CN204887468U - 一种mems麦克风的封装结构 - Google Patents
一种mems麦克风的封装结构 Download PDFInfo
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- CN204887468U CN204887468U CN201520664041.0U CN201520664041U CN204887468U CN 204887468 U CN204887468 U CN 204887468U CN 201520664041 U CN201520664041 U CN 201520664041U CN 204887468 U CN204887468 U CN 204887468U
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- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000003466 welding Methods 0.000 claims abstract description 7
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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CN201520664041.0U CN204887468U (zh) | 2015-08-28 | 2015-08-28 | 一种mems麦克风的封装结构 |
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CN201520664041.0U CN204887468U (zh) | 2015-08-28 | 2015-08-28 | 一种mems麦克风的封装结构 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108737943A (zh) * | 2017-04-17 | 2018-11-02 | 钰太芯微电子科技(上海)有限公司 | 一种新型mems麦克风及其制备方法 |
CN111432325A (zh) * | 2020-04-23 | 2020-07-17 | 深圳市当智科技有限公司 | 一种下进音麦克风的封装方法 |
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2015
- 2015-08-28 CN CN201520664041.0U patent/CN204887468U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108737943A (zh) * | 2017-04-17 | 2018-11-02 | 钰太芯微电子科技(上海)有限公司 | 一种新型mems麦克风及其制备方法 |
CN111432325A (zh) * | 2020-04-23 | 2020-07-17 | 深圳市当智科技有限公司 | 一种下进音麦克风的封装方法 |
CN111432325B (zh) * | 2020-04-23 | 2021-05-07 | 深圳市当智科技有限公司 | 一种下进音麦克风的封装方法 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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TR01 | Transfer of patent right |