.

SHORT DESCRIPTION THE DRAWINGS

The 1 Fig. 10 shows a manufacturing method of a flattened resin-coated printed circuit board according to the invention (especially Example 1);

the 2 shows a manufacturing method of a four-layer printed circuit board according to the invention (in particular example 3);

the 3 shows a manufacturing method of a double-sided printed circuit board according to the invention (in particular example 4);

the 4 shows a manufacturing method of a four-layer printed circuit board according to an embodiment in which a four-layer printed circuit board according to the invention modified and out is stretched;

the 5 shows a manufacturing method of a four-layered printed circuit board according to another embodiment, in which a four-layered printed circuit board according to the invention is modified and expanded;

the 6 Fig. 10 shows a production method of a printed circuit board according to Comparative Example 1, in which polishing is performed;

the 7 Fig. 10 shows a production method of a printed circuit board in which a gap between circuits has not previously been filled with a resin according to a conventional method;

the 8A shows a partially enlarged view of a bubble peripheral part and the 8B Fig. 10 is a partially enlarged view of a notch peripheral portion of a conventional printed circuit board having a notch and a bladder; and

the 9A and 9B 12 show partially enlarged cross-sectional views of a bump bonding member to show the occurrence of a poor bump bond when the bump bond of the BGA component is performed in a conventional four-layer printed wiring board with a notch and a bubble; 9A FIG. 12 is a partial enlarged cross-sectional view showing poor bump bonding in the vicinity of the bubble on the surface of the four-layered printed wiring board, and FIGS 9B FIG. 12 is a partially enlarged cross-sectional view showing a poor bump bond in the vicinity of the notch of the surface of the four-layered printed wiring board.

DESCRIPTION THE PREFERRED EMBODIMENTS

• [I]: Partiale Addukte eines Epoxyharzes mit einer ungesättigten Fettsäure
• [II]: (Meth)acrylate
• [III]: Photo-Vernetzungsmittel
• [IV]: Epoxyharze
• [V]: latente Härtungsmittel

In the method for producing the flattened, resin-coated printed circuit board according to the invention, examples of the photo / thermosetting resin compositions (that is, two-stage curing resin compositions in which primary curing is performed by irradiation with light and secondary hardening) are excluded Heating) are those containing the following components [I] to [V].

• [I]: Partial adducts of an epoxy resin with an unsaturated fatty acid
• [II]: (meth) acrylates
• [III]: Photo-crosslinking agent
• [IV]: Epoxy resins
• [V]: latent hardeners

preferred special examples of photo / thermosetting resin compositions are disclosed in Japanese Patent Application Laid-Open (JP-A) No. 2003-105061 and 2004-75967.

The photo / thermosetting resin composition contains a partial adduct of an epoxy resin with an unsaturated one fatty acid as component [I]. The epoxy value of the epoxy resin (hereinafter sometimes referred to as "raw material epoxy resin" for convenience) Starting material for the preparation of the component (I) is, for example, 130 to 400 and especially 150 to 250. Examples of the starting material epoxy resins shut down Phenolic novolac type epoxy resins, epoxy resins made from a polyfunctional phenol, epoxy resins with a naphthalene skeleton, Glycidylamine-type epoxy resins, epoxy resins with a triacine skeleton, glycidyl ester type epoxy resins and epoxy resins of the alicyclic type.

preferred examples for the starting material epoxy resin shut down the individual compounds represented by the formulas [Chemical Formulas I-E1] to [Chemical Formula I-E7] are given in Table 1 become. Particularly preferred examples thereof include phenolic novolac type epoxy resins, Cresol novolak type epoxy resin, trisphenylmethane type epoxy resins, Bisphenol A novolak type epoxy resins and dicyclopentadiene phenol type epoxy resins, wherein at least a kind of it can be used.

Table 1

In In the formulas, "G" represents a glycidyl group, except in the case that "G" for a different Definition is used.

[Chemical Formula 1]

The symbol n represents an integer of 0 to 30 in the formulas [Chemical Formula I-E1] to [Chemical Formula I-E3]. The symbol n denotes an integer from 1 to 30 in the formulas [Chemical Formula I-E4] to [Chemical Formula I-E6]. The symbol n represents an integer of 2 to 50 in the formula [Chemical Formula I-E7]. In the formula [Chemical Formula I-E2], each of R ¹ and R ^{2 is} independently H or CH ₃ .

Examples for unsaturated fatty acids as additional starting material for the preparation of the component (I) includes materials of the following Formula [Chemical Formula I-UFA].

[Chemische Formel I-UFA] wobei jeder Rest von R¹ bis R³ unabhängig H oder CH₃ ist. Spezielle Beispiele für die ungesättigte Fettsäure schließen Acrylsäure, Methacrylsäure und Crotonsäure ein.[Chemical formula 2]

[Chemical formula I-UFA] wherein each of R ¹ to R ^{3 is} independently H or CH ₃ . Specific examples of the unsaturated fatty acid include acrylic acid, methacrylic acid and crotonic acid.

Of the Component [I] can be prepared by a usual manufacturing method getting produced. For example, the component [I] can thereby be prepared that at least one kind of the starting material epoxy resin and at least a type of unsaturated fatty acid [for example, acrylic acid and / or methacrylic acid (hereinafter occasionally abbreviated as "(meth) acrylic acid") for convenience stirred with heating while heating and mixed.

Of the Ingredient [I] is obtained by the unsaturated fatty acid partial is added to the epoxy resin. That is, with a partial adduct of the epoxy resin with the unsaturated one fatty acid At least one epoxy group remains in the epoxy resin after the addition the unsaturated one fatty acid back. Specifically, the unsaturated fatty acid preferably from 20 to 80%, preferably from 40 to 60% of the epoxy groups in the starting material epoxy resin given. For an adduct, in which the addition amount of the unsaturated fatty acid less than 20% [which, for the sake of simplicity, is sometimes referred to as the "adduct with less than 20% of unsaturated Fatty acid "and the like is occasionally left in the primary photohardened product adhesion. When Result therefore holds if a cover film described later is deducted, the primary photocured Product occasionally on the cover film. In contrast, at an adduct with more than 80% unsaturated fatty acid the toughness of the hardened Product deteriorates by reducing the epoxy groups, so Therefore, the tendency for cracking occurs.

Examples for the Close component [I] Adducts of a novolak-type epoxy resin with (meth) acrylic acid (especially an adduct of a cresol-novolac type epoxy resin with acrylic acid, etc. a) and the photo / thermosetting resin composition can contain at least one kind of it.

preferred examples for close the constituent [I] partial adducts of a phenolic novolac type epoxy resin with acrylic acid, partial Adducts of a cresol novolak type epoxy resin with acrylic acid, partial Adducts of a tris-phenylmethane-type epoxy resin with acrylic acid, partial Adducts of bisphenol A novolac type epoxy resin with methacrylic acid, partial Adducts of an epoxy resin of the dicyclopentadiene-phenol type with methacrylic acid and partial adducts of a phenolic novolac type epoxy resin with crotonic acid, where at least one type of it can be used.

The photo / thermosetting resin composition contains (Meth) acrylates (i.e., acrylates and / or methacrylates) as an ingredient [II]. In the component [II], examples of acrylates include Esters of acrylic acids with Hydroxy compounds. Examples of the methacrylates include esters of methacrylic acids with hydroxy compounds.

