CN1989612A - 半导体封装用印刷电路板的窗口加工方法 - Google Patents

半导体封装用印刷电路板的窗口加工方法 Download PDF

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CN1989612A
CN1989612A CNA2006800001281A CN200680000128A CN1989612A CN 1989612 A CN1989612 A CN 1989612A CN A2006800001281 A CNA2006800001281 A CN A2006800001281A CN 200680000128 A CN200680000128 A CN 200680000128A CN 1989612 A CN1989612 A CN 1989612A
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丁彰宝
吴春焕
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
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    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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Abstract

本发明的半导体封装用印刷电路板的窗口加工方法由如下几个步骤构成：显影步骤，在敷铜基板两面压附干膜，除将形成指状焊片的部分外，使其它部分均暴露于外部；蚀刻步骤，去除在上述显影步骤暴露于外部的部分的铜，形成指状焊片；退膜步骤，在上述蚀刻步骤形成指状焊片后，去除上述压附的干膜；阻焊涂布步骤，使除通过上述退膜步骤形成的指状焊片与焊盘之外的区域绝缘；镀金/镀镍步骤，在上述阻焊涂布步骤中暴露的指状焊片与焊盘上进行电镀，形成镀金/镀镍层；遮罩涂布步骤，在上述镀金/镀镍步骤进行镀金后，利用遮罩支持镀金线；布线步骤，以在上述遮罩涂布步骤中被遮盖的镀金线为中心，加工形成印刷电路板的外形及槽口；遮罩剥离步骤，在上述布线步骤中加工了槽口后，去除镀金线上涂布的遮罩。

Description

半导体封装用印刷电路板的窗口加工方法
技术领域
针对半导体封装用印刷电路板的制造方法，本发明涉及一种半导体封装用印刷电路板的窗口加工方法，通过在单面、双面、多层(Multi Layer)产品上下整体敷铜的基板上，通过显影、蚀刻及剥离形成电路，在除上述形成的电路的指状焊片与焊盘之外的部分形成绝缘层，通过镀金用导线，在上述指状焊片与焊盘上镀金形成镀金/镀镍层，为了去除在上述镀金用导线及槽口加工发生的金属毛刺，在上述指状焊片部分进行遮盖后，进行布线及剥离，从而能够消除上述指状焊片的金属毛刺造成的电气干扰，提高可靠性。
背景技术
图1涉及以往半导体封装用印刷电路板的制造方法。如上述图1所示，以往方法包括如下几个步骤：显影步骤，在敷铜基板两面压附干膜，除将形成指状焊片的部分外，其余部分均暴露于外部；蚀刻步骤，去除在上述显影步骤中暴露于外部的部分的铜，形成指状焊片；退膜步骤，在上述蚀刻步骤中形成指状焊片后，去除上述压附的干膜；阻焊涂布步骤，使除通过上述退膜步骤所形成的指状焊片与焊盘之外的所有区域绝缘；镀金/镀镍步骤，在上述阻焊涂布步骤中暴露的指状焊片与焊盘进行电镀，形成镀金/镀镍层；布线步骤，在上述镀金/镀镍步骤中进行镀金后，加工形成印刷电路板的外形及槽口。
对于通过如上方法制造的半导体封装件BOC(Board On Chip)或FBGA(Fine Pitch Ball Grid Array，精细倾斜球状网阵排列)板而言，引线接合区域排列于封装件的中央，在引线指状焊片进行镀金所需的镀金线排列于中央。但是，如图2所示，在上述指状焊片(20)上未涂布其它物质的情况下，利用布线方法加工槽口(30)时，上述指状焊片(20)的镀金线(10)被推动，发生金属毛刺(40)，上述金属毛刺(40)可能会接近或接触与半导体芯片导电连接的焊线，如果与邻近的指状焊片接触，则会发生电气干扰，引起短路，导致印刷电路板出现不良。
发明内容
本发明正是为解决上述问题而提出的，其目的在于提供一种半导体封装用印刷电路板的窗口加工方法，在半导体封装所使用的印刷电路板的制造步骤中，为防止在镀金/镀镍后进行布线加工时，镀金线向推向上述布线的加工方向的现象，在上述镀金/镀镍后，利用支持遮罩加工部位的镀金线，防止发生金属毛刺。
附图说明
图1是显示以往半导体封装用印刷电路板的制造方法的流程图。
图2是显示以往半导体封装用印刷电路板的制造方法中的布线步骤的附图。
图3是显示本发明的半导体封装用印刷电路板的窗口加工方法的流程图。
图4是显示本发明的半导体封装用印刷电路板的窗口加工方法中的遮罩涂布步骤的附图。
图5是显示本发明的半导体封装用印刷电路板的窗口加工方法中的遮罩剥离步骤的附图。
附图主要部分的符号说明
10： 镀金线     20： 指状焊片
30： 槽口(窗口) 40： 金属毛刺
100：指状焊片   110：镀金线
120：遮罩       130：槽口(窗口)
具体实施方式
本发明的半导体封装用印刷电路板的制造方法可以减少因去除印刷电路板的引线指状焊片的镀金导线及加工与半导体芯片引线接合所需的槽口时发生的金属毛刺(Burr)导致的电气干扰，不至于发生金属毛刺。
为实现上述目的，如图3所示，本发明由如下几个步骤构成：显影步骤，在敷铜基板两面压附干膜，除将形成指状焊片的部分外，使其它部分均暴露于外部；蚀刻步骤，去除在上述显影步骤暴露于外部的部分的铜，形成指状焊片；退膜步骤，在上述蚀刻步骤形成指状焊片后，去除上述压附的干膜；阻焊涂布步骤，使除通过上述退膜步骤形成的指状焊片与焊盘之外的区域绝缘；镀金/镀镍步骤，在上述阻焊涂布步骤中暴露的指状焊片与焊盘上进行电镀，形成镀金/镀镍层；遮罩涂布步骤，在上述镀金/镀镍步骤进行镀金后，利用遮罩支持镀金线；布线步骤，以在上述遮罩涂布步骤中被遮盖的镀金线为中心，加工形成印刷电路板的外形及槽口；遮罩剥离步骤，在上述布线步骤中加工了槽口后，去除镀金线上涂布的遮罩。
在用于上述布线步骤的遮罩涂布步骤中，遮罩区域的形成是在涂布遮罩物质后，利用了漏光或显像。在上述遮罩涂布步骤中，遮罩涂布物质使用固态或液态的物质。
下面参照图4，详细说明本发明的半导体封装用印刷电路板的窗口加工方法的实施例。
在上述显影步骤至镀金/镀镍步骤中，在形成了指状焊片(100)与焊盘的印刷电路板完成后，以上述指状焊片(100)与镀金线(110)为中心涂布遮罩(120)，然后为形成槽口(130)而加工上述印刷电路板的外形及槽口。
如图5所示，在上述布线加工后，去除涂布于槽口(130)的遮罩，去除指状焊片(100)周围涂布的遮罩(120)后，便制了不发生金属毛刺的印刷电路板。
以上说明了本发明的有益实施例，但本发明并非限定于上述实施例，在不超越以下权利要求书所申请的本发明要旨的情况下，具有本发明所属领域常识者均可进行多种变更实施。
综上所述，本发明针对以往布线加工方法中存在的槽口加工时发生金属毛刺的问题，在上述槽口加工部位排列的镀金线上另行应用遮罩，防止在上述槽口处发生分离，消除了因布线加工造成的推动现象，可以使上述金属毛刺引起的电气干扰最小化，可以显著降低印刷电路板的不良率。

Claims (3)

1、一种半导体封装用印刷电路板的窗口加工方法，针对不至于发生金属毛刺的半导体封装用印刷电路板的制造方法，其特征是包括如下几个步骤：显影步骤，在敷铜基板两面压附干膜，除将形成指状焊片的部分外，使其它部分均暴露于外部；蚀刻步骤，去除在上述显影步骤暴露于外部的部分的铜，形成指状焊片；退膜步骤，在上述蚀刻步骤形成指状焊片后，去除上述压附的干膜；阻焊涂布步骤，使除通过上述退膜步骤形成的指状焊片与焊盘之外的区域绝缘；镀金/镀镍步骤，在上述阻焊涂布步骤中暴露的指状焊片与焊盘上进行电镀，形成镀金/镀镍层；遮罩涂布步骤，在上述镀金/镀镍步骤进行镀金后，利用遮罩支持镀金线；布线步骤，以在上述遮罩涂布步骤中被遮盖的镀金线为中心，加工形成印刷电路板的外形及槽口；遮罩剥离步骤，在上述布线步骤中加工了槽口后，去除镀金线上涂布的遮罩。
2、根据权利要求1所述的半导体封装用印刷电路板的窗口加工方法，其特征是：在用于上述布线步骤的遮罩涂布步骤中，遮罩区域的形成是在涂布遮罩物质后，利用了漏光或显像。
3、根据权利要求1所述的半导体封装用印刷电路板的窗口加工方法，其特征是：在上述遮罩涂布步骤中，遮罩涂布物质使用固态或液态的物质。
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CN102480844A (zh) * 2010-11-23 2012-05-30 深南电路有限公司 一种防渗镀的pcb镀金板制造工艺
CN108513433A (zh) * 2018-04-24 2018-09-07 苏州维信电子有限公司 一种隔锡的柔性线路板pad及其制造方法

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KR100941982B1 (ko) 2008-04-07 2010-02-11 삼성전기주식회사 보드온칩 패키지 기판 제조방법

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CN101488486B (zh) * 2008-01-15 2010-06-02 力成科技股份有限公司 可开槽式线路基板
CN102480844A (zh) * 2010-11-23 2012-05-30 深南电路有限公司 一种防渗镀的pcb镀金板制造工艺
CN102480844B (zh) * 2010-11-23 2014-05-07 深南电路有限公司 一种防渗镀的pcb镀金板制造工艺
CN108513433A (zh) * 2018-04-24 2018-09-07 苏州维信电子有限公司 一种隔锡的柔性线路板pad及其制造方法

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KR100648916B1 (ko) 2006-11-27
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