CN1890678A - 电子装置的制造方法 - Google Patents
电子装置的制造方法 Download PDFInfo
- Publication number
- CN1890678A CN1890678A CNA2004800358459A CN200480035845A CN1890678A CN 1890678 A CN1890678 A CN 1890678A CN A2004800358459 A CNA2004800358459 A CN A2004800358459A CN 200480035845 A CN200480035845 A CN 200480035845A CN 1890678 A CN1890678 A CN 1890678A
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Abstract
本发明涉及廉价而生产性优越且适合于获得良好通信特性的电子装置的制造方法。该制造方法用于制造电子装置,该电子装置将在相对向的一组面上各形成有外部电极的多个IC芯片(100)的一个外部电极(102)分别配置于形成有缝隙的接收发送天线中应载置的天线电路(201)上,并且,设置分别用于电连接上述IC芯片的各另一方外部电极(103)和对应的上述天线电路(201)的预定位置的短路板(300),该制造方法的特征在于,使至少一个上述IC芯片(100)与相对应的应载置的天线电路(201)上的预定位置对位,则剩余的上述IC芯片(100)也同时一起随其配置于天线电路(201)上的预定位置。
Description
技术领域
本发明涉及载置了IC芯片的非触式个体识别装置,是有关廉价而生产力优越且适合于获得良好通信特性的电子装置的制造方法及其使用它的构件。
背景技术
近年来,使用RFID(射频识别(radio frequency identifieation)标签的非触式个体识别系统,作为管理物品的寿命周期(life cycle)整体的系统,正受到制造、物流、销售整个切业种的注目。尤其是,使用2.45GHz的微波的电波方式的RFID标签因为在IC芯片上装设外部天线的构造而可以有数米的通信距离的特征而受到注目,因此现在正在构筑以大量商品的物流与物品管理、或产品经历管理为目的的系统。
作为利用上述微波的电波方式的RFID标签,已知的有利用例如日立制作所与株式会社ルネサステクノロシ社开发的TCP(Tape Carrier Package,输送胶带封装体)式嵌入物(inlet)的技术,TCP式嵌入物的制造采用在连续形成聚酰亚胺基材与铜天线电路的输送胶带(tape earrier)上,将同一面上形成有全部外部电极的IC芯片一个个封装的TAB(Tape Automated Bonding,胶带自动接合)方法(参照香山普、成濑邦彦「VLSI封装技术(上)、(下)」,日经BP社,1993年)。以下利用图1说明使用通常的TAB方法的RFID标签的制造方法。
在图1中,首先如图1(a)所示,在通过切割加工将在电路面上形成有金凸块104的同一面上形成全部外部电极的IC芯片110切割成单片后,利用真空吸附器由切割膜(dicing film)10吸附。然后,如图1(b)所示,移到真空吸附站30以使同一面上形成全部外部电极的IC芯片110的金凸块104成为表面。然后,如图1(c)所示,使真空吸附站30上下颠倒以使金凸块104成为下面。将上述同一面上形成全部外部电极的IC芯片110对准将附有铜箔的聚酰亚胺基材的铜箔进行天线电路加工而制成的天线基板500的预定位置后,使用加热器40加热压接固定。在与天线电路501上的金凸块连接的部分施行镀锡或镀焊锡(solder plating),即可获得金-锡合金的连接。然后,如图1(d)所示,利用热固性树脂600密封在同一面上形成全部外部电极的IC芯片110与天线基板500的空隙。上述热固性树脂的硬化结束的状态为所谓嵌入物(inlet)的RFID标签的中间形态。将该嵌入物储存于标签或薄片盒中,即可当做RFID标签来使用。
其他的嵌入物构造有例如由日立制作所的宇佐美所开发的玻璃二极管套装(glass diode package)构造,其在IC芯片的外部电极对向的每一组表面逐一形成的IC芯片上,将双极天线(dipole antenna)与形成于每一面的各外部电极连接(特开2002-269520号公报)。另外,宇佐美等人也开发了一种夹心天线(sandwich antenna)构造,其在将上述两个外部电极分别形成于一组IC芯片相对的各表面的IC芯片封装于激励缝隙型双极天线时,利用天线夹持在上述IC芯片对向的一组的各表面上逐一形成的各外部电极(ISSCC技术文摘),第398至399,2003年)。具有激励缝隙的双极天线构造通过改变该缝隙的宽度与长度即可以使天线的阻抗(impedance)与上述IC芯片的输入阻抗匹配,并加大通信距离。
发明内容
要以使用RFID标签非触式个体识别系统实现大量商品的物流与物品管理,必须对每一商品装设RFID标签,为此需要RFID标签的大量且廉价的生产。
但是,在可获得良好的通信特性的激励型双极天线构造中,由于IC芯片的两个外部电极横跨激励缝隙而连接到天线以形成谐振电路,因此,在同一面上形成有所有外部电极的IC芯片上必须精确地对准输入信号用的两个外部电极与缝隙。因此,先前是利用图1所示的TAB方法将IC芯片逐一封装在天线基板上,但是在上述TAB方法中,由于对同一面上形成有全部外部电极的IC芯片逐一进行利用分割膜做成的真空吸附器吸附在同一面上形成全部的外部电极的IC芯片的吸附,或在同一面上形成全部外部电极的IC芯片与天线基板的对位以及加热压接,还有树脂密封等各工序,因此要将各工序的生产周期(tact time)缩短至1秒钟左右或1秒钟以下是非常困难,而成为大量生产上的一大课题。
