DE102004002708A1 - Sortierhandler für Burn-In-Tester - Google Patents

Sortierhandler für Burn-In-Tester Download PDF

Info

Publication number
DE102004002708A1
DE102004002708A1 DE102004002708A DE102004002708A DE102004002708A1 DE 102004002708 A1 DE102004002708 A1 DE 102004002708A1 DE 102004002708 A DE102004002708 A DE 102004002708A DE 102004002708 A DE102004002708 A DE 102004002708A DE 102004002708 A1 DE102004002708 A1 DE 102004002708A1
Authority
DE
Germany
Prior art keywords
burn
devices
board
test
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102004002708A
Other languages
English (en)
Other versions
DE102004002708B4 (de
Inventor
Seong Bong Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mirae Corp
Original Assignee
Mirae Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mirae Corp filed Critical Mirae Corp
Publication of DE102004002708A1 publication Critical patent/DE102004002708A1/de
Application granted granted Critical
Publication of DE102004002708B4 publication Critical patent/DE102004002708B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Sortierhandler für einen Burn-In-Tester, enthaltend zwei DC-Testteile (131, 132) bzw. zwei Entladepuffer (141) 142) auf gegenüberliegenden Seiten einer Burn-In-Platine (B) an einem Arbeitsplatz in einer Linie mit einer Hauptarbeitslinie (ML), je ein Paar Ladeteile (110, 120) zur Zufuhr neuer Vorrichtungen und Entladeteile (115, 125) zur Aufnahme von Vorrichtungen, welche sich in einem Test als gut erwiesen haben, an jedem Seitenteil eines Grundkörpers (101), so dass zwei Einfüge-/Entfernungspicker (162, 163) eine Arbeit kontinuierlich ausführen, bei welcher zwei Einfüge-/Entfernungspicker (162, 163) sich längs der Hauptarbeitslinie (ML) in beiden Richtungen mit Bezug auf die Burn-In-Platine (B) bewegen, um die Vorrichtungen von der Burn-In-Platine (B) zu entnehmen und zu testende Vorrichtungen wiederum in den Raum einsetzen, wodurch eine Testproduktivität pro Einheitszeitdauer verbessert wird.
DE102004002708A 2003-09-18 2004-01-19 Sortierhandler für Burn-In-Tester Expired - Fee Related DE102004002708B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0064836A KR100491304B1 (ko) 2003-09-18 2003-09-18 번인 테스터용 소팅 핸들러
KR10-2003-0064836 2003-09-18

Publications (2)

Publication Number Publication Date
DE102004002708A1 true DE102004002708A1 (de) 2005-04-21
DE102004002708B4 DE102004002708B4 (de) 2006-08-31

Family

ID=34309442

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004002708A Expired - Fee Related DE102004002708B4 (de) 2003-09-18 2004-01-19 Sortierhandler für Burn-In-Tester

Country Status (5)

