CN203377847U - 振动元件、振子、电子器件、电子设备、移动体 - Google Patents

振动元件、振子、电子器件、电子设备、移动体 Download PDF

Info

Publication number
CN203377847U
CN203377847U CN201320322501.2U CN201320322501U CN203377847U CN 203377847 U CN203377847 U CN 203377847U CN 201320322501 U CN201320322501 U CN 201320322501U CN 203377847 U CN203377847 U CN 203377847U
Authority
CN
China
Prior art keywords
substrate
electrode
vibrating element
vibrating
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320322501.2U
Other languages
English (en)
Chinese (zh)
Inventor
藤原良孝
畑中和寿
内藤松太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of CN203377847U publication Critical patent/CN203377847U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201320322501.2U 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备、移动体 Expired - Lifetime CN203377847U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-128662 2012-06-06
JP2012128662A JP6175743B2 (ja) 2012-06-06 2012-06-06 振動素子の製造方法

Publications (1)

Publication Number Publication Date
CN203377847U true CN203377847U (zh) 2014-01-01

Family

ID=49714714

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201320322501.2U Expired - Lifetime CN203377847U (zh) 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备、移动体
CN201910001026.0A Active CN110011630B (zh) 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备以及移动体
CN201310221542.7A Active CN103475328B (zh) 2012-06-06 2013-06-05 振动元件及其制造方法、振子、电子器件和设备、移动体

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201910001026.0A Active CN110011630B (zh) 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备以及移动体
CN201310221542.7A Active CN103475328B (zh) 2012-06-06 2013-06-05 振动元件及其制造方法、振子、电子器件和设备、移动体

Country Status (3)

Country Link
US (4) US9450166B2 (https=)
JP (1) JP6175743B2 (https=)
CN (3) CN203377847U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108392200A (zh) * 2017-12-29 2018-08-14 深圳市亮动科技开发有限公司 一种心电监测设备的电极组件及其心电监测设备

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202535316U (zh) 2011-03-09 2012-11-14 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
JP5708089B2 (ja) 2011-03-18 2015-04-30 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス
JP6644457B2 (ja) * 2014-03-26 2020-02-12 Tdk株式会社 圧電デバイス
JP2015211362A (ja) * 2014-04-28 2015-11-24 京セラクリスタルデバイス株式会社 水晶デバイスおよび水晶デバイスの製造方法
JP6618675B2 (ja) 2014-07-30 2019-12-11 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
JP6390836B2 (ja) 2014-07-31 2018-09-19 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP6738588B2 (ja) * 2014-09-02 2020-08-12 セイコーエプソン株式会社 発振器、電子機器、および移動体
JP2016127467A (ja) * 2015-01-06 2016-07-11 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
JP2016140024A (ja) 2015-01-29 2016-08-04 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP2017192032A (ja) * 2016-04-13 2017-10-19 日本電波工業株式会社 水晶振動子
JP2017208798A (ja) * 2016-05-13 2017-11-24 日本電波工業株式会社 水晶発振器及び水晶発振器の製造方法
US10367510B2 (en) * 2016-05-13 2019-07-30 Nihon Dempa Kogyo Co., Ltd. Crystal oscillator and method for manufacturing crystal oscillator
JP2018164126A (ja) * 2017-03-24 2018-10-18 セイコーエプソン株式会社 振動デバイス、発振器、ジャイロセンサー、電子機器および移動体
US11495540B2 (en) * 2019-10-22 2022-11-08 Tokyo Electron Limited Semiconductor apparatus having stacked devices and method of manufacture thereof
JP7311152B2 (ja) * 2020-03-18 2023-07-19 有限会社マクシス・ワン 水晶振動子の電極構造、水晶振動子、水晶発振器
US12388415B2 (en) * 2021-05-28 2025-08-12 Nihon Dempa Kogyo Co., Ltd. Crystal unit, semimanufactured crystal unit, and method for manufacturing crystal unit
US20240258990A1 (en) * 2021-09-24 2024-08-01 Daishinku Corporation Piezoelectric vibration device
WO2023085238A1 (ja) * 2021-11-09 2023-05-19 株式会社大真空 サーミスタ付き水晶振動デバイス
JP7630010B2 (ja) * 2021-11-15 2025-02-14 京セラ株式会社 水晶素子及び水晶デバイス
FI131267B1 (fi) * 2022-06-14 2025-01-15 Teknologian Tutkimuskeskus Vtt Oy Akustinen aaltoresonaattori