另外,生产周期长则人事费用等随之增高,不但阻碍低成本化,而且在同一面上形成有全部外部电极的IC芯片与天线基板的连接由于以金锡或金焊接合进行,因此,作为基板材料,必须使用耐热性优异而昂贵的聚酰亚胺上粘贴铜箔的胶带基材,因此生产廉价的嵌入物是困难的。
若利用上述天线夹持在2个外部电极对向的一组的各面上逐一形成的IC芯片的各面上逐一形成的各外部电极的夹心天线构造,虽可不必进行激励缝隙与上述IC芯片的各面上逐一形成的各外部电极的高精确的对位,但是在使用TAB方法的先前的生产方法中,如将在2个外部电极对向的一组的各面逐一形成的IC芯片中的IC芯片尺寸定为0.4mm以下时,即不易以先前的真空吸附器吸附IC芯片,从而嵌入物的大量生产以及低成本化有困难。
本发明是鉴于上述问题而提出的方案,其目的在于提供一种廉价而生产力优异且可以得到良好的通信特性的电子装置的制造方法及其使用的零件。
即,本发明的内容如下。
(1)一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙(slit)的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于:在已对齐的多个上述IC芯片中,只需将至少一个IC芯片定位在载置该等IC芯片的相应的天线电路上的预定位置对位,则剩余的IC芯片即使不进行高精确的对位也能够成批配置在天线电路上的预定位置。
(2)一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:使用第1金属箔形成多个天线电路的工序以及在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;以与将多个上述IC芯片配置在载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中至少一方的列对齐的工序;在形成有第2金属箔的短路板上通过第1各向异性导电性粘接剂层成批暂时固定,以便电连接已对齐的多个上述IC芯片来制造附有IC芯片的短路板的工序;使附有上述IC芯片的短路板对位以使多个上述IC芯片电连接于上述多个天线电路上的预定位置的工序;以及通过第2各向异性导电性粘接剂层将上述附有IC芯片的短路板成批加热压接的工序。
(3)一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成多个天线电路的工序与在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;以与将多个上述IC芯片配置在载置该等IC芯片的相应上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中至少一方的列对齐的工序;将已对齐的多个上述IC芯片成批对位以使多个上述IC芯片电连接于载置IC芯片的相应的上述多个天线电路上的预定位置后,通过第1各向异性导电性粘接剂层暂时固定的工序;使形成有第2金属箔的短路板对位以便电连接于暂时固定的多个上述IC芯片及天线电路上的预定位置的工序;以及通过第2各向异性导电性粘接剂层将短路板成批加热压接于多个上述IC芯片与天线基板上的工序。
(4)一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成天线电路的工序与在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序,在上述天线电路上的预定位置形成第1各向异性导电性粘接剂层的工序;以与将多个上述IC芯片配置于载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔,使对齐多个上述IC芯片的纵列与横列中至少一方的列对齐的工序;在成批对齐已对齐于第1各向异性导电性粘接剂层上的多个上述IC芯片以使多个上述IC芯片电连接于载置IC芯片的相应的上述多个天线电路上的预定位置后暂时固定的工序;在暂时固定的多个上述IC芯片与天线电路上的预定位置上形成第2各向异性导电性粘接剂层的工序;使形成有第2金属箔的短路板对位以便电连接于暂时固定的多个上述IC芯片与天线电路上的预定位置的工序;以及将上述短路板成批加热压接于多个上述IC芯片与天线基板上的工序。
(5)一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:可对沿天线基板的宽度方向对齐的上述IC芯片列进行逐列成批加热压接的个数做为一片来分隔短路板的工序;将上述短路板与被对齐于天线基板的宽度方向的天线电路的一列对位的工序;以及通过各向异性导电性粘接剂层将短路板成批加热压接在上述IC芯片与天线基板上的工序。
(6)在上述第(1)至(5)项的电子装置的制造方法中,其特征在于,第1与第2金属箔的至少一方为铝。
(7)在上述第(1)至(6)项的电子装置的制造方法中,其特征在于,第1与第2金属箔的至少一方由有机树脂所形成的底座基材所支撑,而上述有机树脂可从聚氯乙烯树脂(PVC)、丙烯腈-丁二烯—苯乙烯(ABS)、聚对苯二甲酸乙二醇酯(PET)、乙二醇改性—聚对苯二甲酸乙二醇酯(PETG)、聚萘二甲酸乙二醇酯(PEN)、聚碳酸酯树脂(PC)、双向拉伸聚酯(O-PET)以及聚酰亚胺树脂中选择。
(8)在上述第(1)至(5)项的电子装置的制造方法中,其特征在于,第1与第2金属箔的至少一方由纸所构成的底座基材所支撑。