Country Link
US (2) US6882141B2 (de)
KR (1) KR100491304B1 (de)
CN (1) CN1306581C (de)
DE (1) DE102004002708B4 (de)
TW (1) TWI252209B (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100541395B1 (ko) 2003-09-09 2006-01-11 삼성전자주식회사 반도체칩 적층장치, 이것을 이용한 반도체 패키지의제조방법, 그리고 이러한 방법에 의하여 제조된 반도체패키지
US7151388B2 (en) * 2004-09-30 2006-12-19 Kes Systems, Inc. Method for testing semiconductor devices and an apparatus therefor
US7196508B2 (en) * 2005-03-22 2007-03-27 Mirae Corporation Handler for testing semiconductor devices
CN100373574C (zh) * 2005-05-30 2008-03-05 京元电子股份有限公司 晶粒拾取分类装置
KR100652417B1 (ko) * 2005-07-18 2006-12-01 삼성전자주식회사 인-트레이(Ｉｎ-ｔｒａｙ) 상태의 반도체 패키지 검사장치및 검사방법
EP1752778A3 (de) * 2005-08-09 2008-10-29 Mirae Corporation IC-Sortierer
KR100706330B1 (ko) * 2005-08-18 2007-04-13 (주)테크윙 테스트 핸들러
CN101208606B (zh) * 2005-08-31 2011-07-13 平田机工株式会社 工件装卸装置
US7293487B2 (en) * 2005-11-15 2007-11-13 3M Innovative Properties Company Cutting tool having variable and independent movement in an x-direction and a z-direction into and laterally along a work piece for making microstructures
US7420385B2 (en) * 2005-12-05 2008-09-02 Verigy (Singapore) Pte. Ltd. System-on-a-chip pipeline tester and method
KR100800312B1 (ko) * 2006-01-25 2008-02-04 (주)테크윙 테스트핸들러 및 테스트핸들러의 로딩방법
KR100706138B1 (ko) * 2006-02-21 2007-04-12 우 옵트로닉스 코포레이션 번인 장비
US7589545B2 (en) * 2006-03-01 2009-09-15 Atmel Germany Gmbh Device for final inspection
DE102006009321A1 (de) * 2006-03-01 2007-09-06 Atmel Germany Gmbh Vorrichtung für die Endmesstechnik
KR101188841B1 (ko) * 2006-06-13 2012-10-08 미래산업 주식회사 번인 소터 및 이를 이용한 번인 소팅 방법
TWI344189B (en) * 2006-11-22 2011-06-21 Mirae Corp Method for transferring test trays in a handler
KR100857911B1 (ko) * 2007-02-01 2008-09-10 미래산업 주식회사 반도체 소자 테스트 핸들러용 소팅장치 및 소팅방법
KR100820357B1 (ko) * 2007-02-14 2008-04-08 미래산업 주식회사 전자부품 테스트용 핸들러
CN101284600B (zh) * 2007-04-12 2011-07-06 威光自动化科技股份有限公司 可作为输送及检测界面的载盘传递装置
KR101335916B1 (ko) * 2007-07-11 2013-12-03 삼성전자주식회사 테스트 장치
US7783447B2 (en) * 2007-11-24 2010-08-24 Kingston Technology Corp. Chip handler with a buffer traveling between roaming areas for two non-colliding robotic arms
KR100938172B1 (ko) * 2007-12-28 2010-01-21 미래산업 주식회사 핸들러, 반도체 소자 로딩방법, 테스트트레이 이송방법, 및반도체 소자 제조방법
KR100930260B1 (ko) * 2008-01-18 2009-12-09 에이엠티 주식회사 테스트 핸들러 및 그 동작 방법
WO2009107231A1 (ja) * 2008-02-29 2009-09-03 株式会社アドバンテスト 電子部品移載装置およびそれを備えた電子部品試験装置
KR100981634B1 (ko) * 2008-05-23 2010-09-13 (주) 예스티 반도체패키지의 이송장치
KR100981637B1 (ko) * 2008-06-09 2010-09-13 (주) 예스티 트레이 공급장치
US7960992B2 (en) * 2009-02-25 2011-06-14 Kingston Technology Corp. Conveyor-based memory-module tester with elevators distributing moving test motherboards among parallel conveyors for testing
KR101103289B1 (ko) * 2010-04-19 2012-01-11 에이엠티 주식회사 번인 소터 및 그 동작 방법
TWI416652B (zh) * 2010-08-20 2013-11-21 Chroma Ate Inc With a single through the shuttle shuttle of the semiconductor components test machine
KR101149759B1 (ko) * 2011-03-14 2012-06-01 리노공업주식회사 반도체 디바이스의 검사장치
US20130146418A1 (en) * 2011-12-09 2013-06-13 Electro Scientific Industries, Inc Sorting apparatus and method of sorting components
WO2014011475A1 (en) * 2012-07-10 2014-01-16 Kla-Tencor Corporation Apparatus and method for in-tray and bottom inspection of semiconductor devices
TWI567845B (zh) * 2013-02-25 2017-01-21 泰克元有限公司 用於測試處理機的振動裝置
CN105364315A (zh) * 2014-08-19 2016-03-02 深圳市普尔信通讯设备有限公司 一种自动镭射机
KR101670814B1 (ko) * 2014-12-03 2016-10-31 주식회사 이노비즈 Ic제품 분류기
KR102401058B1 (ko) * 2015-05-12 2022-05-23 (주)제이티 소자핸들러
KR102391516B1 (ko) * 2015-10-08 2022-04-27 삼성전자주식회사 반도체 테스트 장치
WO2017119786A1 (ko) * 2016-01-07 2017-07-13 (주)제이티 이송툴모듈 및 그를 가지는 소자핸들러
TW201834104A (zh) * 2017-01-31 2018-09-16 南韓商宰體有限公司 半導體裝置的元件分類設備
KR20180092355A (ko) * 2017-02-09 2018-08-20 (주)테크윙 테스트핸들러용 테스트트레이 이송장치 및 테스트핸들러에서의 테스트트레이 이송방법
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10845410B2 (en) * 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
KR20200121187A (ko) * 2019-04-15 2020-10-23 주식회사 아테코 전자부품 테스트 핸들러의 스태커 및 이를 포함하는 전자부품 테스트 핸들러
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
CN116990618B (zh) * 2023-08-31 2024-08-16 江苏辰阳电子有限公司 一种充电器批量自动老化测试装置及其使用方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5307011A (en) * 1991-12-04 1994-04-26 Advantest Corporation Loader and unloader for test handler
WO1995034825A1 (fr) * 1994-06-15 1995-12-21 Advantest Corporation Sabot pour manipulateur de circuits integres
US5621312A (en) * 1995-07-05 1997-04-15 Altera Corporation Method and apparatus for checking the integrity of a device tester-handler setup
JP3494828B2 (ja) * 1996-11-18 2004-02-09 株式会社アドバンテスト 水平搬送テストハンドラ
TW369692B (en) * 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
KR100269948B1 (ko) * 1998-08-07 2000-10-16 윤종용 반도체 번-인 공정의 반도체 디바이스 추출/삽입 및자동분류장치
JP2000111613A (ja) * 1998-10-07 2000-04-21 Nippon Eng Kk バーンインボード用ローダアンローダ装置
JP4202498B2 (ja) * 1998-12-15 2008-12-24 株式会社アドバンテスト 部品ハンドリング装置
KR100295774B1 (ko) * 1999-04-08 2001-07-12 정문술 번인테스터용 소팅 핸들러
KR100312862B1 (ko) * 1999-04-30 2001-11-03 정문술 번인 테스터용 소팅 핸들러에서 번인보드 양측으로부터의 디바이스 로딩/언로딩하는 방법 및 그 장치
AU2002216506A1 (en) * 2000-12-21 2002-07-01 Andrew Corporation Dual polarisation antenna