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728415A (en) * 1980-07-29 1982-02-16 Citizen Watch Co Ltd Electrode film construction of quartz oscillator
JPS5751331U (https=) * 1980-09-09 1982-03-24
JPS5751331A (en) 1980-09-12 1982-03-26 Zenitakagumi:Kk Construction of continuous underground wall
JPS5925831A (ja) * 1982-08-03 1984-02-09 Showa Denko Kk 自動車用フレキシブルブ−ツ
JPH02260910A (ja) 1989-03-31 1990-10-23 Meidensha Corp 水晶振動子片
JPH1079640A (ja) 1996-07-10 1998-03-24 Matsushita Electric Ind Co Ltd 圧電デバイス、その製造方法及び移動体通信装置
EP0818882A3 (en) 1996-07-10 1999-12-15 Matsushita Electric Industrial Co., Ltd. Energy trapping piezoelectric device and producing method thereof
JPH10284966A (ja) 1997-03-31 1998-10-23 Kinseki Ltd 圧電素子板上の電極膜の製造方法
JPH10308645A (ja) 1997-05-08 1998-11-17 Toyo Commun Equip Co Ltd Ａｔカット水晶振動子及びその製造方法
JP4019473B2 (ja) * 1997-11-13 2007-12-12 エプソントヨコム株式会社 電子デバイス
JP2000295067A (ja) * 1999-04-05 2000-10-20 Toyo Commun Equip Co Ltd 圧電振動子
JP2001024468A (ja) * 1999-07-09 2001-01-26 Toyo Commun Equip Co Ltd 圧電振動子の電極膜構造
JP2001211052A (ja) * 2000-01-26 2001-08-03 Murata Mfg Co Ltd 圧電共振子
JP3929675B2 (ja) 2000-02-17 2007-06-13 セイコーインスツル株式会社 圧電振動子
JP2001251160A (ja) * 2000-03-07 2001-09-14 Seiko Epson Corp 圧電振動片及びその製造方法
US7098574B2 (en) * 2002-11-08 2006-08-29 Toyo Communication Equipment Co., Ltd. Piezoelectric resonator and method for manufacturing the same
JP2004266703A (ja) 2003-03-04 2004-09-24 Toyo Commun Equip Co Ltd 二重モード圧電フィルタとその調整方法
JP4506135B2 (ja) * 2003-09-18 2010-07-21 エプソントヨコム株式会社 圧電振動子
JP2006129383A (ja) * 2004-11-01 2006-05-18 Daishinku Corp 圧電振動片及びこの圧電振動片を備えた圧電振動デバイス
JP2006140803A (ja) 2004-11-12 2006-06-01 Epson Toyocom Corp メサ型圧電振動子とその製造方法
JP2006311015A (ja) * 2005-04-27 2006-11-09 Seiko Epson Corp 圧電振動片及び圧電振動子
CN101068107A (zh) * 2006-05-01 2007-11-07 爱普生拓优科梦株式会社 压电振子及其制造方法
JP4665849B2 (ja) * 2006-06-23 2011-04-06 株式会社大真空 圧電振動デバイスの製造方法
JP2008042431A (ja) * 2006-08-04 2008-02-21 Epson Toyocom Corp 圧電振動子及びその製造方法
JP5155620B2 (ja) * 2006-08-31 2013-03-06 セイコーインスツル株式会社 厚み滑り振動片の製造方法
JP4968900B2 (ja) * 2006-10-17 2012-07-04 太陽誘電株式会社 ラダー型フィルタの製造方法
JP2008245243A (ja) * 2007-02-26 2008-10-09 Epson Toyocom Corp 輪郭振動子、輪郭振動子の調整方法
JP2008263387A (ja) * 2007-04-11 2008-10-30 Epson Toyocom Corp メサ型圧電振動片
JP2008266748A (ja) * 2007-04-24 2008-11-06 Epson Toyocom Corp 積層膜一括エッチング液およびこれを用いた電極形成方法
JP4936221B2 (ja) * 2007-06-08 2012-05-23 セイコーエプソン株式会社 メサ型圧電振動片、メサ型圧電振動デバイス、発振器、及び電子機器
JP5026197B2 (ja) * 2007-08-28 2012-09-12 日本電波工業株式会社 圧電デバイス、及びその製造方法
JP5035750B2 (ja) * 2007-11-22 2012-09-26 セイコーエプソン株式会社 水晶振動片、水晶振動子、及び水晶発振器
JP5185650B2 (ja) * 2008-02-14 2013-04-17 セイコーインスツル株式会社 圧電振動片の製造方法及びウエハ
JP5240912B2 (ja) 2008-08-29 2013-07-17 京セラクリスタルデバイス株式会社 圧電デバイスの製造方法及び圧電振動素子搭載装置
JP5151823B2 (ja) * 2008-09-02 2013-02-27 セイコーエプソン株式会社 圧電振動片、圧電振動子及び発振器
JP2010074422A (ja) * 2008-09-17 2010-04-02 Nippon Dempa Kogyo Co Ltd 水晶振動子素子の製造方法、水晶振動子素子、水晶振動子及び水晶発振器
JP2010200102A (ja) 2009-02-26 2010-09-09 Kyocera Kinseki Corp 圧電発振器及びその製造方法
JP2010232806A (ja) * 2009-03-26 2010-10-14 Seiko Epson Corp 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法
JP2011019206A (ja) 2009-06-10 2011-01-27 Seiko Epson Corp 圧電振動片の製造方法、および圧電振動子の製造方法
JP2011082870A (ja) 2009-10-08 2011-04-21 Seiko Epson Corp 圧電デバイス
JP5059897B2 (ja) * 2010-02-24 2012-10-31 日本電波工業株式会社 圧電振動片の製造方法
JP5296113B2 (ja) * 2010-02-25 2013-09-25 日本電波工業株式会社 圧電振動片の製造方法、圧電振動片及び圧電デバイス
JP2011199673A (ja) * 2010-03-19 2011-10-06 Seiko Instruments Inc 水晶基板のエッチング方法、圧電振動片、圧電振動子、発振器、電子機器、および電波時計
TWI466437B (zh) 2010-03-29 2014-12-21 Kyocera Kinseki Corp Piezoelectric vibrator
JP5144732B2 (ja) 2010-09-30 2013-02-13 京セラクリスタルデバイス株式会社 圧電振動子
JP2011229123A (ja) * 2010-03-30 2011-11-10 Nippon Dempa Kogyo Co Ltd 水晶デバイス及び水晶デバイスの製造方法
JP2011223473A (ja) * 2010-04-13 2011-11-04 Seiko Epson Corp 振動片、振動子および圧電デバイス
JP5589167B2 (ja) * 2010-11-19 2014-09-17 セイコーエプソン株式会社 圧電振動片および圧電振動子
US8970316B2 (en) * 2011-08-19 2015-03-03 Seiko Epson Corporation Resonating element, resonator, electronic device, electronic apparatus, and mobile object

