CN220819881U - 一种样品测试卡 - Google Patents
一种样品测试卡 Download PDFInfo
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- CN220819881U CN220819881U CN202322040718.0U CN202322040718U CN220819881U CN 220819881 U CN220819881 U CN 220819881U CN 202322040718 U CN202322040718 U CN 202322040718U CN 220819881 U CN220819881 U CN 220819881U
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- 238000012360 testing method Methods 0.000 title claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000011248 coating agent Substances 0.000 claims abstract description 53
- 238000000576 coating method Methods 0.000 claims abstract description 53
- 238000002955 isolation Methods 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008093 supporting effect Effects 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000840 electrochemical analysis Methods 0.000 description 1
- 238000000835 electrochemical detection Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- 238000007665 sagging Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Abstract
本申请涉及分析仪器领域,特别是涉及一种样品测试卡。本申请所提供的样品测试卡,包括第一电极和第一板件。第一电极设置于样品测试卡的第一通道中,用于获取第一通道中的样本的电化学参数;第一板件包括隔离线、涂层和基板,第一电极布设于基板一侧表面用于形成第一通道的第一区域中,隔离线布设于基板一侧表面并靠近第一区域,涂层涂敷于基板设有隔离线一侧表面并覆盖隔离线和至少部分基板,以将第一区域内的基板与样本隔离。其中,隔离线为凸起物。能够利用凸起的隔离线使第一区域中的涂层厚度均匀表面平整,有效地保护了第一区域内的基板,从而提升了样品测试卡的稳定性。
Description
技术领域
本申请涉及分析仪器领域,特别是涉及一种样品测试卡。
背景技术
常用电路板件表面会设有若干电路元件,因此在电路元件设置完毕后,还需要电路板件表面设置涂层以保护电路板件表面的电路元件。现有的涂层设置方法一般为直接涂敷在电路板件表面。
由于电路板件表面的电极或导线等电路结构本身并不平整,且涂层在干燥过程中会发生一定的自然变形,一开始涂平的涂层会因为涂覆面积较大、电路板件表面电路结构不平整等各种因素逐渐变得厚薄不均,因此固化后的涂层表面可能出现不平整的情况。但对于样品测试卡来说,这个涂层的一侧是检测通道中的样品,另一侧是电路元件和电路板件,对于涂层的要求不仅仅为分隔两侧,还会要求涂层的表面相对平整。尤其是在测量通道中,凹凸不平、厚度不均的涂层表面易导致输入测量通道的样品在该表面的作用下引起湍流,产生不利于测试的异常情况,对样品测试卡的稳定性和测试的准确性造成不利影响。
实用新型内容
本申请要解决的技术问题是如何提供一种样品测试卡,以提高电路板件表面涂层厚度的均匀性,从而提升样品测试卡的稳定性。
本申请提供一种样品测试卡,包括第一电极和第一板件。第一电极设置于样品测试卡的第一通道中,用于获取第一通道中的样本的电化学参数;第一板件包括隔离线、涂层和基板,第一电极布设于基板一侧表面用于形成第一通道的第一区域中,隔离线布设于基板一侧表面并靠近第一区域,涂层涂敷于基板设有隔离线一侧表面并覆盖隔离线和至少部分基板,以将第一区域内的基板与样本隔离。其中,隔离线为凸起物。
