CN205874290U - 导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 - Google Patents
导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 Download PDFInfo
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- CN205874290U CN205874290U CN201620743099.9U CN201620743099U CN205874290U CN 205874290 U CN205874290 U CN 205874290U CN 201620743099 U CN201620743099 U CN 201620743099U CN 205874290 U CN205874290 U CN 205874290U
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- conductive adhesive
- face
- oxidant layer
- adhesive oxidant
- resin
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- 230000006835 compression Effects 0.000 description 1
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- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- VZFUCHSFHOYXIS-UHFFFAOYSA-N cycloheptane carboxylic acid Natural products OC(=O)C1CCCCCC1 VZFUCHSFHOYXIS-UHFFFAOYSA-N 0.000 description 1
- XXKOQQBKBHUATC-UHFFFAOYSA-N cyclohexylmethylcyclohexane Chemical compound C1CCCCC1CC1CCCCC1 XXKOQQBKBHUATC-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
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- 239000004744 fabric Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- 239000011229 interlayer Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical class C1(C=CC(N1*)=O)=O 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229940068984 polyvinyl alcohol Drugs 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- 238000005728 strengthening Methods 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-142038 | 2015-07-16 | ||
JP2015142038 | 2015-07-16 | ||
JP2015-188423 | 2015-09-25 | ||
JP2015188423A JP5871098B1 (ja) | 2015-07-16 | 2015-09-25 | 導電性接着剤層、導電性接着シートおよびプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205874290U true CN205874290U (zh) | 2017-01-11 |
Family
ID=55362122
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CN201620743099.9U Withdrawn - After Issue CN205874290U (zh) | 2015-07-16 | 2016-07-14 | 导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 |
CN201610556878.2A Active CN105969242B (zh) | 2015-07-16 | 2016-07-14 | 导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610556878.2A Active CN105969242B (zh) | 2015-07-16 | 2016-07-14 | 导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP5871098B1 (ko) |
KR (1) | KR101794147B1 (ko) |
CN (2) | CN205874290U (ko) |
TW (1) | TWI703199B (ko) |
WO (1) | WO2017010101A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105969242A (zh) * | 2015-07-16 | 2016-09-28 | 东洋油墨Sc控股株式会社 | 导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 |
CN114336112A (zh) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | 一种柔性导电材料与硬质导电材料间软硬界面的衔接方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170116624A (ko) * | 2016-04-11 | 2017-10-20 | 주식회사 잉크테크 | 전도성 접착제 조성물 및 이를 이용한 구조물의 접착 방법 |
JP6893084B2 (ja) * | 2016-10-19 | 2021-06-23 | 日東シンコー株式会社 | 熱硬化性接着シート |
CN108990261A (zh) * | 2017-06-05 | 2018-12-11 | 昆山雅森电子材料科技有限公司 | 纳米金属基板及制备方法及含该基板的线路板的制备方法 |
JP7054998B2 (ja) * | 2017-09-11 | 2022-04-15 | Agcコーテック株式会社 | 塗膜および塗膜付き基材 |
JP6329314B1 (ja) * | 2017-09-28 | 2018-05-23 | タツタ電線株式会社 | 導電性接着剤シート |
JP6546975B2 (ja) * | 2017-10-16 | 2019-07-17 | タツタ電線株式会社 | 導電性接着剤 |
JP6371460B1 (ja) * | 2017-12-06 | 2018-08-08 | タツタ電線株式会社 | 配線基板用補強板 |