Also Published As

Publication number Publication date
KR100491304B1 (ko) 2005-05-24
TWI252209B (en) 2006-04-01
US20050168214A1 (en) 2005-08-04
CN1306581C (zh) 2007-03-21
DE102004002708B4 (de) 2006-08-31
KR20050028221A (ko) 2005-03-22
US7268534B2 (en) 2007-09-11
CN1599049A (zh) 2005-03-23
US6882141B2 (en) 2005-04-19
US20050062463A1 (en) 2005-03-24
TW200512145A (en) 2005-04-01

Similar Documents

Publication Publication Date Title
DE102004002708A1 (de) Sortierhandler für Burn-In-Tester
EP1752778A3 (de) IC-Sortierer
EP1820754A3 (de) Regalsystem und Verfahren zur automatisierten Lagerung von Kleinstückgut
CA2124462A1 (en) Blood coagulation time test apparatus and method
EP2548706A1 (de) Greiferzange mit austauschbaren Greiferfingern
CN204892396U (zh) 集成电路ic测试与视觉检测一体机
CN204746888U (zh) 一种汽车门锁检测生产线上的不良品分拣设备
EP2043421A3 (de) Instandhaltung einer auswechselbaren Komponente einer Bestückvorrichtung
CN206871834U (zh) 一种船用集装箱绑扎件锁类产品自动化检测系统
GB0310280D0 (en) Washing test apparatus
DE202004009895U1 (de) Vibrations-Sortiergerät für Schrauben
CN207502671U (zh) Pcb板测试组合机
CN107765209A (zh) 一种双层兼容电能表和集中器的检定检测设备
CN208833813U (zh) 一种tft oled gamma烧录测试架
CN105093051A (zh) 一种电路板并行在线测试平台
CN207689532U (zh) 浮动接头组件和测试工装组件
DE202010002799U1 (de) Probenpräparationsmaschine
DE102015112566A1 (de) Bauteilehandhabungsvorrichtung, Verfahren zum Fördern von Bauteilen und System
DE885074C (de) Mitnehmerfoerderer
EP1087280A3 (de) Verfahren zur Ermittlung eines fehlerhaften Werkzeuges in einer Produktionsstrasse sowie Produktionsstrasse dazu
DE102004054127B4 (de) Materialprüfungsvorrichtung
KR100522089B1 (ko) 번인테스터용 소팅 핸들러 및 그 제어방법
EP1186900A3 (de) Anordnung zum Testen von integrierten Schaltkreisen
DE202017001365U1 (de) Optische Benutzerführung für eine zuverlässige Entnahme oder Bestückung von Schubladen
CN205426037U (zh) 用于pcb板厚度测试的装置

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee