DD205294A5 - Verfahren zur herstellung einer drahtverbindung - Google Patents

Verfahren zur herstellung einer drahtverbindung Download PDF

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Publication number
DD205294A5
DD205294A5 DD81234387A DD23438781A DD205294A5 DD 205294 A5 DD205294 A5 DD 205294A5 DD 81234387 A DD81234387 A DD 81234387A DD 23438781 A DD23438781 A DD 23438781A DD 205294 A5 DD205294 A5 DD 205294A5
Authority
DD
German Democratic Republic
Prior art keywords
wire
spark discharge
electrode
ball
plasma
Prior art date
Application number
DD81234387A
Other languages
German (de)
English (en)
Inventor
Hermanus A Van De Pas
Wilhelmus J J Lorenz
Johannes B P Janssen
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of DD205294A5 publication Critical patent/DD205294A5/de

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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    • H01L2924/30105Capacitance

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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Physics & Mathematics (AREA)
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  • Wire Bonding (AREA)
DD81234387A 1980-10-29 1981-10-27 Verfahren zur herstellung einer drahtverbindung DD205294A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.

Publications (1)

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DD205294A5 true DD205294A5 (de) 1983-12-21

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DD81234387A DD205294A5 (de) 1980-10-29 1981-10-27 Verfahren zur herstellung einer drahtverbindung

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JP (1) JPS5916409B2 (ja)
KR (1) KR890000585B1 (ja)
AU (1) AU546818B2 (ja)
BE (1) BE890887A (ja)
BR (1) BR8106902A (ja)
CA (1) CA1178664A (ja)
CH (1) CH654142A5 (ja)
DD (1) DD205294A5 (ja)
DE (1) DE3141842A1 (ja)
ES (1) ES8301390A1 (ja)
FR (1) FR2493044B1 (ja)
GB (1) GB2086297B (ja)
HK (1) HK40885A (ja)
IT (1) IT1139570B (ja)
MY (1) MY8500623A (ja)
NL (1) NL8005922A (ja)
PL (1) PL133893B1 (ja)
SG (1) SG21984G (ja)

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US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE19618320A1 (de) * 1996-04-30 1997-11-13 F&K Delvotec Bondtechnik Gmbh Vorrichtung zum "Ball"-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
WO2014054305A1 (ja) * 2012-10-05 2014-04-10 株式会社新川 酸化防止ガス吹き出しユニット

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Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
BE890887A (fr) 1982-04-27
FR2493044B1 (fr) 1986-03-28
IT1139570B (it) 1986-09-24
ES506580A0 (es) 1982-11-16
CH654142A5 (de) 1986-01-31
ES8301390A1 (es) 1982-11-16
IT8124731A0 (it) 1981-10-27
PL233586A1 (ja) 1982-05-10
KR890000585B1 (ko) 1989-03-21
SG21984G (en) 1985-01-04
KR830008394A (ko) 1983-11-18
GB2086297B (en) 1983-12-21
AU7689381A (en) 1982-05-06
DE3141842A1 (de) 1982-10-21
MY8500623A (en) 1985-12-31
NL8005922A (nl) 1982-05-17
PL133893B1 (en) 1985-07-31
FR2493044A1 (fr) 1982-04-30
JPS57102036A (en) 1982-06-24
DE3141842C2 (ja) 1990-09-20
CA1178664A (en) 1984-11-27
BR8106902A (pt) 1982-07-13
HK40885A (en) 1985-05-31
AU546818B2 (en) 1985-09-19
JPS5916409B2 (ja) 1984-04-16
GB2086297A (en) 1982-05-12

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