JP2019125529A (ja) * | 2018-01-18 | 2019-07-25 | タツタ電線株式会社 | 導電性接着フィルム及びそれを用いた電磁波シールドフィルム |
JP6431998B1 (ja) | 2018-03-20 | 2018-11-28 | タツタ電線株式会社 | 導電性接着剤層 |
TWI796476B (zh) * | 2018-10-22 | 2023-03-21 | 日商拓自達電線股份有限公司 | 導電性接著片 |
TWI771595B (zh) * | 2018-10-29 | 2022-07-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
TWI782213B (zh) * | 2018-10-29 | 2022-11-01 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
KR102640159B1 (ko) * | 2018-12-12 | 2024-02-22 | 타츠타 전선 주식회사 | 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법 |
JP6904464B2 (ja) * | 2019-06-12 | 2021-07-14 | 東洋インキScホールディングス株式会社 | プリント配線板 |
TWI703197B (zh) * | 2019-07-16 | 2020-09-01 | 東莞爵士先進電子應用材料有限公司 | 自粘複合型導電膠帶製備方法 |
CN112592668A (zh) * | 2020-12-15 | 2021-04-02 | 珠海冠宇电池股份有限公司 | 单层热熔胶和软包电池及其制备方法 |
CN114591694B (zh) * | 2022-03-05 | 2023-12-01 | 安徽强达电子有限公司 | 一种耐高温胶带及其制备工艺 |
KR20230142333A (ko) * | 2022-03-30 | 2023-10-11 | 토요잉크Sc홀딩스주식회사 | 금속판용 접합제, 프린트 배선판용 보강 부재 및 그 제조 방법, 그리고, 배선판 및 그 제조 방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000297256A (ja) * | 1999-04-14 | 2000-10-24 | Mitsui Mining & Smelting Co Ltd | 導電性粘着テープ |
JP3937299B2 (ja) * | 2001-11-28 | 2007-06-27 | 日立化成工業株式会社 | 支持体つき接着剤及びそれを用いた回路接続構造体 |
JP2008133411A (ja) * | 2006-11-01 | 2008-06-12 | Hitachi Chem Co Ltd | 電気接続用接着フィルム |
US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
JP5068089B2 (ja) * | 2007-03-02 | 2012-11-07 | 日東電工株式会社 | 剥離ライナー付き粘着シートおよび剥離ライナー |
US8651919B2 (en) * | 2007-08-30 | 2014-02-18 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive sheet and process for manufacturing electronic part |
JP5098954B2 (ja) * | 2008-10-28 | 2012-12-12 | 日本ゼオン株式会社 | 電気化学素子用電極の製造方法および電気化学素子 |
JP5232130B2 (ja) * | 2009-12-02 | 2013-07-10 | 住友電気工業株式会社 | プリント配線板の接続構造、その製造方法、および異方導電性接着剤 |
KR101931274B1 (ko) * | 2011-05-31 | 2018-12-20 | 토요잉크Sc홀딩스주식회사 | 도전성 시트 및 그 제조 방법, 및 전자 부품 |
JP5395854B2 (ja) * | 2011-08-11 | 2014-01-22 | タツタ電線株式会社 | プリント配線板及びプリント配線板の製造方法 |
WO2013132831A1 (ja) * | 2012-03-06 | 2013-09-12 | 東洋インキScホールディングス株式会社 | 導電性微粒子およびその製造方法、導電性樹脂組成物、導電性シート、並びに電磁波シールドシート |
KR101456920B1 (ko) | 2012-07-12 | 2014-10-31 | 주식회사 하나은행 | 저축 실행 장치, 저축 실행 방법 및 저축 실행 방법을 컴퓨터에서 실행하기 위한 프로그램을 기록하는 컴퓨터 판독 가능한 기록매체 |
JP5736026B2 (ja) | 2013-11-13 | 2015-06-17 | タツタ電線株式会社 | 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法 |
JP5871098B1 (ja) * | 2015-07-16 | 2016-03-01 | 東洋インキScホールディングス株式会社 | 導電性接着剤層、導電性接着シートおよびプリント配線板 |
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- 2016-07-14 WO PCT/JP2016/003323 patent/WO2017010101A1/ja active Application Filing
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105969242A (zh) * | 2015-07-16 | 2016-09-28 | 东洋油墨Sc控股株式会社 | 导电性粘合剂层、导电性粘合片、印刷配线板及电子机器 |
CN114336112A (zh) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | 一种柔性导电材料与硬质导电材料间软硬界面的衔接方法 |
CN114336112B (zh) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | 一种柔性导电材料与硬质导电材料间软硬界面的衔接方法 |
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CN105969242A (zh) | 2016-09-28 |
KR20170036034A (ko) | 2017-03-31 |
TW201704412A (zh) | 2017-02-01 |
JP2017025284A (ja) | 2017-02-02 |
JP2017025280A (ja) | 2017-02-02 |
WO2017010101A1 (ja) | 2017-01-19 |
CN105969242B (zh) | 2018-06-08 |
TWI703199B (zh) | 2020-09-01 |
JP5871098B1 (ja) | 2016-03-01 |
KR101794147B1 (ko) | 2017-11-07 |
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