CN1905201A - 半导体成像器件及其制造方法 - Google Patents
半导体成像器件及其制造方法 Download PDFInfo
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- CN1905201A CN1905201A CNA200510124713XA CN200510124713A CN1905201A CN 1905201 A CN1905201 A CN 1905201A CN A200510124713X A CNA200510124713X A CN A200510124713XA CN 200510124713 A CN200510124713 A CN 200510124713A CN 1905201 A CN1905201 A CN 1905201A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 72
- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 4
- 230000008569 process Effects 0.000 title description 2
- 238000009792 diffusion process Methods 0.000 claims abstract description 214
- 239000012535 impurity Substances 0.000 claims abstract description 81
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 74
- 239000010703 silicon Substances 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 238000001514 detection method Methods 0.000 claims description 58
- 238000002955 isolation Methods 0.000 claims description 23
- 238000005516 engineering process Methods 0.000 claims description 18
- 238000005468 ion implantation Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 108091006146 Channels Proteins 0.000 description 73
- 238000010586 diagram Methods 0.000 description 22
- 239000002784 hot electron Substances 0.000 description 15
- 238000005036 potential barrier Methods 0.000 description 12
- 230000005284 excitation Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 2
- 238000000418 atomic force spectrum Methods 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000023077 detection of light stimulus Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005220131A JP4313789B2 (ja) | 2005-07-29 | 2005-07-29 | 半導体撮像装置およびその製造方法 |
JP2005220131 | 2005-07-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1905201A true CN1905201A (zh) | 2007-01-31 |
CN100592527C CN100592527C (zh) | 2010-02-24 |
Family
ID=36406055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510124713A Expired - Fee Related CN100592527C (zh) | 2005-07-29 | 2005-11-11 | 半导体成像器件及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US20070023800A1 (zh) |
EP (1) | EP1748489B1 (zh) |
JP (1) | JP4313789B2 (zh) |
KR (1) | KR100803616B1 (zh) |
CN (1) | CN100592527C (zh) |
TW (1) | TWI276223B (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7791170B2 (en) | 2006-07-10 | 2010-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making a deep junction for electrical crosstalk reduction of an image sensor |
CN101859787A (zh) * | 2009-04-10 | 2010-10-13 | 夏普株式会社 | 固态图像捕捉元件及其驱动、制造方法及电子信息设备 |
CN102097444A (zh) * | 2009-11-25 | 2011-06-15 | 索尼公司 | 固体摄像器件、其制造方法以及电子装置 |
US7999342B2 (en) | 2007-09-24 | 2011-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd | Image sensor element for backside-illuminated sensor |
CN102387316A (zh) * | 2010-08-31 | 2012-03-21 | 比亚迪股份有限公司 | 一种高动态范围的像素单元及图像传感器 |
CN102637753A (zh) * | 2011-02-09 | 2012-08-15 | 佳能株式会社 | 固态图像拾取装置 |
CN102867834A (zh) * | 2011-07-05 | 2013-01-09 | 索尼公司 | 固体摄像装置、电子设备和固体摄像装置的制造方法 |
US8525286B2 (en) | 2006-05-09 | 2013-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making wafer structure for backside illuminated color image sensor |