(9)在上述第(1)至(6)项的电子装置的制造方法中,其特征在于,利用第1与第2的各向异性导电性粘接剂层的加热压接密封天线基板与短路板的空隙。
(10)在上述第(1)至(5)项的电子装置的制造方法中,其特征在于,在将多个IC芯片与天线基板及短路板成批加热压接的工序后,具有将连接的天线电路切断成单独的个片的工序。
(11)一种电子装置的构件,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天成电连接的短路板,其特征在于:是在上述IC芯片的附有外部电极的每一面上形成有异方性导电性粘接剂层,且将上述IC芯片以上述各向异性导电性粘接剂层事先夹入的状态下的半导体元件。
(12)一种电子装置的构件,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于:在上述IC芯片的附有外部电极的每一面形成有各向异性导电性粘接剂层,并在以上述各向异性导电性粘接剂层夹入上述IC芯片的状态的半导体元件的上述各向异性导电性粘接剂层中的一方的表面还事先设置短路板。
(13)在上述第(1)至(5)项的电子装置的制造方法中,其特征在于:以与将多个上述IC芯片配置在载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列与横列中的至少一方的列对齐,以成批对齐多个IC芯片的方法,是利用形成有数个至数万个收容上述IC芯片尺寸的凹部的夹具,并通过使夹具振动以将夹具上的上述IC芯片收容于各凹部的方法。
(14)在上述第(1)至(5)项的电子装置的制造方法中,其特征在于:短路板与上述IC芯片及天线基板一起加热压接著。
利用本发明的电子装置的制造方法及其所用构件,可以获得以下的效果。通过将形成于外部电极相对向的一组的各表面的IC芯片对齐多个,而与天线基板及短路板一起封装,即可实现优越的生产力并获得良好的通信特性。由于可以将每一嵌入物的生产周期时间缩短至1秒左右或1秒以下,以及通过各向异性导电性粘接剂层连接IC芯片与天线基板以及短路板而可以对底座基材及天线电路的材料使用廉价材料,因此可以实现廉价的嵌入物。
附图说明
图1是用于说明先前的制造方法的图。
图2是表示利本发明的制造方法所制得的嵌入物的构造图。
图3是用于说明本发明的IC芯片的对齐方法的一例的图。
图4是用于说明本发明的第1实施方式的制造工序图。
图5是用于说明本发明的第2实施方式的制造工序图。
具体实施方式
以下利用附图详细说明本发明的实施方式。
本发明的电子装置具备:在相对向的一组表面上分别形成有外部电极的IC芯片,形成有缝隙(slit)的接收发送天线,以及电连接上述IC芯片与天线的短路板。
上述电子装置为使用本发明的制造方法的RFID标签用嵌入物。图2(a)是由上面所见的RFID标签用嵌入物的示意图。另外,图2(b)是图2(a)的A-A’部分的剖面示意图。利用图2简单说明上述嵌入物的构造。
在图2中,如图2(b)所示,在上述IC芯片100的相对向的1组面上分别形成有第1外部电极102与第2外部电极103。上述IC芯片100利用第1外部电极102在第1连接部2通过各向异性导电性粘接剂层400中所含的导电粒子401连接到底座基材202与天线电路201所构成的天线基板200。相同地,以底座基材302和金属箔301所构成的短路板300与上述IC芯片100的第2外部电极103在第2连接部3,而且短路板300与天线基板200在第3连接部4分别通过各向异性导电性粘接剂层400中所含有的导电粒子401来连接。上述IC芯片的第2外部电极103的第2连接部3与天线基板上的第3连接部4成为跨越形成于天线基板的缝隙1而连接的构造。即,上述IC芯片的第1外部电极102和第2外部电极103通过第1连接部2、天线电路201、第3连接部4、短路板的金属箔301以及第2连接部3电连接。另外,天线基板200与短路板300的空隙以各向异性导电性粘接剂层的基质树脂402密封。
其次,使用附图举例说明上述电子装置的制造方法。
本发明的上述电子装置的制造方法的第1例是该电子装置具备:在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成多个天线电路的工序与在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;以与将多个上述IC芯片配置在载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中至少一方的列对齐的工序;在形成第2金属箔的短路板上通过第1各向异性导电性粘接剂层成批暂时固定以电连接已对齐的多个上述IC芯片以制作附有IC芯片的短路板的工序;使附有上述IC芯片的短路板对位,以使多个上述IC芯片电连接于上述多个天线电路上的预定位置的工序;以及通过第2各向异性导电性粘接剂层将上述附有IC芯片的短路板成批加热压接于天线基板上的预定位置的工序。
另外,本发明的上述电子装置的制造方法的第2例是该电子装置具备:在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板;其特征在于,至少包括:利用第1金属箔形成多个电路的工序与在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;以与将多个上述IC芯片配置在载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中至少一方的列对齐的工序;将已对齐的多个上述IC芯片成批对位以使多个上述IC芯片电连接在载置IC芯片的相应的上述多个天线电路上的预定位置后,介由第1各向异性导电性粘接剂层暂时固定的工序;使形成有第2金属箔的短路板对位以便电连接于暂时固定的多个上述IC芯片及天线电路上的预定位置的工序;以及通过第2各向异性导电性粘接剂层将短路板成批加热压接于多个上述IC芯片与天线基板上。