Examples for the above acrylic acids and methacrylic acids shut down unsaturated fatty acids, indicated by the formula [Chemical formula I-UFA]. Specific examples for acrylic acids and methacrylic acids are acrylic acid, methacrylic acid and crotonic acid.

Examples of the above-mentioned hydroxy compounds include alcohols, (hemi) acetals or (hemi) ketals and hydroxyesters. Examples of the alcohols include lower alcohols, cyclic alcohols, polyhydric alcohols and aromatic alcohols, etc. a. In the hydroxy compounds, examples of the (hemi) acetals or (hemi) ketals include condensates of the above alcohols (eg, cyclic alcohols and polyhydric alcohols or the like) with formaldehyde or hydroxyaldehyde. In the hydroxy compounds, specific examples of the hydroxy acid esters include ring opening adducts of caprolactone with furfuryl alcohol, neopentyl glycol, hydroxypivalate or the like.

preferred Examples of the component [II] include the individual compounds represented by the formulas [Chemical formula II-1] to [Chemical formula Formula II-9] according to the table 2 and in particular isobornyl acrylate, dicyclopentanyl methacrylate, hydroxypivalic acid, Tricyclodecanedimethanol acrylate, trimethylolpropane triglycol acrylate, Dipentaerythritol hexaacrylate and isobornyl crotonate, wherein at least some kind of it can be used.

Table 2

The photo / thermosetting resin composition contains a photo-crosslinking agent as component [III]. Examples of the component Close [III] a constituent by which a primary curing reaction by irradiation with light, for example with ultraviolet light or the like with a wavelength of 200 to 400 nm is allowed.

Specific examples for to conclude component [III] Hydroxyketones, benzylmethylketals, acylphosphine oxides, aminoketones, Benzoin ethers, benzoyl compounds, thioxanthones, biimidazoles, dimethylaminobenzoate, Sulfonium salts, anthraquinones, acridones, acridines, carbazoles and Titanium complexes, wherein at least one type of it are used can.

Preferred examples of the component [III] include the individual compounds represented by the For [Chemical formula III-1] and [Chemical formula III-2] shown in Table 3, at least one kind of which can be used.

Table 3

The photo / thermosetting resin composition contains an epoxy resin as component [IV]. Examples of the epoxy resin include crystalline ones Epoxy resins and / or liquid Epoxy resins. The component [IV] becomes crystalline epoxy resins with a melting point of for example 80 to 110 ° C, in particular 90 to 105 ° C, prefers. Continue to amount in the crystalline epoxy resins, the viscosity (mPa · s) is preferably 50 or less, in particular 0.1 to 20, at the melting point to the melting point plus 20 ° C. Furthermore, a crystalline epoxy resin is preferred, which in the photo / thermosetting Resin composition poorly soluble is.

Examples for crystalline Close epoxy resins biphenyl-type, biphenyl-type, hydroquinone-type crystalline epoxy resins, of the biphenyl novolak type and the fluorine type, wherein at least some kind of it can be used.

wobei R für H oder CH₃ steht und wobei mindestens eine Art davon enthalten sein kann.Examples of biphenyl type crystalline epoxy resins include a compound represented by the following formula [Chemical Formula IVc-1]. [Chemical Formula 3]

wherein R is H or CH ₃ and wherein at least one kind thereof may be contained.

worin X für O oder S steht und R¹ und R² jeweils unabhängig voneinander für H, CH₃ oder t-Butyl stehen und wobei mindestens eine Art davon enthalten sein kann.Examples of biphenyl type crystalline epoxy resins include a material represented by the following formula [Chemical Formula IVc-2]. [Chemical formula 4]

wherein X is O or S and R ¹ and R ^{2 are} each independently H, CH ₃ or t-butyl, and wherein at least one kind thereof may be contained.

worin n den Wert 0, 1 oder 2 hat und wobei mindestens eine Art davon enthalten sein kann.Examples of hydroquinone type crystalline epoxy resins include those indicated by the following formula [Chemical Formula IVc-3]. [Chemical formula 5]

wherein n is 0, 1 or 2 and at least one kind may be included.

worin n den Wert 1 oder 2 hat und wobei mindestens eine Art davon enthalten sein kann.Examples of biphenyl novolac type crystalline epoxy resins include those having the following formula [Chemical Formula IVc-4]. [Chemical formula 6]

wherein n is 1 or 2 and at least one kind may be included.

Examples of fluorine type crystalline epoxy resins include those having the following formula [Chemical Formula IVc-5]. [Chemical formula 7]

preferred examples for close crystalline epoxy resins Tetramethylbiphenyl epoxy resins, hydroquinone diglycidyl ether and di (p-glycidylphenyl) ether at least one kind of which may be included.

in the In the case of ingredient [IV], the liquid epoxy resin makes a liquid or semisolid epoxy resin at normal temperature. Examples include Epoxy resin with a flowability at normal temperature. It is preferable that the liquid epoxy resin a viscosity (Room temperature, mPa · s) for example, 20,000 or less, and more preferably from 1000 to 10000 has.

worin n den Wert 0 oder 1 hat und wobei mindestens eine Art davon enthalten sein kann.Specific examples of the liquid epoxy resin include a bisphenol A type epoxy resin represented by the following formula [Chemical Formula IV1-1]. [Chemical formula 8]

wherein n is 0 or 1 and at least one kind may be included.

wobei n den Wert 0 oder 1 hat und wobei mindestens eine Art davon enthalten sein kann.Further, specific examples of the liquid epoxy resin include a bisphenol F type epoxy resin represented by the following formula [Chemical Formula IV1-2]. [Chemical formula 9]

where n is 0 or 1 and where at least one kind may be included.

Farther shut down special examples of a liquid Epoxy resin, a naphthalene type resin, a diphenyl thioether (sulfide) type resin, a trityl type resin, an alicyclic type resin, a resin prepared from the following Alcohols, a diallyl-bis-A-type resin, a methylresorcin-type resin, a bisphenol AD type resin and an N, N, O-tris (glycidyl) -p-aminophenol at least one kind of which may be included.

preferred examples for the liquid Close epoxy resin a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, N, N, O-tris (glycidyl) -p-aminophenol and a bisphenol AD type epoxy resin at least one kind of which may be included.

The photo / thermosetting resin composition contains a latent curing agent as component [V]. A secondary one curing is effected by heating the component [V]. In the component [V] is For example, the starting temperature of the secondary curing reaction is preferably 150 to 300 ° C and more preferably 150 to 200 ° C.

Specific examples of the component [V] include dicyandiamide (DICY), imidazoles, BF ₃ -amine complex one, amine adduct curing agent, amino acid anhydride (polyamide) adduct curing agents, hydrazide curing agents, carboxylates (salts) of amine curing agents and onium salts, at least one type of which may be included.

at close the component [V] specific examples of the amine adduct curing agent is an adduct of a curing agent of imidazole type [2-ethyl-4-methylimidazole, 2-methylimidazole, 2,4-diamino-6- (2'-methylimidazolyl (1H) -ethyl-S-triazine or the like] or an amine curing agent (Diethylamine or the like) with an epoxy compound with urea or an isocyanate compound. Examples of the hydrazide curing agents shut down adipic (ADH) and sebacic dihydrazide (SDH). examples for the carboxylates (salts) of the amine curing agents include nylon salts and the ATU (3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro [5,5] undecane) adipic acid salt one. examples for close the onium salts Sulfonium salts, ammonium salts and phosphonium salts.