区别于现有技术的情况,本申请公开了一种样品测试卡,能够通过突出于基板平面的隔离线将第一板件表面大面积的涂覆面积分隔呈小块,避免大面积涂敷导致的区域中央塌陷导致的涂层表面不平整、不均匀的问题,从而利用靠近第一区域的隔离线对第一区域形成保护,使得涂敷于第一板件表面的涂层趋向于厚度相对不设置隔离线的涂层的表面更为均匀平整。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单的介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。其中:
图1是本申请样品测试卡一实施例的装配结构示意图。
图2是图1中样品测试卡的爆炸结构示意图。
图3是图1中第一板件的基板结构示意图。
图4是本申请中基板上电路元件的侧视结果示意图。
具体实施方式
为使本申请的上述目的、特征和优点能够更为明显易懂,下面结合附图,对本申请的具体实施方式做详细的说明。可以理解的是,此处所描述的具体实施例仅用于解释本申请,而非对本申请的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本申请相关的部分而非全部结构。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本申请保护的范围。
本申请中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“设置有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其他步骤或单元。
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。
随着仪器分析技术的发展,目前用于对生化样品进行分析的样品测试卡会更多地使用到相比传统的化学分析更为清洁、准确、灵敏的电化学分析方法。在使用了电化学原理的样品测试卡中也通常会设置有暴露在样品中的电极,而这些电极又必须依托于一系列的电路结构而存在。因此,电路板件不可避免地作为配件出现在样品测试卡的结构中,也不可避免地会有局部表面出现在通入样品的测试通道中。为了避免电路板件表面的其他结构因样品而发生短路、或是样品通过电路板件渗漏到样品测试卡其他位置等问题,需要在电路板件的表面设置有涂层,以保护除了必要的电极以外的其他结构。
然而利用早前常用的手段直接将涂层涂敷于电路板件表面时,由于涂层本身的性质和电路板件表面设置的凹凸不平的电路结构,本身支撑力不足的涂层在固化后容易变得凹凸不平,例如两个凸出的电路结构之间的涂层出现下陷。而凹凸不平的涂层势必导致各处在重力作用下厚度不均,容易在较薄的地方出现皲裂变形的情况。样品通入后,凹凸不平的表面容易引起湍流导致样品流动不稳,严重影响测试结果的准确性。因此,如何提供一种样品测试卡,在保证测试准确性的同时能使电路板件表面涂层厚度均匀平整,从而能提升样品测试卡的稳定性,是本申请提供的样品测试卡想要解决的一大问题。
参阅图1至图3,图1是本申请样品测试卡一实施例的装配结构示意图。图2是图1中样品测试卡的爆炸结构示意图。图3是图1中第一板件的基板结构示意图。
本申请提供了一种样品测试卡9,包括第一电极41和第一板件4。其中,第一电极41设置于样品测试卡9的第一通道1中,该第一电极41用于获取第一通道1中的样本的电化学参数。第一板件4则包括隔离线47a、涂层和基板4h。第一电极41布设于基板4h的一侧表面上用于形成第一通道1的第一区域1a中,隔离线47a布设于基板4h的同侧表面并靠近第一区域1a,涂层涂敷于基板4h设有隔离线47a的一侧表面并覆盖隔离线47a,以将第一区域1a内和/或第一区域1a附近的隔离线47a以及基板4h与样本隔离。其中,隔离线47a为凸起物。
利用本实施例提供的方法,可以利用设置在基板4h上的凸起的隔离线47a对涂层起到一定的支撑作用,从而使涂敷在第一区域1a附近的隔离线47a和第一区域1a内的涂层更为均匀,减少对样品测试造成影响的可能,提升样品测试卡9的稳定性;同时也能够使涂层在第一通道1中的一侧表面更为平整,有利于样品或其他试剂在通入第一通道1时流动更为平缓稳定,不易产生影响检测结果的异常情况,有利于提升样品检测的准确性。