此外,本发明的上述电子装置的制造方法的第3例是该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成天线电路的工序与在底座基材上设定上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序,在上述天线电路上的预定位置形成第1各向异性导电性粘接剂层的工序;以与将多个上述IC芯片配置在载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列与横列中至少一方的列对齐的工序;使已对齐于第1各向异性导电性粘接剂层上的多个上述IC芯片成批对位以使多个上述IC芯片电连接在载置IC芯片的相应的上述多个天线电路上的预定位置后,暂时固定的工序;在暂时固定的多个上述IC芯片与天线电路上的预定位置上形成第2各向异性导电性粘接剂层的工序;将形成有第2金属箔的短路板对位以便电连接于暂时固定的多个上述IC芯片与天线电路上的预定位置的工序;以及将上述短路板成批加热压接于多个上述IC芯片与天线基板上的工序。
在上述第1至第3例中,第1与第2金属箔的至少一方为铝。在上述第1至第3例中,第1与第2金属箔的至少一方由有机树脂或纸所构成的底座基材所支撑。上述有机树脂可从聚氯乙烯树脂(PVC)、丙烯腈—丁二烯—苯乙烯(ABS)、聚对苯二甲酸乙二醇酯(PET)、乙二醇改性—聚对苯二甲酸乙二醇酯(PETG)、聚苯二甲酸乙二醇酯(PEN)、聚碳酸酯树脂(PC)、双向拉伸聚酯(O-PET)以及聚酰亚胺树脂中选择。
在上述第1至第3例中,形成天线基板的方法有例如先用第1金属箔形成多个天线电路再设置于底座基材上以形成天线基板的方法,或在基座基材上设置第1金属箔后利用蚀刻法等形成多个天线电路以形成天线基板的方法。
在上述第1至第3例中,上述IC芯片的对齐方法可以利用例如,在金属板表面准备形成有数个至数万个左右的收容上述IC芯片的尺寸的凹部的夹具,并对夹具上供应凹部的个数或更多的IC芯片后,使夹具振动以将IC芯片收容于凹部的方法。图3为表示利用于上述对位方法的夹具例的模式图。在图3中,如图3(a)所示,在夹具60中,61为用于收容上述IC芯片的凹部,62为用于吸引设置于各凹部底面的真空的孔,63为真空泵。通过夹具振动同时进行真空吸引,可以防止一度收容于凹部的上述IC芯片会因再度的振动而脱落,另外,还能够在凹部收容有上述IC芯片后容易去除过剩的IC芯片。凹部为配合IC芯片的形状而做,用于真空吸引的孔62为形成得比IC芯片的面积更细小,可以容易地装卸IC芯片。图3(b)表示将上述IC芯片供应至夹具上的情形,图3(c)表示振动夹具,在上述IC芯片收容于凹部后,去除多余的IC芯片而完成上述IC芯片的对齐情形。
另外,其他上述IC芯片的对齐方法有例如,将芯片形电容器(chipcondensor)或芯片形电阻器(chip resisitor)等的芯片零件排成一列的高速大量送料器(bulk feeder)或零件送料器(parts feeder),以及将对齐成一列的零件封装于印刷电路基板等的高速芯片装载器(chip mounter)组装起来的方法。
这种情况下,可以下列方法制造。
此时,可以例如利用高速芯片装载器将由高速大量送料器所排出的多个上述IC芯片对齐成与相对应的应载置的天线电路上的配置等间隔并暂时固定于附有各向异性导电性粘接剂层的短路板上,并将附有上述IC芯片的短路板成批封装于天线基板上的预定位置。
在上述第1至第3例中,若与已对齐的多个上述IC芯片中至少一个IC芯片定位在载置该等IC芯片的相应天线电路上的预定位置时,其余的IC芯片也不必高精确对位即可随其成批配置于天线电路上的预定位置。
在上述第1至第3例中,在具有将上述IC芯片对齐于天线基板的宽度方向时的列逐列可成批加热压接的个数做为一片来分隔短路板的工序;使上述短路板与天线基板电路上的预定位置对位的工序,以及在上述IC芯片与天线基板上通过各向异性导电性粘接剂层将短路板成批加热压接的工序时,可以缩短生产周期(tact)时间是其理想之处。
在上述第1至第3例中,也可以在上述IC芯片的附有外部电极的各表面形成各向异性导电性粘接剂层,而利用以上述各向异性导电性粘接剂层夹入上述IC芯片的状态的半导体元件,在此情形下,可以更有效率地制造嵌入物。
在上述第1至第3例中,通过上述第1与第2各向异性导电性粘接剂层的加热压接,不但可以将多个上述IC芯片与天线基板及短路板成批加热压接,而且可以密封天线基板与短路板的空隙。
此时,将上述第1与第2各向异性导电性粘接剂层的合计厚度设成至少为上述IC芯片厚度的2分之1以上,如此一来在获得天线基板与短路板的密封性、实现高可靠性上很理想。
在上述加热压接前,把短路板分割成多个,在可防止热变形所引起的位置偏移上有益。
在上述第1至第3例中,也可以在上述IC芯片附有外部电极的各表面上形成各向异性导电性粘接剂层,在以上述各向异性导电性粘接剂层将上述IC芯片事先夹入的状态,半导体元件在上述各向异性粘接剂层中的一方的表面上使用另外事先设有短路板的,此时可以更有效率地制造嵌入物。
在上述第1至第3例中,为了形成短路板,在底座基材上设置第2金属箔的方法有例如,仅简单地将第2金属箔黏贴于上述底座基材上的方法,由于不必针对上述第2金属箔进行蚀刻等处理,故工序少,可以缩短生产周期(tact)时间,在降低成本上有益。
在上述第1至第3例中,在通过各向异性导电性粘接剂层将短路板成批加热压接于上述IC芯片与天线基板上的工序以后,还具有将连续的天线电路逐一切割成个片的工序。