Preferred examples of the component [V] include the compounds of the formulas [Chemical Formula V-1] to [Chemical Formula V-3] in Table 4, wherein at least one kind thereof may be contained. Table 4

To the photo / thermosetting Resin composition can if necessary, various additives are given. Examples for the Close additives fillers, organic / inorganic colorants, flame retardants and antifoams at least one kind of which may be included.

As to the composition of the photo / thermosetting resin, to 100 parts by weight of the component [I], 100 to 300 parts by weight (especially 150 to 250 parts by weight) of the component [II], 1 to 50 parts by weight (especially 5 to 15 parts by weight) of the component [III], 50 to 200 parts by weight (especially 60 to 120 parts by weight) of the component [IV], 1 to 50 parts by weight Parts (especially 5 to 20 parts by weight) of the component [V] and 200 to 500 parts by weight (especially 250 to 350 parts by weight) of the filler are preferable.

The photo / thermosetting resin composition can be made, for example, that the individual Ingredients [I] to [V] and, if necessary, the additive with each other are mixed so that the mixture is uniformly dispersed and that the dispersed mixture is defoamed in vacuo. The order of Addition or the like of the ingredients is not particularly limited and each ingredient may be added sequentially or all Ingredients can be added at once.

It It is preferable that the photo / thermosetting resin composition as prepared above a resin viscosity (Pa · s, room temperature) from 10 to 50 in view of the application properties the printed circuit board or the like has viscosities of 15 to 30 are particularly preferred.

below the invention will be described in detail with reference to the drawings.

In the flattened resin coated printed circuit board manufacturing method of the present invention, a printed circuit board having a through hole [ 1A . 103 ] used as a printed circuit board. Examples of the through holes include all types of holes that penetrate the printed circuit board. Specific examples of the through holes include through-holes, component holes, and other through-holes. Examples of the types of the printed circuit board include double-sided printed circuit boards. Examples of the double-sided printed circuit boards include a rigid printed circuit board, a flexible printed circuit board, and a rigid, flex-printed circuit board.

With respect to the printed circuit board having a through hole, the surface of the conductive layer becomes 1A . 102 ] is preferably roughened to enhance the adhesion of a conductive layer and a resin layer and the like. Examples of the conductive layer include a wiring metal layer, specifically, a circuit layer, a plating metal layer, and a metal foil layer formed on the inner wall of the through hole. Examples of the roughening treatments include treatment with a black oxide, also referred to as a "CZ treatment" (treatment with a chemical roughening agent manufactured by MECetchBOND CO., LTD.), A black reduction treatment, a plating with acicular alloy and physical working (sandblasting, blasting, polishing with leather or the like).

at the preparation of the invention flattened, with resin coated printed circuit board becomes first the photo / thermosetting resin composition on a surface and the through hole of the printed circuit board is applied.

The photo / thermosetting resin composition For example, by screen printing (mask printing or the like using a polyester sieve or a stainless steel sieve etc.), metal mask printing, roll coating printing and the like are applied.

The Generation of bubbles in the applied resin can be achieved by use a vacuum press can be prevented. Furthermore, that can Resin thereby defoamed be that the applied resin is heated (e.g., 10 to 60 Minutes at 80 to 120 ° C), about the viscosity of the resin.

Although the entire surface of the printed circuit board with the resin layer [ 1B . 105 ] is covered by the above application according to the invention, in particular a recess (a recess or the like between the circuits) will also be provided [ 1B . 104 ] formed on the surface of the printed circuit board, and a through hole also with the resin applied [ 1B Conventionally, a resist, a prepreg, a semi-cured resin, an adhesive film and the coating material are coated without first filling the recess between the circuits of the printed circuit board with the resin.

However, if the recess between the circuits has not previously been filled, then it is difficult to fill the recess with the coating material, and the filling tends to be inadequate even if the recess between the circuits with the material for the Layer is filled by a vacuum press. Especially if a line and a room in one With high density circuits, it is difficult to fill the gap between the circuits with the coating material. Therefore, a gap is formed in the gap between the circuits to a small extent, and sometimes air is left in the gap. As a result, when the printed wiring board is treated at a high temperature (eg, 200 to 300 ° C) by melting or the like in case of fixing the components in an aftertreatment process, the remaining air expands and sometimes bubbles ( what is termed the "popcorn phenomenon") of the coating surface occurs [ 6E . 625 and 7C . 725 ].

On the other hand, if the space between the circuits is larger, then the space can be completely filled with the resin. However, when the space is completely filled with the resin, a coating material for a large volume of space between the circuits is used for filling, and as a result, formation of a notch sometimes occurs on the surface of the coated resin layer. 6E . 626 and 7C . 726 ]. Both the above-mentioned bubble and the notch of the coated surface significantly impair the flatness of the printed circuit board.

Therefore it is to maintain the high flatness of the printed circuit board of importance, not just the through hole of the printed circuit board, but also the recess on the surface of the printed circuit board (the gap between the circuits or the like) with the photo / thermosetting resin composition to fill.

• (1) eine Stufe der Abflachung der Oberfläche des aufgebrachten Harzes; und
• (2) eine Stufe der Photohärtung des aufgebrachten Harzes.

In the method for producing the flattened resin-coated printed wiring board of the present invention, the above-mentioned photo / thermosetting resin composition is applied and filled. Then, the following steps (1) and (2) are carried out in order:

• (1) a step of flattening the surface of the applied resin; and
• (2) a step of photocuring the applied resin.

Specifically, in step (1), the above-mentioned coated and filled printed circuit board is sandwiched between two cover films [ 1C . 106 ]. The cover film may be peeled off from the printed circuit board after a primary photocuring to be described later, and preferably penetrates the irradiation light well. Specific examples of the cover film include a PET film, a PEN film, a PP film, and a PE film. The film thickness of the cover films may be, for example, 10 to 200 (typically 25 to 100) μm.

Then, the printed circuit board covered with the above cover film is subjected to pressure-rolling. The pressure rolling may be performed by using, for example, a laminator or the like. That is, the printed circuit board covered with the above cover film is first sandwiched between two rollers [ 1D . 107 ].

In this case, an interval between the rollers is preferably set so that the layer thickness of the resin applied to the circuit of the printed circuit board [ 1I . 111 ] 0.1 to 10 (especially 0.1 to 5) microns after the curing of the resin. Further, the thickness of the resin layer applied to a base material of the printed circuit board is [ 1I . 112 ], preferably the thickness of a circuit copper foil plus 0.1 to plus 10 (especially plus 0.1 to plus 5) μm after curing of the resin. If the layer thickness of the cured resin is too small, then in some cases the roughened copper foil may not be sufficiently covered. On the other hand, when the cured resin layer is then polished to expose the surface of the copper foil, or when an opening to be described below is to be formed, too high a layer thickness of the cured resin tends to cause difficulty in polishing treatment or treatment Achieve an opening occur. As a result, problems such as the occurrence of variations in the dimensions of the printed wiring board or the residual of the resin in the opening occasionally occur. There may also be a large tolerance between the intended value and the actual value of the impedance.

The two rollers are moved on the entire surface of the respective cover films which have been applied to both surfaces of the printed circuit board while maintaining the above-mentioned roller interval [ 1D . 108 ].

When Lamination conditions can specifically, a lamination pressure of 0.01 to 10 (typically 0.1 to 1) MPa, a lamination rate of 0.1 to 10 (typically 0.3 to 3) m / minute, a lamination temperature of room temperature up to 150 ° C (typically 25 to 100 ° C) be applied.