可选地,基板4h表面还可布设有第三电极8。该第三电极8通过引线47b与第一电极41至少信号连接,能够用于将第一电极41所测得的样品的电化学参数以检测信号的形式输出。考虑到基板4h上电路元件的设置方式,该引线47b可以至少部分为凸起物。
可选地,靠近第一区域1a的不同引线47b之间、布设于第一区域1a的不同引线47b之间、和/或引线47b与基板4h的边缘之间布设有隔离线47a,从而对靠近第一区域1a的不同引线47b之间、布设于第一区域1a的不同引线47b之间、和/或引线47b与基板4h的边缘之间可能发生凹陷的涂层提供支撑力,有利于保证涂层厚度均匀表面平整。
可选地,参阅图4,图4是本申请中基板上电路元件的侧视结果示意图。布设在基板4h靠近第一区域1a一侧的电路元件可以为凸起物,例如第一电极41、引线47b、隔离线47a。
可选地,第一板件4上的引线47b与相邻的另一引线47b、隔离线47a、和/或基板4h的边缘之间的距离可以小于等于预设距离,该预设距离被配置为保证涂层的厚度大于阈值,即在一凸起物与另一凸起物或一凸起物与基板4h的边缘之间需要至多保持该预设距离时,才能保持涂敷于其上的涂层的厚度相对均匀且朝向第一通道1一侧表面相对平整。
可选地,该预设距离需要根据凸起物具体的凸起高度、涂层本身的粘度、成分、固化速度等各类性质来进行设定。
可选地,为了节省材料和设置空间,如非特意避让其他结构,引线47b一般较为平直以便于规划基板4h表面的空间布局。因此隔离线47a可以平行于引线47b设置,以便于控制二者之间的距离。且隔离线47a的凸起高度可以与引线47b凸出基板4h的高度相同或相差不超过10%,从而为涂层提供更好的支撑效果。
由于在电化学的检测方法中存在一种十分常用的由检测电极、对电极、和参比电极组成的三电极体系,本申请中,第一电极41可以作为三电极体系的检测电极使用,而对电极也可以设置在第一通道1中。因此,样品测试卡9内还可以设有参比液和参比电极。
可选地,基板4h靠近涂层的一侧表面的还可有用于形成第二通道2的第二区域2a,该第二区域2a中还设有第二电极42。其中,第二通道2用于容纳参比液,第二电极42则被配置为用于获取第二通道2中参比液的电化学参数。
可选地,第二电极42可以作为三电极体系中的参比电极使用。
可选地,隔离线47a还可以设置于第一区域1a与第二区域2a之间,且隔离线47a与第一电极41的间距小于等于预设距离,预设距离被配置为保证涂层的厚度大于阈值。
可选地,当第一区域1a的范围较大时,隔离线47a为了保证第一电极41附近的涂层的平整和均匀,还可以设置于第一区域1a中。
可选地,第一电极41的数量可以至少为两个,从而对样品的不同电化学参数进行测试,因此隔离线47a可以平行于至少两个第一电极41的排列方向设置,从而有效控制隔离线47a与第一电极41之间的距离,保障涂层的相对平整和均匀,同时能够节省设置隔离线47a的材料和基板4h上占用的空间。
可选地,对于测试不同电化学参数的第一电极41来说,其暴露在涂层外的面积可以不相同,第一电极41可以部分被涂层覆盖也可以完全不被涂层覆盖。但由于第一电极41需要与样品接触才能进行测试,因此每个第一电极41至少有部分暴露于涂层外与第一通道1中的样品接触。
可选地,基板4h靠近涂层的一侧表面还设有凹槽43,该凹槽43用于填充连接第一通道1和第二通道2的盐桥3。该凹槽43的一端位于第一区域1a中,另一端则位于第二区域2a中,因此为了使盐桥3能顺利连接第一通道1与第二通道2,第一区域1a与第二区域2a之间的隔离线在对应凹槽43的位置设有缺口49以避让凹槽43。其中,在加工样品测试卡9时,盐桥3在基板4h表面涂敷涂层后再设置于凹槽43中,从而避免涂层的覆盖导致盐桥3无法与第一通道1和第二通道2中的液体接触。
可选地,该缺口49的宽度应当大于凹槽43的宽度,并且缺口49的边缘与凹槽43边缘具有间距。从而避免在缺口49处凹槽43内的基板4h与凹槽43外的隔离线47a、其他电路元件之间落差太大,造成凹槽43附近的涂层表面不够平整。
可选地,为了节省材料并为其他电路元件的布设留出足够的基板4h表面空间,如图3所示,隔离线47a可以为连续凸起或由断续的多段凸起组成。
可选地,基板4h可以为PCB材质的电路板。
可选地,引线47b和隔离线47a的材质可以为铜等具有导电性能的金属材料。