在上述第1至第3例中,在上述切割工序中,将图2中的A-A’方向作为宽度方向时,短路板必须有跨过缝隙到达上述IC芯片的长度,具有与天线电路的宽度大致相同的长度在嵌入物整体的外观上较好。
在上述第1至第3例中,经过上述各工序,即可制得本发明的电子装置的嵌入物构造。
要以RFID标签的形态使用上述嵌入物时,若在嵌入物的上下设置覆盖膜(cover sheet)时,即可保护电路以防止短路。
在上述第1至第3例中,通过对齐上述IC芯片并成批固定于短路板与天线基板即可实现比逐一封装上述IC芯片时更优异的生产力。通过提升生产力即可缩短每一嵌入物的生产周期(tact)时间。
在上述第1至第3例中,通过使用上述IC芯片与短路板并设成跨越缝隙的连接构造,不需要连接到上述IC芯片的天线电路侧面的外部电极与天线电路上的激励缝隙的高精确的对位,即使利用筛网或金属模对齐的上述IC芯片的粗略位置精确度,也可以成批良好地封装于天线基板上。
在上述第1至第3例中,上述各IC芯片与天线基板及短路板,短路板及天线基板的各个电连接介由各向异性导电性粘接剂层来进行。各向异性导电性粘接剂层的连接通过使形成于被连接体的上述IC芯片的各表面的各外部电极与上述各向异性导电性连接剂层所含的导电粒子的接触而达成,由于不需要天线电路上的表面电镀,且不必为形成金属接合而可以承受200℃以上的高温的焊接的高耐热性底座基材,因此可以使用廉价的底座基材与天线电路,以实现降低成本。
为了介由各向异性导电性粘接剂层进行上述电连接,相对于例如以先前的金锡接合等来连接时,必须使用耐热性高的聚酰亚胺做为天线基的底座基材,例如可以使用廉价的聚对苯二甲酸乙二醇酯等。另外,由于不必在上述连接部的天线电路上表面施予镀锡等,因此对天线电路的材料可以使用锡或焊锡的焊接性不良的廉价的铝。因此在聚对苯二甲酸乙二醇酯的底座基材上形成铝制天线电路而得的天线基板为最适合于制造廉价的RFID标签用嵌入物的构件。
在上述第1例中,第1各向异性导电性粘接剂层也可以事先形成于短路板,或形成于上述IC芯片的第2外部电极侧。另外,第2各向异性导电性粘接剂层也可以事先形成于天线基板上,或形成于上述IC芯片的第1外部电极102侧。
在上述第2例中,第1各向异性导电性粘接剂层也可以事先形成于天线基板上,或形成于上述IC芯片的第1外部电极102侧。另外,第2各向异性导电性粘接剂层也可以事先形成于短路板,或形成于IC芯片与天线电路上。
在上述第1至第3例中,只要将已对齐的多个上述IC芯片中至少一个IC芯片与相对应的应载置的天线电路上的预定位置对位,则剩余的IC芯片也不必高精确的对准即可随其成批配置于天线电路上的预定位置。
即,本发明的电子装置的制造方法为具有在相对向的一组面上分别形成有外部电极的IC芯片,形成于缝隙的接收发送天线,以及电连接上述IC芯片与天线的短路板的电子装置的制造方法,其特征在于:若将已对齐的多个上述IC芯片的中至少一个IC芯片与相对应的应载置的天线电路上的预定位置对位,即可不必高精确地对位便可将剩余的IC芯片随其批配置于天线电路上的预定位置。
如上述第1至第3例所说明,在将多个上述IC芯片对齐后,通过与短路板及天线基板电连接地成批固定,即可大幅度提高嵌入物的生产力。
实施例
以下使用附图更详细地说明本发明的优选实施例,但是本发明并非限定于此等实施例。
图2(a)为本发明的实施方式,是从上面俯视使用了本发明的制造方法的RFID标签用嵌入物的示意图。另外,图2(b)为图2(a)的A-A’部分的剖面示意图。利用图2简单说明嵌入物的构造。
在图2中,如图2(b)所示,在IC芯片100相对向的1组的各表面形成有第1外部电极102与外部电极103。IC芯片100利用第1外部电极102在第1连接部2通过各向异性导电性粘接剂层400中所含的导电粒子401连接到底座基材202与天线电路201所构成的天线基板200。相同地,底座基材302与金属箔301所构成的短路板300与IC芯片100的第2外部电极103在第2连接部3、以及短路板300与天线基板200在第3连接部4分别通过上述导电粒子401连接。即,上述IC芯片的第2外部电极103的第2连接部3与天线基板上的第3连接部4成为跨越形成于天线基板的缝隙1而连接起来的构造。即上述IC芯片的第1外部电极102与第2外部电极103通过第1连接部2、天线电路201、第3连接部4、短路板的金属箔301以及第2连接部3电连接。另外,天线基板200与短路板300的空隙由各向异性导电性粘接剂层的基质树脂(matrix resin)402密封。
<第1实施方式>
以下利用图4说明第1实施方式。
首先,如图4(a)所示,在利用粘接剂将厚度9μm的铝箔粘接到厚50μm的聚对苯二甲酸乙二醇酯基材202上的带状基材的铝箔面上,以网版(screen)印刷形成蚀刻阻剂(etching resist)后,在蚀刻液中使用氯化铁水溶液连续形成天线电路201。在此,将每一天线电路的天线宽度设为2.5mm,缝隙宽度为0.5mm,天线电路的形成间距(pitch)为3mm。为了便于附图表示,以下工序中仅表示B部分。
其次,如图4(b)所示,备妥约10000个在相对向的一组面上分别形成有外部电极的纵横各0.4rnm、厚度0.15mm的IC芯片100,并备妥在金属板表面形成有2000个收容上述IC芯片的尺寸的凹部的夹具,该凹部横向(生产线的进行方向的宽度方向)间距为3mm的40个、纵向(生产线的进行方向)间距为2rnm的50个。然后,将10000个的上述IC芯片供应至夹具上时,将夹具振动约60秒以将上述IC芯片收容于各凹部并对齐。此时,在各凹部底面设置用于真空吸附的孔,通过同时进行夹具的振动与真空吸附,防止一度收容于凹部的上述IC芯片因为又一次的振动而脱落,并在凹部再收容到上述IC芯片后,用毛刷去除多余的IC芯片。