In the method for producing the flattened resin-coated printed wiring board according to the present invention, the process (2) is carried out after the process (1) is carried out. Both sides of the printed circuit board are preferably irradiated with light in the process (2). In this case, both sides (front and back) of the printed circuit board can be irradiated with light at the same time and they can also be successively irradiated with light. The applied resin is irradiated with light by way of the cover film, and as a result, primary photocuring of the applied resin is carried out. 1E . 109 ].

As to the irradiation with light, the resin may be irradiated with light having a characteristic range of the absorption wavelength of the component [III] especially ultraviolet light having a wavelength of 200 to 400 nm at -20 to 80 ° C, the irradiation light amount being 0, 5 to 10 J / cm ² . The photocuring can also be carried out using a submerged exposure apparatus described in JP-A Nos. 9-6010 and 10-29247.

To photohardening of the above resin, each of the cover films on both surfaces of printed circuit board removed and removed.

In the method for producing the flattened resin-coated printed wiring board according to the present invention, steps (1) and (2) are completed as described above, and then the photo / thermosetting resin composition [ 1F . 105 ] also applied to the other surface of the printed circuit board. The resin may be applied to a surface of the printed circuit board in the same manner as in the previously described application.

• 3) eine Stufe der Wärmehärtung des photogehärteten Harzes.

Then the stage (1) [ 1G . 1H ] and the stage ( 2 ) are performed sequentially as described above. In the method for producing the flattened resin-coated printed circuit board according to the invention, the following step (3) is then carried out:

• 3) a step of thermosetting the photocured resin.

In the step (3), the applied resin primary-cured in step (2) is then secondarily heat-set to fully cure the resin [ 1I . 110 ]. The excellent properties in terms of heat resistance, solder resistance and adhesion of the cured resin and the printed wiring board or the like are obtained by the complete cure.

The Heating temperature in the step (3) is preferably not smaller as the starting temperature of the reaction (starting temperature of the secondary heat-setting) of Component [V] photo / thermosetting Resin composition. Specifically, the resin is preferably at 120 to 300 ° C (especially 140 to 200 ° C) Heated for 30 to 200 minutes.

As it has already been described above, it is that because it is not is necessary, the heat compression in the preparation of the invention the flattened resin coated printed circuit board (the is called, that it is not necessary, the heating and the pressing at the same time perform), a deformation of the resin can be prevented and that too a deterioration of the flatness of the printed circuit board can be prevented.

at the flattened, with resin coated printed circuit board, based on the above Way has been obtained is the maximum value of the difference of the projection or the above Parts and the recess of the surface in general 3 (typically 1) μm or fewer.

In the Flattened Resin Coated Printed Circuit Board of the Invention [ 1 ] fabricated in the above manner, the recess (specifically, the recess between the circuits and the like) and the through hole of the printed circuit board are filled with the cured resin, and the flattened resin-coated printed circuit board is hardened Resin layer (film) covered with extreme flatness and uniform surface.

Therefore is the thickness of the flattened, resin coated printed circuit board over the entire surface of the uniform printed circuit board, regardless of the circuit density, and the thickness of the applied Resin layer on the conductive Circuit layer (circuit copper foil) has been formed, is fixed.

A multilayer printed circuit board (in particular a four-layered printed circuit board) used as an inner layer material or the like the multilayer printed circuit board can be used produced by the fact that the abovementioned, flattened, Resin-coated printed circuit board according to the invention as a material is used.

• A) Durchführung der Stufe (3) und laminierende Verpressung der gedruckten Leiterplatte, wobei die gedruckte Leiterplatte sandwichartig zwischen Pressbindungsmaterialien angeordnet wird, um die Pressbindungsmaterialien mit der gedruckten Leiterplatte durch Verpressung zu verbinden.

That is, in the multilayer printed wiring board of the present invention, first, the photo / thermosetting resin composition is applied to a surface and the through hole of the printed wiring board. Steps (1) and (2) are successively performed, and the photo / thermosetting resin composition is then applied to the other surface of the printed circuit board. After the sequential execution of the steps (1) and (2), the following step A is performed.

• A) performing step (3) and laminating pressing the printed circuit board, wherein the printed circuit board is sandwiched between press bonding materials to press-bond the press bonding materials to the printed circuit board.

 at In the above step (A), first, the above is flattened, Resin-coated printed circuit board according to the invention as described above in a stage where the step (3) has been completed.

Then, the flattened resin coated printed circuit board of the invention with the flattened resin coated printed circuit board is sandwiched between the press bonding materials. 2A . 213 , the press-bonding materials are press-bonded to the flattened resin-coated printed circuit board of the present invention, and the flattened resin-coated printed circuit board of the present invention is sandwiched between press-bonding materials. 2A . 213 ], lamination and compression, whereby the press-bonding materials are bonded to the flattened resin-coated printed circuit board of the present invention by pressing. Examples of the press bonding materials include a prepreg, a copper foil with a resin, a semi-cured resin film, an adhesive sheet, a dry film and a resist, and typical examples thereof include the prepreg. The thickness of the press-bonding material may be, for example 50 to 100 microns. If necessary, a variety of press bonding materials can be used.

If the press bonding material is a semi-thermosetting resin, then becomes the lamination compression is preferably carried out under heating. If the photo / thermosetting resin composition to the secondary heat set or higher (In particular, the reaction start temperature of the constituent [V] or more) of the photo / thermosetting Resin composition is heated, then the stage (3) in the above manufacturing method for omitted the flattened resin coated printed circuit board become.

• B) Laminierende Verpressung der gedruckten Leiterplatte bei der Wärmehärtungstemperatur des photogehärteten Harzes oder höher, wobei die gedruckte Leiterplatte sandwichartig zwischen den Pressbindungsmaterialien angeordnet wird, wodurch gleichzeitig die Pressbindungsmaterialien pressverbunden werden und die Stufe (3) durchgeführt wird.

That is, in this case, the photo / thermosetting resin composition is first applied to a surface and into the through hole of the printed circuit board. Steps (1) and (2) are performed one after the other. Then, the photo / thermosetting resin composition is applied to the other surface of the printed wiring board, steps (1) and (2) are carried out in order, and then the following step (B) is carried out.

• B) laminating the printed circuit board at the thermosetting temperature of the photocured resin or higher, the printed circuit board being sandwiched between the press bonding materials, thereby press-bonding the press bonding materials simultaneously and performing step (3).

at the above step (B), the press bond (and a perfect Heat curing) of Press bonding material and secondary heat curing [i.e. the stage (3)] of photocured Resin carried out simultaneously, by at the heat curing temperature or above a laminating pressing is performed.

In the steps (A) and (B), the lamination pressing conditions are preferably, for example, 120 to 200 ° C (especially 135 to 180 ° C), 30 to 180 (especially 60 to 150) minutes, the pressure being 10 to 100 (especially 15 to 40) kp / cm ² .

For example, lamination molding may be performed by an open type laminator, a vacuum laminator, or the like. Furthermore, such laminators may be, for example, a hydraulic press and an autoclave press. Furthermore, the hydraulic press of the vacuum type, frame type, box type and the like.