US8704277B2 (en) | 2006-05-09 | 2014-04-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spectrally efficient photodiode for backside illuminated sensor |
CN104505394A (zh) * | 2014-12-10 | 2015-04-08 | 中国科学院半导体研究所 | 兼容测距的cmos图像传感器像素单元及其制作方法 |
CN105990388A (zh) * | 2015-03-19 | 2016-10-05 | 精工爱普生株式会社 | 固态成像元件及其制造方法 |
CN105990387A (zh) * | 2015-03-19 | 2016-10-05 | 精工爱普生株式会社 | 固体摄像元件及其制造方法 |
CN105990389A (zh) * | 2015-03-19 | 2016-10-05 | 精工爱普生株式会社 | 固态成像元件及其制造方法 |
CN110544701A (zh) * | 2019-08-30 | 2019-12-06 | 德淮半导体有限公司 | 半导体结构及其形成方法 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070001100A1 (en) * | 2005-06-30 | 2007-01-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light reflection for backside illuminated sensor |
JP4764682B2 (ja) * | 2005-09-07 | 2011-09-07 | パナソニック株式会社 | 固体撮像装置の製造方法 |
KR100871714B1 (ko) * | 2005-12-05 | 2008-12-05 | 한국전자통신연구원 | 트랜스퍼 트랜지스터 및 이를 구비한 저잡음 이미지 센서 |
US7795655B2 (en) * | 2006-10-04 | 2010-09-14 | Sony Corporation | Solid-state imaging device and electronic device |
JP5584982B2 (ja) | 2009-02-09 | 2014-09-10 | ソニー株式会社 | 固体撮像素子およびカメラシステム |
FR2924532B1 (fr) * | 2007-11-30 | 2009-12-18 | E2V Semiconductors | Capteur d'image a pixel a quatre ou cinq transistors avec reduction de bruit de reinitialisation |
KR100959435B1 (ko) * | 2007-12-26 | 2010-05-25 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
KR100997326B1 (ko) * | 2007-12-27 | 2010-11-29 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
WO2011004708A1 (ja) * | 2009-07-10 | 2011-01-13 | 株式会社島津製作所 | 固体撮像素子 |
US9153621B2 (en) | 2010-01-12 | 2015-10-06 | Himax Imaging, Inc. | Process of forming a back side illumination image sensor |
US8237207B2 (en) * | 2010-01-12 | 2012-08-07 | Himax Imaging, Inc. | Back side illumination image sensor and a process thereof |
JP5651982B2 (ja) * | 2010-03-31 | 2015-01-14 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法、及び電子機器 |
JP5489855B2 (ja) * | 2010-05-14 | 2014-05-14 | キヤノン株式会社 | 固体撮像装置の製造方法 |
US8487350B2 (en) * | 2010-08-20 | 2013-07-16 | Omnivision Technologies, Inc. | Entrenched transfer gate |
US8853783B2 (en) * | 2012-01-19 | 2014-10-07 | Globalfoundries Singapore Pte. Ltd. | ESD protection circuit |
FR2986906B1 (fr) * | 2012-02-15 | 2015-06-19 | New Imaging Technologies Sas | Structure de pixel actif a transfert de charge ameliore |
JP5458135B2 (ja) * | 2012-03-28 | 2014-04-02 | シャープ株式会社 | 固体撮像素子の製造方法 |
US8872301B2 (en) * | 2012-04-24 | 2014-10-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual profile shallow trench isolation apparatus and system |
US9287319B2 (en) * | 2012-11-16 | 2016-03-15 | Sri International | CMOS multi-pinned (MP) pixel |
GB2516971A (en) * | 2013-08-09 | 2015-02-11 | St Microelectronics Res & Dev | A Pixel |
US9748290B2 (en) * | 2014-02-03 | 2017-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming image sensor with lateral doping gradient |
JP6623594B2 (ja) * | 2015-07-22 | 2019-12-25 | セイコーエプソン株式会社 | 固体撮像素子及びその製造方法 |
CN108419031B (zh) * | 2018-03-08 | 2020-12-29 | 京东方科技集团股份有限公司 | 像素电路及其驱动方法和图像传感器 |
KR20220152457A (ko) | 2021-05-07 | 2022-11-16 | 삼성전자주식회사 | 이미지 센서 및 그 동작 방법 |