然后,如图4(c)所示,在厚度50μm的聚对苯二甲酸乙二醇酯基材上以粘接剂黏贴厚度9μm的铝箔的短路板300的铝箔面上,在80℃下层压宽度110mm的各向异性导电性粘接薄膜400(AC-2052P-45(日立化成工业公司制)),并剥离分隔膜(separator film)而形成各向异性导电性粘接剂层。在其上面,在真空吸附上述IC芯片的状态下,将夹具上下倒置,通过停止真空吸附,将附有2000个上述IC芯片的外部电极的各表面中的一方的面为下面而配置成成批对齐的状态。
然后,如图4(d)所示,在与已对齐的上述IC芯片的短路板侧的外部电极相反侧的外部电极表面上,以80℃下层压上述宽度的上述各向异性导电性粘接膜400后,将分隔膜剥离以形成各向异性导电性粘接剂层,做为附有上述IC芯片的短路板。此时,上述IC芯片的附有外部电极的各表面成为以上述各向异性导电性粘接剂层夹入的状态。
然后,如图4(e)所示,将附有上述IC芯片的短路板切割成可以2mm宽度封装于天线基板的宽度方向,并以3mm间距分割成40个IC芯片排成一列的附有上述IC芯片的短路板。
然后,如图4(f)所示,利用CCD摄影机与影像处理装置,使由上述已分割的附有IC芯片的短路板的各向异性导电性粘接剂层上透视的上述IC芯片,与天线电路上的预定位置对位,将上述附有IC芯片的短路板的IC芯片暂时固定于连接到天线基板的方向。此时,只要将1个IC芯片利用CCD摄影机与影像处理装置对准天线电路上的预定位置,其余的39个IC芯片可不必高精确的对位,便随其整批配置于天线电路上的预定位置。另外,除了利用CCD摄影机与影像处理装置之外,从各向异性导电性粘接剂层上以目视透视所见到的上述IC芯片的位置精确度也可以。接着,由短路板侧降下压接头,并以压力3Mpa、温度180℃、加热时间15秒的条件下,再将上述附有IC芯片的短路板相对对齐于天线基板的宽方向的天线电路的一列分整批加热压接于特定的位置,同时密封天线基板与短路板的空隙。然后,对于剩下的49列分也经过相同的工序加热压接于天线基板上。在压接头上,将上述IC芯片的厚度部分的凸起形成于特定部分,以便同时进行上述IC芯片与天线基板及短路板的连接,以及短路板与天线基板的连接。然后,如图4(g)所示,利用压切机切断成每一个个片而制得图2所示的形状的嵌入物构造。
利用本工序,对齐上述IC芯片所需要的时间为每一嵌入物0.03秒,将上述附有IC芯片的短路板连接到天线基板所需要的时间为每一嵌入物0.0375秒。若使用多个压接头,可以进一步缩短每一嵌入物的生产周期时间。
另外,上述IC芯片的封装位置精确度在距离预定位置±0.3mm以内,而没有因为位移而引起组装不良或通信不良。
即,以相对应的应载置的天线电路的配置等间隔配置IC芯片,并能够使成批加热压接短路板的IC芯片的个数分分割成一个单片的方法中,上述IC芯片或各向异性导电性粘接剂层也可以设置于天线电路上。
<第2实施方式>
以下,利用图5说明第2实施方式。
首先,如图5所示,在利用粘接剂将厚度9μm的铝箔粘接到厚50μm的聚对苯二甲酸乙二醇酯基材202上的带状基材的铝箔面上,以网版印刷形成蚀刻阻剂后,在蚀刻液中利用氯化铁水溶液连续形成天线电路201。在此,设每一天线电路的天线宽度为2.5mm,缝隙宽度0.5mm,天线电路的形成间距为3mm。为了便于附图说明,在下面工序中仅表示B’部分。
然后,如图5(b)所示,在天线电路上的预定位置以80℃T层压宽2mm的各向异性导电性粘接膜400(AC-2052P-45(日立化成工业公司制))并剥离分离膜以形成各向异性导电性粘接剂层。
然后,如图5(c)所示,备妥约10000个在相对向的一组面上分别形成有外部电极的纵横各0.4mm而厚度0.15mm的IC芯片100,并备妥在金属板表面形成有2000个收容上述IC芯片的尺寸的凹部的夹具,该凹部横向(生产线的进行方向的宽方向)间距为3mm的40个、纵向(生产线的进行方向)间距为2mm的50个。然后,将约10000个的上述芯片供应至夹具上后,将夹具振动约60秒以将IC芯片收容于各凹部中对齐。此时,如同第1实施例,通过在各凹部底面设置用于真空吸附的孔,并在振动夹具的同时进行真空吸引,即可防止一度收容于凹部中的上述芯片因又一次振动而脱落,并在凹部收容上述IC芯片后,以毛刷去除多余的IC芯片。
然后,如图5(d)所示,已对齐的上述IC芯片中,在仅将横向一列分的40个真空吸附的状态下,直接上下倒置夹具,并利用CCD摄影机与影像处理装置对准于天线电路上的预定位置而停止真空吸引以暂时固定。此时,只要利用CCD摄影机与影像处理装置将1个IC芯片对准天线电路上的预定位置,剩余的39个IC芯片即不必利用上述摄影机与装置高精确地对准而可以随其成批配置于天线电路上的预定位置。
然后,如图5(e)所示,在用粘接剂将厚度9μm的铝箔粘接于厚度为50μm的聚对苯二甲酸乙二醇酯基材上的宽度2mm的带状基材的铝箔面上,在80℃下层压与上述带状基材相同宽度的上述各向异性导电性粘接膜400,再剥离分隔膜做成附有各向异性导电性粘接剂层的短路板。
然后,如图5(f)所示,以外形尺寸为准,使附有各向异性导电性粘接剂层的短路板与天线基板按预定位置对位并暂时固定。然后由附有各向异性导电性粘接剂层的短路板降下压接头,并在压力3MPa、温度180℃、加热时间15秒的条件下,将附有各向异性导电性粘接剂层的短路板成批加热压接对齐于天线基板的宽度方向的上述IC芯片与天线电路的一列分的预定位置,同时密封天线基板与短路板的空隙。然后,对于剩余的49列分也经过相同的工序加热压接于天线基板。在压接头上,在所定的位置形成有上述IC芯片的厚度部分的凸起,以便上述IC芯片与天线及短路板的连接、短路板及天线基板的连接能够同时进行。
