CN204761710U - 一种mems麦克风 - Google Patents
一种mems麦克风 Download PDFInfo
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- CN204761710U CN204761710U CN201520463262.1U CN201520463262U CN204761710U CN 204761710 U CN204761710 U CN 204761710U CN 201520463262 U CN201520463262 U CN 201520463262U CN 204761710 U CN204761710 U CN 204761710U
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- mems
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 6
- 239000000084 colloidal system Substances 0.000 claims description 13
- 241000218202 Coptis Species 0.000 abstract description 11
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract 5
- 230000005611 electricity Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
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Claims (10)
Priority Applications (1)
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CN201520463262.1U CN204761710U (zh) | 2015-07-01 | 2015-07-01 | 一种mems麦克风 |
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CN201520463262.1U CN204761710U (zh) | 2015-07-01 | 2015-07-01 | 一种mems麦克风 |
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CN204761710U true CN204761710U (zh) | 2015-11-11 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106714070A (zh) * | 2017-01-20 | 2017-05-24 | 江苏普诺威电子股份有限公司 | 硅麦克风印制板声孔结构及其加工方法 |
CN107105378A (zh) * | 2017-06-05 | 2017-08-29 | 歌尔股份有限公司 | Mems芯片、麦克风及制作方法与封装方法 |
CN110446148A (zh) * | 2019-09-05 | 2019-11-12 | 朝阳聚声泰(信丰)科技有限公司 | 一种mems麦克风封装及其焊接方式 |
CN110545513A (zh) * | 2019-09-19 | 2019-12-06 | 甬矽电子(宁波)股份有限公司 | Mems传声器及其制备方法 |
CN111314830A (zh) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰(信丰)科技有限公司 | 一种信噪比高的mems麦克风及其生产方法 |
CN111510836A (zh) * | 2020-03-31 | 2020-08-07 | 歌尔微电子有限公司 | Mems封装结构及mems麦克风 |
WO2021174585A1 (zh) * | 2020-03-05 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | 一种mems传感器封装结构 |
-
2015
- 2015-07-01 CN CN201520463262.1U patent/CN204761710U/zh active Active
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106714070A (zh) * | 2017-01-20 | 2017-05-24 | 江苏普诺威电子股份有限公司 | 硅麦克风印制板声孔结构及其加工方法 |
CN107105378A (zh) * | 2017-06-05 | 2017-08-29 | 歌尔股份有限公司 | Mems芯片、麦克风及制作方法与封装方法 |
CN110446148A (zh) * | 2019-09-05 | 2019-11-12 | 朝阳聚声泰(信丰)科技有限公司 | 一种mems麦克风封装及其焊接方式 |
CN110545513A (zh) * | 2019-09-19 | 2019-12-06 | 甬矽电子(宁波)股份有限公司 | Mems传声器及其制备方法 |
CN110545513B (zh) * | 2019-09-19 | 2020-10-27 | 甬矽电子(宁波)股份有限公司 | Mems传声器及其制备方法 |
CN111866681A (zh) * | 2019-09-19 | 2020-10-30 | 甬矽电子(宁波)股份有限公司 | Mems传声器的制备方法 |
CN111866681B (zh) * | 2019-09-19 | 2021-04-27 | 甬矽电子(宁波)股份有限公司 | Mems传声器的制备方法 |
CN111314830A (zh) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰(信丰)科技有限公司 | 一种信噪比高的mems麦克风及其生产方法 |
CN111314830B (zh) * | 2019-12-07 | 2021-02-19 | 朝阳聚声泰(信丰)科技有限公司 | 一种信噪比高的mems麦克风及其生产方法 |
WO2021174585A1 (zh) * | 2020-03-05 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | 一种mems传感器封装结构 |
CN111510836A (zh) * | 2020-03-31 | 2020-08-07 | 歌尔微电子有限公司 | Mems封装结构及mems麦克风 |
CN111510836B (zh) * | 2020-03-31 | 2022-08-16 | 歌尔微电子有限公司 | Mems封装结构及mems麦克风 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |