CN1977217B - 光敏树脂组合物、使用光敏树脂组合物的喷墨头以及喷墨头的制造方法 - Google Patents

光敏树脂组合物、使用光敏树脂组合物的喷墨头以及喷墨头的制造方法 Download PDF

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Publication number
CN1977217B
CN1977217B CN200580021432XA CN200580021432A CN1977217B CN 1977217 B CN1977217 B CN 1977217B CN 200580021432X A CN200580021432X A CN 200580021432XA CN 200580021432 A CN200580021432 A CN 200580021432A CN 1977217 B CN1977217 B CN 1977217B
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CN
China
Prior art keywords
printing ink
photosensitive resin
manufacturing
carbon atoms
inkjet head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200580021432XA
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English (en)
Chinese (zh)
Other versions
CN1977217A (zh
Inventor
石仓宏惠
芝昭二
冈野明彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN1977217A publication Critical patent/CN1977217A/zh
Application granted granted Critical
Publication of CN1977217B publication Critical patent/CN1977217B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN200580021432XA 2004-06-28 2005-06-24 光敏树脂组合物、使用光敏树脂组合物的喷墨头以及喷墨头的制造方法 Expired - Fee Related CN1977217B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004190484A JP4480141B2 (ja) 2004-06-28 2004-06-28 インクジェット記録ヘッドの製造方法
JP190484/2004 2004-06-28
PCT/JP2005/012160 WO2006001515A1 (en) 2004-06-28 2005-06-24 Photosensitive resin composition, ink jet head using photosensitive resin composition, and process for manufacturing ink jet head

Publications (2)

Publication Number Publication Date
CN1977217A CN1977217A (zh) 2007-06-06
CN1977217B true CN1977217B (zh) 2011-05-04

Family

ID=35033645

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580021432XA Expired - Fee Related CN1977217B (zh) 2004-06-28 2005-06-24 光敏树脂组合物、使用光敏树脂组合物的喷墨头以及喷墨头的制造方法

Country Status (7)

Country Link
US (1) US7611827B2 (enExample)
EP (1) EP1763705B1 (enExample)
JP (1) JP4480141B2 (enExample)
KR (1) KR100893414B1 (enExample)
CN (1) CN1977217B (enExample)
TW (1) TWI310483B (enExample)
WO (1) WO2006001515A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796397A (zh) * 2014-09-18 2017-05-31 日立化成株式会社 感光性树脂组合物、感光性元件、带有抗蚀剂图案的基板的制造方法以及印刷配线板的制造方法

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JP4761498B2 (ja) * 2004-06-28 2011-08-31 キヤノン株式会社 感光性樹脂組成物、ならびにこれを用いた段差パターンの製造方法及びインクジェットヘッドの製造方法
JP4241605B2 (ja) * 2004-12-21 2009-03-18 ソニー株式会社 液体吐出ヘッドの製造方法
JP5288828B2 (ja) * 2008-02-25 2013-09-11 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
JP2010240873A (ja) * 2009-04-01 2010-10-28 Canon Inc インクジェットヘッドの製造方法およびインクジェットヘッド
JP5520590B2 (ja) 2009-10-06 2014-06-11 富士フイルム株式会社 パターン形成方法、化学増幅型レジスト組成物及びレジスト膜
US20110123932A1 (en) * 2009-11-20 2011-05-26 Yimin Guan Method for forming a fluid ejection device
CN102147568A (zh) * 2010-02-09 2011-08-10 台湾积体电路制造股份有限公司 光刻图案化方法及双重图案化方法
KR101249723B1 (ko) * 2011-10-28 2013-04-02 전자부품연구원 액적 토출용 노즐 제조 방법 및 이를 이용해 제조된 노즐을 이용한 정전식 액적 토출 장치
JP6193715B2 (ja) * 2013-10-08 2017-09-06 キヤノン株式会社 液体吐出ヘッド
IL310073A (en) * 2021-07-14 2024-03-01 Fujifilm Corp Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for producing electronic device
KR20240167037A (ko) * 2022-04-26 2024-11-26 후지필름 가부시키가이샤 패턴 형성 방법, 전자 디바이스의 제조 방법
WO2024116797A1 (ja) * 2022-11-30 2024-06-06 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、及び電子デバイスの製造方法

Citations (1)

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JPH0645242B2 (ja) 1984-12-28 1994-06-15 キヤノン株式会社 液体噴射記録ヘツドの製造方法
JPH07119269B2 (ja) 1986-08-26 1995-12-20 ダイセル化学工業株式会社 エポキシ樹脂
JPH0725864B2 (ja) 1987-03-09 1995-03-22 ダイセル化学工業株式会社 エポキシ樹脂
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US5314945A (en) * 1990-12-03 1994-05-24 E. I. Du Pont De Nemours And Company Waterbased coating compositions of methylol(meth)acrylamide acrylic polymer, polyurethane and melamine crosslinking agent
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JP3775078B2 (ja) 1998-11-17 2006-05-17 三菱電機株式会社 半導体装置の製造方法
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JP4532785B2 (ja) * 2001-07-11 2010-08-25 キヤノン株式会社 構造体の製造方法、および液体吐出ヘッドの製造方法
KR100824356B1 (ko) 2002-01-09 2008-04-22 삼성전자주식회사 감광성 수지 조성물 및 이를 사용한 패턴의 형성방법

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Publication number Priority date Publication date Assignee Title
CN1475352A (zh) * 2002-07-10 2004-02-18 佳能株式会社 微细结构体的制备方法，微细空洞结构体的制备方法和液体喷出头的制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796397A (zh) * 2014-09-18 2017-05-31 日立化成株式会社 感光性树脂组合物、感光性元件、带有抗蚀剂图案的基板的制造方法以及印刷配线板的制造方法

Also Published As

Publication number Publication date
JP2006011182A (ja) 2006-01-12
TW200617600A (en) 2006-06-01
KR100893414B1 (ko) 2009-04-17
WO2006001515A1 (en) 2006-01-05
CN1977217A (zh) 2007-06-06
US20070081048A1 (en) 2007-04-12
JP4480141B2 (ja) 2010-06-16
EP1763705B1 (en) 2013-10-02
KR20070043805A (ko) 2007-04-25
EP1763705A1 (en) 2007-03-21
US7611827B2 (en) 2009-11-03
TWI310483B (en) 2009-06-01

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Granted publication date: 20110504

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