然后,如图5(g)所示,利用压切机逐一切割成单片而制得图2与图3所示的形状的嵌入物。
根据利用本工序,与第1实施方式一样,上述IC芯片所需要的对齐时间为每一嵌入物0.03秒,将上述短路板连接到天线基板所花时间为每嵌入物0.375秒。若使用多个压接头时,可以进一步缩短每一嵌入物的生产周期(tact)时间。
另外,与第实施方式一样,上述IC芯片的封装位置的精确度为距离预定位置的±0.3mm以内,而没有因位移而导致的组装不良或通信不良。即,以相对应的应载置的天线电路的配置等间隔配置IC芯片,并能够成批加热压接短路板的IC芯片的个数分分割成一个单片的方法中,上述IC芯片或各向异性导电性粘接剂层也可以设置于天线电路上。
<第3实施方式>
以下,说明第3实施方式。
在图5中直到图5(d)是利用与第2实施方式相同的工序进行上述天线基板的加工,将上述各向异性导电性粘接剂层压于天线电路上以形成各向异性导电性粘接剂层,并将在相对向的一组面上分别形成有外部电极的IC芯片对齐,而在天线电路上的预定位置将上述IC芯片成批暂时固定于对齐于天线基板的宽度方向的一列上。
然后,在已暂时固定的上述IC芯片上,在80℃下层压与上述已层压的各向异性导电性粘接膜相同宽度的各向异性导电性粘接膜,并剥离分隔膜而形成各向异性导电性粘接剂层。
然后,备妥用粘接剂将厚度9μm的铝箔粘接于厚度50μm的聚对苯二甲酸乙二醇酯基材上的宽2mm的带状基材,以做成短路板。将上述短路板的铝箔表面侧朝向上述IC芯片,以外形尺寸为基准对位以便与上述各向异性导电性粘接膜重叠以暂时固定。接著由短路板侧降下压接头,并在压力3MPa,温度180℃,加热时间15秒的条件下,将短路板成批加热压接于对齐于天线基板的宽度方向的上述IC芯片与天线电路的一列分的预定位置,同密封天线基板与短路板的空隙。然后,对于剩余的49列分也经过相同的工序以加热压接于天线基板上。在压接头上形成上述IC芯片的厚度部分的凸起于预定位置俾使可以同时进行IC芯片与天线基板以及短路板的连接,以及短路板与天线基板的连接。
然后,利用压切机逐一切割成单片而制得图2与图4所示的形状的嵌入物。
如使用本工序,如同第1与第2实施方式,上述IC芯片的对齐所花的时间为每一嵌入物0.03秒,将上述短路连接到天线基板所花的时间为每一嵌入物0.375秒。若使用多个压接头,则可以进一步缩短每一嵌入物的生产周期时间。
另外,与第1及第2实施方式一样,上述IC芯片的封装位置的精确度为距离预定位置±0.3mm以内,并无由于位移而导致的组装不良与通信不良。
即,以与相对应的应载置的天线电路的配置等间隔配置IC芯片,将能够成批加热压接短路板的IC芯片的个数分分割成一个单片的方法中,上述IC芯片或各向异性导电性粘接剂层也可以设置于天线电路上。
上述的实施例的结果汇总如表1所示。
表1
实施方式 | 对齐所需时间(秒/个) | 连接所需时间(秒/个) | 组装不良(不良数/总数) | 通信不良(不良数/总数) |
第1实施方式 | 0.03 | 0.375 | 0/2000 | 0/2000 |
第2实施方式 | 0.03 | 0.375 | 0/2000 | 0/2000 |
第3实施方式 | 0.03 | 0.375 | 0/2000 | 0/2000 |
Claims (14)
1.一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于:在已对齐的多个上述IC芯片中,只需将至少一个IC芯片定位在载置该等IC芯片的相应天线电路上的预定位置,则剩余的IC芯片即可不必进行高精确的对准而同时一起随其配置于天线电路上的预定位置。
2.一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成多个天线电路的工序以及在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;以与将多个上述IC芯片配置在载置该等IC芯片相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中的至少一方的列对齐的工序;在形成有第2金属箔的短路板上通过第1各向异性导电性粘接剂层成批暂时固定已对齐的多个上述IC芯片使之电连接来制作附有IC芯片的短路板的工序;使附有上述IC芯片的短路板对位,以使多个上述IC芯片电连接于上述多个天线路上的预定位置的工序;以及通过第2各向异性导电性粘接剂层,将上述附有IC芯片的短路板成批加热压接于天线基板上的预定位置的工序。
3.一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成多个天线电路的工序以及在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;以与将多个上述IC芯片配置在载置IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中的至少一方的列对齐的工序;将已对齐的多个上述IC芯片成批对位以便多个上述IC芯片电连接于载置IC芯片的相应的上述多个天线电路上的预定位置后,通过第1各向异性导电性粘接剂层暂时固定的工序;使形成有第2金属箔的短路板对位以便电连接于暂时固定的多个上述IC芯片及天线电路上的预定位置的工序;以及通过第2各向异性导电性粘接剂层将短路板成批加热压接于多个上述IC芯片与天线基板上。