In the manufacture of the multilayer printed wiring board of the present invention, after performing the above step (A) or (B), a hole is drilled in the wiring layer (eg, circuit layer) from the surface of the press bonding material to form a microwave [FIG. B 214 ] of a blind hole. The microwave is used as a conformal path for the interlayer connection with the circuit layer formed in a post process. For example, the hole means of a process may be performed using a laser (UV-laser, CO ₂ laser, excimer laser, Nd: YAG laser or the like) are drilled or a plasma treatment. It is preferred that the diameter of the microweg is, for example, 10 to 200 (in particular 20 to 70) μm.

Then, in the method of manufacturing the multilayer printed wiring board of the present invention, the entire area is plated [ 2C . 215 ]. It is preferable that the entire surface is plated on both surfaces. The exposed surface (the surface of the press-bonding material, the surface of the inner wall of the microgouse, the exposed surface of the conductor layer opened by the microg or the like) is covered with the plating layer by the plating on the entire surface. The plating layer is used for the interlayer connection or the post-process circuit and the like.

Regarding the plating of the entire surface it is first preferable to perform electroless plating to to produce a layer, called a sub-layer, and continue to perform electrolytic plating. Examples for the Designation "plating" when de-energized Plating and electrolytic plating include Plating with copper, plating with nickel, plating with gold, a plating with nickel-gold and a plating with solder one. The plating agent may also be the same or it may be two Types of it are combined. It is to be preferred in that the layer thickness of the electroless plating is 0.1 to 10 (in particular 0.5 to 5) μm is and that the layer thickness of the electrolytic plating is 10 to 50 (especially 15 to 30) microns is.

Then, in the method of manufacturing the multilayer printed circuit board of the present invention, a circuit 2D . 216 ] of the above-mentioned total surface plating layer. For example, the formation of the circuit or of the circuit can be effected by a subtractive method, an additive method or the like.

Thereafter, in the method of manufacturing the multilayer printed circuit board of the present invention, the surface is covered with a resist [ 2E . 217 ]. Examples of the resist include a solder resist, a polyimide resist, and a polyimide film. A typical example is a solder resist.

Of the Resist can be obtained, for example, by a photographic process to be applied in which the exposing and developing using a photosensitive resist ink or a dry film and a printing method using a resist ink or the like is performed.

An opening part may be formed on the resist if necessary. In this case, the exposure / developing of the ink is performed so as to obtain a resist pattern having an opening part. Specifically, the opening of the resist to achieve a support part [ 2E . 218 ] and / or a contact partly [ 2E . 219 ] are formed in the multilayer printed circuit board. In this case, the multilayer printed wiring board is covered with a resist except for the support and contact parts.

An overlay plating [ 2F . 220 ] and / or contact plating [ 2F . 221 ] can be further applied to the surface of the overlay and / or the surface of the contact member exposed from the opening of the resist to improve the abrasion resistance. For example, with respect to overlay plating and / or contact plating, nickel may be plated and then gold may still be plated. The layer thickness of the plating is preferably 0.1 to 20 (especially 0.5 to 10) μm.

Regarding the multilayer printed circuit board [ 2F According to the invention manufactured in the manner described above, regardless of the circuit density of a core part (that is, a part corresponding to the flattened resin-coated printed circuit board used as the material), there are no bubbles and Notches exist on the entire surface and that an extremely excellent flatness is obtained. The thickness of the insulating layer (the hardened resin layer and the layer of the press bonding material) formed on the conductive circuit layer (circuit copper foil) of the core member is also fixed in an extreme manner.

The printed circuit board (particularly the double-sided printed circuit board) usable as a base material for an outer layer or the like of the multilayer printed wiring board can be manufactured by using the flattened resin-coated printed circuit board of the present invention as a material. That is, in the method of manufacturing the printed wiring board according to the present invention, the photo / thermosetting resin composition is applied to a surface and into the through hole of the printed wiring board, and steps (1) and (2) are successively performed. The photo / thermosetting resin composition is then applied to the other surface of the printed circuit board and, in turn, steps (1) to (3) are carried out to first obtain a flattened resin coated printed circuit board according to the invention [ 3A ].

The opening is then formed in the layer of the coated resin (cured resin) of the flattened resin coated printed circuit board. In this aspect, the coated resin layer acts as a resist [ 3B ].

The opening of the coated resin layer may be formed by a method using a laser (a UV laser, a CO ₂ laser, an excimer laser, a Nd: YAG laser or the like) or a plasma treatment as described above , Specifically, the opening of the coated resin layer can be formed by forming a support [ 3B . 318 ] and / or contact part [ 3B . 319 ] is placed in the printed circuit board. Furthermore, a pad plating [ 3C . 320 ] and / or contact plating [ 3C . 321 ] applied to the surface of the support and / or the surface of the contact part.

With reference to the printed circuit board according to the invention 3C ] produced in the above-described manner, there are no bubbles and nicks on the surface, and extremely excellent flatness is obtained. Therefore, the printed circuit board has excellent positional accuracy when mounting high density microcomponents, and the entire printed circuit board has a uniform thickness regardless of the circuit density, and the entirety (all areas) of the printed circuit board is coated with a flat resin layer (especially a solder -Resistfilm). As a result, the printed circuit board also has excellent underfill entry characteristics when BGA (ball grid array) is mounted with a close pitch, for example, BGA whose pitch of the bump is 100 μm or less.

The invention has been described above. However, those skilled in the art can easily modify and extend the invention. For example, in the manufacturing method of the multilayer printed wiring board of the present invention, "a plating resist [ 4A . 422 ] and the plating [ 4B . 415 ] can be applied to a part that is not covered with the plating resist to form the circuit [ 4C . 416 instead of "applying total surface plating and forming the circuit from the plating layer."

Farther Can the multilayer printed circuit board with the desired Number of layers produced by that individual Production steps in the process for producing the multilayer inventive be repeated printed circuit board.

Furthermore, in the method for producing the multilayer printed circuit board according to the present invention, the term "copper foil with resin" [ 5A . 523 and 524 In this case, the "total surface plating" of the after-treatment process may also be omitted ( 5 ).

The desired multilayer printed circuit board with plugged holes where the number of layers is greater and the layer structure is more complicated, can be made by that in appropriate Way a plurality of flattened, resin-coated printed Printed circuit boards, of multilayer printed circuit boards and of printed circuit boards of the invention as base material for the inner Layer or as a base material for the outer layer be combined and that the compilation then laminated becomes.

Farther can in any manufacturing method according to the invention a other adhesive film and another coating material or a copper foil with the resin can be used instead of the prepreg and as a result can be a multi-layer printed circuit board with plugged Holes with the desired Structure are produced.

Farther can, although the step (1) with a pressure roller using the Cover film in the production process according to the invention described other objects (a shape, a plate, a Foil and others), which are different than a film. Furthermore you can other methods that are capable of the surface of the flattened resin, instead of a pressure roller treatment be applied.

[Examples]

below the invention will be specifically described in the examples with reference to the drawings further described.

<Preparation of the photo / thermosetting Resin composition>

- Production Example 1

The ingredients listed below were stirred and mixed. Then, the resulting mixture was uniformly dispersed in a three-roll mill. The obtained uniform dispersion was defoamed in vacuo to prepare a photo / thermosetting resin composition (Preparation Example 1)
Photo / thermosetting resin composition (parts by weight):
40% (meth) acrylic adduct of a dicyclopentadiene phenol type epoxy resin (100), dicyclopentanyl methacrylate (30), trimethylolpropane triacrylate (70), dipentaerythritol hexaacrylate (80), 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane 1-one (10), diethylthioxanthone (1), bisphenol A type epoxy resin (80), bisphenol AD type epoxy resin (20), dicyandiamide (10), silica (250), surface-treated colloidal silica (6) and polydimethylsiloxane (3).