CN115911072B (zh) * | 2023-01-04 | 2023-05-26 | 湖北江城芯片中试服务有限公司 | 半导体器件及其制作方法以及cmos图像传感器 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5268587A (en) * | 1989-03-20 | 1993-12-07 | Hitachi, Ltd. | Semiconductor integrated circuit device including a dielectric breakdown prevention circuit |
JP3125303B2 (ja) * | 1990-11-26 | 2001-01-15 | 日本電気株式会社 | 固体撮像素子 |
KR100192954B1 (ko) * | 1996-07-18 | 1999-06-15 | 김광호 | 수직형 전달게이트를 가지는 전하결합형 고체촬상소자 및 그 제조방법 |
JP3176300B2 (ja) * | 1997-01-09 | 2001-06-11 | 山形日本電気株式会社 | 固体撮像装置及びその製造方法 |
US6023081A (en) * | 1997-11-14 | 2000-02-08 | Motorola, Inc. | Semiconductor image sensor |
JPH11274450A (ja) * | 1998-03-19 | 1999-10-08 | Toshiba Corp | 固体撮像装置 |
JP3403061B2 (ja) | 1998-03-31 | 2003-05-06 | 株式会社東芝 | 固体撮像装置 |
US6690423B1 (en) * | 1998-03-19 | 2004-02-10 | Kabushiki Kaisha Toshiba | Solid-state image pickup apparatus |
JP2000091551A (ja) | 1998-09-11 | 2000-03-31 | Toshiba Corp | 固体撮像装置およびその製造方法 |
JP4284752B2 (ja) * | 1999-05-31 | 2009-06-24 | ソニー株式会社 | 固体撮像素子 |
JP3934827B2 (ja) * | 1999-06-30 | 2007-06-20 | 株式会社東芝 | 固体撮像装置 |
KR100436060B1 (ko) * | 2001-12-07 | 2004-06-12 | 주식회사 하이닉스반도체 | 전하운송효율을 높인 시모스 이미지센서 |
JP3635279B2 (ja) * | 2003-02-21 | 2005-04-06 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法およびインターライン転送型ccdイメージセンサ |
US6921934B2 (en) * | 2003-03-28 | 2005-07-26 | Micron Technology, Inc. | Double pinned photodiode for CMOS APS and method of formation |
US7148528B2 (en) * | 2003-07-02 | 2006-12-12 | Micron Technology, Inc. | Pinned photodiode structure and method of formation |
JP4758061B2 (ja) | 2003-10-16 | 2011-08-24 | パナソニック株式会社 | 固体撮像装置およびその製造方法 |
US7271430B2 (en) * | 2004-06-04 | 2007-09-18 | Samsung Electronics Co., Ltd. | Image sensors for reducing dark current and methods of fabricating the same |
US7666703B2 (en) * | 2005-01-14 | 2010-02-23 | Omnivision Technologies, Inc. | Image sensor pixel having a lateral doping profile formed with indium doping |
-
2005
- 2005-07-29 JP JP2005220131A patent/JP4313789B2/ja not_active Expired - Fee Related
- 2005-10-17 US US11/250,345 patent/US20070023800A1/en not_active Abandoned
- 2005-10-18 TW TW094136295A patent/TWI276223B/zh not_active IP Right Cessation
- 2005-10-19 EP EP05256468A patent/EP1748489B1/en not_active Expired - Fee Related
- 2005-11-04 KR KR1020050105215A patent/KR100803616B1/ko active IP Right Grant
- 2005-11-11 CN CN200510124713A patent/CN100592527C/zh not_active Expired - Fee Related
-
2008
- 2008-11-14 US US12/292,234 patent/US7846758B2/en not_active Expired - Fee Related
-
2010
- 2010-11-02 US US12/917,554 patent/US8008106B2/en not_active Expired - Fee Related
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8790954B2 (en) | 2006-05-09 | 2014-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making wafer structure for backside illuminated color image sensor |
US8704277B2 (en) | 2006-05-09 | 2014-04-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spectrally efficient photodiode for backside illuminated sensor |
US8525286B2 (en) | 2006-05-09 | 2013-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making wafer structure for backside illuminated color image sensor |