4.一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:利用第1金属箔形成天线电路的工序以及在底座基材上设置上述天线电路以形成天线基板的工序或由设置于底座基材上的第1金属箔设置多个天线电路以形成天线基板的工序;在上述天线电路上的预定位置形成第1各向异性导电性粘接剂层的工序;以与将多个上述IC芯片配置在载置该等IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使对齐多个上述IC芯片的纵列或横列中的至少一方的列对齐的工序;在成批对齐已对齐于第1各向异性导电性粘接剂层上的多个上述IC芯片以使多个上述IC芯片电连接于载置IC芯片的相应的上述多个天线电路上的预定位置后,暂时固定的工序;在暂时固定的多个上述IC芯片与天线电路上的预定位置上形成第2各向异性导电性粘接剂层的工序;使形成有第2金属箔的短路板对位以便电连接于暂时固定的多个IC芯片与天线电路上的预定位置的工序;以及将上述短路板成批加热压接于多个上述IC芯片与天线基板上的工序。
5.一种电子装置的制造方法,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于,至少包括:可对沿天线基板的宽度方向对齐的上述IC芯片列进行逐列成批加热压接的个数做为一片来分隔短路板的工序;使上述短路板与被对齐于天线基板的宽度方向的天线电路的一列对位的工序;以及通过各向异性导电性粘接剂层将短路板成批加热压接于上述IC芯片与天线基板上的工序。
6.根据权利要求1至5项所述的电子装置的制造方法,其特征在于:第1与第2金属箔的至少一方为铝。
7.根据权利要求1至6项所述的电子装置的制造方法,其特征在于:第1与第2金属箔的至少一方由有机树脂所形成的底座基材所支撑,上述有机树脂可从聚氯乙烯树脂(PVC)、丙烯腈—丁二烯—苯乙烯(ABS)、聚对苯二甲酸乙二醇酯(PET)、乙二醇改性—聚对苯二甲酸乙二醇酯(PETG)、聚萘二甲酸乙二醇酯(PEN)、聚碳酸酯树脂(PC)、双向拉伸聚酯(O-PET)以及聚酰亚胺树脂中选择。
8.根据权利要求第1至6项所述的电子装置的制造方法,其特征在于:第1与第2金属箔的至少一方由纸所形成的底座基材所支撑。
9.根据权利要求第1至8项所述的电子装置的制造方法,其特征在于:利用第1与第2各向异性导电性粘接剂层的加热压接,密封天线基板与短路板的空隙。
10.根据权利要求第1至9项所述的电子装置的制造方法,其特征在于:在将多个IC芯片与天线基板及短路板成批加热压接的工序后,有将连在一起的天线电路切断成单独的个片的工序。
11.一种电子装置的构件,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于:是在上述IC芯片的附有外部电极的每一面上形成有各向异性导电性粘接剂层,且将上述IC芯片以上述各向异性导电性粘接剂层事先夹入的状态下的半导体元件。
12.一种电子装置的构件,该电子装置具备在相对向的一组面上分别形成有外部电极的IC芯片,形成有缝隙的接收发送天线,以及将上述IC芯片与天线电连接的短路板,其特征在于:在上述IC芯片的附有外部电极的每一面形成有各向异性导电性粘接剂层,并在以上述各向异性导电性粘接剂层夹入上述IC芯片的状态的半导体元件的上述各向异性导电性粘接剂层中的一方的表面还事先设置了短路板。
13.根据权利要求第1至10项所述的电子装置的制造方法,其特征在于:以与将多个上述IC芯片配置在载置该等IC芯片的相应的上述多个天线电路上的预定位置时的相同间隔使多个上述IC芯片在纵列或横列中的至少一方的列对齐来成批对齐多个上述IC芯片的方法,是利用形成有数个至数万个收容上述IC芯片尺寸的凹部的夹具,并通过使夹具振动以将夹具上的上述IC芯片收容于各凹部的方法。
14.根据权利要求第1至10以及13项所述的电子装置的制造方法,其特征在于:短路板与上述IC芯片及天线基板一起加热压接。
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CN104425312A (zh) * | 2013-09-09 | 2015-03-18 | 株式会社东芝 | 半导体制造装置 |
CN105428273A (zh) * | 2014-09-17 | 2016-03-23 | 株式会社东芝 | 半导体制造装置 |
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CN100476869C (zh) * | 2004-01-15 | 2009-04-08 | 日立化成工业株式会社 | 电子装置的制造方法 |
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JP2019032733A (ja) * | 2017-08-09 | 2019-02-28 | 日本メクトロン株式会社 | 貼付タグ、タグシステム |
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US9048534B2 (en) | 2008-03-19 | 2015-06-02 | Nec Toshiba Space Systems, Ltd. | Wide-band feeder circuit and antenna having the same |
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CN105428273A (zh) * | 2014-09-17 | 2016-03-23 | 株式会社东芝 | 半导体制造装置 |
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