<Preparation of thermo / thermosetting Resin composition>

- Production example 2

The ingredients listed below were stirred and mixed. Then, the resulting mixture was uniformly dispersed in a three-roll mill. The obtained uniform dispersion was defoamed in vacuo to prepare a photo / thermosetting resin composition (Production Example 2).
Thermo / thermosetting resin composition (parts by weight):
Triphenylmethane type epoxy resin (19), N, N, O-tris (glycidyl) -p-aminophenol (28), dicyandiamide (2), epoxy resin-amine adduct (1), aluminum hydroxide (49), bentonite (0.5) , Polydimethylsiloxane (0.5).

 <Production of the printed circuit board>

- Example 1

It was a double-sided printed circuit board [thickness of a copper circuit: 40 μm, line / distance (L / S) 20 μm / 40 μm, diameter of the through hole after plating 100 μm], and the circuit layers [ 1A . 102 ] on both surfaces of a base material [thickness. 0.930 mm, 1A . 101 ], and copper plating was formed on the inner wall of the through hole [ 1A . 103 ] used. A double-sided printed circuit board was used with the surface of a conductive layer (circuit and copper plating of the inner wall of the through hole) previously subjected to a roughening treatment called "MECetch-BOND CZ-8101" (manufactured by MECetchBOND CO. LTD., Roughening chemicals) had been.

A screen printing was applied to the photo / thermosetting resin composition (Production Example 1) [ 1B . 105 ] according to the pressure conditions shown in the following Table 5 and the pho thermosetting resin composition was applied to the entire area of a surface (previous side) of the above-mentioned printed circuit board. The through hole and the gap between the circuits [ 1B . 104 ] was filled and the hole was sealed with the photo / thermosetting resin composition. Table 5

Then The printed circuit board was left in a box dryer for 30 minutes at 80 ° C heated, with the printed circuit board on a horizontal frame was brought to the viscosity to reduce and to remove bubbles in the applied resin. The applied photo / thermosetting resin composition (Production Example 1) was inspected by means of a microscope at 50X magnification and the microscopic inspection confirmed the absence of bubbles between circuits or between the circuits.

Then, the printed circuit board was subjected to a laminating apparatus with the printed circuit board sandwiched between PET films. 1C . 106 ], which had a film thickness of 100 μm. In the film-covered printed circuit board sandwiched between two rollers [ 1D . 107 ] made of stainless steel (lamination pressure: 0.1 MPa, lamination speed: 0.5 m / min, lamination temperature: 100 ° C), the rolls were moved on the film [ 1D . 108 ]. In this way, the coated resin layer formed on the surface of the printed circuit board was flattened and thinned [ 1D ].

Then, the above-mentioned printed circuit board was subjected to light irradiation at an exposure of 1200 mJ / cm ² using a high pressure mercury arc lamp to produce a primary photocured material [ 1E . 109 ]. The above-mentioned PET films stacked on both surfaces were peeled off and removed [ 1E ].

Then, the back surface (following surface) of the above printed wiring board was also treated in the same manner as in the previous page. That is, a screen printing was applied to the photo / thermosetting resin composition (Production Example 1) [ 1F . 105 ] was applied in accordance with the printing conditions shown in Table 5, and the photo / thermosetting resin composition was applied to the entire surface of the other sides (following surface) of the above printed circuit board. The gap between the circuits [ 1F . 104 ] was filled with the photo / thermosetting resin composition.

Then The printed circuit board was left in a box dryer for 30 minutes at 80 ° C heated, with the printed circuit board on a horizontal frame was brought to the viscosity to reduce and to remove bubbles in the applied resin. The applied photo / thermosetting resin composition (Production Example 1) was inspected by means of a microscope at 50X magnification and the microscopic inspection confirmed the absence of bubbles between circuits or between the circuits.

Then the printed circuit board was sandwiched between PET films [ 1G . 106 ] with a film thickness of 100 microns. With the film-covered printed circuit board sandwiched between two rollers [ 1G . 107 ] made of stainless steel (lamination pressure: 0.1 MPa, lamination speed: 0.5 m / min, lamination temperature: 100 ° C), the rolls were moved on the film [ 1G . 108 ]. In this way, the resin layer formed on the surface of the printed wiring board was flattened and thinned. [ 1H ].

Then, the above-mentioned printed circuit board was subjected to light irradiation at an exposure of 1200 mJ / cm ² using a high-pressure mercury arc lamp to prepare a primary photocured material. The above-mentioned PET films stacked on both surfaces were peeled off and removed [ 1E ].

Thereafter, the printed wiring board was heated at 150 ° C for 30 minutes to carry out the secondary heat curing of the photocured resin [ 1I . 110 ], whereby a flattened, resin-coated printed circuit board (Example 1) according to the invention was obtained, the total thickness of which was 1.018 mm 1I ] amounted to.

- Example 2

It became a double-sided printed circuit board [thickness of a copper circuit: 40 μm, (L / S) 20 μm / 40 μm, diameter of the through hole after plating: 100 μm] used in the circuit layers on both surfaces of a base material having a thickness of 0.930 mm were, and a copper plating on the inner wall of the through hole had been formed. It was a double-sided printed circuit board used, with the surface a conductive Layer (circuit and copper plating of the inner wall of the through-hole) previously a roughening treatment called "MECetchBOND CZ-8101 "subjected had been.

One Screen printing was applied to the photo / thermosetting resin composition (Production Example 1) in the following Table 5 Applied pressure conditions using a vacuum printing machine and the photo / thermosetting resin composition was on the entire surface of a surface (previous surface) applied to the above printed circuit board. The through hole and the Gap between the circuits were filled and the hole was filled with the photo / thermosetting Resin composition plagued.

Then The printed circuit board was subjected to a laminator, wherein sandwiched the printed circuit board between PET films a film thickness of 100 microns With the film-covered circuit board, the sandwiched between two rollers, Herge made of stainless steel, arranged was (lamination pressure: 0.1 MPa, lamination speed: 0.5 m / min, lamination temperature: room temperature), the rolls became moved on the movie. In this way, the applied resin layer, the on the surface the printed circuit board had been formed, flattened and diluted.

Then, the above-mentioned printed circuit board was subjected to light irradiation at an exposure of 1200 mJ / cm ² using a high-pressure mercury arc lamp to prepare a primary photocured material. The above PET films stacked on both surfaces were peeled off and removed.

Subsequently was the back surface (following surface) the above printed circuit board also in the same way and how the previous surface is treated. That is, a screen printing was applied to the photo / thermosetting resin composition (Production Example 1) in the case shown in Table 5 below Applied pressure conditions using a vacuum printing machine and the photo / thermosetting resin composition was on the entire surface the other surface (following surface) applied to the above printed circuit board. The recess between the Circuits were made with the photo / thermosetting resin composition filled.

Then The printed circuit board was sandwiched between PET films with a film thickness of 100 μm arranged. With the printed circuit board covered with the film, sandwiched between two stainless steel rollers was (lamination pressure: 0.1 MPa, lamination speed: 0.5 m / min, Lamination temperature: room temperature), the rolls were placed on the Moved film. In this way, the applied resin layer, the on the surface the printed circuit board had been formed, flattened and diluted.