可选地,参阅图2,样品测试卡9还可包括第二板件5。该第二板件5开设有第一贯穿口51和第二贯穿口52。第二板件5设置于第一板件4开设有所述凹槽43的一面,盐桥3的一端和第一电极41通过该第一贯穿口51暴露于第一通道1中,盐桥3的另一端和第二电极42通过该第二贯穿口52暴露于第二通道2中。
可选地,第二板件5至少盖设第一板件4的凹槽43区域以形成用于容纳盐桥3的第三通道,第三通道一端通向第一通道1,另一端通向第二通道2。其中,盐桥3接触液体能够膨胀、堵塞第三通道以隔断第一通道1和第二通道2。
可选地,样品测试卡9还可包括第一壳体6,第一壳体6和第一板件4配合夹持第二板件5,以在对应第一贯穿口51的位置形成第一通道1、对应第二贯穿口52的位置形成第二通道2,从而利用第一壳体6、第一板件4、第二板件5形成通过第三通道连接的第一通道1和第二通道2。
可选地,样品测试卡9还可包括第二壳体7,从而实现样品测试卡9整体的装配固定。第二壳体7从第一板件4远离第二板件5一侧抵压第一板件4,使得第二壳体7、第一板件4、第二板件5、第一壳体6紧密固定,从而避免第一通道1和第二通道2中的液体泄漏,并避免第一板件4远离第二板件5一侧的电路元件直接与检测仪器接触造成不良的影响。
以上仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。
Claims (10)
1.一种样品测试卡,其特征在于,包括:
第一电极,设置于所述样品测试卡的第一通道中,用于获取所述第一通道中的样本的电化学参数;
第一板件,包括隔离线、涂层和基板,所述第一电极布设于所述基板一侧表面用于形成所述第一通道的第一区域中,所述隔离线布设于所述基板一侧表面并靠近所述第一区域,所述涂层涂敷于所述基板设有所述隔离线一侧表面并覆盖所述隔离线和至少部分所述基板,以将所述第一区域内的所述基板与所述样本隔离;
其中,所述隔离线为凸起物。
2.根据权利要求1所述的样品测试卡,其特征在于,
所述基板表面还布设有第三电极,所述第三电极通过引线与所述第一电极连接,所述第三电极用于将所述第一电极测得的所述电化学参数输出;所述引线至少部分为凸起物,靠近所述第一区域的不同所述引线之间、布设于所述第一区域的不同所述引线之间、和/或引线与所述基板的边缘之间布设有所述隔离线。
3.根据权利要求2所述的样品测试卡,其特征在于,
所述引线与相邻的另一所述引线、所述隔离线、和/或所述基板的边缘之间的距离小于等于预设距离,所述预设距离被配置为保证所述涂层的厚度大于阈值。
4.根据权利要求2所述的样品测试卡,其特征在于,
所述隔离线平行于所述引线设置,且所述隔离线的凸起高度与引线的凸起高度相同或相差不超过10%。
5.根据权利要求1所述的样品测试卡,其特征在于,
所述基板靠近所述涂层一侧表面的第二区域还设有第二电极,所述第二区域用于形成第二通道,所述第二电极被配置为用于获取所述第二通道中参比液的电化学参数;至少部分所述隔离线设置于所述第一区域与所述第二区域之间,且所述隔离线与所述第一电极的间距小于等于预设距离,所述预设距离被配置为保证所述涂层的厚度大于阈值。
6.根据权利要求5所述的样品测试卡,其特征在于,
所述第一电极的数量至少为二,所述隔离线平行于至少两个所述第一电极的排列方向设置。
7.根据权利要求5所述的样品测试卡,其特征在于,
所述基板靠近所述涂层的一侧表面还设有凹槽,所述凹槽用于填充连接所述第一通道和所述第二通道的盐桥,所述凹槽的一端位于所述第一区域中,所述凹槽的另一端位于所述第二区域中,所述第一区域与所述第二区域之间的所述隔离线设有缺口以避让所述凹槽。
8.根据权利要求7所述的样品测试卡,其特征在于,
所述缺口的宽度大于所述凹槽的宽度,并且所述缺口的边缘与所述凹槽边缘具有间距。
9.根据权利要求7所述的样品测试卡,其特征在于,包括:
第二板件,开设有第一贯穿口和第二贯穿口,所述第二板件设置于所述第一板件设有所述第一电极的一面,所述第一电极通过所述第一贯穿口暴露,所述第二电极通过所述第二贯穿口暴露;
第一壳体,所述第一壳体和所述第一板件配合夹持所述第二板件,以对应所述第一贯穿口形成所述第一通道、对应所述第二贯穿口形成所述第二通道;
其中,所述涂层涂敷于所述基板设有所述隔离线一侧表面并覆盖所述隔离线和至少部分所述基板,以将所述第二区域内的所述基板与所述样本隔离。
10.根据权利要求1所述的样品测试卡,其特征在于,
所述隔离线为连续凸起或由断续的多段凸起组成。
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