CN213042875U - 加热处理装置 - Google Patents

加热处理装置 Download PDF

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Publication number
CN213042875U
CN213042875U CN202021198864.6U CN202021198864U CN213042875U CN 213042875 U CN213042875 U CN 213042875U CN 202021198864 U CN202021198864 U CN 202021198864U CN 213042875 U CN213042875 U CN 213042875U
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CN
China
Prior art keywords
heat treatment
collection container
treatment apparatus
suction
suction pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021198864.6U
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English (en)
Chinese (zh)
Inventor
高木慎介
久我恭弘
大塚幸信
相良慎一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN213042875U publication Critical patent/CN213042875U/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D45/00—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces
    • B01D45/04—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia
    • B01D45/08—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia by impingement against baffle separators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202021198864.6U 2019-07-01 2020-06-24 加热处理装置 Active CN213042875U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019122961A JP7261675B2 (ja) 2019-07-01 2019-07-01 加熱処理装置及び加熱処理方法
JP2019-122961 2019-07-01

Publications (1)

Publication Number Publication Date
CN213042875U true CN213042875U (zh) 2021-04-23

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN202021198864.6U Active CN213042875U (zh) 2019-07-01 2020-06-24 加热处理装置
CN202010592474.5A Active CN112185847B (zh) 2019-07-01 2020-06-24 加热处理装置以及加热处理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202010592474.5A Active CN112185847B (zh) 2019-07-01 2020-06-24 加热处理装置以及加热处理方法

Country Status (5)

Country Link
US (1) US11393702B2 (cg-RX-API-DMAC7.html)
JP (1) JP7261675B2 (cg-RX-API-DMAC7.html)
KR (1) KR102809463B1 (cg-RX-API-DMAC7.html)
CN (2) CN213042875U (cg-RX-API-DMAC7.html)
TW (1) TWI842910B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112185847A (zh) * 2019-07-01 2021-01-05 东京毅力科创株式会社 加热处理装置以及加热处理方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7441665B2 (ja) * 2020-02-10 2024-03-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TW202324499A (zh) 2021-11-05 2023-06-16 日商東京威力科創股份有限公司 加熱處理裝置、加熱處理方法及電腦記憶媒體
JP7795962B2 (ja) * 2022-04-26 2026-01-08 東京エレクトロン株式会社 加熱処理装置、加熱処理方法及びコンピュータ記憶媒体
JP2023167845A (ja) 2022-05-13 2023-11-24 東京エレクトロン株式会社 加熱処理装置、加熱処理方法及びコンピュータ記憶媒体
JP2023177658A (ja) * 2022-06-02 2023-12-14 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
CN115394636B (zh) * 2022-10-26 2023-01-03 广州粤芯半导体技术有限公司 半导体光刻方法、系统、设备和计算机可读存储介质
JP7764356B2 (ja) * 2022-12-21 2025-11-05 日本碍子株式会社 プラグ、プラグ製造方法及び半導体製造装置用部材
KR102765522B1 (ko) * 2022-12-22 2025-02-12 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102828824B1 (ko) * 2024-05-09 2025-07-04 엠투에스 주식회사 오븐 유닛을 구비한 코팅 액 도포 시스템

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US4943235A (en) * 1987-11-27 1990-07-24 Tel Sagami Limited Heat-treating apparatus
JPH0793270B2 (ja) * 1991-02-15 1995-10-09 株式会社半導体プロセス研究所 半導体製造装置及びその使用方法
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
JP3853256B2 (ja) * 2002-05-28 2006-12-06 東京エレクトロン株式会社 基板ベーク装置、基板ベーク方法及び塗布膜形成装置
KR100693475B1 (ko) * 2005-01-24 2007-04-16 이앙구 반도체 설비의 부산물 포집장치
JP4519087B2 (ja) * 2006-03-02 2010-08-04 東京エレクトロン株式会社 熱処理装置
JP4781901B2 (ja) * 2006-05-08 2011-09-28 東京エレクトロン株式会社 熱処理方法，プログラム及び熱処理装置
JP4737083B2 (ja) * 2006-12-28 2011-07-27 東京エレクトロン株式会社 加熱装置及び塗布、現像装置並びに加熱方法
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP5066981B2 (ja) * 2007-03-30 2012-11-07 東京エレクトロン株式会社 成膜方法、成膜装置及び記憶媒体
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JP6384414B2 (ja) * 2014-08-08 2018-09-05 東京エレクトロン株式会社 基板加熱装置、基板加熱方法、記憶媒体
JP6406192B2 (ja) * 2014-12-10 2018-10-17 東京エレクトロン株式会社 加熱処理装置、加熱処理方法及び記憶媒体
US20170032983A1 (en) * 2015-07-29 2017-02-02 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, maintenance method of substrate processing apparatus, and storage medium
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JP7451490B2 (ja) * 2018-07-30 2024-03-18 ノードソン コーポレーション プラズマを用いたワーク処理用のシステム
JP2020170749A (ja) * 2019-04-01 2020-10-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7261675B2 (ja) * 2019-07-01 2023-04-20 東京エレクトロン株式会社 加熱処理装置及び加熱処理方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112185847A (zh) * 2019-07-01 2021-01-05 东京毅力科创株式会社 加热处理装置以及加热处理方法
CN112185847B (zh) * 2019-07-01 2025-07-25 东京毅力科创株式会社 加热处理装置以及加热处理方法

Also Published As

Publication number Publication date
JP7261675B2 (ja) 2023-04-20
CN112185847A (zh) 2021-01-05
US20210005468A1 (en) 2021-01-07
TW202119524A (zh) 2021-05-16
US11393702B2 (en) 2022-07-19
TWI842910B (zh) 2024-05-21
JP2021009923A (ja) 2021-01-28
CN112185847B (zh) 2025-07-25
KR102809463B1 (ko) 2025-05-19
KR20210003048A (ko) 2021-01-11

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