Then, the above-mentioned printed circuit board was subjected to light irradiation at an exposure of 1200 mJ / cm ² using a high-pressure mercury arc lamp to prepare a primary photocured material. The above PET films stacked on both surfaces were peeled off and removed.

hereupon the printed circuit board was heated to 150 ° C for 30 minutes, to a secondary Heat curing of photocured Perform resin, whereby a flattened, resin coated printed circuit board (Example 2) according to the invention made with a total thickness of 1030 mm.

- Example 3

The above printed circuit board (Example 1) was used as a base material for producing a four-layered printed circuit board. That is, first, both surfaces of the above printed circuit board (Example 1) were treated with prepregs [ 2A . 213 ] was covered with a thickness of 0.1 mm so that the printed circuit board was sandwiched between the prepregs.

hereupon was according to the press conditions Table 6 heated the above printed circuit board and Pressed in a vacuum to bind the prepregs by compression.

Table 6

Then, a laser was irradiated from the surface of the prepreg of the above printed circuit board to expose a circuit layer [ 2 B and 202 ], whereby a microgrow (path diameter: 70 μm) was formed [ 2 B . 214 ] [ 2 B ].

Then, copper plating (first electroless copper plating followed by electrolytic copper plating) was performed on both surfaces of the above-mentioned printed circuit board and the surface of the inner wall of the microwave [ 2C . 215 ] and the surface of the path and the prepreg were covered with the copper foil to form a double-sided copper clad laminate. The plating thickness of the electroless copper plating and the electrolytic plating were 1 μm and 14 μm, respectively.

Then a circuit [ 2D . 216 ] is formed on both surfaces of the above double-sided copper clad laminate as follows. First, an etch resist was formed by a dry film (laminate) method. That is, the dry film was laminated on both surfaces of the above double-sided copper clad laminate, and a negative-type film (pattern mask) was superimposed thereon. The dry film was then exposed by means of an ultra-high pressure mercury lamp and cured.

Then became a carrier film of the dry film and a developing solution (1% sodium carbonate) was from a spray nozzle on the exposed surface of the resist sprayed on and a development has been done. This was the surface of the Resists washed to form a resist pattern.

Then, an etching was performed. That is, an iron (III) chloride solution (36 wt%) was coated on both surfaces of the above resist covered with the double-sided copper clad laminate The spray nozzle was sprayed on and unnecessary copper foil was released and removed. A 3% sodium hydroxide solution was sprayed from the spray nozzle after completion of the above etching and the etch resist was washed away, causing the etch resist to swell.

After the formation of the circuit as described above, a solder resist ink was applied to form a solder resist [ 2E . 217 ]. That is, an ultraviolet ray / thermosetting acrylate / epoxy resin was first screen-printed on both surfaces with a circuit formed thereon by a squeegee (hardness of the squeegee: 75) by way of a Tetron screen of 150 mesh.

Then, after pre-baking the resin in a hot air drying oven, a negative film was stuck on the resin and the resin was exposed (300 mJ / cm ² ) and cured. The resin was developed by means of a 1% sodium carbonate solution (30 ° C, 2.5 kg / cm ² ) to form an opening (pad part). 2E . 218 ]) and a contact part [ 2E . 219 ] to build. Then the resin became 30 Heated to 150 ° C for minutes and thermoset.

Then the edition part [ 2E . 218 ] and the contact part [ 2E . 219 ] was first applied to electrolytic nickel and then gold plating was performed [ 2F . 220 and 221 ].

As described above, a four-layer printed circuit board (Example 3) was 2F ] according to the invention, in which the thickness of the insulating layer formed on a circuit-rich part in the core part was fixed (uniform) and the thickness of the insulating layer formed on a circuit-poor part was fixed (uniformly was). No blisters and notches existed on the entire surface. The entire material was flat.

- Example 4

The above printed circuit board (Example 2) was used as a base material to make a double-sided printed circuit board. That is, the covering cured resin layer [ 3A . 310 ] of the above printed circuit board (Example 2) was first irradiated with a laser to form a copper foil of a circuit layer in a pad part [ 3B . 318 ] and a contact part [ 38 . 319 ] [ 3B ] uncover.

Then the edition part [ 3C . 318 ] and the contact part [ 3C . 319 ] is first applied to electrolytic nickel and subsequently subjected to electrolytic gold plating [ 3C . 321 ].

As described above, a double-sided printed wiring board according to the present invention (Example 4) in which the thickness of the insulating layer formed on a circuit rich part was fixed (uniform) was the thickness of the insulating layer was formed on the circuit-poor part, was fixed (uniform), and in which there were no bubbles and notches on the entire surface. The entire assembly was flat and the total thickness was 1.030 mm [ 3C ].

Comparative Example 1

A double-sided printed circuit board [thickness of the copper circuit: 40 μm, (L / S) 20 μm / 40 μm, diameter of the through hole after plating: 100 μm] was used, in the circuit layers [ 6A . 602 ] on both surfaces of a base material [ 6A . 601 ] were formed with a thickness of 0.930 mm. Copper plating was formed on the inner wall of the through hole. A double-sided printed circuit board was used in which the surface of a conductive layer (circuit and copper plating of the inner wall of the through-hole) had previously been subjected to a roughening treatment with MECetchBOND CZ-8101.

A screen printing was applied to a thermo / thermosetting resin composition (Production Example 2) [ 6A . 605 ] was applied to the above printed circuit board according to the printing conditions shown in Table 5. Only the through hole was filled and the hole was purged with the resin without filling the gap between the circuits with the resin.

Then, after the above printed wiring board was heated at 130 ° C for 60 minutes to form a primary thermoset resin [ 6B . 609 ] [ 6B ], both surfaces of the above printed First polish the circuit board once with a ceramic abrasive material No. 400 and then continue with the abrasive material No. 600 4 times [ 6C ] polished.

Then, both surfaces of the above printed wiring board were covered with prepregs [FIG. 613 ], with the printed circuit board sandwiched between the prepregs. The thickness of the prepreg was 0.1 mm.

Then, the above printed wiring board was subjected to a vacuum-heating pressing process under the press conditions shown in Table 6, and the press-bonding of the prepreg and secondary heat-curing of the primary heat-cured resin were simultaneously carried out to prepare a printed wiring board. 6E ] (Comparative Example 1)

The following defects were observed in the obtained printed circuit board (Comparative Example 1). That is, the filling due to the prepreg was insufficient in the circuit rich part of L / S = 20 μm / 40 μm. This left air between the circuits and the surface swelled to [ 6E . 625 ].

Further, although the filling was perfect due to the prepreg in the low-current part of L / S = 20 μm / 200 μm, a notch occurred due to the filling and consumption of the prepreg between the circuits. 6E . 626 ].

Comparative Example 2

The The above printed circuit board (Comparative Example 1) was used as a base material for the Production of a four-layer printed circuit board used. This means, the four-layered printed circuit board (Comparative Example 2) was in the same manner as in the case of Example 3 with the exception that the material of the comparative example 1 as a printed circuit board instead of the material of the example 1 was used.

However, bubbles [ 6E . 625 ] and notches [ 6E . 626 ] on the surface of the printed wiring board (Comparative Example 1) of the base material (core base material). This resulted in the formation of bubbles [ 9A . 925 ] and notches [ 9B . 926 ] also on the surface of the thus prepared four-layer printed circuit board (Comparative Example 2).