US7791170B2 (en) | 2006-07-10 | 2010-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making a deep junction for electrical crosstalk reduction of an image sensor |
US7994032B2 (en) | 2006-07-10 | 2011-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making deep junction for electrical crosstalk reduction of an image sensor |
US8324002B2 (en) | 2007-09-24 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor element for backside-illuminated sensor |
US7999342B2 (en) | 2007-09-24 | 2011-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd | Image sensor element for backside-illuminated sensor |
CN104538414B (zh) * | 2007-09-24 | 2019-05-07 | 台湾积体电路制造股份有限公司 | 背照式传感器的制造方法 |
CN104538414A (zh) * | 2007-09-24 | 2015-04-22 | 台湾积体电路制造股份有限公司 | 背照式传感器的制造方法 |
US8653570B2 (en) | 2009-04-10 | 2014-02-18 | Sharp Kabushiki Kaisha | Solid-state image capturing element and driving method for the same, method for manufacturing solid-state image capturing element, and electronic information device |
CN101859787B (zh) * | 2009-04-10 | 2014-01-08 | 夏普株式会社 | 固态图像捕捉元件及其驱动、制造方法及电子信息设备 |
CN101859787A (zh) * | 2009-04-10 | 2010-10-13 | 夏普株式会社 | 固态图像捕捉元件及其驱动、制造方法及电子信息设备 |
CN102097444B (zh) * | 2009-11-25 | 2014-01-29 | 索尼公司 | 固体摄像器件、其制造方法以及电子装置 |
CN102097444A (zh) * | 2009-11-25 | 2011-06-15 | 索尼公司 | 固体摄像器件、其制造方法以及电子装置 |
CN102387316B (zh) * | 2010-08-31 | 2014-11-05 | 比亚迪股份有限公司 | 一种高动态范围的像素单元及图像传感器 |
CN102387316A (zh) * | 2010-08-31 | 2012-03-21 | 比亚迪股份有限公司 | 一种高动态范围的像素单元及图像传感器 |
CN102637753B (zh) * | 2011-02-09 | 2014-10-08 | 佳能株式会社 | 固态图像拾取装置 |
US8952428B2 (en) | 2011-02-09 | 2015-02-10 | Canon Kabushiki Kaisha | Element isolation structure of a solid-state pickup device |
CN102637753A (zh) * | 2011-02-09 | 2012-08-15 | 佳能株式会社 | 固态图像拾取装置 |
CN102867834B (zh) * | 2011-07-05 | 2016-12-21 | 索尼半导体解决方案公司 | 固体摄像装置、电子设备和固体摄像装置的制造方法 |
CN102867834A (zh) * | 2011-07-05 | 2013-01-09 | 索尼公司 | 固体摄像装置、电子设备和固体摄像装置的制造方法 |
CN104505394A (zh) * | 2014-12-10 | 2015-04-08 | 中国科学院半导体研究所 | 兼容测距的cmos图像传感器像素单元及其制作方法 |
CN104505394B (zh) * | 2014-12-10 | 2019-02-01 | 中国科学院半导体研究所 | 兼容测距的cmos图像传感器像素单元及其制作方法 |
CN105990389A (zh) * | 2015-03-19 | 2016-10-05 | 精工爱普生株式会社 | 固态成像元件及其制造方法 |
CN105990387A (zh) * | 2015-03-19 | 2016-10-05 | 精工爱普生株式会社 | 固体摄像元件及其制造方法 |
CN105990388A (zh) * | 2015-03-19 | 2016-10-05 | 精工爱普生株式会社 | 固态成像元件及其制造方法 |
CN105990387B (zh) * | 2015-03-19 | 2021-03-30 | 精工爱普生株式会社 | 固体摄像元件及其制造方法 |
CN105990388B (zh) * | 2015-03-19 | 2021-07-09 | 精工爱普生株式会社 | 固态成像元件及其制造方法 |
CN105990389B (zh) * | 2015-03-19 | 2021-08-10 | 精工爱普生株式会社 | 固态成像元件及其制造方法 |
CN110544701A (zh) * | 2019-08-30 | 2019-12-06 | 德淮半导体有限公司 | 半导体结构及其形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US7846758B2 (en) | 2010-12-07 |
TWI276223B (en) | 2007-03-11 |
CN100592527C (zh) | 2010-02-24 |
EP1748489A2 (en) | 2007-01-31 |
US20090075416A1 (en) | 2009-03-19 |
US20070023800A1 (en) | 2007-02-01 |
US20110045629A1 (en) | 2011-02-24 |
JP4313789B2 (ja) | 2009-08-12 |
EP1748489B1 (en) | 2011-12-14 |
KR100803616B1 (ko) | 2008-02-19 |
EP1748489A3 (en) | 2007-09-05 |
TW200705652A (en) | 2007-02-01 |
KR20070014925A (ko) | 2007-02-01 |
JP2007036083A (ja) | 2007-02-08 |
US8008106B2 (en) | 2011-08-30 |
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