DE102004002708A1 - Sortierhandler für Burn-In-Tester - Google Patents

Sortierhandler für Burn-In-Tester Download PDF

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Publication number
DE102004002708A1
DE102004002708A1 DE102004002708A DE102004002708A DE102004002708A1 DE 102004002708 A1 DE102004002708 A1 DE 102004002708A1 DE 102004002708 A DE102004002708 A DE 102004002708A DE 102004002708 A DE102004002708 A DE 102004002708A DE 102004002708 A1 DE102004002708 A1 DE 102004002708A1
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DE
Germany
Prior art keywords
burn
devices
board
test
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102004002708A
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English (en)
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DE102004002708B4 (de
Inventor
Seong Bong Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mirae Corp
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Mirae Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mirae Corp filed Critical Mirae Corp
Publication of DE102004002708A1 publication Critical patent/DE102004002708A1/de
Application granted granted Critical
Publication of DE102004002708B4 publication Critical patent/DE102004002708B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Sortierhandler für einen Burn-In-Tester, enthaltend zwei DC-Testteile (131, 132) bzw. zwei Entladepuffer (141) 142) auf gegenüberliegenden Seiten einer Burn-In-Platine (B) an einem Arbeitsplatz in einer Linie mit einer Hauptarbeitslinie (ML), je ein Paar Ladeteile (110, 120) zur Zufuhr neuer Vorrichtungen und Entladeteile (115, 125) zur Aufnahme von Vorrichtungen, welche sich in einem Test als gut erwiesen haben, an jedem Seitenteil eines Grundkörpers (101), so dass zwei Einfüge-/Entfernungspicker (162, 163) eine Arbeit kontinuierlich ausführen, bei welcher zwei Einfüge-/Entfernungspicker (162, 163) sich längs der Hauptarbeitslinie (ML) in beiden Richtungen mit Bezug auf die Burn-In-Platine (B) bewegen, um die Vorrichtungen von der Burn-In-Platine (B) zu entnehmen und zu testende Vorrichtungen wiederum in den Raum einsetzen, wodurch eine Testproduktivität pro Einheitszeitdauer verbessert wird.
DE102004002708A 2003-09-18 2004-01-19 Sortierhandler für Burn-In-Tester Expired - Fee Related DE102004002708B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0064836 2003-09-18
KR10-2003-0064836A KR100491304B1 (ko) 2003-09-18 2003-09-18 번인 테스터용 소팅 핸들러

Publications (2)

Publication Number Publication Date
DE102004002708A1 true DE102004002708A1 (de) 2005-04-21
DE102004002708B4 DE102004002708B4 (de) 2006-08-31

Family

ID=34309442

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004002708A Expired - Fee Related DE102004002708B4 (de) 2003-09-18 2004-01-19 Sortierhandler für Burn-In-Tester

Country Status (5)

Country Link
US (2) US6882141B2 (de)
KR (1) KR100491304B1 (de)
CN (1) CN1306581C (de)
DE (1) DE102004002708B4 (de)
TW (1) TWI252209B (de)

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CN101208606B (zh) * 2005-08-31 2011-07-13 平田机工株式会社 工件装卸装置
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KR100857911B1 (ko) * 2007-02-01 2008-09-10 미래산업 주식회사 반도체 소자 테스트 핸들러용 소팅장치 및 소팅방법
KR100820357B1 (ko) * 2007-02-14 2008-04-08 미래산업 주식회사 전자부품 테스트용 핸들러
CN101284600B (zh) * 2007-04-12 2011-07-06 威光自动化科技股份有限公司 可作为输送及检测界面的载盘传递装置
KR101335916B1 (ko) * 2007-07-11 2013-12-03 삼성전자주식회사 테스트 장치
US7783447B2 (en) * 2007-11-24 2010-08-24 Kingston Technology Corp. Chip handler with a buffer traveling between roaming areas for two non-colliding robotic arms
KR100938172B1 (ko) * 2007-12-28 2010-01-21 미래산업 주식회사 핸들러, 반도체 소자 로딩방법, 테스트트레이 이송방법, 및반도체 소자 제조방법
KR100930260B1 (ko) * 2008-01-18 2009-12-09 에이엠티 주식회사 테스트 핸들러 및 그 동작 방법
KR101214808B1 (ko) * 2008-02-29 2012-12-24 가부시키가이샤 아드반테스트 전자부품 이송과 적재장치 및 이를 구비한 전자부품 시험장치
KR100981634B1 (ko) * 2008-05-23 2010-09-13 (주) 예스티 반도체패키지의 이송장치
KR100981637B1 (ko) * 2008-06-09 2010-09-13 (주) 예스티 트레이 공급장치
US7960992B2 (en) * 2009-02-25 2011-06-14 Kingston Technology Corp. Conveyor-based memory-module tester with elevators distributing moving test motherboards among parallel conveyors for testing
KR101103289B1 (ko) * 2010-04-19 2012-01-11 에이엠티 주식회사 번인 소터 및 그 동작 방법
TWI416652B (zh) * 2010-08-20 2013-11-21 Chroma Ate Inc With a single through the shuttle shuttle of the semiconductor components test machine
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KR20200121187A (ko) * 2019-04-15 2020-10-23 주식회사 아테코 전자부품 테스트 핸들러의 스태커 및 이를 포함하는 전자부품 테스트 핸들러
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Also Published As

Publication number Publication date
DE102004002708B4 (de) 2006-08-31
US20050062463A1 (en) 2005-03-24
CN1306581C (zh) 2007-03-21
CN1599049A (zh) 2005-03-23
KR20050028221A (ko) 2005-03-22
KR100491304B1 (ko) 2005-05-24
US6882141B2 (en) 2005-04-19
US7268534B2 (en) 2007-09-11
TW200512145A (en) 2005-04-01
US20050168214A1 (en) 2005-08-04
TWI252209B (en) 2006-04-01

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8339 Ceased/non-payment of the annual fee