<Production of a Printed Circuit Board with BGA component formed as a bump thereon>

- Production example 1 and comparative preparation example 1

The Bump bonding the bump hill [Mean of height of the bump hill: 33.4 μm and standard deviation of height of the bump hill: 1.5] in a BGA component and the support part of the four-layered printed circuit board (each of Example 3 and Comparative Example 2) was carried out a BGA component, with a printed circuit board attached (respectively of Preparation Example 1 and Comparative Preparation Example) 1)

<Determination of the characteristic properties the printed circuit board>

The individual printed circuit boards were subjected to a measurement and on the thickness of the hardened Films of the respective applied resins on the circuit and of the base material (Examples 1 and 2, respectively). Farther were the maximum bubbles and the maximum notches on the surface of the (four-layer) printed circuit board (each of the examples 1 and 2, of Comparative Example 1, Production Example 1 and Comparative Preparation Example 1), the standard deviation (Size of the fluctuation the thickness in each part of the printed circuit board) of the flatness the (four-layer) printed circuit board (each of the examples 1 and 2, of Comparative Example 1, Production Example 1 and Comparative Production Example 1), the average value of Height of bump (Production Example 1 and Comparative Production Example 1) the mounting of the BGA component and the bump bond capability (Production Example 1 and Comparative Production Example 1).

The for the Determination used BGA device had a size of 16.0 mm × 16.0 mm, a thickness of the plate of 0.4 mm, a bump distance of 75 μm and a number of bumps from 148.

Table 7

Table 8

In In Tables 7 and 8, "bubble value" and "notch value" respectively mean the height of the bubble or the depth of the notch when using a surface part (this means a flattened surface part) as reference surface, at the no blistering and notching on the surface of the (four-layer) printed circuit board was done.

The Thickness of the cured Film of the applied resin, bubbles and notches on the surface as well as the height the bump hill after mounting the BGA component were measured according to the cross-sectional method. The standard deviation the flatness of the surface the printed circuit board (each of Examples 1 and 2 and the Comparative Example 1) were calculated by using a grid with an interval of 2 mm on the surface of the printed circuit board was applied and that the entire thickness of the printed circuit boards in the intersections of 25 pieces were measured in the vertical direction and in horizontal Direction had been laid. The standard deviations of the flatness of the surface the four-layer printed circuit board (each of Example 3 and of Comparative Example 2) were calculated that the Total thickness measured in each overlay plating part on the surface has been.

The bump bondability was determined as follows. If the average "h" (= 33.4 μm) of the height of the bump before the bump bond, the average "h" of the height of the bump after the bump bond (after mounting the BGA component), the standard deviation "s" of Flatness of the surface of the four-layered printed wiring board and the standard deviation "ρ" (= 1.5) of the height of the bump before the bump bonding satisfies the condition of the equation (1) in Table 9, then the bump bonding ability has been judged as "(good bump bonding)." If the parameters satisfied the relationship of equation (2), then the bump bondability was referred to as "x (poor bump bondability)". In the equation (1) or (2), the left side represents the amount of the shattered bump (hereinafter also sometimes referred to as "bump shattering" for convenience), and the right side represents the total sum fluctuation amount (hereinafter, occasionally for simplicity) "Fluctuation") of the fluctuation of the flatness of the surface of the four-layered printed circuit board and the fluctuation of the height of the bump. Table 9

The Tables 7 and 8 clearly show the following. That is, the flattened, resin coated printed circuit boards (example 1 and 2) and the four-layer printed circuit board (Example 3) according to the present Invention have a smaller concavity and convexity on the surface the printed circuit board (since the sum of the maximum bubble value and the maximum notch value is small) than the conventional ones (four-layer) printed circuit board (Comparative Example 1 and Comparative Preparation Example 1) and an extremely flattened surface (because the standard deviation of flatness is smaller).

Farther it is such that when the BGA component is mounted (Bond Hill-bound is) on the four-layer printed circuit board (example 3) according to the present Invention (Production Example 1), the "fluctuation" by the "fragmentation of the bump " can (as the total amount of destruction of the bump or the total extent of destruction the bump hill is larger as the total sum or the total sum of the fluctuations), so that by this all bumps be bound with security.

on the other hand can when the BGA component is mounted (bump-bound will) on the conventional Four-layer printed circuit board (Comparative Example 2) (Comparative Production Example 1), the "fluctuation" not by the "smashing of the bump " (as the amount or extent of the destruction the bump hill is less than the total sum or the total sum of the fluctuations), leaving some bumps can not be tied.

That is, it can, as in 9A is shown, if the bubble is too big, a bump 932a in the bubble 925 does not exist, is crushed to the extent that a pad plating 920 on a bump 932b can be bound (and that is because of the amount or extent of the "breakup of the bump" of the bump 932a already reached a limit). As a result, a bump bond of the bump 932b and pad plating 920 not be carried out.

Likewise, as in 9B shown, if the notch is too big, the bump 932a can not be smashed to the extent that the pad plating 920 that in the notch 926 exists, with the bump hill 932b (This is because the amount or extent of the "breakup of the bump" of the bump 932a already reached the limit). As a result, a bump bond of the bump 932b with the pad plating 920 not be carried out.

Claims (7)

A method of manufacturing a printed circuit board, comprising the steps of: applying a photo / thermosetting resin composition to a surface and the through hole of a printed circuit board having the through hole; successively performing the following steps (1) and (2); Applying the photo / thermosetting resin composition to the other surface of the printed circuit board; and successively performing the following steps (1) to (3) (1) flattening the surface of the applied resin; (2) photocuring the applied resin; and (3) thermosetting the photocured resin. Method for producing a multilayer printed Printed circuit board comprising the steps: Applying a photo / thermosetting Resin composition on a surface and the through hole a printed circuit board having the through hole; successively performing the following stages (1) and (2); Apply the photo / thermosetting Resin composition on the other surface of the printed circuit board; successively performing the following stages (1) and (2); (A) first performance of the next step (3), next laminating pressing of the printed circuit board with press-bonding materials, the printed circuit board being sandwiched between the press-bonding materials is arranged, or (B) laminating pressing of the printed Printed circuit board with the press-bonding materials at the heat-curing temperature or higher of the photohardened Resin, the printed circuit board sandwich-like between the press-bonding materials is arranged to be in this way to carry out the said step (3); Form a hole from the surface of the press-bonding material to a conductor layer to form a microgrow; apply a total surface plating; Form a circuit of a plating layer; and stack a resist; (1) flattening or leveling the surface of the applied resin; (2) photocuring the applied resin; and (3) thermosetting the photocured Resin. Method for producing a multilayer printed A circuit board according to claim 2, wherein the resist has an opening. Method for producing a printed circuit board, comprising the stages: Applying a photo / thermosetting Resin composition on a surface and the through hole a printed circuit board having the through hole; successively performing the following stages (1) and (2); Apply the photo / thermosetting Resin composition on the other surface of the printed circuit board; and successively performing the following steps (1) to (3) and: Forming an opening in the coated resin layer: (1) flatten or match the surface the applied resin; (2) photocuring the applied resin; and (3) thermosetting the photocured Resin. Method for producing a printed circuit board according to claim 3 or 4, wherein a surface exposed by the opening with a plating is covered. Method for producing a printed circuit board according to one of the claims 1 to 5, the surface a conductive layer of the printed circuit board with the through hole is roughened. Printed circuit board manufactured according to the manufacturing process according to one of the claims 1 to 6.