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108392200A (zh) * 2017-12-29 2018-08-14 深圳市亮动科技开发有限公司 一种心电监测设备的电极组件及其心电监测设备
CN108392200B (zh) * 2017-12-29 2021-10-29 深圳市亮动科技开发有限公司 一种心电监测设备的电极组件及其心电监测设备

Also Published As

Publication number Publication date
US20160268494A1 (en) 2016-09-15
US20200259068A1 (en) 2020-08-13
US10147867B2 (en) 2018-12-04
US20190067549A1 (en) 2019-02-28
JP2013255052A (ja) 2013-12-19
CN110011630A (zh) 2019-07-12
CN110011630B (zh) 2023-07-07
US11495727B2 (en) 2022-11-08
US9450166B2 (en) 2016-09-20
US10680158B2 (en) 2020-06-09
US20130328452A1 (en) 2013-12-12
CN103475328A (zh) 2013-12-25
JP6175743B2 (ja) 2017-08-09
CN103475328B (zh) 2019-01-18

Similar Documents

Publication Publication Date Title
CN203377847U (zh) 振动元件、振子、电子器件、电子设备、移动体
CN102957394B (zh) 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法
CN102957396B (zh) 振动元件、振子、电子装置、电子设备及移动体
CN103475329B (zh) 振动元件及其制造方法、振子、电子器件、电子设备
CN203233372U (zh) 振动元件、振子、电子器件、电子设备以及移动体
TW201351878A (zh) 振動元件、振動器、電子裝置、電子機器及移動體
CN105281704A (zh) 振动元件、振子、振荡器、电子设备以及移动体
JP6191152B2 (ja) 振動素子、振動子、電子デバイス、電子機器、及び移動体
JP2014007693A (ja) 振動素子、振動子、電子デバイス、電子機器、及び移動体
JP2015088876A (ja) 振動素子、振動子、電子デバイス、電子機器及び移動体
JP6787467B2 (ja) 振動素子、振動子、電子デバイス、電子機器、移動体および振動素子の製造方法
JP2014023015A (ja) 振動素子、振動子、電子デバイス、電子機器及び移動体
US10153749B2 (en) Resonator element, resonator, and electronic device
JP2013258452A (ja) 振動素子、振動子、電子デバイス、電子機器、移動体、および振動素子の製造方法
JP6627902B2 (ja) 振動素子、振動子、電子デバイス、電子機器、移動体および振動素子の製造方法
JP6562101B2 (ja) 振動素子、振動子、電子デバイス、電子機器、及び移動体
JP6315115B2 (ja) 振動素子、振動子、電子デバイス、電子機器、および移動体
JP2013207336A (ja) 振動素子、振動子、電子デバイス、及び電子機器
JP2017220945A (ja) 振動素子、振動子、電子デバイス、電子機器及び振動素子の製造方法

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140101